JPH07503032A - Article cleaning method and cleaning composition - Google Patents
Article cleaning method and cleaning compositionInfo
- Publication number
- JPH07503032A JPH07503032A JP5511448A JP51144893A JPH07503032A JP H07503032 A JPH07503032 A JP H07503032A JP 5511448 A JP5511448 A JP 5511448A JP 51144893 A JP51144893 A JP 51144893A JP H07503032 A JPH07503032 A JP H07503032A
- Authority
- JP
- Japan
- Prior art keywords
- hydrocarbons
- mixture
- liquid
- volume
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims description 57
- 238000004140 cleaning Methods 0.000 title claims description 45
- 238000000034 method Methods 0.000 title claims description 34
- 229930195733 hydrocarbon Natural products 0.000 claims description 52
- 150000002430 hydrocarbons Chemical class 0.000 claims description 50
- 239000007788 liquid Substances 0.000 claims description 46
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 23
- 239000004215 Carbon black (E152) Substances 0.000 claims description 20
- -1 saturated aliphatic alcohols Chemical class 0.000 claims description 17
- 150000001298 alcohols Chemical class 0.000 claims description 14
- 238000004821 distillation Methods 0.000 claims description 13
- 239000003599 detergent Substances 0.000 claims description 11
- 229910052736 halogen Inorganic materials 0.000 claims description 8
- 150000002367 halogens Chemical class 0.000 claims description 8
- 150000001491 aromatic compounds Chemical class 0.000 claims description 6
- 150000002894 organic compounds Chemical class 0.000 claims description 6
- 239000003208 petroleum Substances 0.000 claims description 6
- 238000013019 agitation Methods 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical class C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims description 4
- 239000012188 paraffin wax Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims 5
- 230000004907 flux Effects 0.000 description 32
- 239000002904 solvent Substances 0.000 description 16
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 14
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 14
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000005476 soldering Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 7
- 238000009835 boiling Methods 0.000 description 6
- 239000006071 cream Substances 0.000 description 6
- 235000007586 terpenes Nutrition 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 210000001520 comb Anatomy 0.000 description 5
- 238000011109 contamination Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 150000003505 terpenes Chemical class 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 150000008282 halocarbons Chemical class 0.000 description 3
- 230000009931 harmful effect Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- CYEJMVLDXAUOPN-UHFFFAOYSA-N 2-dodecylphenol Chemical compound CCCCCCCCCCCCC1=CC=CC=C1O CYEJMVLDXAUOPN-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000003495 polar organic solvent Substances 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 1
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 1
- UAZLASMTBCLJKO-UHFFFAOYSA-N 2-decylbenzenesulfonic acid Chemical compound CCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O UAZLASMTBCLJKO-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- 239000001293 FEMA 3089 Substances 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-M benzenesulfonate Chemical compound [O-]S(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-M 0.000 description 1
- 229940077388 benzenesulfonate Drugs 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- KWKXNDCHNDYVRT-UHFFFAOYSA-N dodecylbenzene Chemical compound CCCCCCCCCCCCC1=CC=CC=C1 KWKXNDCHNDYVRT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 231100000086 high toxicity Toxicity 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 229930003658 monoterpene Natural products 0.000 description 1
- 150000002773 monoterpene derivatives Chemical class 0.000 description 1
- 235000002577 monoterpenes Nutrition 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229940072033 potash Drugs 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229930004725 sesquiterpene Natural products 0.000 description 1
- 150000004354 sesquiterpene derivatives Chemical class 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
- C11D7/262—Alcohols; Phenols fatty or with at least 8 carbon atoms in the alkyl or alkenyl chain
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/024—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Wood Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Detergent Compositions (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるため要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 物品の洗浄方法及び洗浄組成物 本発明は物品の洗浄方法、及びその方法に使用するための洗浄組成物に関する。[Detailed description of the invention] Article cleaning method and cleaning composition The present invention relates to a method of cleaning articles and a cleaning composition for use in the method.
印刷回路板(PCB)の製造において、ハンダ併用フラックスを印刷回路板に適 用して印刷回路板へのハンダの強い結合を促進することが通常である。フラック ス及びハンダは、例えば、ウェーブハンダ付は方法またはりフローハンダ付は方 法により適用し得る。ハンダ付は後に、フラックスは印刷回路板に残る。その残 留フラックスは、早期の回路破損の可能性を減少するために除去される必要があ る。In the production of printed circuit boards (PCBs), flux combined with solder is applied to printed circuit boards. It is common to use a solder to promote a strong bond of the solder to the printed circuit board. flack For example, wave soldering is a method or flow soldering is a method. applicable by law. After soldering, the flux remains on the printed circuit board. the remains The residual flux needs to be removed to reduce the possibility of premature circuit failure. Ru.
ハンダ付は技術を使用する電子部品、例えば、PCBの製造に使用されるフラッ クスは、一般に、ロジン含有フラックスまたは合成の水溶性フラックスである。Soldering is an electronic component that uses technology, for example, the flash used in the manufacture of PCBs. The flux is generally a rosin-containing flux or a synthetic water-soluble flux.
ロジン含有フラックスとして、軽度に活性化されたロジン(HMA)フラックス 及びロジン活性化(RA)フラックスが挙げられ、これらは、例えば、有機酸、 アミン、アミドまたはハロゲン含有化合物を使用するロジン含有フラックスの活 性化により得られる。活性化物質の多くはハンダ付けの際に分解し、こうして電 子部品を損傷し得る無機物質を生しる。こうして、除去すべき残渣はロジン分子 と無機物質の組み合わせを含む。Mildly activated rosin (HMA) flux as rosin-containing flux and rosin activated (RA) fluxes, which include, for example, organic acids, Activation of rosin-containing fluxes using amines, amides or halogen-containing compounds Obtained by sexualization. Many of the activators decompose during soldering and thus Generates inorganic substances that can damage sub-components. In this way, the residue to be removed is rosin molecules. and combinations of inorganic substances.
