JPH0751787Y2 - Surface mount electronic components - Google Patents
Surface mount electronic componentsInfo
- Publication number
- JPH0751787Y2 JPH0751787Y2 JP1988165414U JP16541488U JPH0751787Y2 JP H0751787 Y2 JPH0751787 Y2 JP H0751787Y2 JP 1988165414 U JP1988165414 U JP 1988165414U JP 16541488 U JP16541488 U JP 16541488U JP H0751787 Y2 JPH0751787 Y2 JP H0751787Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electronic component
- mount electronic
- surface mount
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、面実装部品の電極部の構造に関し、特に、半
田付等による実装時のストレス低減に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a structure of an electrode portion of a surface mount component, and more particularly to reduction of stress at the time of mounting by soldering or the like.
従来この種の面実装電子部品は、第３図の様に素子部２
の両側の電極部１の実装面の面積とその反対の面（上
面）の面積が等しく、かつ、実装面と隣接する電極部側
面は実装面に垂直であった。Conventionally, this type of surface-mounted electronic component has an element portion 2 as shown in FIG.
The area of the mounting surface of the electrode portion 1 on both sides of the surface was equal to the area of the opposite surface (upper surface), and the side surface of the electrode portion adjacent to the mounting surface was perpendicular to the mounting surface.
上述した従来の面実装電子部品は、第４図に示すよう
に、平面絶縁基板５の平面上に形成された電極部４に従
来の面実装電子部品を半田３をもって実装したときの半
田３のつき方は電極部２の側面及び実装面と反対面（上
面）に半田３がはい上がってくる。このため環境の温度
変化による熱膨張係数の違いによるストレスが電極部２
にかかり電極部２が破壊するという欠点がある。As shown in FIG. 4, the above-mentioned conventional surface mount electronic component has the solder 3 when the conventional surface mount electronic component is mounted with the solder 3 on the electrode portion 4 formed on the plane of the flat insulating substrate 5. The solder 3 sticks up to the side surface of the electrode portion 2 and the surface (upper surface) opposite to the mounting surface. Therefore, the stress caused by the difference in the coefficient of thermal expansion due to the temperature change of the environment causes the electrode portion 2
There is a drawback in that the electrode part 2 is destroyed due to this.
本考案によれば、対向する両端面に電極部を有する面実
装電子部品において、前記両端面側に位置して前記電極
部の実装面と隣接する両端面側の電極面形状が凹状の湾
曲形を有するとともに前記実装面と前記湾曲形の電極面
とに隣接する電極面の幅が前記実装面の近傍において前
記凹状の底部近傍における幅より大きな寸法となるよう
に前記実装面とその反対側の間に延在していることを特
徴とする面実装電子部品が得られる。According to the present invention, in a surface mount electronic component having electrode portions on both end surfaces facing each other, the electrode surface shape on both end surface sides located on the both end surface sides and adjacent to the mounting surface of the electrode portion is a concave curved shape. Of the mounting surface and the opposite side thereof so that the width of the electrode surface adjacent to the mounting surface and the curved electrode surface is larger than the width in the vicinity of the concave bottom portion in the vicinity of the mounting surface. A surface mount electronic component is obtained which is characterized by extending between.
次に、本考案を図面を参照してより詳細に説明する。 The present invention will now be described in more detail with reference to the drawings.
第１図は、本考案の一実施例のスケッチ図（立体図）で
ある。面実装電子部品は、複数の電極部１及び素子２を
所有する。この面実装電子部品は、平面絶縁基板５の平
面上に形成された回路導体部４に面実装電子部品電極部
２を半田３をもって実装する。本考案の面実装電子部品
の電極部２の側面の形状は凹状の湾曲形をしている。FIG. 1 is a sketch drawing (three-dimensional drawing) of an embodiment of the present invention. The surface mount electronic component has a plurality of electrode parts 1 and a plurality of elements 2. In this surface mount electronic component, the surface mount electronic component electrode portion 2 is mounted on the circuit conductor portion 4 formed on the flat surface of the flat insulating substrate 5 with the solder 3. The side surface of the electrode part 2 of the surface-mounted electronic component of the present invention has a concave curved shape.
