JPH0745774A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To reduce the size of a hybrid integrated circuit device and to improve an assembling workability required in the case of connecting to a heat sink and leads. CONSTITUTION:A heat sink 11 and a plurality of leads 12 are formed into a lead frame, and an integrated circuit board 1 with various elements is mounted on the heat sink 11. In the integrated circuit board 1, a plurality of lead terminals 4, 6 are formed along the edge part of the board 1 by metallizations, and notch parts 8 are formed in the respective lead terminals 4, 6. Concurrently, on the side surfaces of the notch part 8, metallizations connected with the lead terminals 4, 6 are formed, and these lead terminals 4, 6 and the notch parts 8 are soldered respectively to the respective leads 12. Thereby, the leads 12 can be made into fine pieces, and the size of a hybrid integrated circuit device is reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device having leads and a heat sink connected to a hybrid integrated circuit substrate.

[0002]

2. Description of the Related Art As shown in FIG. 4A, a conventional hybrid integrated circuit has a back surface of an integrated circuit board 21 on which active elements TR such as GaAs FETs and passive elements such as chip capacitors C and chip resistors R are mounted. The heat sink 31 is integrally connected to. Further, as shown in FIG. 2B, clip type lead pins 32 are provided on the integrated circuit board 2 for the lead terminals 22 formed on the surface of the integrated circuit board 21 by metallization.
1 is inserted so as to be sandwiched in the thickness direction, and the two are integrated by soldering or the like. A wiring pattern 23 is formed on the lead terminal 22 and is connected to the various elements. The tip end of the clip-type lead pin 32 is formed in a bifurcated shape, and the edge of the integrated circuit board 21 is sandwiched by the elasticity of the bifurcated portion. in this case,
An insulating coating 33 is applied to the bifurcated portion. As another structure for connecting the leads, as shown in FIG. 3C, the lead terminals 22 of the integrated circuit board 21 are connected to the lead fixing parts 24.
Is integrally provided, the clip type lead pin 32 is fitted to the lead fixing component 24, and fixed by the solder 34.

[0003]

In such a conventional hybrid integrated circuit device, in order to secure the spring property when the lead pin 32 is fitted, the width dimension of the lead pin is 1.
About 6 mm is required, and therefore the integrated circuit board 21
The width of the lead terminal 22 formed above is required to be about 2.0 mm. Therefore, the distance between adjacent lead terminals is 2.
When it is set to 54 mm, one side of the integrated circuit board in which 6 pins are arranged is 15.24 mm or more, and it is difficult to reduce the size of the hybrid integrated circuit device even if various elements mounted on the integrated circuit board are reduced in size. There's a problem.

Further, the lead pins 32 are connected to the integrated circuit board 21.
In order to fit the lead pin 32 and the lead fixing component 24, it is necessary to apply a stress to the lead pin 32 in the lateral direction, and an automatic assembly machine for mounting various elements from the direction perpendicular to the surface of the integrated circuit board 21. There is a problem that the workability of assembling is poor due to poor compatibility with the above. Furthermore, conventionally, the connection of the lead pins 32 and the connection of the heat sink 31 to the integrated circuit board 21 are performed in independent steps, respectively, which increases the number of assembly steps of the hybrid integrated circuit device, resulting in a complicated process and time. There is a problem of this. It is an object of the present invention to provide a hybrid integrated circuit device which is downsized and whose assembly workability is improved.

[0005]

A hybrid integrated circuit device of the present invention is mounted with a heat sink, a plurality of leads arrayed and formed on the same plane as the heat sink, and the back surface of the heat sink in contact with the heat sink. An integrated circuit board having various elements mounted on the surface is provided, and a plurality of lead terminals are formed by metallization along the edge of the integrated circuit board, and each lead terminal is provided with a notch and the notch is provided. Form a metallization that connects to the lead terminals on the side of
The lead terminals and the metallizations of the notches and the leads are soldered. Locking pieces that engage with both ends of the integrated circuit board are provided upright on both ends of the heat sink. Also,
A heat sink and a plurality of leads are integrally formed by a lead frame, an integrated circuit board is assembled, and then the two are cut and separated.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of the hybrid integrated circuit of the present invention.
(A) is a perspective view, (b) is the AA line expanded sectional view,
(C) is a BB line sectional view. Further, FIG. 2 is an enlarged view of a main part. In these figures, the integrated circuit substrate 1 has a required circuit pattern formed by metallization on the front and back surfaces of a ceramic substrate 2 mainly made of 92% aluminum oxide having a thickness of 0.8 mm. That is, the circuit pattern on the surface is composed of a land 3 for mounting various elements, a plurality of lead terminals 4, and a wiring pattern 5 for connecting these to each other. Further, the pattern on the back surface includes lead terminals 6 provided on the back surface side so as to face the lead terminals 4.
The ground pattern 7 is formed in the area excluding the lead terminals 6.

As shown in FIG. 2, each of the lead terminals 4 and 6 is provided with a notch 8 which is a semicircular notch at the end of the substrate of each lead terminal 4 and 6. The semicircular surface of the notch 8 is formed. Is also metallized so that the lead terminals 4 and 6 on the front and back surfaces of the integrated circuit board 1 are electrically connected to each other. And, in this embodiment, G for 900 MHz is used.
The active element TR, which is an aAsFET, is mounted in the integrated circuit board 1 in a state where the back surface thereof is exposed to the back surface side of the board 1 through a hole formed in the integrated circuit board 1, and passive elements such as the chip capacitor C and the chip resistor R are respectively integrated circuit board 1 is mounted on each land on the surface and soldered.

