JPH076268U - Jig for single-sided plating - Google Patents

Abstract

(57) [Summary] [Purpose] When plating only one side of a substrate, it is not necessary to provide an insulating coating on the side where plating is not required, and only the necessary side is brought into contact with the plating solution for plating. . [Structure] A single-sided plating jig 10 that holds a substrate 12 to be plated, is suspended by a suspending unit 14, and is immersed in a plating solution. This jig has a box-shaped structure, and the box-shaped portion has a front plate 16 having a board mounting opening 22 for mounting the board from the inside, and a board having an opening of the front board at the entire circumference thereof. It has a substrate mounting spring 30 that is in close contact with the peripheral edge of the substrate, and a rear plate 18 that can be opened and closed to attach and detach the substrate, so that the inside is a liquid-tight space when the substrate is mounted. In order to make the inside a liquid-tight space, packing 26, 3 is provided on the inner peripheral edge of the opening abutting the substrate and the rear plate mounting surface that can be opened and closed.
6 and so on are provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a jig used for plating only one side of a board. More specifically, as a box-shaped structure, only one side (front side) of the board comes into contact with the plating solution and the other side (back side) The present invention relates to a single-sided plating jig that faces the inside of a liquid-tight box-shaped part and is protected from contact with the plating solution. This jig is particularly useful for plating only one side of a disk-shaped wafer for manufacturing a thin film magnetic head.

[0002]

[Prior art]

A conventional jig for plating a substrate has a structure in which the plate to be plated is held by a plate-shaped member and immersed in the plating solution by the hanging part, and the entire surface of the substrate comes into contact with the plating solution. It was like this. For example, in manufacturing a thin film magnetic head, it is necessary to plate a magnetic film or a non-magnetic film on only one side of a substrate (wafer). As the substrate, a mixed ceramic of alumina (Al ₂ O ₃ ) and titanium carbide (TiC) is used, but this ceramic is conductive. Therefore, the magnetic film and non-magnetic film are also plated on the back surface where plating is not desired.

Therefore, in the conventional technique, a method of forming an insulating film in advance on the entire surface (back surface and outer peripheral surface) other than the surface (front surface) requiring plating is adopted. In order to form this insulating coating, the insulating resin is usually applied and dried several times, and after that step, the procedure of sending to the plating process is adopted.

[0004]

[Problems to be solved by the device]

 However, when forming an insulating coating, it takes several hours to dry the insulating resin once, and if it is performed several times, the working time is very long. Further, the work of applying and drying the insulating resin is also troublesome, and the material cost for that is wasted.

Further, even if an insulating film is formed on the back surface, etc., it may be damaged due to the conductivity of the substrate. If the back surface is slightly plated, the thickness of the plating film on the surface There is a problem that the distribution is adversely affected, uniform plating cannot be performed, and the product yield is reduced.

An object of the present invention is that when plating only one surface of a substrate, it is not necessary to provide an insulating coating on the surface where plating is unnecessary, and only the necessary surface is plated in contact with the plating solution. To provide a jig for single-sided plating.

[0007]

[Means for Solving the Problems]

 The present invention is a jig that holds a substrate to be plated, is hung by a hanging part, and is immersed in a plating solution, and has a box-shaped structure, and the box-shaped portion is a jig for the substrate. A front plate that has a board mounting opening for mounting from the inside, a board mounting spring that sticks the board to the peripheral edge of the opening of the front plate along its entire circumference, and a rear plate that can be opened and closed to attach and detach the board. This is a single-sided plating jig that has a plate and has a liquid-tight space inside when the substrate is mounted. In order to make the interior a liquid-tight space, packing etc. are provided on the inner peripheral edge of the opening where the board contacts and the mounting surface of the openable back plate.

[0008]

[Action]

 Only one side (front surface) of the substrate is exposed from the opening of the front plate of the box-shaped portion and contacts the plating solution. Since the back surface is inside the box-shaped portion, which is a liquid-tight space, it does not come into contact with the plating solution and therefore is not plated. Therefore, it is not necessary to form an insulating film on the back surface or outer peripheral surface. The preparation for plating work is completed by mounting the substrate in the opening of the front plate, pressing it with a spring, and sealing it with the rear plate.

[0009]

【Example】

 FIG. 1 is a side sectional view showing an embodiment of a single-sided plating jig according to the present invention, FIG. 2 is an enlarged view of part A thereof, and FIG. 3 is a perspective view showing the entire structure. This one-sided plating jig 10 holds a disk-shaped substrate (wafer) 12 to be plated, is suspended by a suspending section 14 and is immersed in a plating solution, and the substrate retaining section has a box-shaped structure. Is doing. The box-shaped portion is composed of a front plate 16, a rear plate 18, and a side plate 20, which are slightly larger and fixed to the suspension portion 14 at the upper end.

