JPH0735583B2 - Electroless gold plating liquid - Google Patents
Electroless gold plating liquidInfo
- Publication number
- JPH0735583B2 JPH0735583B2 JP60226738A JP22673885A JPH0735583B2 JP H0735583 B2 JPH0735583 B2 JP H0735583B2 JP 60226738 A JP60226738 A JP 60226738A JP 22673885 A JP22673885 A JP 22673885A JP H0735583 B2 JPH0735583 B2 JP H0735583B2
- Authority
- JP
- Japan
- Prior art keywords
- gold
- plating solution
- sodium
- gold plating
- electroless gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims description 58
- 229910052737 gold Inorganic materials 0.000 title claims description 56
- 239000010931 gold Substances 0.000 title claims description 56
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 54
- 239000007788 liquid Substances 0.000 title description 7
- 150000003839 salts Chemical class 0.000 claims description 9
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims description 9
- 235000019345 sodium thiosulphate Nutrition 0.000 claims description 9
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 8
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical group [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 7
- PMXFJUYOBVSEGY-UHFFFAOYSA-L sodium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane;gold(1+) Chemical compound [Na+].[Au+].[O-]S([O-])(=O)=S PMXFJUYOBVSEGY-UHFFFAOYSA-L 0.000 claims description 7
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- DTNJZLDXJJGKCM-UHFFFAOYSA-K sodium;trichlorogold Chemical compound [Na].Cl[Au](Cl)Cl DTNJZLDXJJGKCM-UHFFFAOYSA-K 0.000 claims description 5
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 4
- 239000008139 complexing agent Substances 0.000 claims description 4
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims description 4
- 235000019270 ammonium chloride Nutrition 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 235000010265 sodium sulphite Nutrition 0.000 claims description 2
- 229940006280 thiosulfate ion Drugs 0.000 claims description 2
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 claims description 2
- 239000003002 pH adjusting agent Substances 0.000 claims 3
- 238000000354 decomposition reaction Methods 0.000 claims 1
- ZBKIUFWVEIBQRT-UHFFFAOYSA-N gold(1+) Chemical compound [Au+] ZBKIUFWVEIBQRT-UHFFFAOYSA-N 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 239000003607 modifier Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 description 32
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 3
- -1 borane compound Chemical class 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229910000085 borane Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910003803 Gold(III) chloride Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- OBITVHZFHDIQGH-UHFFFAOYSA-N [Au].[K]C#N Chemical compound [Au].[K]C#N OBITVHZFHDIQGH-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 description 1
- 231100001231 less toxic Toxicity 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は無電解金めっき液に係り、特にシアン化物を含
んだ無電解金めっき液より毒性が低く、しかも長時間連
続厚付け可能な無電解金めっき液に関する。Description: FIELD OF THE INVENTION The present invention relates to an electroless gold plating solution, and in particular, it is less toxic than an electroless gold plating solution containing cyanide and is capable of continuously thickening for a long time. Gold plating solution.
無電解金めっきの方法としては、たとえばプレイティン
グ（Plating）57、914（1970）におけるOkinakaによる
シアン化金（Ｉ）カリウム、シアン化カリウム、ボラン
系化合物をめっき液主成分とする方法が知られている。
この方法によれば、１μm/hのめっき速度をもつ安定な
めっき液が得られる。しかし、このめっき液は多量のシ
アン化物イオンを含み、作業時および廃液処理時の安全
性に問題がある。As a method of electroless gold plating, for example, a method of using gold (I) potassium cyanide, potassium cyanide, or a borane-based compound as a plating solution main component by Plating 57, 914 (1970) by Okinawa is known. .
According to this method, a stable plating solution having a plating rate of 1 μm / h can be obtained. However, this plating solution contains a large amount of cyanide ions, and there is a problem in safety during work and waste solution treatment.
シアン化物イオンを全く含まない無電解金めっき液とし
ては、ルースによる塩化金（III）酸とヒドラジンを主
成分とするもの（米国特許第3300328号）と、ハックら
による塩化金（III）酸カリウムとボラン系化合物を主
成分とするもの（特公昭56−20353）がある。このどち
らも金錯塩中の金イオンは３価であるため、シアン化金
（Ｉ）カリウムを用いる場合に比べると多量の還元剤が
必要である。また、特にルースによるめっき液は不安定
で、２時間ほどでめっき液に沈殿が生じてめっきが続け
られなくなる。Electroless gold plating solutions containing no cyanide ions include those containing loose gold (III) chloride and hydrazine as the main components (US Pat. No. 3300328) and Huck et al. Potassium (III) chloride. And those containing a borane compound as a main component (Japanese Patent Publication No. 56-20353). In both cases, since the gold ion in the gold complex salt is trivalent, a large amount of reducing agent is required as compared with the case where potassium gold (I) cyanide is used. In addition, since the plating solution due to looseness is unstable, precipitation occurs in the plating solution in about 2 hours and the plating cannot be continued.
本発明の目的はめっき液成分にシアン化物イオンを全く
含まず、しかもシアン化物イオンを含んだ従来のめっき
液と同程度のめっき速度、およびめっき液安定性をもつ
無電解金めっき液を提供することにある。An object of the present invention is to provide an electroless gold plating solution which does not contain cyanide ions at all in the plating solution and has a plating rate and plating solution stability comparable to those of conventional plating solutions containing cyanide ions. Especially.
従来の無電解金めっき液でシアン化物イオンを多量に用
いるのは、めっき液をアルカリ性にして強力な還元剤を
使用する際に、金錯塩から生じる金錯イオンが分解して
金の沈殿が生じるのを、シアン化物イオンが安定な金錯
イオンをつくる能力によって防ぐためである。A large amount of cyanide ion is used in the conventional electroless gold plating solution, when the plating solution is made alkaline and a strong reducing agent is used, the gold complex ion generated from the gold complex salt is decomposed to cause precipitation of gold. This is due to the ability of cyanide ions to form stable gold complex ions.
発明者らは、めっき液を中性にして還元剤の還元力が弱
まる状態においては、シアン化物イオンを使用する必要
はないと考えた。ただし、その場合でも良質な金膜質を
得るために、金錯イオンを安定に存在させる必要があ
り、発明者らはシアン化物イオンにかわる錯化剤として
チオ硫酸イオンが適当であると推定した。中性の水溶液
中で強い還元力をもつ還元剤としてチオ尿素を選び、金
錯塩としてチオ硫酸金（Ｉ）ナトリウム、錯化剤として
チオ硫酸ナトリウムを用いて無電解金めっき液をつく
り、その特性を評価した。その結果、このめっき液がシ
アン化物イオンを含む従来のめっき液と同程度のめっき
速度、およびめっき液安定性をもち、良質の金皮膜を与
えることを見出した。また、チオ硫酸金（Ｉ）ナトリウ
ムのかわりに、金錯塩として塩化金（III）酸ナトリウ
ムとチオ硫酸ナトリウムを混合して用いても、３価の金
イオンが１価に還元された状態になるので、チオ硫酸金
（Ｉ）ナトリウムを使うのと同様の効果が得られること
を見出した。The inventors considered that it is not necessary to use cyanide ions in a state where the reducing power of the reducing agent is weakened by neutralizing the plating solution. However, even in that case, in order to obtain a good quality gold film, it is necessary to stably exist the gold complex ion, and the inventors presumed that thiosulfate ion is suitable as a complexing agent in place of cyanide ion. Thiourea was selected as a reducing agent having a strong reducing power in a neutral aqueous solution, and an electroless gold plating solution was prepared by using sodium gold (I) thiosulfate as a gold complex salt and sodium thiosulfate as a complexing agent, and its characteristics. Was evaluated. As a result, they have found that this plating solution has a plating rate and stability of plating solution comparable to those of conventional plating solutions containing cyanide ions, and gives a good quality gold film. Further, even if sodium gold (III) chloride and sodium thiosulfate are used as a gold complex salt in place of sodium gold (I) thiosulfate, trivalent gold ions are reduced to a monovalent state. Therefore, it was found that the same effect as that obtained by using sodium gold (I) thiosulfate can be obtained.
以下に本発明の無電解金めっき液の組成について、量的
限定と限定理由を示す。The composition of the electroless gold plating solution of the present invention is shown below in terms of quantitative limitations and reasons for limitation.
（ａ）金錯塩としてチオ硫酸金（Ｉ）ナトリウムあるい
は塩化金（III）酸ナトリウムの配合割合は、１〜50g/l
が良、好ましくは５〜20g/lであり、特に好ましくは５
〜11g/lである。なお、1g/lより少ないとめっき反応が
ほとんど進行せず、50g/lより多いとめっき反応に特別
の効果がないうえに経済的に不利である。(A) The compounding ratio of sodium gold (I) thiosulfate or sodium chloroaurate (III) chloride as a gold complex salt is 1 to 50 g / l.