On the other hand, as shown in FIG. 3A, a lead frame 10 is formed by molding a metal plate of, for example, 1.0 mm thick nickel silver plated with 2 μm of gold, to form the integrated circuit board 1. It is mounted on this lead frame. The lead frame 10 is formed of a single metal plate in a state where a heat sink 11 and a plurality of leads 12 are integrated by a frame 13, and the frame 13 is cut and removed after the integrated circuit device is assembled. ing. The heat sink 11 is a ground pattern 7 on the back surface of the integrated circuit board 1.
The shape of the engaging claw 14 is formed by protruding a part of both ends in a tongue shape and bending the same upward at a right angle. Further, the plurality of leads 12 are formed with a pitch dimension corresponding to the lead terminals 4 and 6 provided on the integrated circuit board 1, but the shape thereof is configured as a simple strip.

The lead frame 10 configured as described above
The integrated circuit board 1 is mounted on the heat sink 11 of
The ground pattern 7 is brought into contact with the upper surface of the heat sink 11. The lead terminals 4 and 6 of the integrated circuit board 1 are positioned correspondingly on the leads 12, and the lead terminals 4 and 6 are connected to the surfaces of the leads 12 by soldering. At this time, since the lead terminals 4 and 6 are connected on the front and back surfaces via the peripheral surface of the semicircular cutout portion 8, the solder 9 wets from the peripheral surface of the cutout to the surface of the lead terminals 4 and 6. A suitable connection is realized. Also, these lead terminals 4, 6
The integrated circuit board 1 is reliably fixed on the heat sink 11 by soldering the lead 12 and the lead 12.

In this case, since the locking claws 14 provided at both ends of the heat sink 11 engage with both ends of the integrated circuit board 1 to hold the integrated circuit board 1 in the longitudinal direction and regulate its position, the integrated circuit is prevented. The substrate 1 is not moved to apply a lateral force to the lead 12, and the lead 12 is not deformed and the soldered portions with the lead terminals 4 and 6 are not damaged. The short-side direction of the integrated circuit board 1 is
It is held by soldering the leads 12 and the lead terminals 4, 6. If the locking claws 15 are provided upright on both sides of the heat sink 11 as shown in FIG. 3B, the position of the integrated circuit board on the heat sink can be firmly regulated. After that, by cutting and removing the frame 13 of the lead frame 10, the heat sink 11 and each lead 12 are separated from each other, and are electrically independent, and the hybrid integrated circuit device is completed.

Therefore, according to this hybrid integrated circuit device, the leads 12 are simply formed into strips and the integrated circuit board 1 is formed.
Since it is only necessary to solder to the lead terminals 4 and 6, the lead 12 does not need a spring property, the width dimension thereof can be made extremely small, the integrated circuit board can be miniaturized, and further, the hybrid integration can be achieved. It is possible to reduce the size of the circuit device. Further, when assembling the device, it suffices to simply mount the integrated circuit board 1 on the lead frame 10 from above and perform soldering, so that it is not necessary to apply stress in the lateral direction, and moreover, the heat sink 11 and the leads 12 are not applied. Connections can be made at the same time, and assembly work can be simplified and speeded up.

[0012]

As described above, according to the present invention, an integrated circuit board is mounted on a heat sink, a plurality of lead terminals are formed by metallization along the edge of the integrated circuit board, and each lead terminal is formed on each lead terminal. With the notch,
The metallization connected to the lead terminals is formed on the side surface of this notch, and the metallization of these lead terminals and the notch and the heat sink are soldered to the leads formed on the same plane. Even if the integrated circuit board can be connected to the integrated circuit board with high reliability, the width of the integrated circuit board can be made extremely small, and the size of the hybrid integrated circuit device can be reduced. Is regulated, the movement of the integrated circuit board is prevented to prevent the leads from being bent or damaged, and the leads to be made into strips. Further, since the heat sink is integrally formed with a plurality of leads as a lead frame, and the integrated circuit board is assembled and then the two are cut and separated, manufacturing and handling of the heat sink and the leads can be facilitated.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention, (a) is a perspective view,
(B) is an AA line expanded sectional view, (c) is a BB line sectional view.

FIG. 2 is an enlarged view of a main part of FIG.

FIG. 3 is a perspective view of the lead frame of FIG. 1 and a perspective view of the improved lead frame.

FIG. 4 is a perspective view of a conventional hybrid integrated circuit device, a cross-sectional view of a main part thereof, and a partial cross-sectional view of another example.

[Explanation of symbols]

 1 Integrated Circuit Board 2 Ceramic Board 4, 6 Lead Terminal 7 Ground Pattern 8 Cutout 9 Solder 10 Lead Frame 11 Heat Sink 12 Lead 14, 15 Locking Claw

Claims (3)

[Claims] 1. A heat sink, a plurality of leads arrayed and formed on the same plane as the heat sink, and an integrated circuit board mounted on the heat sink with its back surface in contact with each other and having various elements mounted on its front surface. A plurality of lead terminals are formed by metallization along the edge of the integrated circuit board, and notches are provided in each lead terminal,
A hybrid integrated circuit device characterized in that a metallization connected to a lead terminal is formed on a side surface of the notch, and the lead terminal and the metallization of the notch are soldered to the lead. 2. The hybrid integrated circuit device according to claim 1, wherein locking pieces that engage with both ends of the integrated circuit board are provided upright on both ends of the heat sink. 3. The hybrid integrated circuit device according to claim 1, wherein the heat sink and the plurality of leads are integrally formed by a lead frame, the integrated circuit board is assembled, and then the two are cut and separated.