JPH0789185A - Method and device for assembling head unit, and ink jet output device - Google Patents

Abstract

PURPOSE:To constitute an ink jet output device wherein adjustment of positional deviation of ink jet position of a head unit is completed at a stage that the head unit is assembled, correction at every image output is unnecessary, the device is small in size and simplified, correction of the positional deviation at exchanging the head is unnecessary, and maintenance inspection work is easy. CONSTITUTION:In a method for assembling a head unit which attaches on a frame body 28 a plurality of head chips C for discharging ink, relative positions among the head chips C are decided so as to correct positional deviation of ink jet position, and the head chips C are fixed to the frame body 28 so as to keep the relative positions. Further, in an ink jet output device, the head unit and the others are built integrally.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for assembling a head unit in which a plurality of ink-jet type head chips are mounted on a frame, and an ink jet output apparatus.

[0002]

2. Description of the Related Art An ink jet type output method for ejecting ink droplets to output an image is widely used today because it is excellent in low noise and can be easily downsized. When performing color output in such an inkjet method, a plurality of head chips having nozzles for ejecting ink in a row are arranged on a carriage at a predetermined interval, and ink of different colors is ejected from each head chip. Output the image.

In such a color output device, the landing accuracy of the ink ejected from each head chip greatly affects the image quality. For example, when recording at 360 dpi, the recording pitch is about 70 μm per pixel,
If there is a shift of more than half a pixel, the image quality will be extremely degraded.

In particular, in the course of production, each head chip has its own habit, and the ink landing position is slightly deviated. Therefore, in order to maintain high image quality, it is essential to effectively correct this misalignment. Is.

Conventionally, in a serial type ink jet output apparatus in which a plurality of such head chips are mounted on a carriage, the above-mentioned misalignment is corrected by the following method. First, there is a method in which the apparatus has a structure in which head chips are individually mounted on a carriage, and at this time, the mounting position is adjusted while checking the habit of each head chip to correct the positional deviation of the ink landing position. Further, in an apparatus in which a plurality of head chips are integrated with an ink cartridge, when the apparatus is operated, ink is ejected from the head chips, the ink landing position is measured, and the information is stored in ROM. A method of electrically adjusting ink ejection timing based on information has also been proposed.

[0006]

However, any of the methods complicates the assembly process of the device and increases the production cost. In addition, the method of mounting the head chips while adjusting them individually has a problem that the user cannot replace the heads because a special technique is required for the head replacement, and the maintenance work is complicated. Further, the method of electrically adjusting the displacement has a problem that the device becomes large and cannot be used for a small image output device.

Therefore, an object of the present invention is to provide a method of assembling an output head unit and an apparatus for assembling an output head, which realizes a high ink landing accuracy without complicating the output device, and is easy to replace by a user, and an ink jet. To provide an output device.

[0008]

In order to achieve this object, the present invention provides a method for assembling an output head unit in which a plurality of head chips for ejecting ink are mounted on a frame body, and the ink landing position is displaced. A method is proposed in which the relative position between the plurality of head chips is determined so as to correct the above, and the plurality of head chips are fixed to the frame body so as to maintain this relative position.

In addition, as a device, a plurality of position determining means for determining a relative position between a plurality of head chips and a plurality of position determining means for maintaining a relative position between the head chips so as to correct the positional deviation of the ink landing position. And an assembling apparatus for an output head unit, which includes a frame attaching means for adhering and fixing the head chip to the frame.

In addition to the basic invention described above, a test pattern is recorded using a head chip, and the relative position between head chips is determined using the ink landing position information read from the test pattern. The method may also be used, and a test pattern output means for recording a test pattern using a head chip as the device, and a test pattern reading means for reading information on the ink landing position and the ink size from the test pattern. It may be an assembling device having.

Further, when mounting the above-mentioned head chip on the frame body, a plurality of head chips are positioned without pressing against the wall of the frame body, and at least two of the end faces of the head chip are positioned.
We propose an assembling method that adheres and fixes in a state of floating above the frame at more than one place.

Further, an ink jet output device having a head unit assembled by the above method and device is proposed.

[0013]

[Action]

In the method and apparatus for assembling the head unit of the present invention, the adjustment of the displacement of the ink landing position is completed at the stage of assembling the head unit. for that reason,
It is not necessary to make a correction each time an image is output, and the device is downsized and simplified.

In the method and apparatus for obtaining the landing position information using the test pattern, based on the landing position information,
Information on individual head chip habits is easily and accurately obtained. Then, when determining the relative position between the head chips, highly accurate control is performed.

In the assembling method in which the head chips are bonded and fixed in a state of being floated from the frame, the relative distance between the plurality of incorporated head chips is not affected by the accuracy of the frame.

Further, in the ink jet output apparatus of the present invention, when the head chip needs to be replaced, the user can replace the head unit for each head unit, and the position adjustment of the head chip is not required.

[0018]

The output device incorporating the head unit according to the present invention can be used not only as a recording device such as a printer or a copying machine, but also as a printing device, a dyeing device or the like. The device will be described.

[First Embodiment] (Head Unit Assembling Apparatus) A head unit mounting method and a head unit assembling apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 4.

First, referring to FIG. 1, the structure of an apparatus for carrying out a head unit assembling method will be described. The test pattern recording unit 1 is a unit that determines the tendency of the landing performance of each ink head C, and includes a chip gripper 1a that grips the head chip C, and a recording paper that is arranged in front of this chip gripper 1a. It consists of 1b. An ink supply tank (not shown) and a contact pin (not shown) for applying an electric signal to the head chip C can be connected to the gripped head chip C, and the head chip C can be connected via this contact pin. When a test pattern recording signal is given, ink is ejected from the head chip C to record a test pattern on the recording paper 1b.

The recording paper 1b is wound around a supply roll 1c and a winding roll 1d.
In the case of d, the recording paper 1b is sequentially wound every time the test pattern recording is performed. The supply roll 1c and the winding roll 1d are mounted on the moving stage 1e, and the recording sheet 1b on which the test pattern is recorded can be moved to the reading position of the test pattern reading unit 2.