Is good, preferably 5 to 20 g / l, particularly preferably 5
~ 11 g / l. If it is less than 1 g / l, the plating reaction hardly proceeds, and if it is more than 50 g / l, there is no special effect on the plating reaction and it is economically disadvantageous.
（ｂ）チオ硫酸ナトリウム配合量は、金錯塩としてチオ
硫酸金（Ｉ）ナトリウムを用いた場合は５〜200g/lが良
く、好ましくは25〜100g/lであり、特に好ましくは25〜
50g/lである。5g/lより少ないと金の沈殿が生じやす
く、200g/lより多いとイオウの沈殿が生じる。金錯塩と
して塩化金（III）酸ナトリウムを用いた場合は、上記
範囲のチオ硫酸ナトリウムに塩化金（III）酸ナトリウ
ムと同量のチオ硫酸ナトリウムを加える。When (b) sodium thiosulfate is used as the gold complex salt, sodium gold (I) thiosulfate is preferably 5 to 200 g / l, preferably 25 to 100 g / l, and particularly preferably 25 to
It is 50 g / l. If it is less than 5 g / l, gold is likely to precipitate, and if it is more than 200 g / l, sulfur is precipitated. When sodium gold (III) chloride is used as the gold complex salt, the same amount of sodium thiosulfate as sodium gold (III) chloride is added to sodium thiosulfate in the above range.
（ｃ）亜硫酸ナトリウム配合量は２〜100g/lが良く、好
ましくは10〜50g/lであり、特に好ましくは25〜50g/lで
ある。2g/lより少ないとイオウの沈殿が生じやすく、10
0g/lより多いとめっき反応に特別の効果がない。The compounding amount of (c) sodium sulfite is preferably 2 to 100 g / l, preferably 10 to 50 g / l, and particularly preferably 25 to 50 g / l. If it is less than 2 g / l, sulfur precipitation will occur easily,
If it is more than 0 g / l, there is no special effect on the plating reaction.
（ｄ）塩化アンモニウム配合量は５〜50g/lが良く、好
ましくは20〜50g/lであり、特に好ましくは20〜40g/lで
ある。5g/lより少ないと金の沈殿が生じやすく、50g/l
より多いとめっき反応に特別の効果がない。The amount of ammonium chloride (d) is preferably 5 to 50 g / l, preferably 20 to 50 g / l, and particularly preferably 20 to 40 g / l. If the amount is less than 5g / l, gold precipitation is likely to occur, 50g / l
If there is more, there is no special effect on the plating reaction.
（ｅ）チオ尿素の配合量は１〜75g/lが良く、好ましく
は８〜40g/lであり、特に好ましくは８〜20g/lである。
1g/lより少ないか75g/lより多いと、めっき反応はほと
んど進行しない。The compounding amount of (e) thiourea is preferably 1 to 75 g / l, preferably 8 to 40 g / l, and particularly preferably 8 to 20 g / l.
When the amount is less than 1 g / l or more than 75 g / l, the plating reaction hardly proceeds.
以下に本発明を実施例により詳細に説明する。 The present invention will be described in detail below with reference to examples.
実施例1. 大きさ2.5cm×2.5cm、厚さ0.3mmの銅板に、厚さ２μｍ
のニッケル皮膜を、次に厚さ１μｍの金皮膜をそれぞれ
電気めっきでつけて試料とした。試料を脱脂液で、次に
希塩酸で洗浄後よく水洗した。窒素フローで乾燥してか
ら、試料の重量を秤量した。この試料を、以下に示す成
分のめっき液に２時間浸した。液温は60℃で、塩酸によ
ってpHを4.0とした。Example 1. A copper plate having a size of 2.5 cm × 2.5 cm and a thickness of 0.3 mm and a thickness of 2 μm
Then, a nickel film of 1 .mu.m and a gold film having a thickness of 1 .mu.m were respectively applied by electroplating to obtain samples. The sample was washed with a degreasing solution, then with dilute hydrochloric acid, and then thoroughly washed with water. After drying with a nitrogen flow, the weight of the sample was weighed. This sample was immersed in a plating solution having the following components for 2 hours. The liquid temperature was 60 ° C. and the pH was adjusted to 4.0 with hydrochloric acid.