第２図は、本考案の面実装電子部品を絶縁基板５の平面
上に形成された電極部４に半田３をもって実装した時の
半田３の付き方を示したものの断面図であり、半田３の
表面形状は面実装電子部品の電極部２の側面に沿って半
田３ははい上るが半田３の自重のために湾曲部より上に
ははい上れない。FIG. 2 is a cross-sectional view showing how the solder 3 is attached when the surface mount electronic component of the present invention is mounted on the electrode portion 4 formed on the plane of the insulating substrate 5 with the solder 3. The surface shape of the solder 3 rises along the side surface of the electrode portion 2 of the surface-mounted electronic component, but cannot rise above the curved portion due to the weight of the solder 3.
以上説明したように、本考案では電極部側面の形状が凹
状の湾曲形を有するため、台形形状にしたときより実装
面の接触面積を広くできるのみならず、電極部上部に半
田がはい上がることを防止し、環境の温度変化に対し電
極部の伸縮による破壊を防ぐことができる。As described above, in the present invention, since the side surface of the electrode portion has a concave curved shape, not only can the contact area of the mounting surface be wider than when the trapezoidal shape is used, but also the solder can rise to the upper portion of the electrode portion. It is possible to prevent the damage due to expansion and contraction of the electrode portion against the temperature change of the environment.
第１図は本考案の一実施例のスケッチ図（立体図）であ
る。第２図は第１図の一実施例を絶縁基板上に形成され
た電極半導体部４に半田３で実装した時の半田３の付き
方を示した断面図である。第３図は従来の面実装電子部
品の立体図であり、第４図は同じく他の絶縁基板上の電
極導体部４に半田３で実装した時の半田３の付き方を示
した断面図である。 １……面実装電子部品の電極部、２……面実装電子部品
の素子部、３……半田、４……回路導体部、５……絶縁
基板。FIG. 1 is a sketch drawing (three-dimensional drawing) of an embodiment of the present invention. FIG. 2 is a sectional view showing how the solder 3 is attached when the embodiment of FIG. 1 is mounted on the electrode semiconductor portion 4 formed on the insulating substrate with the solder 3. FIG. 3 is a three-dimensional view of a conventional surface mount electronic component, and FIG. 4 is a sectional view showing how the solder 3 is attached when the solder 3 is mounted on the electrode conductor portion 4 on another insulating substrate. is there. 1 ... Electrode part of surface mount electronic component, 2 ... Element part of surface mount electronic component, 3 ... Solder, 4 ... Circuit conductor part, 5 ... Insulating substrate.
Claims (1)
子部品において、前記両端面側に位置して前記電極部の
実装面と隣接する両端面側の電極面形状が凹状の湾曲形
を有するとともに前記実装面と前記湾曲形の電極面とに
隣接する電極面の幅が前記実装面の近傍において前記凹
状の底部近傍における幅より大きな寸法となるように前
記実装面とその反対側の間に延在していることを特徴と
する面実装電子部品。1. A surface mount electronic component having electrode portions on opposite end surfaces thereof, wherein the electrode surface shapes on both end surface sides which are located on the both end surface sides and adjacent to the mounting surface of the electrode portion are concave curved shapes. Between the mounting surface and the opposite side thereof such that the width of the electrode surface adjacent to the mounting surface and the curved electrode surface is larger than the width in the vicinity of the concave bottom in the vicinity of the mounting surface. Surface-mounted electronic component characterized by being extended to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165414U JPH0751787Y2 (en) | 1988-12-20 | 1988-12-20 | Surface mount electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988165414U JPH0751787Y2 (en) | 1988-12-20 | 1988-12-20 | Surface mount electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0284313U JPH0284313U (en) | 1990-06-29 |
| JPH0751787Y2 true JPH0751787Y2 (en) | 1995-11-22 |
Family
ID=31451877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988165414U Expired - Lifetime JPH0751787Y2 (en) | 1988-12-20 | 1988-12-20 | Surface mount electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751787Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015133340A1 (en) * | 2014-03-03 | 2015-09-11 | 太陽誘電株式会社 | Electrochemical device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5934111Y2 (en) * | 1979-10-23 | 1984-09-21 | 日本ケミコン株式会社 | Connection structure of leadless electronic components |
| JPS602801U (en) * | 1983-06-20 | 1985-01-10 | 三洋電機株式会社 | Chip-shaped circuit components |
-
1988
- 1988-12-20 JP JP1988165414U patent/JPH0751787Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0284313U (en) | 1990-06-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |