JPH0787280B2 - Nozzle rotation positioning device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (b) Industrial field of application The present invention rotates the nozzle based on the recognition result of the rotation posture of the chip-shaped electronic component held by the pick-up nozzle by the recognition device. The present invention relates to a nozzle rotation positioning device that changes its posture.

(B) Conventional technology As a conventional technology, in Japanese Patent Laid-Open No. 61-168298, after inserting the drive rotor into the inner friction surface of the driven rotor of the suction head unit, the expansion member of the drive rotor is expanded. There is disclosed a technique in which the inner peripheral friction surface is frictionally engaged and the driving rotating body is rotated to rotate the suction pipe of the suction head to change the rotational posture of the electronic component.

However, when the rotation centers of the driving rotating body and the driven rotating body do not coincide with each other, distortion occurs in the radial direction during rotation, or a rotation transmission error occurs.

(C) Problems to be Solved by the Invention Therefore, even if the rotation centers of the driving rotary body and the driven rotary body do not coincide, distortion does not occur in the radial direction during rotation, and reliable rotation transmission can be performed. To do so.

(D) Means for Solving the Problems Therefore, according to the present invention, a fitting groove is formed in the upper portion of the pick-up nozzle, which is rotatably provided by being guided by a predetermined rotary bearing, and is installed above the pick-up nozzle. Nozzle rotating means that has a fitting portion that fits in the fitted groove and that is vertically movable and rotatable, and when the nozzle rotating means is lowered and the fitting portion abuts the fitted groove of the nozzle. Cushion means attached to the nozzle rotating means or the take-out nozzle to press the fitting portion and the fitted groove into pressure contact with each other, and at least the fitting portion fitted to the fitted groove by the urging force of the cushion means. A sliding means for sliding in one direction is provided.

(E) Operation With the above configuration, the fitting portion is brought into contact with the fitted groove of the ejection nozzle by the downward movement of the nozzle rotating means.

At this time, the fitting portion and the fitted groove are biased by the nozzle rotating means or the cushion means attached to the take-out nozzle so as to come into pressure contact, and the fitting portion is fitted through the sliding means by the biasing force. It is slid according to the mating groove.

(F) Example Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

(1) is an XY table that is moved in the X and Y directions by driving the X-axis servo motor (2) and the Y-axis servo motor (3), and is a chip-shaped electronic component (4) (hereinafter referred to as chip component (4)). The printed circuit board (5) on which the (.) Is mounted is placed.

(6) is a component supply table in which a large number of component supply devices (7) are arranged side by side, and the ball screw (8A) is rotated by the drive of the component supply section servomotor (8) to be guided by the guide (9) and X. Direction (left and right direction in FIG. 1).

Reference numeral (10) is a suction head portion (12) as a pickup head portion provided with a plurality of suction nozzles (11) as pickup nozzles for picking up and carrying the chip component (4) from the component supply device (7) on the lower surface. Is installed in a large number, and is intermittently rotated by the rotation of the rotary disk servomotor (13).

In addition, a fitting groove (11A) into which a fitting portion (30) (30A) described later is fitted is provided in the upper portion of the suction nozzle (11), and a contact rod (52) described later contacts. The contacted part (11B) is provided.

(I) is a suction station for taking out the chip component (4) from the component supply device (7).

(II) recognizes the state of the chip component (4) sucked by the suction nozzle (11) by the recognition device (14) and corrects the rotation of the chip component (4) based on the recognition result. It is a nozzle rotation correction station. In the first nozzle rotation correction station (II), the chip component (4) having leads such as SOP and QFP is corrected. That is, the chip component (4) that must be accurately mounted on the pattern of the printed circuit board (5) is handled, and when the correction is completed, it is recognized again by the recognition device (14). If the correction is not completed, it is corrected. Then, the above operation is repeated until the correction is completed (until the error is within a certain range).

(III) is a second nozzle rotation correction station that performs rotation correction on a leadless chip component (4) such as LCC, and performs correction only once based on the recognition result by the recognition device (14).

(IV) is the first nozzle rotation correction station (II)
Alternatively, the chip component (4) after completion of the work at the second nozzle rotation correction station (III) is printed on the printed board (5).
It is a mounting station that is mounted on top.

As a result of the recognition by the recognition device (14), (V) is a chip component (such as the chip component (4) that is standing and adsorbed, or the adsorbed chip component (4) is different, which must not be mounted (V). 4) is a discharge station.

