JPH07303009A - Sine wave oscillation circuit - Google Patents

Abstract

PURPOSE:To provide a sine wave oscillation circuit capable of easily generating a sine wave by combining smaller kinds of parts and generating two kinds of sine waves with remarkably different frequencies with simple constitution. CONSTITUTION:This sine wave oscillation circuit 1 is comprised by including an inverter logic circuit 10 functioning as an invertible amplifier, LC elements 12, 14 in which an inductor component and a capacitor component are formed in distributed constant fashion, and a capacitor 16 functioning as a load. The LC elements 12, 14 are connected to the inverter logic circuit 10 in ring shape, and oscillation can be continued with the frequency in which the phase shift of a signal returned after making a round is set at 0 or 360 deg., then, the sine wave can be generated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sine wave oscillating circuit for obtaining a sine wave signal having a predetermined frequency by utilizing LC resonance.

[0002]

2. Description of the Related Art Conventionally, a sine wave has been used in various fields such as communication, and various oscillation circuits for obtaining this sine wave are known. For example, as typical ones, a Wien bridge type oscillation circuit and various LC oscillation circuits such as Colpitts type and Hartley type are known.

In principle, each of these various sine wave oscillating circuits is constructed by combining an amplifier such as a transistor and an LC circuit or an RC circuit, and each element constant is used to obtain a sine wave of a desired oscillation frequency. Need to decide.

[0004]

By the way, in the conventional sine wave oscillation circuit, the inductor and the capacitor forming the LC circuit or the resistor and the capacitor forming the RC circuit are individually prepared and combined. On the other hand, the number of device constants determined by designers is large, but the design becomes complicated. In particular, depending on the device that uses the sine wave,
It would be convenient if the desired oscillation frequency could be easily achieved by combining fewer types of components.

Further, the above-mentioned conventional sine wave oscillation circuit is
It generates a sine wave with a fixed fundamental frequency, and by replacing the resistors and capacitors with variable elements, the frequency can be varied within a narrow range near this fundamental frequency. Therefore, the frequency is different, for example, the frequency is 3 to
If you want to generate two types of sine waves that differ by about 5 times, basically you should prepare two types of sine wave oscillation circuits, and if you want to switch the sine wave to be used, prepare the sine wave oscillation. A method of switching and using the circuit itself is used. Therefore, there is a problem in that the scale of the oscillation circuit becomes large if two types of sine waves having widely different frequencies are to be generated.

The present invention has been made in view of the above points, and an object thereof is to provide a sine wave oscillation circuit capable of easily generating a sine wave by combining fewer types of components. It is in.

Another object of the present invention is to provide a sine wave oscillating circuit capable of generating two types of sine waves having greatly different frequencies with a simple structure.

[0008]

In order to solve the above problems, a sine wave oscillating circuit according to a first aspect of the present invention includes an inverting amplifier that amplifies an input signal and performs phase inversion, and one of them is a signal input / output path. Two inductors used as a capacitor and capacitors between them are formed in a distributed constant manner, and one of the inductors used as the signal input / output path is connected in series with the other inductor and A plurality of LC elements in which inductors are connected to each other, and sine wave oscillation is performed by feeding back the output of the inverting amplifier to the input side through the plurality of inductors connected in series.

A sine wave oscillator circuit according to a second aspect is the sine wave oscillator circuit according to the first aspect, wherein the other inductors of the plurality of LC elements are connected to each other through a frequency adjustment capacitor.

A sine wave oscillator circuit according to a third aspect of the present invention is the sine wave oscillator circuit according to the first aspect, wherein the other inductors of the plurality of LC elements are connected to each other via a varicap.

A sine wave oscillation circuit according to a fourth aspect of the present invention is provided.
In the sine wave oscillating circuit according to any one of 3 above, the inverting amplifier is constituted by an inverter logic circuit.

According to a fifth aspect of the present invention, a sine wave oscillating circuit is provided.
In the sine wave oscillating circuit according to any one of 3 above, the inverting amplifier is constituted by a grounded source circuit or a grounded emitter circuit.

According to a sixth aspect of the present invention, there is provided a sine wave oscillator circuit according to the first aspect.
In the sine wave oscillation circuit of any one of 5,
Each of the C elements is formed by alternately stacking a plurality of strip-shaped conductors functioning as the inductor and a dielectric sheet and winding them concentrically, and any one of the plurality of strip-shaped conductors is used for the signal input. It is characterized in that it is used as an output path.

The sine wave oscillating circuit according to a seventh aspect of the present invention is the sine wave oscillating circuit according to the first aspect.
In the sine wave oscillation circuit of any one of 5,
Each of the C elements is formed on substantially the same plane, each of which has a plurality of spiral electrodes each functioning as the inductor, an insulating layer formed between the plurality of spiral electrodes, and the insulating layer. The plurality of spiral electrodes are configured to include an insulating substrate formed on one surface so as to be substantially overlapped with each other with a layer interposed therebetween, and any one of the plurality of spiral electrodes is provided to the signal input / output path. It is used as.