The test pattern reading means 2 reads the information of the test pattern recording recorded on the recording paper 1b, reads the information of the recording state, and determines whether the recording state is within the standard. is there. The test pattern reading unit 2 irradiates light and also analyzes the test pattern by measuring the ink landing position and the dot size with an optical device 2a that reads the test pattern by the reflected light from the recording paper 1b. The image processing apparatus 2b is configured to determine whether the deviation of the ink landing position of the test pattern and the size of the dot are within the standard.

Specifically, as shown in FIG. 2, the recording sheet 1
The ink landing position (black circle position) of the test pattern recorded in b is read from the coordinate origin with respect to the specified ink landing target position (white circle position), the amount of vertical deviation and lateral deviation, and further the dot diameter as information, and Is within the standard, and if it is within the standard, the head chip C is stocked on the temporary placing table 4 by the auto hand 3.

The automatic hand 3 comprises a rail 3a provided in the X-axis direction perpendicular to the ink ejection direction (Y-axis direction) by the head chip C, and a movable table 3b capable of reciprocating on the rail 3a. Further, the movable table 3b is provided with a tip gripping finger 3c which can move up and down in the Z-axis direction perpendicular to the X- and Y-axis directions and which can grip the head chip C.

A temporary placing table 4 is arranged near the test pattern recording means 1, and the head chips C judged by the test pattern reading means 2 to be within the standard are temporarily stocked on the temporary placing table 4. And the finger 3
c holds the head chip C and attaches it to a predetermined position of the frame body 28 on the frame body attaching means 5.

The frame body attaching means 5 has a frame body holder 5a for holding the frame body 28, a dispenser 5b for applying an adhesive agent to the frame body 28 arranged in the vicinity thereof, and a curing agent for the adhesive agent. Optical fibers 5 for guiding UV light for
c, 5d, 5e. The frame holder 5a itself is attached to the frame moving stage 5f, and the held frame 28 can be moved in the X-axis direction.

(Assembling Procedure of Head Unit) Next, the procedure of attaching the head chip C to the frame 28 by the above apparatus will be described with reference to the flowcharts shown in FIGS.

First, the head chip C is supplied to the chip gripping tool 1a by an automatic hand (S1), and the head chip C is supplied.
The reference surface of is abutted against the abutting portion of the gripping tool 1a and fixed (S2). Then, an ink supply tank and a contact pin that gives an electric signal are connected to the gripped head chip C (S3).

At the time of connection with the ink supply tank, if air bubbles enter the ink flow path in the head chip C, the ink will be insufficiently ejected. Therefore, the recovery means not shown in FIG. A recovery operation of sucking a certain amount of ink is performed, and the ink ejection surface is cleaned and preliminary ejection is performed (S4).

After the ink can be normally ejected from the head chip C by the above operation, the recording paper 1b is wound on the winding roll 1d by a certain amount (S5), and a test pattern is recorded on the recording paper 1b (S6). ). This recording paper 1b
Is moved to the observation area of the reading means 2 by the moving stage 1e (S7). During this movement, the recording start position of the recording sheet 1b and the stop position in the observation area are accurately controlled by the stage 1e.

The optical system 2a and the image processing device 2b read the ink landing position information and the dot size information by the test pattern recording (S).
8) It is determined whether or not the read result is within the standard (S9). This determination is performed by measuring the dot diameter, the vertical deviation, the lateral deviation, and the ink landing position as shown in FIG. 2, and matching these measurements with the standard.
If the reading result is out of the standard, the head chip C is discharged as a defective ejection product by the auto hand 3 (S10).

On the other hand, when the read result is within the standard, the head chip C is moved to the temporary placing table 4 by the auto hand 3 (S11), and the residual ink in the head chip C is sucked. (S12), the head chip C is filled with clear ink containing no dye (S1).
3). This is to prevent ink sticking around the ejection port of the head chip C due to residual ink. The head chip C stands by on the temporary placing table 4 (S14), the temporary placing table 4 monitors the presence or absence of the head chip C (S15, S16), and when the head chip C is carried by the finger 3c, the next head chip Work is performed (S1).

Next, the head chip C filled with the clear ink is gripped by the fingers 3c, placed at a predetermined position on the frame body 28 by the auto hand 3, and fixed with an adhesive. To explain this concretely, the head chip C
The adhesive is applied to the lower part of the head chip by applying the adhesive to the corresponding part of the frame body 28 to which the lower part of the head chip is adhered. For that purpose, an adhesive is applied to a predetermined position of the frame body 28 (S17). The adhesive is applied to the frame 28 while the head chip C is being filled with clear ink.

Then, the frame 28 coated with the adhesive is set on the frame holder 5a (S18), and the head chip C is gripped by the finger 3c (S19). While the finger 3c is raised (S20), the moving table 3b is moved along the rail 3a (S21), and when the moving table 3b moves to a predetermined position, the finger 3c is lowered to move the head chip C to the frame 28. It is inserted into the predetermined position (S22). At this time, the head chip C is held by the fingers 3c without contacting any part of the frame body 28. This is so that the accurate head chip position can be obtained even if the accuracy of the frame 28 is poor. As a result, the head chips C can be arranged only by the mechanical accuracy of the device without being influenced by the accuracy of the frame body 28 and the head chips C.

When the head chips C move, if there is no variation in the ink landing positions of the head chips C, a plurality of head chips C may be mechanically arranged at equal intervals when they are attached to the frame 28. However, since the ink landing positions of the respective head chips C actually have some variations, the variations are corrected based on the data of the ink landing positions obtained from the reading result (S23,
S24).

The correction in the X-axis direction shown in FIG.
Can be corrected by correcting the amount of movement of the finger 3c, and correction in the Z-axis direction can be performed by correcting the amount of lowering of the finger 3c.

In this embodiment, the correction in the X-axis direction is performed by moving the frame 28 in the X-axis direction by the frame moving stage 5f. Assuming that the amount of movement of the head chip C side in the X-axis direction is changed, the dispenser 5 that applies the adhesive agent accordingly
This is because the b and the optical fibers 5c, 5d, and 5e also have to be moved, which complicates the device. Further, the movement of the moving table 3b in the X-axis direction requires a certain speed, and thus there is a limit to increase the moving accuracy (resolution). On the other hand, if the frame body 28 is moved in the X-axis direction, the moving amount of the moving table 3b is always improved by the reciprocating movement of the same moving amount, so that the position reproducibility is remarkably improved.

