JPH0738868Y2 - Thermal insulation case for IC temperature test - Google Patents

Description

[Detailed Description of the Invention] [Industrial application] The present invention relates to an insulating case for temperature test of an IC, and more particularly to an insulating case that moves inside an IC test hanger with the IC housed in a socket.

[Prior Art] ICs mass-produced in a factory are subjected to a thermal acceleration test (aging) that accelerates adverse conditions and a temperature test as an environment resistance test in order to maintain a certain quality, and each is determined to be a good product or a defective product. Be sorted.

In the thermal acceleration test, a socket board with a large number of ICs inserted is put into a furnace in units of several sets, usually heated at 125 ° C for 72 hours, then taken out, and each IC is taken out from the socket for inspection. .

The temperature test tests whether the IC can maintain its normal characteristics in tropical and cold regions.
The low temperature test is performed at 0 ℃ and at -40 ℃, and IC test handler is usually used for this test.

The conventional IC test handler consists of a loader that extracts the IC from the magazine and flows it into the transport path, a thermostat that keeps each IC at high or low temperature, a test board that measures the IC data, and an unloader that collects the IC. The tank and equipment are sealed to exclude outside air and humidity.

However, in the conventional temperature test, a dedicated test handler corresponding to the type of IC is used, or in order to handle with one handler, the loader, transfer system, and unloader must be replaced and adjusted. For this reason, a method has been proposed in which a socket board or a carrier plate corresponding to each IC is prepared in advance and a temperature test is performed by one handler (Japanese Patent Laid-Open No. 64-64).
-80035).

[Problems to be solved by the invention] However, in the above-mentioned socket board, the IC with the protruding leg is fixed to the socket, but if the IC without the protruding leg is placed in the socket, the IC may be transported or measured. There was a risk that the IC would move and shift. In this case, as in No. 56-19767
If the backside of the IC is fixed with a holding member, it is possible to prevent the displacement of the IC, but with this method the position of the holding member is constant.
If the type or size of IC changes, there is a difficulty that cannot be dealt with.

Furthermore, in the case of a low temperature test, if jamming, that is, if the IC is clogged, it is necessary to open a part of the constant temperature bath to remove the jam, but if the -40 ° C bath is opened suddenly, moisture will enter from the outside and Frost adheres to the IC, carrier system and each device. For this reason, conventionally, the cooler is stopped and the temperature in the tank is gradually raised to room temperature to remove the jam, and the handler stop time is extremely long.

The present invention has been made in view of such circumstances, and an object thereof is to reliably fix various types of ICs with a simple mechanism.
It is to provide an insulating case for temperature test of IC.

[Means for Solving the Problems] In order to achieve the above object, in the invention of claim (1), a heat insulating case main body and an IC provided inside the case main body are provided.
A heat insulating case is composed of a socket for use with, a heat insulating lid that covers the upper part of the case body, and a pressing member that is attached to the inside of the lid via a spring to fix the IC on each socket.

[Operation] According to the configuration of claim (1), when the case body is covered with the lid, the ICs on the sockets are fixed from above by the pressing member regardless of their types.

[Embodiment] FIG. 1 shows a perspective view of a heat insulating case 1 according to the present invention. The case 1 includes a heat insulating case body 2 as a lower box and a heat insulating lid 3 covering the upper side. It consists of

Inside the case body 2, a large number of sockets 4 for receiving ICs are provided. As can be seen from FIG. 2, the sockets 4 can be electrically connected to the pogo pins 7 on the test board 6 through the through holes 5 at the bottom. Has become.

A claw 8 that elastically engages with the lid 3 is formed in the opening of the case body 2. As the opening / closing mechanism for both, a so-called bayonet mechanism that opens by a slight rotation of the lid 3 may be used. An index 9 is provided on the outer surface of the case body 2 for displaying the IC type, data, and the like.

The lid 3 has an inlet 10 for temperature adjusting gas in the center thereof.
A check valve 11 is provided in the valve 10. Correspondingly, a plurality of gas discharge ports 12 are formed on the case body 2 side, and each discharge port 12 is opened by a pressure valve 13 when the internal pressure exceeds a certain level.

A pressing plate 15 for pressing the IC on the socket 4 is attached to the inner surface of the lid 3 via a spring 14. Presser plate 15
As shown in FIG. 3, the inside of the heater 20 and the thermocouple 21
Temperature adjusting means such as In this case, the heater
Instead of 20, as shown in phantom in FIG. 3, a Peltier element
If 22 is adopted, both heating and cooling of the IC can be performed simply by switching the current direction.

