JPH0760493B2 - Thin film magnetic head - Google Patents

Description

The present invention relates to a thin film magnetic head of a magnetic disk device.

[Prior Art] In a conventional thin film magnetic head, as shown in FIG. 3, an insulating protective film 2 is provided on a conductive substrate 1, and a first magnetic pole 3 using a soft magnetic material and a conductive film are provided on the insulating protective film 2. Alternatively, the non-conductive gap layer 4, the insulating layer 5, the conductor coil 6, the insulating layer 7, and the second magnetic pole 8 of the soft magnetic material are sequentially formed, and then the end surface A of the gap portion is polished and finished.

[Problems to be solved by the invention]

In the structure described above, the conductor coil 6 is used by being connected to an external circuit, so that the potential is fixed. But magnetic pole 3
Since and 8 are surrounded by the insulator, the potential is not fixed.
Therefore, when static electricity is generated by the movement of the medium (magnetic disk) facing the head, the potential of the magnetic pole rises and discharges to the surroundings, causing noise to be mixed into the reproduced signal.

[Means for Solving the Problems] The present invention provides a thin-film magnetic head which solves the above-mentioned problems. The means is to provide an insulating layer on a non-magnetic conductive substrate, and to form a thin film on the insulating layer. A thin film magnetic head in which a magnetic pole and a coil are formed by a technique, a hole reaching a substrate is provided in a part of the insulating layer, and the magnetic pole is electrically connected to the substrate through the hole. .

[Work]

In the thin film magnetic head, by electrically connecting the magnetic poles to the conductive substrate, the static electricity generated in the magnetic poles by the movement of the opposing magnetic disk can be released to the ground through the substrate to prevent discharge.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram showing a first embodiment of the present invention, in which a is a plan view and b is a sectional view taken along line bb of FIG.

In this embodiment, as shown in the figure, an insulating layer 12 having a hole 11 reaching the substrate is provided on a conductive substrate 10, and a first magnetic pole 13 is formed on the insulating layer 12 from the hole 11 by a soft magnetic material. A gap layer (insulator) 15 provided so as to be in contact with the substrate 10 and having an opening in the rear closure portion 14 is provided thereon, and a coil pattern 17 is further provided via an insulating layer 16 on the gap layer. A second magnetic pole 18 connected by the rear closure portion 14 is provided and then polished from the end face of the substrate to a line indicated by a chain line 19.

In this embodiment having such a configuration, the magnetic poles 13 and 18 are the insulating layer 1
Since it is electrically connected to the substrate 10 through the second hole 11, the magnetic pole can be kept at the same potential as the device frame by holding the substrate in the device with a conductive material.

Next, a second embodiment will be described with reference to FIG. In the figure, a is a plan view and b is a sectional view taken along the line bb in FIG. A, and the same parts as those in FIG.

The difference between this embodiment and the previous embodiment is that the previous embodiment is a substrate.
In contrast to the fact that the first magnetic pole 13 is directly electrically connected from the hole 11 of the insulating layer 12 provided on the layer 10 and the gap layer 15 is an insulator, in the present embodiment, the gap layer 15 Is formed of a conductive non-magnetic material and is connected to the conductive substrate 10 through the hole 11 of the insulating layer 12, and the function and effect are exactly the same as in the previous embodiment.

〔The invention's effect〕

As described above, according to the present invention, the magnetic poles are electrically connected to the conductive substrate directly through the holes provided in the insulating layer or through the gap layer of the conductive magnetic material, so that the recording medium moves in the opposite direction. As a result, static electricity generated in the magnetic pole can be released to the ground through the substrate. This makes it possible to prevent noise due to discharge from entering the reproduction signal.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of a thin film magnetic head of the present invention, FIG. 2 is a diagram for explaining a second embodiment of the present invention, and FIG. 3 is a conventional thin film magnetic head. FIG. In the figure, 10 is a conductive substrate, 11 is a hole, 12 is an insulating layer, and 13 is a first
Magnetic pole, 14 is the rear closure part, 15 is the gap layer, 16
Is an insulating layer, 17 is a coil pattern, and 18 is a second magnetic pole.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hitoshi Takagi, 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa, Fujitsu Limited (72) Inventor, Kunio Hata, 1015, Kamedota, Nakahara-ku, Kawasaki, Kanagawa, Fujitsu Limited ( 56) References JP-A-50-161224 (JP, A)

Claims (2)

[Claims] 1. An insulating layer is provided on a non-magnetic conductive substrate,
In a thin film magnetic head having a magnetic pole and a coil formed thereon by a thin film technique, a hole reaching the substrate is provided in a part of the insulating layer, and the magnetic pole is electrically connected to the substrate through the hole. Thin film magnetic head. 2. The thin-film magnetic head according to claim 1, wherein the magnetic pole and the substrate are electrically connected to each other through a conductive non-magnetic material formed in a gap portion of the magnetic pole. .