JPH077814B2 - Mounting board - Google Patents
Mounting boardInfo
- Publication number
- JPH077814B2 JPH077814B2 JP2275187A JP2275187A JPH077814B2 JP H077814 B2 JPH077814 B2 JP H077814B2 JP 2275187 A JP2275187 A JP 2275187A JP 2275187 A JP2275187 A JP 2275187A JP H077814 B2 JPH077814 B2 JP H077814B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resin
- electrical heating
- thermal conductivity
- heating part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract 8
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 10
- 230000007257 malfunction Effects 0.000 description 7
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は発熱部品及び耐熱性の低い部品からなる実装基
板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board including a heat generating component and a component having low heat resistance.
従来の技術 近年、実装基板の発展はめざましく、ラジオ受信機、テ
レビ受信機、ビデオ機器、ステレオ装置などに代表され
る音響・通信の分野では、特徴があり、かつ付加価値の
高い製品をめざしており、薄型・軽量化・高密度化が要
求されている。2. Description of the Related Art In recent years, the development of mounting boards has been remarkable, and in the field of audio and communication represented by radio receivers, television receivers, video equipment, stereo equipment, etc., we aim to have products with distinctive features and high added value. Therefore, it is required to be thin, lightweight and high-density.
そして、今まで自動車やオートバイなどの野外で使用さ
れる分野に用いられていたのは、ラジオ受信機やカース
テレオ装置などのアクセサリー的な補助装置であった
が、カーエレクトロニクス技術の発展はめざましく、自
動制御装置やフロントパネルなどの心臓部まで電子回路
を構成した実装基板が用いられるようになってきてい
る。And until now, what was used in the field used outdoors such as automobiles and motorcycles was auxiliary equipment like accessories such as radio receivers and car stereo devices, but the development of car electronics technology is remarkable, Mounting boards having electronic circuits have been used up to the heart of automatic control devices and front panels.
発明が解決しようとする問題点 しかしながら、限られたスペースに発熱部品と耐熱性の
低い部品からなる実装基板を装着する必要がある為、音
響・通信分野に用いるのと同様に高密度実装基板が求め
られている。Problems to be Solved by the Invention However, since it is necessary to mount a mounting board composed of a heat-generating component and a component having low heat resistance in a limited space, a high-density mounting substrate is required as in the acoustic / communication field. It has been demanded.
ところで、発熱部品にはパワトランジスターやトライア
ック等のサイリスタがあり、通常放熱部が設けられてい
るが、十分に熱が放出されない為、使用雰囲気温度プラ
ス30℃程度の温度上昇を見る必要がある。By the way, the heat-generating component has a thyristor such as a power transistor and a triac, and is usually provided with a heat radiating portion. However, since heat is not sufficiently released, it is necessary to see a temperature rise of about 30 ° C above the ambient temperature.
一方、高精度の要求されるマイクロコンピュータ・IC等
の半導体自体の発熱はほとんどないが、動作保証温度は
85℃程度のものが多く、音響・通信分野における最高雰
囲気温度は50℃なので問題にならないが、野外で使用さ
れる分野では、真夏の炎天下を考慮すると、短時間であ
るが最高使用温度を80℃と考える必要があり、動作保証
温度との温度差に余裕がほとんどなく、発熱部品と耐熱
性の低い部品を別々の基板にしたり、両者の間に十分な
距離をとることができない状態にあるので、耐熱性の低
い部品に発熱部品からの熱が伝わらないようにする必要
がある ラジオ受信機やカーステレオ装置などのアクセサリー的
な補助装置であれば、動作保証温度を越えて多少の誤動
作があっても許されるかもしれないが、心臓部に用いら
れる実装基板に要求される条件は厳しく、わずかな誤動
作でも人身事故につながるので、高信頼性が求められて
いる。On the other hand, semiconductors such as microcomputers and ICs, which require high precision, generate almost no heat, but the guaranteed operating temperature is
Most of them are around 85 ° C, and the maximum ambient temperature in the acoustic and communication fields is 50 ° C, so there is no problem, but in the field used outdoors, considering the hot summer in the summer, the maximum operating temperature is 80 Since it is necessary to consider it as ℃, there is almost no margin in the temperature difference from the operation guaranteed temperature, and it is in a state where the heat-generating component and the component with low heat resistance cannot be formed on different boards or a sufficient distance can be kept between them. Therefore, it is necessary to prevent heat from the heat-generating parts from being transmitted to parts with low heat resistance.If the accessory auxiliary device such as a radio receiver or car stereo device exceeds the guaranteed operating temperature, some malfunction may occur. Although it may be allowed even if it exists, the conditions required for the mounting board used for the heart are strict, and even a slight malfunction can cause personal injury, so high reliability is required.