The lead wires 23 of the heater 20 and the Peltier element 22 pass through the inside of the lid 3 and the case body 2, and are electrically connected to the contacts (not shown) on the test board 6 when the measurement position of the IC is reached. . In this case, the terminal of the lead wire 23 may be exposed on the upper surface of the lid 3 and the current may be supplied from the pusher 19 side.

A ridge 3a is formed on the upper edge of the lid 3 to prevent the condensed water generated during the low temperature test from dripping downward, and a similar ridge 2a is formed around the bottom surface of the case body 2. .

As shown in FIG. 2, the test board 6 is installed below a pair of fixed rails 16 (only one is shown), and the rail 16a at the measurement position is separated from the rails 16 on both sides and the lower surface is provided with a return spring 17. It is supported.

A gas supply nozzle 18 and a bifurcated pusher 19 are installed above the measurement position. The gas supply nozzle 18 causes the inside of the heat insulating case 1 to have a predetermined temperature, and in the high temperature test, high temperature air is jetted, and in the low temperature test, nitrogen gas or cold air is jetted. I c
The temperature can be adjusted only by the heater 20 and the Peltier element 22 described above, but if gas supply is also used, the time can be shortened accordingly. The supply nozzle 18 includes an inner pipe 18a and an outer pipe 18b.
If a double pipe is used and the gas overflowing at the inlet 10 is recovered by the outer pipe 18b, the formation of frost can be prevented.

Further, in this embodiment, dummy IC's for monitoring are previously inserted in the sockets 4 on both sides of the case body 2. Dummy I
C'has the same electronic circuit as an IC to be inserted into another socket 4, and has a temperature sensor 24 such as a thermocouple incorporated therein. The signals from the dummy IC 'and the temperature sensor 24 are sent to the monitor side through the test board 6 so that the worker can monitor the temperature condition in the heat insulating case 1.

Next, the temperature test sequence of the IC using this heat insulating case 1 will be described.

First, when the IC is inserted into each socket 4 of the case body 2 by the loader (not shown) of the IC test handler, the holding plate
15 presses each IC from above with spring force. In this state, the heat insulating case 1 is intermittently moved on the fixed rail 16 to the right in FIG. 2 by a conveyor (not shown). In the case of the low temperature test, it is desirable to supply nitrogen gas or the like at room temperature from the inlet 10 to expel moisture in order to prevent the formation of frost.

Next, when the heat insulating case 1 is sent to the measurement position, the heater 20 of the holding plate 15 is energized and each IC is heated by heat conduction. Subsequently, the upper nozzle 18 and pusher 19 are lowered to push down the heat insulating case 1 integrally with the rail 16a, so that gas is injected into the case 1 through the injection port 10 and the through hole 5 and the pogo pin 7 are fitted together. With this, the data of each IC is measured on the test board 6 side through the socket 4, the through hole 5, and the pogo pin 7, and the temperature inside the case 1 is the dummy IC '.
Are monitored by workers.

When the measurement is completed, the nozzle 18 and the pusher 19 are raised, so that the heat insulating case 1 and the rail 16a are pushed up to their original positions by the action of the spring 17. Next, the heat insulating case 1 is sent to the right side of FIG. 2 to open the lid 3, and then the IC inside is automatically taken out by an unloader or the like. These ICs are sorted by good product and defective product or by data as in the past.
It is stored in a predetermined magazine or pallet (not shown).

[Effects of the Invention] As described in detail above, if a temperature test is performed using the heat insulating case of the present invention, there is an effect that the IC on the socket is securely fixed by the pressing member regardless of the type and size of the IC. .

[Brief description of drawings]

Fig. 1 is a perspective view of the case body and lid of the heat insulating case, Fig. 2 is an enlarged sectional view of the IC measurement point, and Fig. 3 is a holding plate and dummy I.
It is an enlarged view of C'portion. 1 ... Insulation case, 2 ... Case body, 3 ... Lid, 4 ...
… Socket, 6 …… Test board, 7 …… Pogo pin, 14
...... Spring, 15 …… Presser plate, 20 …… Heater, 24 …… Temperature sensor, IC '…… Dummy IC, 22 …… Peltier element

Claims (1)

[Scope of utility model registration request] 1. A heat-insulating case main body, an IC socket provided inside the case main body, a heat-insulating lid that covers the upper part of the case main body, and each of them attached to the inside of the lid via a spring. An IC consisting of a pressing member that fixes the IC on the socket
Insulation case for temperature test.