The head chip C is attached to the frame 2 as described above.
When it is inserted into the predetermined position of 8, the adhesive applied to the frame 28 adheres to the lower portion of the head chip C. Then, an adhesive is applied to the upper portion of the head chip C and the frame body 28 by the dispenser 5b (S25). Next dispenser 5
After evacuating b to a place not affected by UV light (S2
6), UV light is irradiated to cure the adhesive to fix the head chip C to the frame 28 (S27).

Next, after the adhesive is cured, the finger 3c releases the grip of the head chip C (S28), and the finger 3c rises (S29), and the next head chip stocked on the temporary placing table 4 is held. The moving table 3b is moved to get C (S30).

When the next head chip C is attached to the frame body 28, the frame body moving stage 5f is driven to move the frame body 28 by the standard pitch (S31, S32), and the process returns to step S19 to the above. Performs the same operation.

After mounting a plurality of head chips C on the frame 28, the frame 28 is stored in a predetermined stocker by an unillustrated auto hand (S33).

As described above, the test pattern is recorded by the head chip, and only the ink landing position and the dot size within the standard are incorporated in the frame while being corrected according to the deviation of the ink landing position. By exchanging the frame body, it is possible to easily exchange the head chip whose ink landing accuracy is guaranteed.

(Structure of Head Unit) Next, the assembly structure of the head unit according to this embodiment will be described.

FIG. 7 shows an assembly structure of a single head chip C. The head chip C has a heater board 20 and a wiring board 2 on a support 19 made of metal which constitutes the bottom.
1, a top plate 22, a pressing spring 23, and an ink supply member 24 are sequentially stacked and attached.

One end 21a of the wiring board 21 is alternately connected to the wiring portion of the heater board 20, and the wiring board 2
The other end 21b of 1 is provided with a plurality of pads 21c corresponding to the electrothermal converters 25 (see FIG. 8) provided on the apparatus body side. The wiring board 21 is attached to the support 19 with an adhesive or the like.

The pressing spring 23 has an M-shape, and the central portion of the M-shape has a common liquid chamber 26 (see FIG. 8).
Is pressed with a light pressure, and a part of the liquid path, preferably a region near the discharge port 27, is pressed with a linear pressure in a concentrated manner by the front salient portion 23a. Further, the heater board 20 and the top plate 22 are attached in a state of being sandwiched by inserting the leg portions 23b of the pressing springs 23 into the holes 19a formed in the support body 19 and engaging the front end portions with the rear surface side. , Presser spring 23
And the front sill 23a are pressed together to be fixed by pressure.

An ink receiving port 22a is formed in the top plate 22 and is connected to an ink conduit 24a of an ink supply member 24 described later.

The ink supply member 24 supports the ink conduit 24a on a fixed ink supply pipe 24b in a cantilever manner, and the flow between the fixed end side of the ink conduit 24a and the ink supply pipe 24b. A sealing ball 24c is inserted to form the passage. A filter 24d is provided at the side end of the ink supply pipe 24b.

Further, since the ink supply member 24 is formed by molding, it is inexpensive, has high positional accuracy, does not deteriorate in manufacturing accuracy, and can be mass-produced, and the top plate of the ink conduit 24a having a cantilever structure. The pressure contact state with respect to the ink receiving port 22a formed in 22 is stable. Therefore, it is possible to form a more complete communication simply by pouring the sealing adhesive from the ink supply member 24 side while the ink conduit 24a is in pressure contact with the ink receiving port 22a.

The support 19 of the ink supply member 24 is used.
The fixing to the ink supply member 24 is performed by inserting two pins (not shown) projecting on the back surface side of the ink supply member 24 into the holes 19 of the support body 19 so as to project to the back surface side, and heat-sealing them. Fix it.

Next, the frame for positioning the head chip will be described with reference to FIGS. The frame 28 fixes a plurality of head chips C in parallel,
As will be described later, the head chips C are collectively positioned and fixed in a groove formed between a plurality of ribs. After mounting a plurality of head chips C, the frame body 28 is covered with an upper lid 29. The upper lid 29 is provided with four holes 29a through which the ink supply tubes 24b of the head chips C are inserted (this embodiment). Exemplifies a case where four head chips C are arranged in parallel. Further, in the upper lid 29, the locking pieces 29b provided at both ends are provided with the corresponding locking portions 28a of the frame body 28.
It is attached to the frame body 28 by being locked to.

The frame 28 is further covered with a lid connector 30, and each lid chip 30 has a head chip C.
The electrical contacts between the device main body and the device main body are collected at one location, and the electrode pad 31 formed of a flexible cable is assembled to the lid frame 32. Further, the lid connector 30 is provided with a connector 31a for connecting to the head chip C, and the connector 31a is connected to the electrode pad 31 so that respective electrical contacts to the apparatus main body are provided at one place here. Put together. The lid connector 30 is a lid frame 3
The lock pieces 32a provided at both ends of the frame 2 are attached to the frame body 28 by locking the corresponding lock portions 28b of the frame body 28. In the present embodiment, since a shift register (not shown) is mounted on each head chip C, the number of contacts can be made less than or equal to the total number of electrodes of the head chip, and the electrode pad 3
A recording signal is transmitted to each head chip by being electrically connected to the apparatus main body through the electrical contacts grouped by 1. In addition, in this embodiment, an example in which four head chips C are arranged in parallel is shown, but the present invention is not limited to this.

The electric connection with the apparatus main body is made by pressing an electrode pad (not shown) on the apparatus main body side against the electrode pad 31 assembled to the lid connector 30 covering the frame body 28. .

As shown in FIG. 6, two slots 33 are formed in the outer wall of the back surface of the frame 28 (the direction of the arrow L in FIG. 5).
Are formed. The frame body 28 is positioned on the carriage 5 by fitting a positioning pin (not shown) protruding from the carriage 5 into the groove 33. When the frame body 28 is mounted on the carriage 5, only the frame body 28 receives the mounting force, so that each head chip C can minimize distortion due to an external force.

Further, although the material of the frame body 28 affects the rigidity of the frame body, the manufacturing precision (environmental resistance) of the frame body 28, the fixing force to the apparatus body, and the deformation during handling are taken into consideration. Selected. In this embodiment, PPS containing filler
(Polyphenylene sulfite) is used.