(VI) is a nozzle selection station for selecting the suction nozzle (11) corresponding to the chip component (4) to be sucked at the suction station (I), and a gear (provided on the outer diameter portion of the suction head portion (12) ( (Not shown) is driven by a drive system (not shown) and is rotated after meshing with the gear and then rotated by a drive gear servomotor (15) which rotates a drive gear (16) as a nozzle selecting means. A desired suction nozzle (11) is selected.

(VII) is a rotation direction of the suction nozzle (11) according to the orientation of the chip component (4) at the standby position when the chip component (4) is taken out by the suction nozzle (11) in the suction station (I). It is an origin position adjustment station that adjusts the origin position of.

The recognizing device (14) will be described below with reference to FIG.

(17) is a CCD camera that recognizes the state where the chip component (4) is sucked by the suction nozzle (11), and is a box waiting below the chip component (4) that has been conveyed to above the recognition device (14). Two mirrors (19) mounted inside (18)
The image obtained by utilizing the reflection of (20) is recognized through the lens (21).

Next, the first and second nozzle rotation correction stations (I
I) (III) first and second nozzle rotation positioning device (22)
(23) will be described in detail. Since the devices (22) and (23) have the same structure, the first nozzle rotation positioning device (22) will be described with reference to FIG.

(22A) is a first nozzle rotation motor as a drive source for rotating the suction nozzle (11) by θ, and the output shaft (25)
A vertical moving means (60) including a nozzle rotating body (28) fitted into a bearing body (27) via a coupling (26) and a nozzle rotating rod (29) described later is attached to the.

Reference numeral (29) is a nozzle rotation rod fitted in the nozzle rotation body (28) and having a nozzle rotation fitting portion (30) at its lower end, and a vertically elongated hole (31) provided in the nozzle rotation body (28). A pin (32) protruding further outward is provided. The nozzle rotation fitting part (30) is notched diagonally from both sides toward the lower end so as to fit with the fitted groove (11A). In addition, a locking portion (3) that locks a spring (33) as cushion means with the bottom surface of the nozzle rotating body (28).
4) is provided, and a rocking lever (37) is attached to the engaging portion (34) via a rod end (36) to a vertical movement lever (35) that is vertically moved by a cam as a drive source (not shown). ) Is locked and the swing lever (37) is swung up and down in accordance with the vertical movement of the vertical movement lever (35), so that the nozzle rotation rod (29) is pushed up and down by the spring (33). Be moved.

Also, a ball spline may be used as the vertical movement means (60).

Next, the third nozzle rotation positioning device (24) of the nozzle origin alignment station (VII) will be described.
The same structure as that of the first nozzle rotation positioning device (22) described above has the same drawing number, and the description thereof will be omitted.

As shown in FIG. 5, the inside of the nozzle rotation fitting portion (30A) provided on the nozzle rotation rod (29) is the first cavity (5
0) and a second cavity (51) connected to the first cavity (50) having a diameter smaller than that of the first cavity (50).

The spring (55) is provided at the stepped portion (53) between the first cavity (50) and the second cavity (51) by the engagement portion (54) of the (52).
The rotation of the fitting portion (30A) together with the urging force of the contact rod is a contact rod as a brake means that is locked in a free state, and the contact rod extends below the lower end of the fitting portion (30A). (Five
The tip of 2) contacts the fitted groove (11A) to regulate the rotation of the suction nozzle (11) before fitting. The contact rod (52) is designed to idle without following the rotation when the fitting portion (30A) is rotated. To assist this, the upper surface of the first cavity (50), that is, A thrust bearing (61) is provided on the spring (55) receiving side of the nozzle rotating rod (29) as a receiver for the spring (55).
The rotation of the spring (55) prevents the rotational force from being transmitted to the contact rod (52).

Reference numeral (38) in FIG. 6 is an interface, which is the XY table (1), the parts supply table (6), the turntable (10), the drive gear (16), and the first, second, and third nozzle rotation positioning devices. (2
2) (23) and (24) are connected, while each of these control elements is program-controlled by a CPU (39) as a control device.

(40) is a RAM as a storage device, and each suction nozzle (1
Rotation center position data of 1), recognition position data of the chip component (4) by the recognition device (14), and mounting position data (X) of each chip component (4) on the printed circuit board (5).
Direction, Y direction, θ direction) and the like are stored in each predetermined area.