ハンダ付は後の物品の脱フラツクスのための多くの従来使用された方法において 、残留フラックスはハロゲン化炭化水素溶剤を使用して除去されていた。しかし ながら、近年、これらの溶剤は環境に対して特に有害な効果を有することが認め られるようになってきた。更に、それらの物理的性質のために、特別な要件がそ れらの貯蔵、取扱及び廃棄に必要とされる。それ故、可能な場合にはハロゲン炭 化水素溶剤の使用を避けることが望ましい。Soldering is used in many traditionally used methods for subsequent defluxing of articles. , the residual flux had been removed using halogenated hydrocarbon solvents. but However, in recent years it has been recognized that these solvents have particularly harmful effects on the environment. It has become possible to do so. Furthermore, due to their physical properties, special requirements apply to them. required for their storage, handling and disposal. Therefore, halogenated charcoal should be used where possible. It is desirable to avoid the use of hydrohydric solvents.
欧州特許第416.763号明細書は、テルペン炭化水素またはその他の非ハロ ゲン化溶剤を含む汚れた物品、例えば、I’CBの洗浄用の組成物を開示してい る。洗浄工程後に、残存している痕跡量の溶剤は、溶剤と水性媒体の共沸混合物 を生成することにより共沸により除去されると言われており、その共沸混合物は 物品の表面から蒸発される。必要により、低沸点有機溶剤、例えば、ケトン、ア ミン、エーテルまたはアルコールが洗浄組成物中に含まれて共沸混合物の生成を 促進してもよい。低沸点有機溶剤が、存在する場合には、03〜C4アルコール であることが好ましい。EP 416.763 discloses that terpene hydrocarbons or other non-halo Discloses a composition for cleaning soiled articles, such as I'CB, containing a genified solvent. Ru. After the cleaning process, any remaining traces of solvent form an azeotrope of solvent and aqueous medium. is said to be removed azeotropically by producing Evaporated from the surface of the article. If necessary, use a low-boiling organic solvent such as a ketone or a Minerals, ethers, or alcohols are included in the cleaning composition to promote the formation of azeotropes. May be promoted. Low-boiling organic solvent, if present, 03-C4 alcohol It is preferable that
日本特許第3−6300号明細書は、ターペンタイン油及び表面活性剤と共に、 IOcモノテルペン〜15Cセスキテルペンから選ばれたテルペン炭化水素を含 む親油性洗剤の使用を開示している。その組成物は、アルコール(示された唯一 の例はc3アルコールである)、エーテル、ケトン、エステル、芳香族化合物ま たは水を更に含んでもよい。Japanese Patent No. 3-6300 discloses that, together with turpentine oil and a surfactant, Contains terpene hydrocarbons selected from IOc monoterpenes to 15C sesquiterpenes. Discloses the use of lipophilic detergents. Its composition consists of alcohol (the only one indicated) examples are c3 alcohols), ethers, ketones, esters, aromatics or or may further contain water.
米国特許第4.983.224号明細書は、テルペンまたはテルペノール、表面 活性剤及び非プロトン性溶剤、例えば、DMFまたはDMSOを含む洗浄組成物 を開示している。U.S. Pat. No. 4,983,224 discloses that terpenes or terpenols, surface Cleaning compositions comprising an activator and an aprotic solvent, such as DMF or DMSO is disclosed.
欧州特許第120.319号明細書は、電子部品からワックスを除去するための 洗浄組成物を開示しており、その組成物はハロゲン化炭化水素または非ハロゲン 化炭化水素、少なくとも2個のフッ素原子を含むフッ素化アルコール及び、必要 により、更に別の極性の有機溶剤を含む。炭化水素は、とりわけ、石油エーテル であってもよい。更に別の極性の有機溶剤は、例えば、アルコールであってもよ い。European Patent No. 120.319 discloses a method for removing wax from electronic components. Discloses a cleaning composition, the composition comprising a halogenated hydrocarbon or a non-halogen fluorinated hydrocarbons, fluorinated alcohols containing at least two fluorine atoms, and as necessary , further contains another polar organic solvent. Hydrocarbons are, inter alia, petroleum ether It may be. Further polar organic solvents may be e.g. alcohols. stomach.
アルコールとして、夫々の場合に7個以下の炭素原子を有する脂肪族アルコール 、環式アルコール及び芳香族アルコールが提案されている。as alcohol, aliphatic alcohols having in each case not more than 7 carbon atoms; , cyclic alcohols and aromatic alcohols have been proposed.
英国特許第2.175.004号明細書は、金属表面及びプラスチック表面から 汚れ及びグリースを除去するための洗浄組成物を開示しており、その組成物は8 5〜97重量部の脂肪族化合物及び/または脂環式化合物を含む非芳香族炭化水 素、3〜15重量部の少なくとも1個のC8〜C1,8アルキル基を含むアルキ ル化芳香族物質及び、好ましい形態において、0.1−1重量部の添加剤(これ は組成物を水と非相溶性にし、こうして洗浄工程後に水からの分離を促進する) を含む。添加剤は、8〜20個の炭素原子を有する脂肪族アルコール、アルキレ ングリコールのエーテル誘導体及び8個より多い炭素原子を有するヒドロキシカ ルボン酸から選ばれてもよい。British Patent No. 2.175.004 discloses that from metal surfaces and plastic surfaces Discloses a cleaning composition for removing dirt and grease, the composition comprising: Non-aromatic hydrocarbon water containing 5 to 97 parts by weight of aliphatic compounds and/or alicyclic compounds alkyl containing 3 to 15 parts by weight of at least one C8-C1,8 alkyl group; aromatics and, in a preferred form, 0.1-1 parts by weight of additives (such as makes the composition incompatible with water, thus facilitating its separation from water after the washing step) including. Additives include aliphatic alcohols, alkylene alcohols having 8 to 20 carbon atoms. Ether derivatives of glycols and hydroxycarbons having more than 8 carbon atoms It may be selected from rubonic acids.