(Head Chip Mounting Structure) Next, a structure for mounting the head chip C having the above-described structure on the carriage 5 will be described with reference to FIGS. 9 and 10.

Color recording can be performed by arranging a plurality of the head chips C in parallel and supplying different color inks to each of them. Further, when the same ink is supplied, high speed recording becomes possible. In any case, each head chip C
Needs to be accurately positioned with respect to the carriage 5.

The positioning of each head chip C with respect to the frame 28 is determined by positioning the head chip C at the position of the arrow as shown in FIG. That is, Ca and Cb regulate the lengthwise distance to the nozzle end, Cc the widthwise distance to the nozzle end, and Cd the height to the nozzle tip.

On the bottom surface of the frame 28, as shown in FIG. 10, there are formed adhesive reservoirs 36 surrounded by the projections 34a, 34b, the projections 34c, 34d and the two rails 35, respectively. In the adhesive reservoir 36,
A fixed volume of the first adhesive for fixing and supporting the head chip C is filled. Therefore, each head chip C is attached to the support 1 by the adhesive filled in the adhesive reservoir 36.
9 is fixedly supported in a state of being floated above the frame 28.

The rail 35 is also formed on the bottom surface and the back surface of the frame body 28 in parallel to the Y and Z axis directions, and between the rail 35 on the bottom surface and the portion surrounded by the protrusion 34a and the rail 35 on the back surface side. An adhesive reservoir 37 is formed in the groove. The adhesive reservoir 37 has the first
After the adhesive is solidified, the first adhesive is covered, and the second adhesive is embedded in the gap between the end portion of the head chip C and the frame body 28.

A recess 38 is formed between the rails 35, and when the second adhesive is injected from one of the directions M and N of the support 19 of the head chip C, or the second adhesive is applied from both sides. When the agent is injected, the second adhesive can be evenly applied to both surfaces of the head chip C.

As the above-mentioned first adhesive, a UV-based curing adhesive that is fast to be cured and has high mass production efficiency and has high hardness after complete curing is used, and as the second adhesive, the brittleness of the above-mentioned first adhesive is used. In order to cover the above, a silicon-based adhesive having elasticity and capable of sufficiently filling a minute gap was used.

The method for correcting the ink droplet landing position between each head chip C and the frame 28 is to measure the landing deviation in advance for each head chip and to use this information when adhesively fixing in the frame 28. First, the head chip C is tilted in the main scanning direction by an automatic registration adjusting device or is moved in parallel in the same direction, so that the head chip C can be moved in parallel with the frame 2.
The adhesive is fixed in a state in which it is floated by a minute amount. As a result, the head chips C can be fixed to the frame body 28 by adjusting the positions in all the X, Y, and Z axis directions, and a head chip unit having higher positioning accuracy than the conventional one can be configured.

The first adhesive is the adhesive reservoir 36.
It suffices that it is filled in at least two places, but the whole may be adhered along the groove between the rails 35. Further, in the present embodiment, in order to position and fix the head chip in a short time in consideration of automation, after applying the first adhesive, two kinds of adhesives are applied such that the second adhesive is applied in a batch process thereafter. However, it is also possible to bond and fix the adhesive with one kind of adhesive such as a room temperature curable or heat curable adhesive such as an epoxy adhesive.

Further, as shown in FIG. 11, after the frame 28 is mounted on the carriage 5, the ink supply tanks 7 are fitted to the ink supply pipes 24b projecting from the rear surface side of the frame 28, respectively. Then, the mounting work of the head chip C is completed. The ink supply tank 7 is replaceably attached to the frame 28.

According to the above construction, the landing deviation of the ink between the head chips is measured in advance, the position of each head chip C is adjusted in all the X, Y and Z axis directions by taking this information into consideration. By fixing to the body 28, the landing deviation of each head chip is corrected as a head chip unit, and it is not necessary to electrically adjust the ink ejection timing from the apparatus main body side, so that the control operation is simplified. You can Therefore, a high image quality can be maintained and a stable image can be provided.

Further, the head chip C is positioned with high accuracy by performing all position adjustments in the X-, Y-, and Z-axis directions so that the head chip C does not come into direct contact with the frame 28 and is floated by an adhesive agent. The manufacturing cost can be reduced without being affected by the accuracy of C and the frame body 28.

Furthermore, a plurality of head chips C are attached to the frame 28.
By positioning and holding the head, the head chip can be unitized and the head replacement operation for the carriage 5 can be facilitated.

[Second Embodiment] In the first embodiment described above, when the head chips C are incorporated in the frame 28, the deviation of the ink landing position of each head chip C is corrected for each head chip C while the frame is being corrected. Although the example in which it is set to 28 is shown, in this method, the UV light irradiation time for storing the head chips C, applying the adhesive, and curing the same is as many as the number of the head chips C incorporated in the frame body 28. Since it is necessary, the work process tends to be long. Further, in this method, in order to shorten the process, a plurality of correction mechanisms are required to set the head chips C on the frame body 28 at the same time, which complicates the apparatus and may reduce the mechanical accuracy of the apparatus. There is.

Therefore, in the assembling apparatus of the second embodiment, the lateral displacement of the ink landing position of the test pattern recording (X-axis direction) is carried out between steps S13 and S14 of FIG.
A procedure for dividing the head chips C into ranks according to the amount and adding them is added.

In this way, if the head chips C in the same rank are incorporated into the frame 28 at equal intervals, the deviation of the ink landing points can be kept within the range of the rank. Therefore, the correction procedure (steps S23, S24) shown in FIG. 4 of the first embodiment described above becomes unnecessary.

FIG. 12 illustrates the assembling apparatus of the second embodiment. The test pattern recording means 1 has a structure similar to that of the first embodiment, but has four head chips C1 to C, respectively.
4 has a plurality of temporary mounts 104 on which the 4 can be placed. In addition, the same device has four fingers 103C1 to 103C.
C4 is provided, and the four head chips C1 to C4 are simultaneously gripped from the temporary placing table 104 and are simultaneously assembled to the frame body 28 on the frame body holder 5a. Further, this device is provided with four adhesive dispensers 10 corresponding to the mounting positions of the head chips C1 to C4 on the frame 28.
5b1 to 105b4 and three optical fibers 105c1 to 105c4 and 105d1 to 105d for each head chip C
Head chip C1 having 4,105e1 to 105e4
~ C4 can be bonded to the frame body 28 at the same time.