問題点を解決するための手段 少なくとも発熱部品及び耐熱性の低い部品からなる実装
基板において、前記発熱部品を熱伝導性の良い樹脂で被
覆すると共に、耐熱性の低い部品との間に熱伝導性の悪
い樹脂層を設けることによって、前記問題点を解決する
ものである。Means for Solving the Problems In a mounting board including at least a heat-generating component and a component having low heat resistance, the heat-generating component is coated with a resin having good heat conductivity, and the heat conductivity between the component having low heat resistance is high. The above-mentioned problems are solved by providing a resin layer having poor heat resistance.
作用 この技術的手段による作用は次のようになる。すなわ
ち、発熱部品を熱伝導性の良い樹脂で被覆することによ
り、熱をより大きな面積で逃がすと共に、耐熱性の低い
部品との間に熱伝導性の悪い樹脂層を設けることによっ
て、耐熱性の低い部品に発熱部品からの熱が伝わらない
ようにすることにより、誤動作がなく信頼性の高い実装
基板を得ることができる。Action The action of this technical means is as follows. That is, by covering the heat-generating component with a resin having good thermal conductivity, heat is released in a larger area, and by providing a resin layer having poor thermal conductivity with the component having low heat resistance, By preventing heat from the heat-generating components from being transmitted to the low components, it is possible to obtain a highly reliable mounting board without malfunction.
実施例 以下本発明の一実施例の実装基板について、図面を参照
しながら詳細に説明する。Embodiment A mounting board according to an embodiment of the present invention will be described in detail below with reference to the drawings.
熱伝導性の良い樹脂はエポキシ樹脂・ウレタン樹脂・ア
クリル樹脂・シリコーン樹脂・ポリブタジエン樹脂など
のベース樹脂にアルミナやマイカなどの熱伝導性の良い
充填剤を加えることによって、容易に得ることができ
る。A resin having good heat conductivity can be easily obtained by adding a filler having good heat conductivity such as alumina or mica to a base resin such as epoxy resin, urethane resin, acrylic resin, silicone resin, polybutadiene resin.
一方、熱伝導性の悪い樹脂はウレタン樹脂・ポリエチレ
ン樹脂・ゴムなどを独立発泡させることによって熱伝導
性の悪い樹脂層を容易に得ることができ、フロンガスを
併用することにより、より熱伝導性の悪い樹脂層を得る
ことができる。On the other hand, a resin with poor thermal conductivity can easily obtain a resin layer with poor thermal conductivity by independently foaming urethane resin, polyethylene resin, rubber, etc. A bad resin layer can be obtained.
そして、実装基板を密閉できる場合には、前記樹脂と発
泡剤の２液を混合して密閉系の中で発泡させるのが望ま
しい。また、実装基板を密閉できない場合には、あらか
じめ発泡させた熱伝導性の悪い樹脂を貼りつけるなどの
方法によって、熱伝導性の悪い樹脂層を設けることがで
きる。If the mounting board can be hermetically sealed, it is desirable to mix the two liquids of the resin and the foaming agent and foam them in a hermetically sealed system. If the mounting substrate cannot be hermetically sealed, a resin layer having poor thermal conductivity can be provided by, for example, attaching a resin having poor thermal conductivity that has been foamed in advance.
（実施例１） 第１図において、スリットを設けた紙フェノール基板１
上に、放熱部を有するパワートランジスター２、チップ
タイプの固定抵抗器３、マイクロコンピュータ４を取付
けた電子回路基板に、ウレタン樹脂にアルミナを充填
し、熱伝導性が0.75kcal/m・hr・℃の樹脂をディスペン
サーを用いてパワートランジスター２に被覆し、80℃×
30分の硬化条件で硬化させ、熱伝導性の良い樹脂被覆層
５を作成した。(Example 1) In FIG. 1, a paper phenol substrate 1 having slits is provided.