英国特許第1.524.448号明細書は、表面から油状汚染物質及び脂肪汚染 物質を除去するための低温クリーナーを開示している。その組成物は鉱油留分( これは主としてパラフィン系またはナフテン系の留分であることが好ましい)、 及び6〜20個の炭素原子を含む飽和または不飽和の脂肪族アルコールまたは脂 環式アルコール及び/または脂肪酸、並びにスルホコハク酸ジエステルを含んで もよい。British Patent No. 1.524.448 discloses that oily contaminants and fatty contaminants from the surface A cryogenic cleaner for removing substances is disclosed. Its composition consists of mineral oil distillate ( This is preferably a predominantly paraffinic or naphthenic fraction), and saturated or unsaturated aliphatic alcohols or fats containing 6 to 20 carbon atoms. Contains cyclic alcohols and/or fatty acids and sulfosuccinic acid diesters Good too.
アルコールとして、不飽和アルコールが好ましいと言われる。It is said that unsaturated alcohols are preferred as alcohols.
国際特許第鶴8710020り1号明細書は、印刷回路板及び/または配線板か らロジンフラックスまたは接着テープ残渣の洗浄方法を開示しており、この方法 では、これらの板が、必要により表面活性剤(これはテルペンを乳化できる)と 組み合わせて、テルペンを含む組成物と接触させられる。International Patent No. 8710020-1 specifies a printed circuit board and/or a wiring board. discloses a method for cleaning rosin flux or adhesive tape residue, and this method Now, these plates are treated with a surfactant (which can emulsify the terpenes) if necessary. The combination is contacted with a composition containing a terpene.
欧州特許第412.475号明細書は、PCBを洗浄するための洗浄組成物を開 示しており、その組成物は二塩基酸エステル及びテルペン以外の炭化水素溶剤を 含む。European Patent No. 412.475 discloses a cleaning composition for cleaning PCBs. The composition contains no hydrocarbon solvents other than dibasic acid esters and terpenes. include.
炭化水素溶剤として、石油から誘導された溶剤、例えば、ミネラルスピリット、 ナフサ及び芳香族化合物が提案されている。その組成物は、二塩基酸エステルと 炭化水素溶剤の混和性を改良するために、更に別の成分、例えば、ノニオン系表 面活性剤を含んでもよい。As hydrocarbon solvents, solvents derived from petroleum, such as mineral spirits, Naphtha and aromatics have been proposed. The composition comprises a dibasic acid ester and To improve the miscibility of the hydrocarbon solvent, further components, e.g. It may also contain a surfactant.
欧州特許第104.633号明細書は、印刷回路板を共沸液体溶剤中に浸漬する PCBの洗浄方法を開示している。共沸液体は、比較的低分子量の炭化水素、例 えば、ンクロヘキサンまたはへブタンと一緒に、低分子量のアルコール、例えば 、C3またはC4アルコールを含んでもよい。EP 104.633 immerses a printed circuit board in an azeotropic liquid solvent. A method for cleaning PCBs is disclosed. Azeotropic liquids are relatively low molecular weight hydrocarbons, e.g. For example, together with nclohexane or hebutane, a low molecular weight alcohol, e.g. , C3 or C4 alcohol.
欧州特許第302.313号明細書は、物体を密閉容器中で水と更に別の溶剤、 例えば、塩化メチレン、トリクロロエチレンまたはテトラクロロエタンの共沸混 合物で処理する物体の洗浄方法を開示している。European Patent No. 302.313 discloses that an object is treated in a closed container with water and another solvent, For example, azeotropic mixtures of methylene chloride, trichloroethylene or tetrachloroethane Discloses a method for cleaning objects treated with compounds.
本発明は、物品を (i )C8〜CI5パラフイン系炭化水素及びナフテン系炭化水素から選ばれ た一種以上の炭化水素を含み、カリ液体の芳香族化合物及び炭化水素の合計含量 を基準として8重量%以下の芳香族化合物含量を有する炭化水素含有液体、(i i)C5〜CI5の直鎖または分枝鎖の飽和脂肪族アルコールから選ばれた一種 以上のアルコールを含むアルコール含有液体と接触させる物品の洗浄方法であっ て、これらの液体力いロゲン含有有機化合物を実質的に含まず、かつその方法が 物品を成分(i)及び(ii)を含む液体混合物と接触させる場合に、成分(i i)が炭化水素及びアルコールの合計含量を基準として少なくとも5容量%に相 当することを特徴とする物品の洗浄方法を提供する。The present invention provides an article (i) Selected from C8 to CI5 paraffinic hydrocarbons and naphthenic hydrocarbons The total content of aromatic compounds and hydrocarbons in the potash liquid a hydrocarbon-containing liquid having an aromatics content of not more than 8% by weight, based on i) One selected from C5 to CI5 linear or branched saturated aliphatic alcohols This is a method for cleaning articles that come into contact with alcohol-containing liquids containing the above alcohols. These liquids are substantially free of rogen-containing organic compounds, and the process is When the article is contacted with a liquid mixture comprising components (i) and (ii), component (i) i) corresponds to at least 5% by volume based on the total content of hydrocarbons and alcohols; To provide a method for cleaning an article, which is characterized in that:
一種以上の液体は5 ppm以下のハロゲンを含むことが有利である。Advantageously, the one or more liquids contain less than 5 ppm of halogen.
物品は炭化水素含有液体及びアルコール含有液体と連続して接触されてもよい。The article may be contacted sequentially with a hydrocarbon-containing liquid and an alcohol-containing liquid.