Next, the procedure for attaching the head chips C1 to C4 to the frame will be described with reference to the flow charts shown in FIGS.

First, the head chip Cn is supplied to the chip gripping tool 1a by an automatic hand (S101), and the reference surface of the head chip C is abutted against the abutting portion of the grip body 1a and fixed (S102). Then, an ink supply tank and a contact pin that gives an electric signal are connected to the gripped head chip Cn (S103).

At the time of connection with the ink supply tank, if air bubbles enter the ink flow path in the head chip Cn, ink ejection becomes insufficient. Therefore, a certain amount from the head chip Cn is recovered by the recovery means not shown in FIG. The recovery operation of sucking the ink is performed, and the ink ejection surface is cleaned and preliminarily ejected (S104).

After the ink can be normally ejected from the head chip Cn by the above operation, the recording paper 1b is wound on the winding roll 1d by a certain amount (S105), and the recording paper 1b is wound.
Then, a test pattern is recorded (S106). The recording sheet 1b is moved to the observation area of the reading means 2 by the moving stage 1e (S107). This movement is for recording paper 1
The recording start position by b and the stop position in the observation area are accurately controlled by the stage 1e.

Then, the optical meter 2a and the image processing device 2b.
By reading the ink landing position information and the dot size information by the test pattern recording,
108), it is determined whether or not the read result is within the standard (S109). This determination is as shown in FIG.
The dot diameter, vertical deviation, lateral deviation, and ink landing position are measured, and these are collated with the standard to determine whether it is within the standard or out of the standard. If the reading result is out of the standard, the head chip Cn is discharged as an ejection defective product by an unillustrated auto hand (S110).

On the other hand, if the read result is within the standard, the residual ink in the head chip Cn is sucked (S111) and the clear ink not containing the dye is filled in the head chip (S112). This is to prevent ink sticking near the ejection port of the head chip Cn due to residual ink. The head chips Cn are ranked according to the amount of displacement of the landing position, and are stored in a tray (not shown) by rank (S113). It is determined whether or not a predetermined number of head chips of the same rank are accumulated in this tray (S114, 115), and if the predetermined number is accumulated, the head chips of the same rank are arranged on the temporary stand 104 by an auto hand (not shown) ( S116). At this time, the intervals between the head chips are approximately equal.

Head chips C arranged on the temporary table 104
1 to C4 are simultaneously gripped by the fingers 103C1 to 103C4, arranged at a predetermined position of the frame 28 and fixed with an adhesive. More specifically, the adhesive is applied to the lower portions of the head chips C1 to C4 by taking the adhesive on the lower side of the frame W to which the lower portions of the head chips are adhered. Therefore, as described in the first embodiment, the adhesive is applied to the predetermined position of the frame 28 (S117). The adhesive is applied to the frame body 28 while the head chips C1 to C4 are arranged on the temporary placing table 104.

Then, the frame 28 coated with the adhesive is set on the frame holder 5a (S118), and the finger 10 is
The head chips C1 to C4 are held by the 3C1 to 103C4 (S119). This finger 103C1-10
3C4 is raised (S120), and the moving stand 3b
Is moved along the rail 3a (S121), and the moving table 3
When b moves to a predetermined position, fingers 103C1-10
3C4 is lowered to attach the head chips C1 to C4 to the frame 28
(S122) At this time, the head chips C1 to C4 are held by the fingers C1 to C4 without contacting any part of the frame body 28. This is because even if the accuracy of the frame 28 is poor, an accurate head chip position can be obtained. As a result, the head chips C1 to C4 can be accurately arranged according to the mechanical accuracy of the device, that is, the accuracy of the spacing between the fingers 103C1 to 103C4.

Since the head chips C1 to C4 have the same amount of landing deviation, the variations in ink landing position are small. Therefore, when a plurality of head chips C1 to C4 are attached to the frame 28, they are mechanically arranged at a predetermined pitch. You can arrange them at intervals. That is, the fingers 103C1 to 103C
The intervals of 4 may be set to be equal intervals at a predetermined pitch.

As described above, the head chips C1 to C4
When is inserted into a predetermined position of the frame body 28, the adhesive applied to the frame body 28 adheres to the lower portion of the head chip C. Then, the dispensers 105b1 to 105b4 apply an adhesive to the upper portions of the head chips C1 to C4 and the frame body 28 (S123). Next, the dispensers 105b1-1
After retracting 05b4 to a place that is not affected by UV light (S
124), UV light is irradiated to cure the adhesive and fix the head chips C1 to C4 to the frame 28 (S125).

After the adhesive is cured, the finger 1
03C1 to 103C4 release the grip of the head chips C1 to C4 (S126), and the fingers 103C1 to 103C1
103C4 rises (S127), and the moving table 3b is moved to pick up the next head chip C1 to C4 stocked on the temporary placing table 4 (S128).

Finally, the frame 28 to which the head chips C1 to C4 are attached is housed in a predetermined stocker by an auto hand (not shown) (S129).

As described above, a test pattern is recorded by the head chip, and only those whose ink landing position and dot size are within the standard are ranked according to the deviation of the ink landing position, and a plurality of them are formed. Since the head chip of (1) can be attached to the frame body by one operation, the working time is significantly shortened. Further, unlike the first embodiment, the frame moving stage 5f does not adjust the distance between the head chips C1 to C4, so that a control device for that is not required and the device can be simplified. further,
A plurality of head chips C can be installed at the same time, and the installation time can be significantly shortened.

In this embodiment, the deviation of the ink landing position in the vertical direction (Z-axis direction), which is the nozzle arrangement direction of the head chip C, is sufficiently within the standard because of the configuration of the head chip C. The ranking is performed only for the lateral displacement.

[Third Embodiment] In the second embodiment, the ranks are divided according to the landing position deviation in the chip arrangement direction (horizontal direction), and the nozzles are arranged in the vertical direction (Z direction).
Regarding the deviation of the landing position in the (axial direction), the variation was within the standard, so the ranking was not performed.

However, in order to obtain a higher print quality, it is necessary to match the landing position in the vertical direction (Z-axis direction).