Since the setting position of the rotation center of the suction nozzle (11) may shift due to temperature change, aging change, etc.,
Each suction nozzle (11) that does not suck the chip component (4) when it exceeds a certain set temperature or after a certain time
May be recognized by the recognition device (14) to calculate the displacement amount of the rotation center of the suction nozzle (11) and the displacement amount may be stored in the RAM (40) again, or the displacement amount may be stored in the suction nozzle. It may be added to the rotation center position data of (11).

A drive circuit (41) is connected to the CPU (39),
The drive circuit (41) includes the X-axis servomotor (2), Y
Axis servo motor (3), parts supply section servo motor (8), rotary table servo motor (13), drive gear servo motor (15), and first, second, and third nozzle rotation motors (22A) ( 23A) and (24A) are connected.

The operation will be described in detail below with reference to the drawings.

First, before performing the mounting operation, the center of rotation of each suction nozzle (11) in the recognition device (14) (the CCD camera (17)
(With reference to a reference point such as the image center), and the rotation center position data is stored in the RAM (40).

For the center position recognition work of the suction nozzle (11), a jig is sucked by the suction nozzle (11), and this jig is rotated with the rotation of the suction nozzle (11). The hole provided may be recognized by the recognition device (14) at the rotation angle position of the suction nozzle (11), and the rotation center of the suction nozzle (11) may be calculated from the recognition result by a calculation device (not shown).

Furthermore, a trial shot of the chip component (4) is actually performed while changing the mounting angle, the displacement amount between the mounting position and the rotation center of each suction nozzle (11) is measured, and the value is input to the RAM (40 ) May be entered.

The component supply table (6) is moved to the suction station (I) by driving the component supply unit servomotor (8), and the desired component supply device (7) is on standby at the component removal position. Then, the suction nozzle (11) is moved above the chip component (4) housed in the standby component supply device (7), and the suction nozzle (11) sucks the chip component (4).

Next, the rotation correction operation in the θ direction of the chip part (4) in the first nozzle rotation correction station (II) will be described.

Here, the recognition device (14) recognizes the position of the chip component (4) from the image center of the CCD camera (17) in the state of being sucked by the suction nozzle (11), and the recognition data (X ₁ , Y ₁ ，
Store θ ₁ ) in RAM (40). Among them, the correction operation for the angle data (θ) will be described.

The recognition angle data (θ ₁ ) is, for example, an angle formed by a line of intersection formed by extending one side of the image center and an end surface of the chip component (4) serving as a reference.

The mounting angle data (θ direction) of the mounting position data stored in the RAM (40) and the recognition angle data (θ ₁ ) are compared by a comparison device (not shown). Calculate the amount of deviation (θ direction − θ ₁ ) with
It is stored in (40) and the rotation is corrected. That is, if the chip component is a chip component (4) having a lead, the suction nozzle (11) is rotated by the first nozzle rotation positioning device (22) to correct the position of the chip component (4). Do. That is, the vertical movement lever (35) is lowered by the driving of the cam, and the swing lever (3
7) is swung downward and the fitting part (30) for nozzle rotation is biased by the spring (33) while being fitted to the taper part of the fitted groove (11A) provided in the upper part of the suction nozzle (11). After contact, the first nozzle rotation motor (22A) is rotated by the displacement amount (θ direction −θ ₁ ) to cause the suction nozzle (11).
Is rotated to align the chip component (4). After completion of this alignment correction, the recognition device (14) again recognizes the suction state of the chip component (4) and confirms that the chip component (4) has been rotated by the displacement amount (θ direction −θ ₁ ).
When it falls within the setting range stored in AM (40), turntable (1
0) is rotated again, and the suction head section (12) is moved to the next station.

If the corrected error is out of the range, the above work is continued until it is within the range.

Then, at the mounting station (IV), the XY table (1)
Thus, the printed circuit board (5) is moved in the XY direction, and the chip component (4) is mounted at a predetermined position.

Here, the chip component (4) sucked by the suction nozzle (11) does not require so much accuracy, for example, when the chip component (4) has no lead, the work time required for the entire process is shortened. In order to do so, the mounting work is advanced by the following operation.