The front plate 16 is formed with a circular opening 22 for mounting the board 12 for mounting the board 12 from the inside. The opening 22 has a step at the inner peripheral edge and has a slightly smaller inside diameter so that the stepped portion 24 supports the substrate 12. An annular packing 26 is partially embedded in the surface of the step 24 facing the inside (the surface facing the substrate). In this manner, the vicinity of the outer peripheral edge of the surface of the substrate 12 contacts the packing 26 and is sealed.

Inside the front plate 16, there is provided a substrate mounting spring 30 for closely contacting the substrate 12 with the peripheral edge of the opening 22 over the entire circumference thereof. The board mounting spring 30 has a leaf spring structure here, and can be easily attached and detached with the thumbscrews 32 for fixing at both ends. An adjusting thumbscrew 34 is provided at the center of the board mounting spring 30, and the pressing force of the base plate 12 can be adjusted by its rotation. The adjusting thumbscrew 34 adjusts the force with which the base plate 12 is pressed against the packing 26 to prevent the plating solution from entering and prevent excessive stress from being applied.

The rear plate 18 is openable and closable with respect to the side plate 20 for attaching and detaching the substrate 12, and a packing 36 is provided between the rear plate 18 and the rear plate 18, and the structure can be fixed with a screw 38. As a result, the inside becomes a liquid-tight space when the substrate is attached. Note that this jig is for electroplating, and electricity is supplied to the substrate 12 from the hanging portion 14 through the front plate 16, for example. Therefore, although not shown, it is preferable to provide a conducting plate on the back surface of the front plate 16 so that the electrode of the substrate 12 contacts the protrusion.

Further, if necessary, as shown in FIG. 2, there may be a case where the opening 22 is sealed with the fluorocarbon rubber 40 between the opening 12 and the substrate 12. With this seal, the inside of the box-shaped portion can be made more liquid-tight.

To attach the substrate 12, first, the rear plate 18 is removed, and the thumbscrew 32 for fixing at least one of the substrate attaching springs 30 is removed. Then, the substrate 12 is attached to the stepped portion 24 of the opening 22 of the front plate 16 so that the surface to be plated faces the outside of the box-shaped portion (so as to face the opening 22), and the fixing portion that has been removed is fixed. Tighten the thumbscrew 32. At that time, if necessary, the pressing force of the adjusting thumbscrew 34 is adjusted so that the vicinity of the outer surface of the substrate 12 is brought into close contact with the packing 26. Then, the rear plate 18 is attached to make the inside of the box-shaped portion a liquid-tight space. In some cases, the gap between the edge of the opening 22 and the substrate 12 is sealed by the fluorine rubber 40 as shown in FIG. This state is transferred to the plating equipment. Only one surface (front surface) of the substrate 12 contacts the plating solution, and the back surface does not contact the plating solution inside the box-shaped portion. As a result, it is possible to plate only the necessary one side.

FIG. 4 is a side sectional view showing another embodiment. Since the basic configuration is the same as that described above, corresponding parts are designated by the same reference numerals, and description thereof will be omitted. A coil spring 42 is used here as a spring for pressing the substrate 12. Of course, such a structure may be used.

[0016]

[Effect of device]

 As described above, the present invention is a jig in which the substrate is mounted inside the box-shaped portion, only one surface of the substrate is exposed, and the opposite surface faces the liquid-tight box-shaped portion. However, it is possible to plate only the necessary one side without forming an insulating film on the back side of the substrate. Therefore, the number of steps such as applying and drying the insulating resin can be reduced, and the work efficiency is improved. In addition, the required film thickness distribution of the surface plating film will be uniform, and the product yield will be improved. Furthermore, the cost of the insulating coating material (insulating resin) is not required, and the cost can be reduced in combination with the reduction in the number of steps as described above.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of a single-sided plating jig according to the present invention.

FIG. 2 is an enlarged cross-sectional view of part A thereof.

FIG. 3 is a perspective view showing the overall structure of a jig for single-sided plating according to the present invention.

FIG. 4 is a side sectional view showing another embodiment of the single-sided plating jig according to the present invention.

[Explanation of symbols]

 10 Single-sided plating jig 12 Substrate 14 Hanging part 16 Front plate 18 Rear plate 22 Opening 26 Packing 30 Board mounting spring 36 Packing

Claims (1)

[Scope of utility model registration request] 1. A jig which holds a substrate to be plated, is hung by a hanging portion, and is immersed in a plating solution, and has a box-shaped structure, and the box-shaped portion has the substrate inside. A front plate having an opening for mounting a substrate for mounting from the front plate, a substrate mounting spring for closely contacting the substrate with the peripheral edge of the opening of the front plate over its entire circumference, and a rear plate that can be opened and closed for mounting and dismounting the substrate. A jig for single-sided plating that has a liquid-tight space inside when mounted on a substrate.