For that purpose, the landing deviation in the vertical direction (Z-axis direction) may be divided into ranks, but in order to match both the vertical and horizontal directions, the number of ranks increases, and It becomes difficult to obtain head chips of the same rank horizontally.

Therefore, in this embodiment, the lateral method (X-axis direction) is used.
Of the head chips C1 to C4 on the temporary table in the vertical direction (Z-axis direction) according to the amount of vertical deviation.
This is a structure for correcting this.

The vertical adjustment mechanism includes fingers 103C1 to 103C1.
The same effect can be obtained by attaching to each of the 103C4, but if an adjusting mechanism is provided for each of the moving fingers, the weight of the finger itself increases, and the adjusting mechanism is inserted according to the finger row set at a predetermined pitch. Is difficult and is not preferable.

FIG. 15 shows the temporary placing table 204 and the height adjusting device 205 provided with the adjusting mechanism described above.

The temporary placing table 204 is a main body 204 having an L-shaped cross section.
a and piezo elements 204b1-2b arranged on the upper surface thereof
04b4. Piezo elements 204b1 to 204b
4 are arranged corresponding to the positions where the head chips C1 to C4 are placed, respectively, and the individual piezo elements 204b1 to 204b2.
04b4 is independent. The height adjusting device 205 includes direct current power supplies 205b1 to 205b4 and lead wires 205a connecting these to the piezoelectric elements 204b1 to 204b4.
1 to 205a4, which are connected to a control device (not shown). That is, the piezo element 204b1
˜204b4 has a structure capable of expanding and contracting in the vertical direction (Z-axis direction) of the head chips C1 to C4 by the voltage of the DC power supplies 205b1 to 205b4.

That is, the controller (not shown) changes the voltage of the DC power sources 301b1 to 301b4 according to the landing position information of the head chips C1 to C4 in the vertical direction (Z-axis direction), so that the piezo elements 204b1 to 204b4.
The height of the head chip can be adjusted to change the position of the head chip in the vertical direction (Z-axis direction).

In this way, the temporary placement table 205 has already corrected the deviation of the landing points in the vertical direction (Z-axis direction), and the subsequent steps are arranged at equal intervals with a predetermined pitch as in the second embodiment. By simultaneously gripping the head chips C1 to C4 with the formed fingers, moving them to the frame, and adhering them, it is possible to make a head with a small landing point deviation even in the vertical direction (Z-axis direction).

In this embodiment, since the pitch between the head chips is small, the laminated piezo elements are used.
It goes without saying that the same effect can be obtained by using a normal Z stage as long as it can be physically arranged.

(Structure of Inkjet Recording Device) Finally, an inkjet recording device incorporating a head unit assembled by the method shown in the first to third embodiments will be described.

As shown in FIG. 16, the platen roller 501, which is a conveying unit, conveys the recording sheet P, which is the recording material, and supports the recording sheet P at the recording position. A knob 501a that can be manually rotated is provided at one end of the rotary shaft of the platen roller 501. A pressing plate 50 for pressing the recording sheet P conveyed to the recording position is provided on the front surface of the platen roller 501.
2 is placed.

A plurality of head chips C1 to C are provided in the frame 28.
An ink supply tank 7 is connected to each of the head units H including the ink supply tank 7
The respective color inks are supplied. Then, according to a signal, ink is ejected onto the recording sheet P conveyed by the platen roller 501 to perform color recording.

The head unit H and the ink supply tank 7 are mounted on the carriage 505,
It reciprocates in the sub-scanning direction (arrows a and b directions). The carriage 505 is connected to a lead screw 506 having a spiral groove 506a formed therein.
A screw gear 506b is attached to the end of 06. Further, the carriage 505 is inserted into guide rails 507 whose both ends are supported by the apparatus main body.

The material of the carriage 505 is selected so as to have a sufficiently rigid structure depending on the usage of the apparatus body. In this example, PPS (polyphenylene sulfite) containing a filler was used.

The driving force of the driving motor 508, which is the driving source, is transmitted to the lead screw 506 via the drive transmission gear 509a and the screw gear 506b. Therefore,
By driving the drive motor 508 to rotate forward and backward,
The drive force is transmitted to the lead screw 506 via the drive transmission gear 509a and the screw gear 506b, and the carriage 505 reciprocates in the directions of arrows a and b in the drawing.

The carriage 505 has a lever 50 attached to it.
5a is provided so as to project, and the lever 505a is detected by the photocouplers 510a and 510b provided at the ends of the carriage movement range.
The home position (standby position) of 05 is detected, and the rotation direction of the drive motor 508 is switched.

The cap member 511 is for carrying out a recovery process for the ink discharge port of the head unit, and is a support member 5.
It is integrally supported by 12. This support member 5
12 is equipped with suction means (not shown). Further, the cap member 511 is provided with an opening portion 513, and the recovery processing is performed by covering the opening portion 513 with the nozzle of the head unit and sucking with a suction means.

The recovery lever 514 is for starting the recovery process, and the cam 515 that abuts when the carriage 505 returns to the home position moves along with the movement, and the driving force from the driving motor 508 is driven. Transmission gear 5
The movement is controlled by a known transmission means such as 09b or clutch switching (not shown).

A supporting plate 517 is attached to the chassis 516 of the apparatus main body, and a cleaning blade 518 is slidably supported on the supporting plate 517.
The cleaning blade 518 is moved in the front-rear direction by a driving unit (not shown) to clean ink droplets attached to the ejection ports. It goes without saying that the form of the cleaning blade 518 is not limited to that shown in the drawing, and other known ones can be applied.

The capping, cleaning, and suction recovery processes are performed at predetermined timings at corresponding positions according to the operation of the lead screw 506 when the carriage 505 moves to the home position side area.

Depending on such an ink jet recording apparatus, the frame 28 incorporating the head chip C is mounted on the carriage 505, and the ink supply tank 7 and contact pins for supplying an electric signal to the head chip C (see FIG. It can be easily replaced by connecting (not shown).

[Other Embodiments] In the above-described embodiments, the ink jet recording method was used as the recording method. In this case, the electrothermal converter is energized according to a recording signal and applied by the electrothermal converter. It is more preferable that the recording is performed by ejecting the ink from the ejection port due to the growth and contraction of the bubbles generated in the ink by utilizing the film boiling generated in the ink by the thermal energy.