上記めっき液を強制かくはんし、30分毎に試料を取り出
し金膜厚を重量法によって測定した。その結果を図の曲
線１に示した。 The plating solution was forcibly stirred, a sample was taken out every 30 minutes, and the gold film thickness was measured by a gravimetric method. The result is shown in the curve 1 of the figure.
金膜厚は２時間で1.2μｍに達した。析出した金膜は無
光沢の明黄色で、液中に沈殿は観測されなかった。The gold film thickness reached 1.2 μm in 2 hours. The deposited gold film was a dull bright yellow color, and no precipitation was observed in the liquid.
実施例2. 上記実施例１と同様に準備した試料を、以下に示す成分
のめっき液に２時間浸した。液温は80℃で、塩酸によっ
てpHを5.0とした。Example 2. A sample prepared in the same manner as in Example 1 was immersed in a plating solution having the following components for 2 hours. The liquid temperature was 80 ° C, and the pH was adjusted to 5.0 with hydrochloric acid.
上記めっき液を強制かくはんし、実施例１と同様に金膜
厚を測定した。その結果を図の曲線２に示した。金膜厚
は２時間で1.8μｍに達した。金膜質は無光沢の明黄色
で、液中に沈殿は観測されなかった。 The plating solution was forcibly stirred and the gold film thickness was measured in the same manner as in Example 1. The result is shown in the curve 2 in the figure. The gold film thickness reached 1.8 μm in 2 hours. The gold film had a matte, bright yellow color, and no precipitation was observed in the liquid.
実施例3. 上記実施例１と同様に準備した試料を、以下に示す成分
のめっき液に２時間浸した。液温は80℃で、塩酸によっ
てpHを5.0とした。Example 3 A sample prepared in the same manner as in Example 1 above was immersed in a plating solution having the following components for 2 hours. The liquid temperature was 80 ° C, and the pH was adjusted to 5.0 with hydrochloric acid.
上記めっき液を強制かくはんし、実施例１と同様に金膜
厚を測定した。その結果を図の曲線３に示した。金膜厚
は２時間で1.7μｍに達した。金膜質は無光沢の明黄色
で、液中に沈殿は生じなかった。 The plating solution was forcibly stirred and the gold film thickness was measured in the same manner as in Example 1. The result is shown in the curve 3 of the figure. The gold film thickness reached 1.7 μm in 2 hours. The gold film had a matte, bright yellow color and no precipitation occurred in the liquid.
〔発明の効果〕 以上述べたように本発明によればシアン化物イオンを全
く含まないめっき液によって、連続的に厚付け金めっき
が可能であるので、無電解金めっき作業の安全化ならび
にめっき廃液処理の点で効果がある。特にセラミック基
板など、電子部品の金めっき工程に本発明を導入すれ
ば、めっき工程を大幅に合理化することができる。[Advantages of the Invention] As described above, according to the present invention, since it is possible to continuously perform thick plating with a plating solution containing no cyanide ions, the safety of electroless gold plating work and the waste plating solution are achieved. It is effective in terms of processing. In particular, if the present invention is introduced into the gold plating process for electronic components such as ceramic substrates, the plating process can be greatly streamlined.
図は本発明の無電解金めっき液を用いて、金皮膜を析出
させたときの金膜厚（μｍ）とめっき時間（時間）との
関係を示す図である。 1,2,3……実験データThe figure is a diagram showing the relationship between the gold film thickness (μm) and the plating time (hour) when a gold film was deposited using the electroless gold plating solution of the present invention. 1,2,3 …… Experimental data
───────────────────────────────────────────────────── フロントページの続き (72)発明者 富沢 明 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (56)参考文献 特開 昭51−92738（ＪＰ，Ａ) 特公 昭58−17256（ＪＰ，Ｂ２) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akira Tomizawa 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Inside the Institute of Industrial Science, Hitachi, Ltd. (56) Reference JP-A-51-92738 (JP, A) Public Sho 58-17256 (JP, B2)
Claims (7)
含むことを特徴とする無電解金めっき液。1. An electroless gold plating solution comprising a thiosulfato gold (I) complex and a gold source.