しかしながら、物品は前記液体の液体混合物と接触されることが好ましく、前記 混合物は75〜95容量部の08〜C15パラフイン系炭化水素及びナフテン系 炭化水素から選ばれた一種以上の炭化水素と、5〜25容量部、好ましくは8〜 15容量部のC5〜C15直鎖または分枝鎖の飽和脂肪族アルコールとを含む。However, it is preferred that the article is contacted with a liquid mixture of said liquid, said The mixture contains 75 to 95 parts by volume of 08 to C15 paraffinic hydrocarbons and naphthenic hydrocarbons. one or more hydrocarbons selected from hydrocarbons, and 5 to 25 parts by volume, preferably 8 to 25 parts by volume. 15 parts by volume of C5-C15 straight or branched chain saturated aliphatic alcohol.
液体混合物の芳香族化合物含量は、その混合物の芳香族化合物及び炭化水素の合 計含量を基準として8重量%以下であることが認められるであろう。The aromatics content of a liquid mixture is the combination of aromatics and hydrocarbons in the mixture. It will be appreciated that it will not exceed 8% by weight based on the total content.
炭化水素含有液体は石油の蒸留中に得られた蒸留留分であることが有利である。Advantageously, the hydrocarbon-containing liquid is a distillate fraction obtained during distillation of petroleum.
炭化水素含有液体はナフタレンl容量部当たり0.5〜2容量部のノルマルパラ フィン及びイソパラフィンを含むことが好ましい。存在する場合の芳香族化合物 の量は、炭化水素及び芳香族化合物の合計重量を基準として2重量%を越えない ことが好ましく、1重量%を越えないことが更に好ましい。例えば、炭化水素含 有液体は、液体の合計重量を基準として1重量%未満の芳香族化合物と共に、約 55容量部のノルマルパラフィン及びイソパラフィンと、約45容量部のナフタ レンとを含んでもよい。The hydrocarbon-containing liquid has a normal concentration of 0.5 to 2 parts by volume per 1 part by volume of naphthalene. Preferably, it includes fins and isoparaffins. Aromatic compounds if present does not exceed 2% by weight based on the total weight of hydrocarbons and aromatic compounds. It is more preferable that the amount does not exceed 1% by weight. For example, hydrocarbon-containing The liquid contains less than 1% by weight of aromatic compounds based on the total weight of the liquid, and about 55 parts by volume of normal paraffin and isoparaffin and about 45 parts by volume of naphtha It may also contain ren.
炭化水素含有液体の蒸留沸騰範囲は大気圧で150℃〜260℃の範囲内にある ことが好ましい。The distillation boiling range of hydrocarbon-containing liquids is within the range of 150°C to 260°C at atmospheric pressure. It is preferable.
アルコール含有液体(これは06〜C8アルコールから選ばれたアルコールを含 むことが有利である)は、線状または分枝であってもよい脂肪族−級アルコール の混合物を含むことが好ましい。アルコール含有液体の蒸留沸騰範囲は大気圧で 150℃〜310℃の範囲内にあることが好ましい。Alcohol-containing liquid (this includes an alcohol selected from 06 to C8 alcohols) (advantageously) is an aliphatic alcohol which may be linear or branched. Preferably, it contains a mixture of. The distillation boiling range of alcohol-containing liquids is at atmospheric pressure. It is preferably within the range of 150°C to 310°C.
洗浄方法において、物品は、超音波攪拌を伴わないで、または好ましくは超音波 攪拌を伴って液体成分またはその液体混合物中の浸漬により;噴霧により;凝縮 が起こるような条件下で物品を蒸気と接触させることにより;または前記方法の 組み合わせにより炭化水素成分及びアルコール成分と接触させられてもよい。In the cleaning method, the article is cleaned without ultrasonic agitation or preferably with ultrasonic agitation. By immersion in a liquid component or liquid mixture thereof with stirring; by spraying; by condensation by contacting the article with steam under conditions such that The hydrocarbon component and the alcohol component may be contacted in combination.
物品が炭化水素含有液体及びアルコール含有液体と連続して接触させられる場合 、物品は最初に液体のいずれかと接触させられてもよい。物品が接触させられる 液体または混合物は周囲温度〜90℃の温度、更に好ましくは40℃〜50℃の 温度であってもよい。洗浄された物品は、その後、空気、好ましくは熱い空気中 で乾燥させられてもよい。When the article is brought into continuous contact with hydrocarbon-containing liquids and alcohol-containing liquids , the article may first be contacted with any liquid. items are brought into contact The liquid or mixture is at a temperature between ambient temperature and 90°C, more preferably between 40°C and 50°C. It may also be temperature. The cleaned article is then placed in air, preferably hot air. May be dried.
必要により、物品は洗剤溶液と接触され、そして水ですすがれて洗剤溶液を除去 し、その後、乾燥させられてもよい。If necessary, the article is contacted with a detergent solution and rinsed with water to remove the detergent solution. and then may be dried.
洗剤溶液は、アルキルベンゼンスルホネート及びアルキルフェノールアルコキシ レート、例えば、アルキルフェノールエトキシレートを含んでもよい。アルキル ベンゼンスルホネート及びアルキルフェノールアルコキシレートのアルキル基は 、夫々の場合に、8〜14個の炭素原子を有する脂肪族アルキル基、環式アルキ ル基または脂環式アルキル基であることが有利である。洗剤溶液は、例えば、ド デシルベンゼンスルホネートとドデシルフェノールエトキシレートの混合物であ ってもよい。物品が洗剤溶液と接触させられた後に、残留洗剤が、水、好ましく は脱イオン水ですすぐことにより除去されることが適当である。The detergent solution contains alkylbenzene sulfonates and alkylphenol alkoxy eg, alkylphenol ethoxylates. alkyl The alkyl group of benzene sulfonate and alkylphenol alkoxylate is , in each case aliphatic alkyl groups with 8 to 14 carbon atoms, cyclic alkyl groups Advantageously, it is a group or a cycloaliphatic alkyl group. The detergent solution can be It is a mixture of decylbenzene sulfonate and dodecylphenol ethoxylate. You can. After the article has been brought into contact with the detergent solution, residual detergent is removed from water, preferably water. is suitably removed by rinsing with deionized water.