With regard to its typical structure and principle, it is preferable to use the basic principle disclosed in, for example, US Pat. Nos. 4,723,129 and 4740796. This method can be applied to both the so-called on-demand type and continuous type, but in the case of the on-demand type in particular, it is arranged corresponding to the sheet or liquid path holding the liquid (ink). By applying at least one drive signal to the electrothermal transducer, which corresponds to the recorded information and gives a rapid temperature rise beyond nucleate boiling,
This is effective because heat energy is generated in the electrothermal converter to cause film boiling on the heat-acting surface of the head chip, and as a result, bubbles can be formed in the liquid in a one-to-one correspondence with this drive signal. Due to the growth and contraction of the bubbles, the liquid is ejected through the ejection openings to form at least one droplet. It is more preferable to make this drive signal into a pulse shape because bubbles can be grown and contracted immediately and appropriately, so that particularly excellent liquid ejection can be achieved.

As the pulse-shaped drive signal, those described in US Pat. Nos. 4,463,359 and 4,345,262 are suitable. If the conditions described in US Pat. No. 4,313,124 of the invention relating to the rate of temperature rise on the heat acting surface are adopted, more excellent recording can be performed.

As the constitution of the head chip, in addition to the combination constitution of the ejection port, the liquid passage, and the electrothermal converter (the linear liquid passage or the right-angled liquid passage) as disclosed in the above-mentioned respective specifications, The present invention also includes configurations using US Pat. Nos. 4,558,333 and 4,459,600, which disclose configurations in which the heat acting portion is arranged in a bending region.

Further, JP-A-59-123670, which discloses a structure in which a common slit is used as a discharge portion of a plurality of electrothermal converters, and an opening for absorbing a pressure wave of thermal energy are disclosed. Japanese Patent Laid-Open Publication No.
A configuration based on Japanese Patent Publication No. 59-138461 may be used.

Further, it is preferable to add a head chip recovery means, a preliminary auxiliary means, and the like, which are provided as a constitution of the ink jet recording apparatus, because the effects of the present invention can be further stabilized. Specific examples thereof include capping means, cleaning means, pressurizing or suctioning means for the head chip, preheating means by electrothermal conversion type or other heating element or a combination thereof, and recording. It is also effective to perform a stable recording by performing a preliminary discharge mode in which another discharge is performed.

In addition, although the ink is described as a liquid in the above-described embodiments, the ink is one which solidifies at room temperature or lower and softens or liquefies at room temperature, or the ink jet recording method is used. 30 inks
Generally, the temperature is controlled in the range of ℃ or more and 70 ℃ or less to control the temperature of the ink so that the viscosity of the ink is in the stable ejection range. good. In addition, it is possible to prevent the temperature rise due to thermal energy from being positively used as the energy for changing the state of the ink from the solid state to the liquid state, or to use the ink that solidifies when left standing for the purpose of preventing ink evaporation. However, in any case, heat is applied such as ink that is liquefied by application of heat energy according to the recording signal and liquid ink is ejected, or that begins to solidify when it reaches the recording sheet. It is also applicable when using an ink that has the property of being liquefied for the first time by energy.

The ink in such a case is described in JP-A-54-5.
As described in JP-A-6847 or JP-A-60-71260, a form in which it is opposed to an electrothermal converter in a state where it is held as a liquid or a solid substance in a concave portion or a through hole of a porous sheet. Also good. The most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

Further, as a form of the above-mentioned ink jet recording apparatus, besides the one used as an image output terminal of an information processing apparatus such as a computer, a copying apparatus combined with a reader or the like, and further a facsimile apparatus having a transmission / reception function. It may take a form or the like.

[0118]

According to the present invention described above, since the head unit can complete the adjustment of the displacement of the ink landing position at the stage of assembling the head unit, it is not necessary to make a correction each time an image is output, and the apparatus is eliminated. Can be miniaturized and simplified.

In particular, depending on the method and apparatus for obtaining the landing position information using the test pattern, the information regarding the habit of each head chip can be easily and accurately obtained, and the relative position between the head chips can be determined. In doing so, it is possible to perform highly accurate control.

Further, according to the assembling method in which the head chips are bonded and fixed in a state of being floated from the frame, the relative distance between the plurality of head chips to be incorporated is not affected by the accuracy of the frame, and the image quality is improved. It is possible to produce high head chips.

Further, according to the ink jet output apparatus of the present invention, the user can replace each head unit and no adjustment is required.
Since no position control mechanism is required, an inkjet output device having a simple structure can be configured.

[Brief description of drawings]

FIG. 1 is a perspective view of a head unit assembling apparatus according to a first embodiment.

FIG. 2 is an explanatory diagram when ink is ejected from a test pattern.

FIG. 3 is a flowchart showing an assembling procedure of the head unit of the first embodiment.

FIG. 4 is a flowchart showing a procedure for assembling the head unit of the first embodiment.

FIG. 5 is an explanatory diagram showing a configuration of a head unit.

FIG. 6 is a bottom view of the head unit.

FIG. 7 is an explanatory diagram showing an assembly structure of a head chip.

FIG. 8 is a partial explanatory diagram of a head chip.

FIG. 9 is an explanatory diagram showing positioning of a head chip.

FIG. 10 is an explanatory diagram showing a positioning portion for the frame of the head chip.

FIG. 11 is an explanatory diagram showing a mounting configuration of a head unit with respect to a carriage.

FIG. 12 is a perspective view of a head unit assembling apparatus according to a second embodiment.

FIG. 13 is a flowchart showing an assembling procedure of the head unit of the second embodiment.

FIG. 14 is a flowchart showing an assembling procedure of the head unit of the second embodiment.

FIG. 15 is a perspective view of a temporary placing base of the head unit of the third embodiment.

FIG. 16 is a perspective view of an inkjet recording apparatus.

