JPH0749796Y2 - Wafer protection sheet peeling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a wafer protective sheet peeling device which is used in a semiconductor component manufacturing process and peels a protective sheet for protecting the surface of a wafer from the wafer.

(Prior Art) Conventionally, in a manufacturing process of a semiconductor component such as an IC and a transistor, a protective sheet is attached to protect a surface of a wafer before a back grinder process. This protective sheet is peeled off from the wafer before the dicing saw process which is the next process after the back grinder process.

FIG. 3 is a perspective view showing a conventional wafer protective sheet peeling apparatus, in which 30 is a wafer, 31 is a protective sheet having the wafer 30 stuck on the back surface, and 32 is the wafer 30 having the protective sheet 31 stuck thereon. A cassette that is stored, 33 is a cassette that stores the wafer 30 after the protective sheet 31 has been peeled off, 34 and 35 are first and second transfer bodies that are belts that transfer the wafer 30, and 36 is a peeling tape. , 37 is a supply body of the peeling tape 36 that gives back tension to the peeling tape 36, 38 is a winding body that winds up the peeling tape 36, and 39 and 40 are sandwiching the peeling tape 36 and the protective sheet 31 to bond them. First roller and second
Rollers, 41 are a wafer suction table, and 42 is a sheet peeling unit that moves the wafer 30 together with the protection sheet 31 adhered to the peeling tape 36 to the wafer suction table 41 and peels the wafer 30 from the protection sheet 31.

In the figure, after the back grinder process, the protective sheet 31
A cassette 32 accommodating the wafer 30 with the affixed thereon and an empty cassette 33 are set. Then, when the operation is started, the wafer 30 is transferred from the cassette 32 between the first roller 39 and the second roller 40 by the first transfer body 34. First roller 39 and second
A predetermined load is applied to the roller 40 in order to adhere the release tape 36 to the protective sheet 31. Therefore, the peeling tape 36 is adhered to the protective sheet 31 while passing between the first roller 39 and the second roller 40.

At this time, the peeling tape 36 is taken up by the take-up body 38, and the back tension is applied to the supply body 37, so that the peeling tape 36 is delivered without loosening.

The wafer 30 to which the protective sheet 31 having the peeling tape 36 adhered is attached is conveyed to the wafer suction table 41 by the lateral movement of the sheet peeling unit 42, and in this state, the wafer suction table 41.
A vacuum acts on the wafer 30 to attract and hold the wafer 30.

Next, the sheet peeling unit 42 performs the returning operation, so that the protective sheet 31 is peeled off from the wafer 30 by the peeling tape 36. At this time, the roller of the sheet peeling section 42 moves while winding the peeling tape 36, and the winding body 38 winds up the peeling tape 36.

When the peeling of the protective sheet 31 is confirmed, the wafer 30 held on the wafer suction table 41 is sent to the second carrier 35, and when this sending is confirmed, the wafer 30 is removed by the second carrier 35. Stored in an empty cassette 33.

The empty cassette 33 of the cassette 32 is moved up and down by an elevator (not shown), and the supply and storage operations of the wafer 30 are repeated.

(Problems to be Solved by the Invention) In the above-mentioned conventional apparatus, since the adhesive of the peeling tape 36 adheres to the second roller 40 through which the peeling tape 36 passes, the wafer 30
There is a problem that the adhesive agent adheres to the back surface of the wafer 30 when passing through.

In order to ensure the peeling operation, it is conceivable to increase the adhesive force between the peeling tape 36 and the protective sheet 31, but in this case, the load on the first roller 39 and the second roller 40 is increased. There is a need. However, if the load is increased, the wafer 30 is likely to be damaged, and the reliability of the peeling operation is rather deteriorated.

Further, if the rotation speeds of the first roller 39 and the second roller 40 are increased, the wafer 30 is easily damaged, and the peeling speed capacity is limited.

SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer protective sheet peeling device capable of reducing the damage of the wafer and increasing the peeling speed.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a wafer protective sheet peeling device for bonding a protective sheet for protecting the surface of a wafer to a peeling tape and peeling the protective sheet from the wafer. A peeling tape adhesive part for adhering to the protective sheet of the peeling tape, and a wafer suction table which holds a wafer on which the protective sheet is stuck and can move up and down with respect to the peeling tape connecting part. The adhesive portion and the wafer suction table are relatively movable laterally.

(Operation) Since the above means is adopted, the peeling tape can be adhered to the protective sheet only during the peeling operation. That is, since the wafer suction table rises when there is a wafer having the protective sheet attached to the peeling tape adhesive portion, the peeling tape adhesive does not adhere to the front surface of the wafer suction table and the peeling tape is attached to the back surface of the wafer. It is possible to prevent the adhesive from adhering. Further, when the protective sheet and the peeling tape are adhered, the wafer suction table moves the wafer laterally in order to peel the protective sheet from the wafer with the peeling tape.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a first view of a wafer protective sheet peeling device of the present invention.
1 is a perspective view showing an embodiment, 1 is a wafer, 2 is a protective sheet having the wafer 1 stuck on its surface, 3 is a cassette containing the wafer 1 having the protective sheet 2 stuck thereon, and 4 is a protective sheet An empty cassette 5 for storing the wafer 1 after the peeling of the wafer 2 is composed of a first belt 5 and a belt 6 for carrying the wafer 1.
A carrier and a second carrier, 7 is a supply chuck for the wafer 1 provided near the first carrier 5, 8 is a storage chuck provided near the second carrier 6, and 9 is a first carrier 5. The wafer suction table, which is installed between the second carrier 6 and the second carrier 6, is vertically moved by the first driving means 10, and is laterally moved by the second driving means 11. An elastic body gives a downward biasing force to the wafer suction table 12. A peeling tape adhesive portion composed of a roller, 13 a sheet peeling portion composed of a roller pair, 14 a peeling tape, and 15 a peeling tape 14 giving back tension to the peeling tape 14.
And 16 is a winding body for winding the peeling tape 14.