First, if it is necessary to recognize the sucked state of the chip component (4) by the recognition device (14) and make a correction, the second nozzle rotation positioning of the next second nozzle rotation correction station (III) This is done by the device (23). The correction work is performed in the same manner as the first nozzle rotation positioning device (22).
Incidentally, here, the second nozzle rotation correction station (III)
The reason why the correction is performed in step 1 is that it takes a long time to perform a plurality of operations (recognition and correction operations) in one station (first nozzle rotation correction station (II)). The component (4) may also be corrected by the first nozzle rotation correction station (II).

Further, the chip component (4) determined to be uncorrectable by the recognition device (14) is ejected here when the turntable (10) is continuously rotated and moved to the ejection station (V).

The suction nozzle (11) used next in the next nozzle selection station (VI) rotates after the drive gear (16) meshes with the gear (not shown) provided in the suction head section (12). It is selected by rotating the suction head section (12) accordingly.

At the next nozzle origin alignment station (VII), the origin of the selected suction nozzle (11) is aligned. That is, since the suction nozzle (11) is rotationally corrected in accordance with the amount of deviation in the first or second nozzle rotation correction station (II) (III), the suction becomes a reference when the chip component (4) is sucked. The origin of the nozzle (11) in the direction of rotation becomes different, and the origin positions must be matched before adsorption.

Therefore, the rotation stop position of the third nozzle rotation motor (24A) is set, and the nozzle rotation positioning device (24) is driven to align the origin position of the suction nozzle (11) in the rotation direction. That is, for example, the fitting portion (30A) and the fitted groove (11
Even if it intersects with (A), first, the fitting portion (30A) is lowered while being rotated, and the contact rod (52) urged downward by the spring (55) is the contacted portion. It contacts (11B) (see Fig. 7). Then, by pressing the contacted portion (11B) downward, the rotation of the contact rod (52) by the fitting portion (30A) is released, that is, the fitting portion (30A) is contact rod (52). It becomes idle and the contact rod (52)
Rotation of the mating part (30A) so that the suction nozzle (11) does not rotate with the mating part (30A) until the mating part (30A) and the mating groove (11A) are mated That is, the rotational force of the nozzle rotating rod (29) is transmitted to the upper portion (61A) of the thrust bearing (61), but is not transmitted to the lower portion (61C) due to the rolling action of the ball (61B).
The fitting portion (30A) and the fitted groove (11A) are aligned in the same direction until the fitting portion (30A) rotates up to 180 degrees and stops. Therefore, the fitting portion (30A) and the fitted groove (11A) are fitted while being pressed against each other by the spring (55), and the suction nozzle (11) is rotated by the rotation of the fitting portion (30A). At the stop position, the mating part (30A) and the mating groove (11A)
Can be aligned and stopped in the same direction (see FIG. 8), and the suction nozzle (11) after the rotation is stopped is always prepared at the origin position.

The origin position is stored in the RAM (40), and the value and the amount rotated at the time of correction are calculated by a calculator and the value is subtracted from 180 degrees, and the nozzle rotation is performed by that value. The suction nozzle (11) may be aligned with the origin position by rotating the motor (24A) so that the direction of the fitted groove (11A) coincides with the direction of the origin position.

Further, the nozzle rotation motor (24A) may be reversely rotated by an amount corresponding to the rotation during the correction so that the suction nozzle (11) is aligned with the origin position.

Thereafter, the mounting work of the chip component (4) is successively continued in the same manner.

In the description of the rotation correction, as shown in FIG. 2, since the nozzle rotation fitting portion (30) and the fitted groove (11A) are in the same direction, the fitting portion (30) is Although it has been described that it is fitted into the fitted groove (11A) only by descending, when the fitting portion (30) and the fitted groove (11A) are eccentric (9th embodiment).
(See the figure), if the mating part (30) and one of the tapered surfaces of the mating groove (11A) are also in contact, the mating part (30) will rotate when the mating part (30) is rotated. Since the fitting groove (11A) can be rotated in a direction that coincides with the direction of the tapered surface of (1), the suction nozzle (11) can be rotated in the desired direction. Therefore, for example, even if the suction nozzle (11D) having a direction is formed with the V-shaped groove (11C) for sucking the cylindrical chip part (4A) as shown in FIG. By setting the groove (11A) and the V-shaped groove (11C) in the same direction, the axial center of the component (4A) can be adjusted according to the packing shape of the cylindrical chip component (4A) of the component supply device (7). Direction and the V
It can be aligned with the groove (11C), and the fitted groove (11A) stops in the V-shaped groove (11C) stop direction, so that reliable component mounting can be performed.

Next, another embodiment of the nozzle rotation positioning device will be described with reference to FIG.