洗剤溶液の適用及びその後のすすぎは、残留フラックス中に存在し得る潜在的に 有害な無機物質の除去を助ける。Application of the detergent solution and subsequent rinsing removes any potential that may be present in the residual flux. Helps remove harmful inorganic substances.
物品は電子部品、更に特別にはPCBであることが好ましい。Preferably, the article is an electronic component, more particularly a PCB.
本発明の方法はロジン含有フラックスの使用によりノ1ンダ付けされた物品の洗 浄に特に有利に使用し得るが、その方法はまた合成の水溶性フラックスの助けに よりハンダ付けされた物品の洗浄に使用されてもよい。The method of the present invention provides cleaning of nolded articles through the use of rosin-containing flux. Although the method can also be used with particular advantage for the synthesis of water-soluble fluxes, It may also be used to clean more soldered items.
更に、本発明は、 (i)石油の蒸留により得られた蒸留留分75〜95容量部(前記留分は留分の 合計重量を基準として92重量%以上、好ましくは99重量%以上の08〜CI 5パラフイン系炭化水素及びナフテン系炭化水素から選ばれた炭化水素を含む) と、(ii)C5〜C15の直鎖または分枝鎖の飽和脂肪族アルコールから選ば れた一種以上のアルコール5〜25容量部とを含む物品の洗浄用組成物であって 、組成物がハロゲン含有有機化合物を実質的に含まないことを特徴とする物品の 洗浄用組成物を提供する。Furthermore, the present invention (i) 75 to 95 parts by volume of distilled fraction obtained by distillation of petroleum (the said fraction is 08-CI of 92% by weight or more, preferably 99% by weight or more based on the total weight (including hydrocarbons selected from 5 paraffinic hydrocarbons and naphthenic hydrocarbons) and (ii) a C5 to C15 straight or branched saturated aliphatic alcohol. 5 to 25 parts by volume of one or more types of alcohol, said composition for cleaning articles, said composition comprising: , an article characterized in that the composition is substantially free of halogen-containing organic compounds. A cleaning composition is provided.
本発明の方法は、ハンダ付は後のフラックス残渣の除去に特に有利である。炭化 水素含有液体及びアルコール含有液体の使用は、ハロゲン化溶剤を使用しないで フラックス残渣の優れた除去が得られることを可能にする。有利な洗浄効果が得 られると考えられる。何となれば、極性溶剤と非極性溶剤の組み合わせを使用す る結果として、フラックス残渣の極性成分及び非極性成分の両方が容易に溶解さ れるからである。炭化水素成分及びアルコール成分を特定された夫々の炭素数範 囲内で選択することにより、ロジン分子の溶解が増進される。また、炭化水素の 混合物及び/またはアルコールの混合物の使用はロジン分子の溶解を促進する。The method of the invention is particularly advantageous for removing flux residues after soldering. Carbonization When using hydrogen-containing liquids and alcohol-containing liquids, do not use halogenated solvents. Enables excellent removal of flux residues to be obtained. Provides beneficial cleaning effects It is thought that it will be possible. Why use a combination of polar and non-polar solvents? As a result, both polar and non-polar components of the flux residue are easily dissolved. This is because Each carbon number range specified for hydrocarbon components and alcohol components By choosing within this range, dissolution of the rosin molecules is enhanced. In addition, hydrocarbon The use of mixtures and/or mixtures of alcohols facilitates dissolution of the rosin molecules.
本発明により使用される溶剤及び溶剤混合物は、ハロゲン置換有機化合物(これ らはオゾン減少特性を有することが知られている)の使用が避けられることを可 能にするとともに、優れた洗浄が得られる。更に、その混合物は低毒性及び高引 火点を有し、その結果、それは使用するのに比較的安全であり、かつ複雑な取扱 操作が不要である。更に、それはPCBの製造に一般に使用される材料に対し腐 食性ではない。The solvents and solvent mixtures used according to the invention are halogen-substituted organic compounds (such as (known to have ozone-depleting properties) can be avoided. It also provides excellent cleaning performance. Moreover, the mixture has low toxicity and high toxicity. has a flash point, so it is relatively safe to use and requires no complicated handling No operation required. Additionally, it is non-corrosive to the materials commonly used in the manufacture of PCBs. Not edible.
下記の実施例は本発明を説明する。The following examples illustrate the invention.
実施例1 防衛規格(Defence 5tandard)59−47 :l−ム及び回路 板を下記ノ三ツノ方法の一つによりハンダ付けした。Example 1 Defense Standard 59-47: l-me and circuit The boards were soldered using one of the following three methods.
(a)液体フラックス 63/37(スズ/鉛)合金を使用して、回路板またはコームを1.5a+/分 のコンベヤー速度で250℃でハンダ付けした。ノ\ンダ付けの前に、回路板ま たはコームの上側を約90℃に予熱した。ブラシを使用してフラックスを塗布し た。夫々の場合、RMA 、 RA、水溶性合成液体フラックスまたは無洗浄( no clean)液体フラックスを使用した。じ無洗浄゛フラックスは、少な くとも低グレードの電子部品の場合に、その後の洗浄を必要としないで使用し得 るフラックスである。)(b)ハンダクリーム 使用したクリームは、62%のスズ含量を有する86%金属のMS粉末のクリー ムであった。そのクリームを手動のスクリーン印刷により回路板またはコームに 塗布し、BTIJ赤外オーブン中で加熱することによりリフローした。夫々の場 合、RMAクリームフラックスまたは“無洗浄”合成水溶性クリームフラックス を使用しtこ。(a) Liquid flux Using 63/37 (tin/lead) alloy, circuit boards or combs at 1.5a+/min Soldering was carried out at 250°C with a conveyor speed of . Before soldering, clean the circuit board. Or the upper side of the comb was preheated to about 90°C. Apply flux using a brush Ta. In each case, RMA, RA, water-soluble synthetic liquid flux or no-clean ( A no clean liquid flux was used. The same no-clean flux is Can be used without the need for subsequent cleaning, at least in the case of low-grade electronic components. It is a flux that ) (b) Solder cream The cream used was a cream of 86% metal MS powder with a tin content of 62%. It was mu. Apply the cream to circuit boards or combs by manual screen printing. It was coated and reflowed by heating in a BTIJ infrared oven. each place RMA cream flux or “no-clean” synthetic water-soluble cream flux Use this.