The electronic circuit board on which the power transistor 2 having the heat dissipation part, the chip type fixed resistor 3 and the microcomputer 4 is attached, urethane resin is filled with alumina, and the thermal conductivity is 0.75 kcal / m · hr · ° C. The power transistor 2 is covered with the resin of 80 ℃ using a dispenser
The resin coating layer 5 was cured under curing conditions for 30 minutes to form a resin coating layer 5 having good thermal conductivity.
次に、あらかじめ発泡倍率50倍で独立発泡させ、熱伝導
性が0.04kcal/m・hr・℃の発泡クロロプレンゴムからな
るブロックを、パワートランジスター２とマイクロコン
ピュータ４との間に貼りつけ、熱伝導性の悪い樹脂層６
を作成した。以上のようにして作成した実装基板は、80
℃の恒温槽中で動作させても誤動作もなく、正常であっ
た。Next, a block made of foamed chloroprene rubber having a thermal conductivity of 0.04 kcal / m · hr · ° C was previously foamed independently with a foaming ratio of 50 times, and was attached between the power transistor 2 and the microcomputer 4 to conduct heat. Poor resin layer 6
It was created. The mounting board created as described above is 80
There was no malfunction even when operated in a constant temperature bath at ℃, and it was normal.
（実施例２） 第２図において、電子回路パターンを有するポリイミド
フイルムを貼りつけたアルミ基板７上に放熱部を取付け
たパワートランジスター２とポリイミドフイルムを介し
て接続された電子回路パターンを有するガラスエポキシ
基板８上に、マイクロコンピュータ４を取付けた電子回
路基板のパワートランジスター２に、エポキシ樹脂にマ
イカを充填し、熱伝導性が0.65kcal/m・hr・℃の樹脂を
ディスペンサーを用いてパワートランジスター２に被覆
し、80℃×60分の硬化条件で硬化させ、熱伝導性の良い
樹脂被覆層５を作成した。(Embodiment 2) In FIG. 2, a glass epoxy having an electronic circuit pattern connected through a polyimide film with a power transistor 2 having a heat radiating portion mounted on an aluminum substrate 7 to which a polyimide film having an electronic circuit pattern is attached. Epoxy resin is filled with mica on the power transistor 2 of the electronic circuit board on which the microcomputer 4 is mounted on the substrate 8, and the resin having thermal conductivity of 0.65 kcal / m · hr · ° C is used by using the dispenser. And was cured under curing conditions of 80 ° C. for 60 minutes to form a resin coating layer 5 having good thermal conductivity.
次に、耐熱ABS製のケースの中に挿入し、40℃の温度に
保ちながら、硬質ウレタン樹脂と発泡剤の２液混合が可
能なガンを用いて注入発泡させ、熱伝導性が0.018kcal/
m・hr・℃である熱伝導性の悪い樹脂層６を作成した。Next, insert it in a heat-resistant ABS case and inject and foam it with a gun that can mix two parts of hard urethane resin and foaming agent while keeping the temperature at 40 ° C, and the thermal conductivity is 0.018kcal /
A resin layer 6 having a poor thermal conductivity of m · hr · ° C. was prepared.
以上のようにして作成した実装基板は、実施例１と同様
に、80℃の恒温槽中で動作させても誤動作もなく、正常
であった。The mounting board produced as described above was normal without any malfunction even when it was operated in a constant temperature bath at 80 ° C., as in Example 1.
（比較例） 以下、比較例の実装基板について、図面を参照しながら
詳細に説明する。(Comparative Example) Hereinafter, a mounting board of a comparative example will be described in detail with reference to the drawings.
実施例１と同様に、第３図において、スリットを設けた
紙フェノール基板１上に、放熱部を有するパワートラン
ジスター２、チップタイプの固定抵抗器３、マイクロコ
ンピュータ４を取付けた電子回路基板に、何も処理をし
ないで、実施例１と同様に、80℃の恒温槽中で動作させ
ると、誤動作を生じた。Similar to the first embodiment, in FIG. 3, an electronic circuit board in which a power transistor 2 having a heat dissipation portion, a chip type fixed resistor 3, and a microcomputer 4 are mounted on a paper phenol substrate 1 provided with slits, When no operation was performed and the device was operated in a constant temperature bath at 80 ° C. as in Example 1, a malfunction occurred.