リウム、もしくは塩化金（III）ナトリウムとチオ硫酸
ナトリウムの混合物、錯化剤としてのチオ硫酸ナトリウ
ム、還元剤としてのチオ尿素、PH調整剤よりなることを
ことを特徴とする無電解金めっき液。2. Water, sodium gold (I) thiosulfate as a gold complex salt, or a mixture of sodium gold (III) chloride and sodium thiosulfate, sodium thiosulfate as a complexing agent, thiourea as a reducing agent, and PH. An electroless gold plating solution, characterized by comprising a conditioner.
特徴とする特許請求の範囲第２項記載の無電解金めっき
液。3. The electroless gold plating solution according to claim 2, wherein the PH adjusting agent is ammonium chloride.
0.0を示すだけ添加されていることを特徴とする特許請
求の範囲第２項記載の無電解金めっき液。4. The pH adjuster is an electroless gold plating solution having a pH of 3.0 to 1
The electroless gold plating solution according to claim 2, wherein the electroless gold plating solution is added only to show 0.0.
リウム、もしくは塩化金（III）ナトリウムとチオ硫酸
ナトリウムの混合物、錯化剤としてのチオ硫酸ナトリウ
ム、還元剤としてのチオ尿素、PH調整剤、チオ硫酸イオ
ン分解防止剤としての亜硫酸ナトリウムよりなることを
ことを特徴とする無電解金めっき液。5. Water, sodium gold (I) thiosulfate as a gold complex salt, or a mixture of sodium gold (III) chloride and sodium thiosulfate, sodium thiosulfate as a complexing agent, thiourea as a reducing agent, and PH. An electroless gold plating solution comprising a modifier and sodium sulfite as a thiosulfate ion decomposition inhibitor.
特徴とする特許請求の範囲第５項記載の無電解金めっき
液。6. The electroless gold plating solution according to claim 5, wherein the PH adjusting agent is ammonium chloride.
0.0を示すだけ添加されていることを特徴とする特許請
求の範囲第５項記載の無電解金めっき液。7. The pH of the electroless gold plating solution is 3.0 to 1 as the PH adjuster.
The electroless gold plating solution according to claim 5, wherein the electroless gold plating solution is added only to show 0.0.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60226738A JPH0735583B2 (en) | 1985-10-14 | 1985-10-14 | Electroless gold plating liquid |
| CN86106675.8A CN1003524B (en) | 1985-10-14 | 1986-10-11 | Electroless Gold Plating Solution |
| DE8686114143T DE3663690D1 (en) | 1985-10-14 | 1986-10-13 | Electroless gold plating solution |
| EP86114143A EP0219788B1 (en) | 1985-10-14 | 1986-10-13 | Electroless gold plating solution |
| KR1019860008554A KR910006643B1 (en) | 1985-10-14 | 1986-10-13 | Electroless gold plating solution |
| US07/091,457 US4804559A (en) | 1985-10-14 | 1987-08-31 | Electroless gold plating solution |
| US07/143,959 US4880464A (en) | 1985-10-14 | 1988-01-14 | Electroless gold plating solution |
| US07/184,061 US4963974A (en) | 1985-10-14 | 1988-04-20 | Electronic device plated with gold by means of an electroless gold plating solution |
| US07/532,656 US5202151A (en) | 1985-10-14 | 1990-06-04 | Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60226738A JPH0735583B2 (en) | 1985-10-14 | 1985-10-14 | Electroless gold plating liquid |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10001596A Division JPH08253872A (en) | 1996-04-22 | 1996-04-22 | Gold plating method for electronic parts |
| JP10001496A Division JPH08253871A (en) | 1996-04-22 | 1996-04-22 | Electroless gold plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6286171A JPS6286171A (en) | 1987-04-20 |
| JPH0735583B2 true JPH0735583B2 (en) | 1995-04-19 |
Family
ID=16849831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60226738A Expired - Lifetime JPH0735583B2 (en) | 1985-10-14 | 1985-10-14 | Electroless gold plating liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735583B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2967106B2 (en) * | 1986-04-18 | 1999-10-25 | 株式会社日立製作所 | Electronic component manufacturing method |
| JP2655329B2 (en) * | 1988-01-28 | 1997-09-17 | 関東化学 株式会社 | Electroless plating solution |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2803147C2 (en) * | 1978-01-25 | 1984-03-08 | W.C. Heraeus Gmbh, 6450 Hanau | Immersion gold bath |
-
1985
- 1985-10-14 JP JP60226738A patent/JPH0735583B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6286171A (en) | 1987-04-20 |
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| Date | Code | Title | Description |
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| EXPY | Cancellation because of completion of term |