(C)フラックス・コアードワイヤ 回路板またはコームを、R^フラックスを含む60/40(スズ/鉛)、融点3 62℃、+6 SWG 5−コアー、ハンダで360℃のビット温度で手で/1 ンダ付けした。(C) Flux cored wire The circuit board or comb is 60/40 (tin/lead) with R^ flux, melting point 3. 62℃, +6 SWG 5-core, solder by hand at 360℃ bit temperature /1 I added a note.
8枚のハンダ付は印刷回路板及び8枚のノ1ンダ付はコームを、異性体の06、 C7及びC8アルコール10容量部と、C11−Cl3のパラフィン化合物及び ナフテン化合物からなる炭化水素液体90容量部を含む洗浄組成物で洗浄した。8 pieces of solder are printed circuit board, 8 pieces of solder are comb, isomer 06, 10 parts by volume of C7 and C8 alcohol, a C11-Cl3 paraffin compound, and It was cleaned with a cleaning composition containing 90 parts by volume of a hydrocarbon liquid consisting of naphthenic compounds.
その混合物の成る性質を測定し、下記のとおりであった。The properties of the mixture were determined and were as follows.
試験 測定方法 結果 蒸留 ASTM t186 IBP 182℃ 50% 213℃ IBP及びFDPは、沸騰が開始し、そして終了する夫々の温度を表す。PMC Gはペンスキイーマルテンズ(Pensky−Martens)密閉カップを意 味する。Test Measurement Method Results Distillation ASTM t186 IBP 182℃ 50% 213℃ IBP and FDP represent the respective temperatures at which boiling begins and ends. PMC G stands for Pensky-Martens sealed cup. Taste.
夫々のハンダ付は回路板またはコームを超音波攪拌下で45℃で洗浄組成物50 0m1中で個々に洗浄した。Each solder is cleaned by cleaning the circuit board or comb with 50% of the cleaning composition at 45°C under ultrasonic agitation. Washed individually in 0ml.
その後、ハンダ付は回路板またはコームを、脱イオン水中にドデシルベンゼンス ルホネートとドデシルフェノールエトキシレートの混合物IO容量%を含む洗剤 溶液中の浸漬によりすすいだ。その後、回路板またはコームを脱イオン水中です すぎ、熱空気中で乾燥させた。Then solder the circuit board or comb in dodecylbenzene in deionized water. Detergent containing a mixture of sulfonate and dodecylphenol ethoxylate IO% by volume Rinse by immersion in solution. Then place the circuit board or comb in deionized water Rinse and dry in hot air.
残留イオンの汚染に関する試験を、所定の容積の75/25 v/vのイソプロ パツール/脱イオン水を含む試験溶剤を使用してケンコ・オメガメーター(Ke nco (mg−aIlleter)中で洗浄された回路板またはコームにつき 個々に行った。また、一連のハンダ付けされていない回路板及びコームを試験し て比較の目的のための基準線を得た。結果を表1に示し、表中、イオン汚染レベ ルは所定の数のハンダ付けされていないコーム及び回路板の平均の汚染を測定す ることにより測定された基準線に対するイオン性物質の量である。Tests for residual ion contamination were performed using a given volume of 75/25 v/v isopropylene. Using a test solvent containing Patur/deionized water, the Kenko Omegameter (Ke For circuit boards or combs cleaned in nco (mg-aIlletter) I went individually. We also tested a series of unsoldered circuit boards and combs. A reference line was obtained for comparison purposes. The results are shown in Table 1. In the table, the ion contamination level The module measures the average contamination of a given number of unsoldered combs and circuit boards. This is the amount of ionic substances measured with respect to the reference line.
表1 イオン汚染レベル(NaCIのμg数数年平方インチフラックス 洗浄されなか った場合 洗浄された場合4、無洗浄合成液体 6.6 3.2 7、無洗浄合成りリーム 25.8 6.68、 RAワイヤ 42.5 3. 6 また、回路板及びコームの表面絶縁抵抗(SIR)を測定した。SIR試験に関 して、夫々の回路板またはコームの初期絶縁抵抗を、1分間にわたって500V I)Cの電圧を使用して測定し、その後、夫々の回路板またはコームを40℃ 、90%の相対湿度(R)l)の増湿室に96時間入れた。その後、SIRをそ の湿度条件(90%の相対湿度、40℃)下で500V DCを使用して再度測 定した。SIR試験の結果を表2に示す。Table 1 Ion contamination level (μg of NaCI several years square inch flux not cleaned) If washed, if washed 4, unwashed synthetic liquid 6.6 3.2 7. No-clean synthetic ream 25.8 6.68, RA wire 42.5 3. 6 Additionally, the surface insulation resistance (SIR) of the circuit board and comb was measured. Regarding SIR test the initial insulation resistance of each circuit board or comb to 500V for 1 minute. I) Measure the voltage using C and then heat each circuit board or comb to 40℃. , 90% relative humidity (R)l) for 96 hours. Then, remove the SIR. Measure again using 500V DC under humidity conditions (90% relative humidity, 40°C). Established. The results of the SIR test are shown in Table 2.