In the same figure, after the back grinder process, the protective sheet 2
The cassette 3 containing the wafer 1 with the affixed thereon and the empty cassette 4 are set. Then, when the operation is started, the wafer 1 is supplied from the cassette 3 to the supply chuck 7 by the first carrier 5.
It is transported to the chuck position. When this transfer is confirmed, the wafer 1 is chucked by the supply chuck 7 and transferred onto the wafer suction table 9. At this time, the wafer suction table 9 is in the lowered position, and the wafer 1 is suction-held by the vacuum applied to the wafer suction table 9. After this suction holding, the wafer suction table 9 is lifted up to the peeling tape adhesive portion 12 by the first driving means 10. When rising, the pressing force of the peeling tape bonding portion 12 is applied to the protective sheet 2 and the peeling tape 14, and the peeling tape 14 is bonded to the protective sheet 2. In this bonded state, the wafer suction table 9 is laterally moved by the second driving means 11, and the sheet peeling section 13 winds up the peeling tape 14, so that the protective sheet 2 is peeled from the wafer 1.

Simultaneously with the winding of the peeling tape 14, the peeling tape 14 from which the protective sheet 2 has been peeled from the wafer 1 is wound by the winding body 16. Further, in the supply body 15, since the back tension works, the peeling tape 14 does not loosen.

The wafer 1 on the wafer suction table 9 from which the protective sheet 2 has been peeled off is moved to the chuck position of the storage chuck 8 and is chucked by the storage chuck 8 to be transferred to the second carrier 6.
It is carried to and stored in an empty cassette 4. At this time, the wafer suction table 9 is moved by the first driving means 10 and the second driving means 11
Has returned to its original descending position.

According to the above-described first embodiment, the surface of the wafer suction table 9 is moved by vertically moving the wafer suction table 9 with respect to the peeling tape bonding portion 12 in order to bond the protective sheet 2 to the peeling tape 14 during the peeling operation. Since the adhesive does not adhere to the wafer, the adhesion of the adhesive to the back surface of the wafer 1 is prevented. Further, since the peeling tape adhering portion 12 receives the urging force of the elastic body, an appropriate pressing force is applied to the wafer 1, so that the wafer 1 is not damaged and the reliability of the peeling operation can be improved. Further, since the wafer suction table 9 moves laterally to perform the peeling operation, the peeling speed can be increased.

FIG. 2 shows a second embodiment of the wafer protective sheet peeling device of the present invention.
17 is a perspective view showing an embodiment, and 17 is a peeling tape adhesive portion provided with a roller 17a capable of moving laterally above the wafer suction table 9, and the members corresponding to the members described in FIG. Attached.

In the same figure, as in the first embodiment, the wafer suction table 9 raises the wafer 1 to a position where the pressing force of the peeling tape adhesive portion 17 is applied. When this rise is confirmed, the roller 17a of the peeling tape adhesive portion 17 laterally moves while pressing the upper surface of the peeling tape 14 so that no air remains between the peeling tape 14 and the protective sheet 2 (Fig. The position of the roller 17a shown by the chain double-dashed line).

According to the second embodiment, the protective sheet 2 and the peeling tape 14 can be surely adhered to each other and the peeling error can be prevented.

In the first and second embodiments, the peeling tape adhesive portion 12,1
Alternatively, it is conceivable to provide a heating unit (not shown) on the wafer suction table 9 so that the protective sheet 2 can be easily peeled off.

(Effect of the Invention) According to the present invention, since the wafer suction table is vertically movable and laterally movable with respect to the peeling tape adhesive portion,
Only during the peeling operation, the wafer moves to the adhesion part of the peeling table, so it is possible to prevent the adhesive from adhering to the back surface of the wafer carelessly, and since the wafer suction table moves laterally, the peeling speed can be increased. It is possible to provide a wafer protective sheet peeling device which can improve reliability and efficiency.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a wafer protective sheet peeling device according to the present invention, FIG. 2 is a perspective view showing a second embodiment of a wafer protective sheet peeling device according to the present invention, and FIG. It is a perspective view which shows the conventional protective sheet peeling apparatus of a wafer. 1 ... Wafer, 2 ... Protective sheet, 3 ... Cassette, 4
…… Empty cassette, 5,6 …… Transporter, 7,8 …… Chuck,
9 ... Wafer suction table, 10, 11 ... Driving means, 12, 17
...... Peeling tape adhesive part, 13 …… Sheet peeling part, 14 …… Peeling tape, 15 …… Supplier, 16 …… Winding body.

Claims (3)

[Scope of utility model registration request] 1. In a wafer protective sheet peeling device for bonding a protective sheet for protecting a surface of a wafer to a peeling tape and peeling the protective sheet from the wafer, a peeling tape bonding for bonding the peeling tape to the protective sheet. And a wafer suction table that holds the wafer to which the protective sheet is attached and can move up and down with respect to the peeling tape connecting portion, and the peeling tape bonding portion and the wafer suction table are relatively horizontal. A protective sheet peeling device for a wafer, which is movable. 2. The wafer protective sheet peeling device according to claim 1, wherein the peeling tape bonding portion is provided with a heating portion. 3. The wafer protective sheet peeling device according to claim 1, wherein the wafer suction table is provided with a heating unit.