JPH0766547A - How to connect the printed circuit board - Google Patents

Abstract

(57) [Abstract] [Purpose] To simplify the structure, reduce the size, and reduce the cost, and also to prevent noise, reduce loss, and improve reliability. [Structure] When connecting the second printed board 3 to the first printed board 2, the upper surface 2u of the first printed board 2 is connected.
Are provided with a plurality of first connection patterns 4a, 4b ... And a plurality of second connection patterns 5a facing the first connection patterns 4a, 4b ... On the lower surface 3d of the second printed circuit board 3. 5b ... is provided and the first connection pattern 4 is provided.
a and the second connection patterns 5a are soldered by the reflow method using the cream solder H.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board connecting method suitable for connecting another printed circuit board such as a multilayer board to an arbitrary printed circuit board.

[0002]

2. Description of the Related Art Generally, when connecting (mounting) a surface mounting component such as an IC chip to a printed circuit board, cream solder is applied to a connection pattern provided on the surface of the printed circuit board and the surface mounting component The leads protruding from the component body are soldered by the reflow method.

By the way, if another printed board is connected to an arbitrary printed board to apparently form one printed board, for example, a relatively expensive multilayer board is used only for the other printed board. In addition, since a relatively inexpensive single-layer board can be used as the arbitrary printed board, there is an advantage that the cost can be significantly reduced.

However, the conventional method of connecting the printed circuit boards is such that the other printed circuit board is provided with a separate lead so that the other printed circuit boards can be connected in the same manner as the case of the surface mount component, or both of the printed circuit boards to be connected. Since they were screwed together and were electrically connected via a connector or lead wire, separate components such as leads and connectors were required, and due to the complexity of the configuration,
There was a problem that increased cost and lowered reliability. In addition, since there is an unnecessary projecting portion and an occupied space, there is a problem that the printed circuit board is increased in size and, when used in a high frequency circuit, noise and loss are increased.

The present invention solves the problems existing in the prior art as described above, and in particular, simplifies the configuration, reduces the size, and reduces the cost, and further prevents noise and reduces loss. It is an object of the present invention to provide a method for connecting printed circuit boards, which can achieve higher reliability and improved reliability.

[0006]

According to the method of connecting printed boards according to the present invention, when connecting the second printed board 3 to the first printed board 2, a plurality of upper surfaces 2u of the first printed board 2 are connected. The first connection patterns 4a, 4b ... Are provided, and a plurality of second connection patterns 5a, 5b ... That face the first connection patterns 4a, 4b ... Are provided on the lower surface 3d of the second printed circuit board 3. Are provided, and the first connection patterns 4a ... And the second connection patterns 5a ... Are soldered by a reflow method using the cream solder H.

As another manufacturing mode, the first connecting patterns 4a, 4b on the first printed circuit board 2,
It is also possible to provide through holes 2h ... In 4c. In this case, when connecting the first connection patterns 4a ... And the second connection patterns 5a ..., it is possible to perform soldering in a reflow method using cream solder H, or in a solder dip bath. It can also be soldered depending on the model. When soldering by the flow method, the vent holes 3s ... Are provided in the second connection patterns 5a.

In any manufacturing method, a plurality of unit boards 6 are provided on at least the second printed board 3.
It is possible to use a multilayer substrate formed by laminating a, 6b, 6c ..., For example, a multilayer substrate 6 having a coil component L configured by providing coil patterns Pa ... on a plurality of unit substrates 6a.

[0009]

According to the printed circuit board connection method of the present invention, the plurality of first connection patterns 4a ... Are provided in advance on the upper surface 2u of the first printed circuit board 2 and the second printed circuit board 3 is provided. The lower surface 3d of the plurality of second connecting patterns 5a ...
Is provided. On the other hand, when connecting the second printed board 3 to the first printed board 2, cream solder H is applied to the first connection patterns 4a ... Or the second connection patterns 5a. The first connection patterns 4a ... And the second connection patterns 5a ... Are connected by soldering. Therefore, a separate component such as a lead is not necessary, and there is no unnecessary protruding portion or occupied space.