Reference numerals (42) and (43) are an X-direction linear guide and a Y-direction linear guide provided on the upper portion of the nozzle rotation fitting portion (30), and a linear guide locking portion provided on the lower end of the nozzle rotation rod (29). The rail (42A) of the X-direction linear guide (42) is fixed to the (44), and the rail (4) of the Y-direction linear guide (43) is attached to the movable block (42B) of the linear guide (42).
3A) is fixed, and the fitting portion (30) is fixed to the movable block (43B) of the linear guide (43). Further, the linear guides (42) (43) have stoppers (45A) (45B) (46) that restrict the swing of the linear guides (42) (43) within the fitted groove (11A).
A) (other not shown) are provided respectively.

As a result, when the fitting portion (30) is fitted into the fitted groove (11A) and there is eccentricity between the springs (33)
By the urging force of, the X-direction and Y-direction linear guides (42) and (43) are flexibly moved to eliminate the eccentricity between the fitting portion (30) and the fitting groove (11A). Thus, the load in the radial direction applied to the suction nozzle (11) is reduced.

Further, the linear guide may be provided only in one direction, and in this case as well, the load in the radial direction applied to the suction nozzle (11) is reduced.

Although the spring (33) as the cushion means is provided on the side of the fitting portion (30) in the above-described embodiment, the fitting groove (11) is provided.
It may be provided on the A) side, that is, on the suction nozzle (11) side. In this case, for example, the spring is attached to the lower surface of the upper portion of the suction nozzle (11) in which the fitted groove (11A) is formed and the suction head portion (12).
It may be provided between the upper surface and the upper surface.

Further, the above-mentioned braking means may be provided on the suction head portion (12) side and brought into contact with the upper portion of the suction nozzle (11) to restrict the rotation of the suction nozzle (11).

(G) Effect of the Invention With the above configuration, when the driven rotary body is rotated by the drive rotary body, compared with the structure in which the drive rotary body is fitted into the inner circumferential friction surface of the driven rotary body to rotate. , It is possible to surely drive the rotation without causing any bending during rotation.

Also, even if the rotation axis of the drive rotor does not match the rotation axis of the take-out nozzle when the take-out nozzle is rotated by fitting the fitting part of the drive rotor into the fitted groove of the take-out nozzle In addition, the fitting portion can slide in accordance with the fitted groove to absorb the deviation of the shaft center, and the nozzle can be reliably rotated.

[Brief description of drawings]

1 and 6 are a plan view and a circuit diagram of an electronic component automatic mounting apparatus to which the present invention is applied, FIG. 2 is a side view of a first nozzle rotation correction station, and FIG. 3 is a first nozzle rotation. FIG. 4 is a perspective view of a positioning device, FIG. 4 is a perspective view of a third nozzle rotation positioning device, FIG. 5 is a partially enlarged view of FIG. 4, and FIGS. 7 and 8 are a fitting portion and a fitting groove. Diagram showing mating with
FIG. 9 is a view showing an eccentric state of the fitting portion and the fitted groove, FIG. 10 is a view showing a directional suction nozzle that sucks a cylindrical chip component, and FIG. 11 is a view showing another embodiment. The perspective view of a nozzle rotation positioning device is shown. (11) (11D) ... Suction nozzle, (11A) ... Mated groove, (11
B) ... Abutted part, (12) ... Suction head part, (22) (23)
(24) ... First, second, and third nozzle rotation positioning devices, (22
A) (23A) (24A) ... 1st, 2nd, 3rd nozzle rotating motor, (28) ... Nozzle rotating body, (30) (30A) ... Nozzle rotating fitting part, (42) ... X Directional linear guide, (43)… Y
Directional linear guide, (52) ... Contact rod.

Claims (1)

[Claims] 1. A take-out nozzle having an engaged groove formed in an upper portion thereof and being rotatably provided by being guided by a predetermined rotary bearing, and a fitting provided above the take-out nozzle and fitted into the engaged groove. A nozzle rotating means having a joint portion capable of moving up and down and rotating, and the fitting portion and the fitted groove when the nozzle rotating means is lowered and the fitting portion comes into contact with the fitted groove of the nozzle. Cushioning means attached to the nozzle rotating means or the take-out nozzle to press the pad, and sliding means for sliding the fitting part in at least one direction according to the fitted groove by the biasing force of the cushioning means. Nozzle rotation positioning device.