結果は、残留ハンダ付はフラックスの有効な洗浄が得られ、イオン汚染レベルが 相当する14μgのNaC1/平方インチ(2,2μg/c+n’)のMIL P−28809A要件を充分に下まわっていることを実証する。また、結果は、 洗浄工程後に、回路板及びコームの抵抗が洗浄されなかった回路板の抵抗とほぼ 同じであるか、またはそれより低いことを示す。こうして、洗浄工程は絶縁抵抗 に有害な効果を有しない。多くの場合、SIRは洗浄後に改良される。また、洗 浄された回路板は、R890%、40℃の雰囲気に96時間暴露された後にSI R試験で充分に機能する。The results showed that residual solder was effectively cleaned of flux, and the level of ionic contamination was reduced. Equivalent to 14 μg NaCl/in2 (2,2 μg/c+n’) MIL Demonstrate that the requirements are well below P-28809A requirements. Also, the result is After the cleaning process, the resistance of the circuit board and comb is approximately the same as the resistance of the uncleaned circuit board. Indicates the same or lower. In this way, the cleaning process Does not have any harmful effects. In many cases, the SIR is improved after cleaning. Also, wash The cleaned circuit board was exposed to a 90% R8, 40°C atmosphere for 96 hours before SI Works well in the R test.
実施例2 異性体の06及びC7アルコール5容量部とCl0−Cl3パラフィン及びナフ テン95容量部を含む洗浄混合物を調製した。Example 2 5 parts by volume of isomeric 06 and C7 alcohols and Cl0-Cl3 paraffins and naphs A cleaning mixture containing 95 parts by volume of ten was prepared.
その混合物に関する物理データを測定したところ、下記のとおりであった。Physical data regarding the mixture was measured and was as follows.
試験 測定方法 結果 蒸留 ASTM D86 IBP 165.0℃ 50% 192.0℃ FI3P 2]2. O℃ 引火点、PMCCASTM C9360,0℃15℃における密度 ASTM C40520,7796g/ccアニリン点 ASTM C61165,5℃セ イボルト色度 ASTiJ Cl56 +30回路板からのロジン除去の効率を 評価するために、活性化フラックスで被覆された6枚のPCBを洗浄し、夫々の PCBを超音波攪拌しながら5分間にわたって洗浄混合物100m1中で45℃ で個々に洗浄した。Test Measurement Method Results Distillation ASTM D86 IBP 165.0℃ 50% 192.0℃ FI3P 2]2. O℃ Flash point, PMCCASTM C9360, density at 0°C and 15°C ASTM C40520, 7796g/cc aniline point ASTM C61165, 5°C EVOLT Chromaticity ASTiJ Cl56 +30 Efficiency of rosin removal from circuit board For evaluation, six PCBs coated with activated flux were cleaned and each The PCB was heated at 45 °C in 100 ml of the cleaning mixture for 5 minutes with ultrasonic agitation. were washed individually.
洗浄後、試験片を除去し、乾燥させ、回路板に残存している残留ロジンをイソプ ロピルアルコール(IPA)+00011により抽出した。After cleaning, remove the specimen, dry it, and remove any residual rosin from the circuit board. Extracted with lopyl alcohol (IPA) +00011.
IPAのロジン含量を242nmの波長で分光測光により測定した。The rosin content of IPA was measured spectrophotometrically at a wavelength of 242 nm.
比較の目的のために、CFC−11393容量部とメタノール7容量部を含むハ ロゲン化洗浄液体を調製し、活性化フラックスで被覆された6枚のPCBを5分 間にわたって密閉容器中でハロゲン液体の凝縮蒸気(沸点48℃)により個々に 洗浄した。For comparison purposes, a halide containing 3 parts by volume of CFC-11393 and 7 parts by volume of methanol was used. Prepare rogens cleaning liquid and clean 6 PCBs coated with activated flux for 5 minutes. individually by condensed vapor (boiling point 48°C) of a halogen liquid in a closed container for a period of time. Washed.
洗浄後に、試験片を炭化水素/アルコール洗浄の場合のようにして処理した。結 果を表3に示し、この表は、ハロカーボン溶剤系を使用してわずかに61%の平 均洗浄効率が得られるのと比較して、炭化水素/アルコール混合物を使用して8 7%の平均洗浄効率(即ち、ロジン除去率(%))が得られることを示す。After cleaning, the specimens were treated as for hydrocarbon/alcohol cleaning. Conclusion The results are shown in Table 3, which shows that using the halocarbon solvent system only 61% of the average compared to the level cleaning efficiency obtained using hydrocarbon/alcohol mixtures. It is shown that an average cleaning efficiency (ie, rosin removal rate (%)) of 7% is obtained.