発明の効果 以上の説明から明らかなように本発明による実装基板
は、発熱部品を熱伝導性の良い樹脂で被覆することによ
り、熱をより大きな面積で逃がすと共に、耐熱性の低い
部品との間に熱伝導性の悪い樹脂層を設けることによっ
て、耐熱性の低い部品に発熱部品からの熱が伝わらない
ようにすることにより、誤動作がなく信頼性の高い実装
基板を得ることができる。EFFECTS OF THE INVENTION As is clear from the above description, the mounting board according to the present invention covers heat-generating components with a resin having good thermal conductivity to allow heat to escape in a larger area, and also to reduce heat-resistant components. By providing a resin layer having poor thermal conductivity so that heat from the heat-generating component is not transmitted to the component having low heat resistance, it is possible to obtain a highly reliable mounting board without malfunction.
【図面の簡単な説明】 第１図は本発明の第１の一実施例における実装基板の断
面図、第２図は本発明の第２の一実施例における実装基
板の断面図、第３図は比較例の実装基板の断面図であ
る。 １……紙フェノール基板、２……パワートランジスタ
ー、４……マイクロコンピュータ、５……熱伝導性の良
い樹脂層、６……熱伝導性の悪い樹脂層、７……アルミ
基板、８……ガラスエポキシ基板、９……ケース。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of a mounting board according to a first embodiment of the present invention, FIG. 2 is a sectional view of a mounting board according to a second embodiment of the present invention, and FIG. [FIG. 3] is a cross-sectional view of a mounting board of a comparative example. 1 ... Paper phenol substrate, 2 ... Power transistor, 4 ... Microcomputer, 5 ... Resin layer with good thermal conductivity, 6 ... Resin layer with poor thermal conductivity, 7 ... Aluminum substrate, 8 ... Glass epoxy board, 9 ... Case.
Claims (2)
からなる実装基板であって、前記発熱部品を熱伝導性の
良い樹脂で被覆すると共に、前記耐熱性の低い部品との
間に熱伝導性の悪い樹脂層を設けることを特徴とする実
装基板。1. A mounting board comprising at least a heat-generating component and a component having low heat resistance, wherein the heat-generating component is covered with a resin having good heat conductivity, and the heat conductivity between the heat-generating component and the component having low heat resistance. A mounting board characterized in that a resin layer having poor conductivity is provided.
m・hr・℃以上であり、熱伝導性の悪い樹脂の熱伝導性
が0.05kcal/m・hr・℃以下であることを特徴とする特許
請求の範囲第（１）項記載の実装基板。2. A resin having good thermal conductivity has a thermal conductivity of 0.5 kcal /
The mounting board according to claim (1), wherein the resin has a thermal conductivity of not less than m · hr · ° C and a thermal conductivity of the resin having poor thermal conductivity is not more than 0.05 kcal / m · hr · ° C.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2275187A JPH077814B2 (en) | 1987-02-03 | 1987-02-03 | Mounting board |
| US07/151,904 US4843520A (en) | 1987-02-03 | 1988-02-03 | Electronic circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2275187A JPH077814B2 (en) | 1987-02-03 | 1987-02-03 | Mounting board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63190364A JPS63190364A (en) | 1988-08-05 |
| JPH077814B2 true JPH077814B2 (en) | 1995-01-30 |
Family
ID=12091394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2275187A Expired - Lifetime JPH077814B2 (en) | 1987-02-03 | 1987-02-03 | Mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH077814B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4012743B2 (en) | 2002-02-12 | 2007-11-21 | 浜松ホトニクス株式会社 | Photodetector |
| JP5298413B2 (en) * | 2006-08-30 | 2013-09-25 | 富士通株式会社 | Electronic equipment |
| US8816494B2 (en) * | 2012-07-12 | 2014-08-26 | Micron Technology, Inc. | Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages |
| JP6304377B2 (en) * | 2014-06-23 | 2018-04-04 | 株式会社村田製作所 | Resin substrate combination structure |
-
1987
- 1987-02-03 JP JP2275187A patent/JPH077814B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63190364A (en) | 1988-08-05 |
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