If the through holes 2h are provided in the first connection patterns 4a on the first printed circuit board 2, the solder dip bath is used in addition to the reflow soldering using the cream solder H. Flow type soldering is also possible. In this case, solder is through hole 2
While penetrating into h ..., the through holes 2h ... And the second connection patterns 5a ... Are connected, and the ventilation holes 3s ...
Degassing is performed by.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, preferred embodiments according to the present invention will be described in detail with reference to FIGS.

First, in FIG. 3, 7 is the first printed circuit board 2.
It is a main printed circuit board constituting the above, and for example, a single layer board such as an aluminum board can be used.

Reference numeral 8 is an auxiliary printed circuit board which constitutes the second printed circuit board 3. For example, the multilayer printed circuit board 6 shown in FIG. 4 can be used. The multi-layer substrate 6 is formed by laminating a plurality of relatively thin unit substrates 6a, 6b, 6c, ... In order through an insulating plate, and thereby forming a single laminated plate. Then, a part of the multi-layer substrate 6 has a certain area A
Is ensured to form the coil component L. That is, the multilayer substrate 6
Originally, as shown in FIG. 4, it is used as a printed circuit board for surface mounting various electronic components M1, M2, M3 ... Such as IC chips. , And the coil patterns Pa are printed on the unit boards 6a corresponding to the area A, and when the unit boards 6a are stacked, the coil patterns Pa are formed on the through holes 3hm.
Connect by ... Further, the multilayer board 6 is provided with core insertion holes 11, 12 and 13, and the divided core divisions 14p and 14q are respectively inserted from the upper surface side and the lower surface side of the multilayer board 6 as shown in FIG. It is inserted into the holes 11 ... To be united, and is fixed by the C-shaped grip fitting 15.
As a result, the coil component L having the core 14 on a part of the multilayer substrate 6 is directly constructed.

On the other hand, when connecting the auxiliary printed circuit board 8 to the main printed circuit board 7, first, as shown in FIG.
A plurality of first connection patterns 4a, 4b, 4c ... Having through holes 2h ... Are provided on the main printed circuit board 7. Further, a plurality of second connection patterns 5a, 5b, 5c ... Which face the first connection patterns 4a, 4b, 4c ... Are provided on the lower surface 3d of the auxiliary printed board 8. Then, as shown in FIG. 3, the cream solder H is applied to the first connection patterns 4a on the main printed circuit board 7 and the second connection patterns 5a on the auxiliary printed circuit board 8 are superposed thereon. , Reflow type soldering is performed (see FIG. 1).

In this case, since the solder enters through the through holes 2h, it is possible to perform the soldering in a flow type using a solder dip bath. In the case of performing soldering by the flow method, the second printed circuit board 3 at the positions of the second connection patterns 5a ... Is provided with the ventilation holes 3s. As a result, degassing is performed when the solder enters.

The first connection pattern 4a ... and the second connection pattern 5a ... may be provided as a dedicated pattern for mechanically connecting the printed circuit boards 7 and 8 or may be provided in an electric circuit. It may be provided as a pattern that also serves as a connection. Further, FIG. 5 shows a more embodied printed circuit board, 31 is an accommodating hole for accommodating the core 14 provided in the main printed circuit board 7, M4, M5, M6 and M7 are various electronic parts such as IC chips, and 32 is an auxiliary. A shield cover for covering the printed circuit board 8 is shown. The shield cover may be provided on a part of the unit boards in the multilayer board 6.

Therefore, such a connecting method eliminates the need for additional components such as leads, and eliminates unnecessary projecting portions and occupied space, thus simplifying (simplifying) the structure and reducing the cost. The reliability and size can be reduced. Further, when used in a high frequency circuit, noise prevention and loss reduction can be achieved.

On the other hand, FIG. 6 shows a modified embodiment of the present invention.
In the modified embodiment, a plurality of first connecting patterns 4a, 4 are provided on the upper surface 2u of the first printed board 2 (main printed board 7).
b ... is provided. This case is different from the embodiment shown in FIG. 1 in that the first connecting patterns 4a, 4b ... Are not provided with through holes. The second printed circuit board 3
The (auxiliary printed circuit board 8) is the same as that of the embodiment shown in FIG. Therefore, also in this case, the cream solder H is applied to the first connection patterns 4a, 4b, ... On the main printed circuit board 7.
And the second printed circuit board 3 on top of this.
When the second connection patterns 5a, 5b ... Are stacked, the soldering can be performed by the reflow method.