[Explanation of symbols]

1 ... Test pattern recording means, 1a ... Chip gripping tool, 1
b ... recording paper, 1c ... supply roll, 1d ... winding roll,
1e ... moving stage, 2 ... test pattern reading means, 2
a ... Optical system, 2b ... Image processing device, 3 ... Auto hand,
3a ... Rails, 3b ... Moving base, 3c ... Chip gripping fingers, 4 ... Temporary placing base, 5 ... Frame body attaching means, 5a ... Frame body holder, 5b ... Dispenser, 5c, 5d, 5e ... Optical fiber, 5f ... Frame moving stage, 7 ... Ink supply tank, 19 ... Support, 19a, 19b, 29a ... Hole, 20 ... Heater board, 21 ... Wiring board, 22 ... Top plate, 22a ... Ink receiving port, 23 ... Press spring, 23a … Front part, 23b… Leg part, 24
... Ink supply member, 24a ... Ink conduit, 24b ... Ink supply tube, 24c ... Sealing ball, 24d ... Filter, 25 ... Electrothermal converter, 26 ... Common liquid chamber, 27 ... Discharge port, 28 ... Frame, 29 …
Upper lid, 29b, 32a ... Locking piece, 30 ... Lid connector, 31 ... Electrode pad, 31a ... Connector, 32 ... Lid frame, 33 ... Groove hole, 34a,
34b, 34c, 34d ... Protrusion, 35 ... Rail, 36, 37 ... Adhesive agent accumulating portion, 38 ... Recess, 103 c1 to c4 ... Chip gripping finger, 104 ... Temporary placing table, 105 b1 to b4 ... Dispenser, 10
5 c1 to c4, 105 d1 to d4, 105 e1 to e4 ... Optical fiber, 204
… Temporary stand, 205 b1 to b4… Piezo element, 505… Carriage, P… Head chip, H… Head unit

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical indication B41J 25/28 Z (72) Inventor Masahiko Hikuma 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Co., Ltd. (72) Inventor Yosuke Sarai, 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc.

Claims (17)

[Claims] 1. A method of assembling a head unit in which a plurality of head chips for ejecting ink are mounted on a frame, wherein a relative position between the plurality of head chips is determined so as to correct misalignment of ink landing positions. Then, a method of assembling a head unit, characterized in that the plurality of head chips are fixed to a frame so as to maintain the relative position. 2. The method of assembling a head unit according to claim 1, wherein the relative position of the plurality of head chips is recorded with a test pattern using the head chip, and the ink read from the test pattern is used. A method of assembling a head unit, wherein the method is determined using the landing position information of the head unit. 3. The head unit assembling method according to claim 2, wherein whether or not the landing quality of the head chip is within a standard based on the landing position information of the ink read from the test pattern. A method of assembling a head unit, comprising determining and selecting a head chip within a standard and fixing it to the frame. 4. The head unit assembling method according to claim 2, wherein the ink landing position misregistration correction uses the ink landing position information read from the test pattern, A method for assembling a head unit, which is performed when fixing the head to the frame. 5. The method of assembling a head unit according to claim 2, wherein the ink landing position misregistration is corrected by using the ink landing position information read from the test pattern. A method for assembling a head unit, characterized in that the head chips, which are close to each other in position shift, are combined and fixed to the frame body so as to maintain a predetermined relative position. 6. The method of assembling a head unit according to claim 2, wherein, of the positional deviation corrections of ink landing positions, vertical position misalignment correction is performed by using landing position information read from the test pattern. It is performed by adjusting the height of a portion of the temporary placing table on which the head chips are temporarily placed, and is fixed to the frame body so as to maintain the predetermined relative position. Assembling method of head unit. 7. The method of assembling a head unit according to claim 1, wherein the plurality of head chips are positioned without being pressed against the wall of the frame body, and at least two of the end surfaces of the head chip are positioned.
A method of assembling a head unit, characterized in that the head unit is adhesively fixed at a position above the frame while floating from the frame. 8. The method of assembling a head unit according to claim 7, wherein the head chip is fixed by using two or more kinds of adhesives, and at least a UV adhesive is used as the first adhesive. A method of assembling a head unit, wherein a silicon-based adhesive is used as the second adhesive. 9. In a head unit assembling apparatus for mounting a plurality of head chips for ejecting ink on a frame, a relative position between the plurality of head chips is maintained so as to correct a positional deviation of ink landing positions. An apparatus for assembling a head unit, comprising: positioning means; and frame body mounting means for fixing the plurality of head chips to a frame body so as to maintain a relative position between the head chips. 10. The head unit assembling apparatus according to claim 9, wherein the position determining means includes a test pattern output means for recording a test pattern using a head chip, and an ink from the test pattern. And a test pattern reading unit for reading information on the landing position of the ink and the size of the ink. 11. The head unit assembling apparatus according to claim 10, wherein the test pan-turn reading unit is based on ink landing position information read from the test pattern,
An apparatus for assembling a head unit, wherein it is determined whether or not the landing quality of the head chip is within a standard, and a head chip within the standard is selected and fixed to the frame. 12. The head unit assembling apparatus according to claim 10, wherein the frame attaching means uses the ink landing position information obtained from the position determining means to frame the plurality of head chips. An apparatus for assembling a head unit, which corrects a positional deviation when fixing to a body. 13. The head unit assembling apparatus according to claim 10, wherein the frame attaching means uses the ink landing position information obtained from the position determining means to shift the ink landing position. An apparatus for assembling a head unit, characterized in that the head chips are combined with each other and fixed to the frame body so as to maintain a predetermined relative position to correct the positional deviation. 14. The head unit assembling apparatus according to claim 10, wherein the frame attaching means uses landing position information read from the test pattern, and the head chip is temporarily placed on a temporary placing table. It is performed by adjusting the height of the portion where each head chip is placed, and is fixed to the frame body so as to maintain this predetermined relative position. A head unit assembling apparatus characterized by performing a correction. 15. A transporting means for transporting an output material, and a plurality of output head chips for ejecting ink to the output material according to image information to output an image are fixedly adhered onto a frame body. And a carrier that is reciprocally movable in the main scanning direction by mounting the output unit. The output unit is configured to correct the displacement of the ink landing position. An inkjet output device, comprising: determining a relative position between head chips; and bonding and fixing the plurality of head chips to a frame so as to maintain the relative position. 16. The inkjet output device according to claim 15, wherein the output unit includes an electrothermal converter for generating thermal energy for ejecting ink. apparatus. 17. The ink jet output apparatus according to claim 16, wherein the recording means uses film boiling generated in the ink by thermal energy applied by the electrothermal converter to eject ink from an ejection port. An inkjet output device, which discharges the ink.