表3 0ジン除去率(%) 123456 炭化水素/ 90.1 86.7 88.8 85.4 85.7 87.1ハ ロカーボン/ 61.3 61.8 65.7 54.2 63.5 60.9 アルコール 混合物 国際調査報牛 11.fi−A1.−9.Pc■/EP92103o1・フロントページの続き (51)Int、C1,’ 識別記号庁内整理番号HOIL 23150 Z 8617−4MH05K 3/26 7511−4E //CC11D 7/60 7:24 7:26) ITable 3 0jin removal rate (%) 123456 Hydrocarbons/90.1 86.7 88.8 85.4 85.7 87.1 Ha Rocarbon/61.3 61.8 65.7 54.2 63.5 60.9 alcohol blend international research report 11. fi-A1. -9. Pc■/EP92103o1・Continuation of front page (51) Int, C1,' Identification code Office serial number HOIL 23150 Z 8617-4MH05K 3/26 7511-4E //CC11D 7/60 7:24 7:26) I
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP92300061 | 1992-01-03 | ||
EP92300061.6 | 1992-01-03 | ||
PCT/EP1992/003017 WO1993013246A1 (en) | 1992-01-03 | 1992-12-31 | Method and composition for cleaning articles |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07503032A true JPH07503032A (en) | 1995-03-30 |
Family
ID=8211218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5511448A Pending JPH07503032A (en) | 1992-01-03 | 1992-12-31 | Article cleaning method and cleaning composition |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0621907A1 (en) |
JP (1) | JPH07503032A (en) |
KR (1) | KR940703940A (en) |
CA (1) | CA2126969A1 (en) |
MY (1) | MY134746A (en) |
WO (1) | WO1993013246A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69528151T2 (en) * | 1994-07-07 | 2003-01-30 | Safety-Kleen Uk Ltd., Isleworth | IMPROVED SOLVENT COMPOSITION |
US6004434A (en) * | 1994-07-07 | 1999-12-21 | Safety-Kleen Corp. | Method of recycling cleaning solvent |
GB2298430A (en) * | 1995-02-22 | 1996-09-04 | Exxon Chemical Patents Inc | Cleaning composition and method |
GB2298433A (en) * | 1995-02-22 | 1996-09-04 | Exxon Chemical Patents Inc | Cleaning composition |
FR2733247B1 (en) * | 1995-04-20 | 1997-06-13 | Atochem Elf Sa | CYCLOALCANE BASED CLEANING AGENT |
FR2733248B1 (en) * | 1995-04-20 | 1997-06-13 | Atochem Elf Sa | COLD CLEANING COMPOSITION BASED ON ALKANES OR CYCLOALKANS AND AN ORGANIC COMPOUND COMPRISING AN OXYGENATED FUNCTION |
WO1997003136A1 (en) * | 1995-07-11 | 1997-01-30 | Shell Internationale Research Maatschappij B.V. | Cleaning composition |
FR2847905A1 (en) * | 2002-12-03 | 2004-06-04 | Serma Technologies | Cleaning composition, especially useful for degreasing, comprises aliphatic hydrocarbons, aromatic or olefinic hydrocarbons and oxygenates |
FR2943070B1 (en) * | 2009-03-12 | 2012-12-21 | Total Raffinage Marketing | HYDROCARBON HYDRODEPARAFFIN FLUID FOR THE MANUFACTURE OF INDUSTRIAL, AGRICULTURAL OR DOMESTIC FLUIDS |
CN105802758B (en) * | 2016-05-17 | 2019-04-05 | 江苏筑磊电子科技有限公司 | Cleaning Agent for PCB agent after fire |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2525996C2 (en) * | 1975-06-11 | 1983-11-24 | Henkel KGaA, 4000 Düsseldorf | Cold cleaner |
DE3812454A1 (en) * | 1988-04-14 | 1989-10-26 | Shell Int Research | DEGREASING LIQUID |
GB8918504D0 (en) * | 1989-08-14 | 1989-09-20 | Bush Boake Allen Ltd | Methods and compositions for cleaning articles |
DE3935032C3 (en) * | 1989-10-20 | 2000-08-24 | Zinser Raimund | Method and device for cleaning and drying objects |
JPH03146597A (en) * | 1989-11-01 | 1991-06-21 | Henkel Hakusui Kk | Cleaning composition of printed circuit board |
EP0426942A1 (en) * | 1989-11-08 | 1991-05-15 | Arakawa Chemical Industries, Ltd. | Agent for cleaning rosin-base solder flux |
CA2082071A1 (en) * | 1990-06-11 | 1991-12-12 | Maher E. Tadros | Cycloparaffins containing cleaning composition and method of using them |
-
1992
- 1992-12-24 MY MYPI92002380A patent/MY134746A/en unknown
- 1992-12-31 JP JP5511448A patent/JPH07503032A/en active Pending
- 1992-12-31 KR KR1019940702298A patent/KR940703940A/en not_active Application Discontinuation
- 1992-12-31 EP EP93902139A patent/EP0621907A1/en not_active Ceased
- 1992-12-31 WO PCT/EP1992/003017 patent/WO1993013246A1/en not_active Application Discontinuation
- 1992-12-31 CA CA002126969A patent/CA2126969A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1993013246A1 (en) | 1993-07-08 |
KR940703940A (en) | 1994-12-12 |
MY134746A (en) | 2007-12-31 |
EP0621907A1 (en) | 1994-11-02 |
CA2126969A1 (en) | 1993-07-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2614980B2 (en) | Composition and method for removing rosin soldering fluxes with terpenes and hydrocarbons | |
US5084200A (en) | Cleaning composition of dibasic ester, hydrocarbon solvent, compatibilizing surfactant and water | |
US5196136A (en) | Cleaning composition of hydrocarbon component, surfactant and multibasic ester additive | |
US5300154A (en) | Methods for cleaning articles | |
US4867800A (en) | Cleaning composition of terpene compound and dibasic ester | |
CA2049594C (en) | Environmentally safe cleaning process and cleaning composition useful therin | |
KR100192681B1 (en) | Cleaning composition for printed circuit boards, consisting of dibasic esters and hydrocarbon solvents | |
JP2022513514A (en) | Solvent composition containing 1,2,2-trifluoro-1-trifluoromethylcyclobutane (TFMCB) | |
US5011620A (en) | Cleaning composition of dibasic ester and hydrocarbon solvent | |
US5062988A (en) | Cleaning composition of dibasic ester, hydrocarbon solvent and compatibilizing component | |
EP3746537A1 (en) | Compositions comprising trans-1,2-dichloroethylene and an organic compound, and methods of using the same | |
JPH07503032A (en) | Article cleaning method and cleaning composition | |
JP3086254B2 (en) | Formulations for cleaning electronic and electrical assemblies | |
JP4761293B2 (en) | Cleaning composition and cleaning method | |
US5238504A (en) | Use of terpene hydrocarbons and ketone blends for electrical contact cleaning | |
CA2077151A1 (en) | Cleaning compositions | |
JPH0362896A (en) | Detergent composition | |
JPH0394082A (en) | Detergent composition | |
JPH04130199A (en) | Cleaning composition and cleaning method | |
JP3582168B2 (en) | Azeotropic cleaning composition | |
EP0523892B1 (en) | Cleaning compositions | |
RU2113921C1 (en) | Cleaning liquid composition, variant thereof, and method of removing contaminations from substrate using cleaning composition | |
JP2000510883A (en) | Decafluoropentane composition | |
JPH03198396A (en) | Composition of cleaning agent | |
CN117417795A (en) | Microwave component chip cleaning agent based on double solvents and preparation method thereof |