The embodiment has been described in detail above.
The present invention is not limited to such an embodiment.
For example, both the first printed circuit board and the second printed circuit board can be configured with an arbitrary number of layers. Other details,
The shape and the like can be arbitrarily changed without departing from the scope of the present invention.

[0020]

As described above, according to the method of connecting a printed circuit board of the present invention, a plurality of first connection patterns are formed on the first printed circuit board when connecting the second printed circuit board to the first printed circuit board. A plurality of second connection patterns facing the first connection pattern are provided on the lower surface of the second printed circuit board, and the first connection pattern and the second connection pattern are provided with cream solder. Since it is used and soldered by the reflow method, the following remarkable effects are obtained.

Since separate components such as leads and connectors are not required, the configuration can be simplified (simplified).
It is possible to reduce costs and improve reliability.

Since there is no unnecessary protruding portion or occupied space, the printed circuit board can be downsized, and
Even when used in a high frequency circuit, noise and loss can be reduced.

If a through hole is provided in the first connecting pattern, it is possible to perform soldering in a flow type using a solder dip bath.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing a part of a printed circuit board connected by a connection method according to the present invention,

FIG. 2 is a plan view showing a part of a printed circuit board connected by the same connecting method;

FIG. 3 is a longitudinal sectional view showing a part of each printed circuit board to be connected by the same connecting method;

FIG. 4 is a perspective view of a second printed circuit board connected by the same connecting method;

FIG. 5 is a vertical cross-sectional view of a more embodied printed circuit board connected by the same connection method;

FIG. 6 is a vertical cross-sectional view showing a part of each printed circuit board to be connected by a connection method according to a modified embodiment of the present invention;

[Explanation of symbols]

 2 1st printed circuit board 2u Upper surface 2h ... Through hole 3 Second printed circuit board 3d Lower surface 3s ... Vent hole 4a ... 1st connection pattern 5a ... 2nd connection pattern 6 Multilayer board 6a ... Unit board H Cream solder Pa ... Coil pattern L Coil parts

Claims (9)

[Claims] 1. A method for connecting a second printed board to a first printed board, comprising: providing a plurality of first connecting patterns on an upper surface of the first printed board; A plurality of second connection patterns facing the first connection pattern are provided on the lower surface of the substrate, and the first connection pattern and the second connection pattern are soldered by a reflow method using cream solder. A method for connecting a printed circuit board, comprising: 2. The method for connecting printed circuit boards according to claim 1, wherein at least the second printed circuit board is a multi-layer circuit board formed by laminating a plurality of unit boards. 3. The method for connecting printed circuit boards according to claim 2, wherein the second printed circuit board has a coil component formed by providing a coil pattern on a plurality of unit boards. 4. A method of connecting a printed circuit board for connecting a second printed circuit board to a first printed circuit board, wherein a plurality of first connecting patterns having through holes are provided on the first printed circuit board, and A plurality of second connection patterns facing the first connection pattern are provided on the lower surface of the printed circuit board, and the first connection pattern and the second connection pattern are soldered by a reflow method using cream solder. A method of connecting a printed circuit board, characterized by being attached. 5. The printed circuit board connecting method according to claim 4, wherein at least the second printed circuit board is a multi-layer circuit board formed by laminating a plurality of unit boards. 6. The method of connecting a printed circuit board according to claim 5, wherein the second printed circuit board has a coil component formed by providing a coil pattern on a plurality of unit boards. 7. A printed circuit board connecting method for connecting a second printed circuit board to a first printed circuit board, wherein a plurality of first connecting patterns having through holes are provided on the first printed circuit board, and A plurality of second connecting patterns and ventilation holes facing the first connecting pattern are provided on the printed circuit board, and the first connecting pattern and the second connecting pattern are flowed using a solder dip bath. A method for connecting a printed circuit board, characterized in that soldering is performed by using. 8. The method of connecting printed boards according to claim 7, wherein at least the second printed board is a multi-layer board formed by laminating a plurality of unit boards. 9. The method of connecting a printed circuit board according to claim 8, wherein the second printed circuit board has a coil component formed by providing a coil pattern on a plurality of unit boards.