According to another aspect of the present invention, there is provided a sine wave oscillating circuit.
In the sine wave oscillation circuit of any one of 5,
Each of the C elements has respective winding portions of different layers, and when a plurality of spiral electrodes that entirely function as the inductor and the winding portions of these spiral electrodes are alternately stacked, It is configured to include an insulating plate or an insulating film inserted between the peripheral portions, and any one of the plurality of spiral electrodes is used as the signal input / output path.

According to a ninth aspect of the present invention, there is provided a sine wave oscillator circuit according to the first aspect.
In the sine wave oscillation circuit of any one of 5,
Each of the C elements is formed so as to substantially face both sides of an insulating sheet having a plurality of folded portions that are alternately folded in the opposite direction and laminated, and the folded portions are alternately folded and laminated. It is characterized in that each of them is configured to include a plurality of conductors each of which functions as the inductor of a predetermined number of turns, and one of the plurality of conductors is used as the signal input / output path.

According to a tenth aspect of the present invention, a sine wave oscillating circuit is provided.
In the sine wave oscillating circuit according to any one of items 1 to 9, the oscillating frequency is switched by changing the diameter of each of the plurality of inductors for each different winding portion and changing the operating power supply voltage of the inverting amplifier. And

[0018]

The sine wave oscillating circuit according to claim 1 includes an inverting amplifier and an inverting amplifier.
It is configured by connecting a plurality of LC elements in series in a ring shape. In this inverting amplifier, the phase of the signal is inverted, that is, 180 degrees out of phase, so that the phase is further increased by two or more LC elements connected to this inverting amplifier.
The phase of the signal after returning by 80 degrees is 0 degree or 360 degrees.
Oscillation will be performed at a frequency that becomes a frequency.

As described above, according to the first aspect of the present invention, the sine wave oscillation is performed only by connecting the inverting amplifier and the LC element in a ring shape, and it is easy to combine only a smaller number of types of components. A sine wave can be generated.

Further, in the sine wave oscillating circuit according to the present invention, a frequency adjusting capacitor is connected in series with the capacitor components of the plurality of LC elements described above, and each LC is adjusted in accordance with the element constant of the frequency adjusting capacitor. The phase characteristics and resonance characteristics of the element can be adjusted. Therefore, the frequency of the generated sine wave can be easily adjusted within a certain range by changing the element constant of the frequency adjustment capacitor.

Further, in the sine wave oscillating circuit of claim 3, the frequency adjusting capacitor is replaced with a varicap, and the sine wave generated by externally controlling the capacitance of the varicap is generated. The frequency can be changed in a range. Therefore, the voltage control type sine wave oscillation circuit can be easily configured.

In the sine wave oscillating circuit according to a fourth or fifth aspect of the present invention, the inverting amplifier described above is configured by a grounded source circuit or a grounded emitter circuit using an inverter logic circuit or a transistor. That is, all of these are to invert the logic of the input signal and output it, and at the same time, to amplify the voltage level of the input signal. By simply combining an inverting amplifier with such a structure and an LC element,
A sine wave can be easily generated.

The sine wave oscillating circuit according to claims 6 to 9 is
It shows an example of a specific configuration of the LC element described above. That is, a spiral electrode is formed by stacking spiral electrodes on an insulating substrate by alternately stacking strip-shaped conductors and dielectric sheets and winding them in a concentric manner. The LC element is formed by using a conventional spiral electrode or by folding an insulating sheet having conductors formed on both surfaces to form a laminated body. Therefore, it is possible to easily realize an LC element in which an inductor component and a capacitor component are formed in a single element in a distributed constant with a simple structure, and a sine wave oscillation circuit is configured by using this LC element. The types of parts can be reduced.

Further, the sine wave oscillating circuit according to a tenth aspect of the invention is such that the oscillating frequency is discontinuously switched by changing the operating power supply voltage of the inverting amplifier. That is, by changing the diameter of each inductor of the LC element for each different winding portion, a phenomenon that a single element has a plurality of resonance points appears. Therefore, when the operating power supply voltage of the inverting amplifier is changed, the operating point of the inverting amplifier moves so as to correspond to another resonance point, and a phenomenon in which the oscillation frequency largely switches occurs. In this way, two types of sine waves having widely different frequencies can be generated by a single circuit without combining separate circuits, and the circuit scale can be reduced.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A sine wave oscillator circuit according to an embodiment of the present invention will be specifically described below with reference to the drawings.

[First Embodiment] FIG. 1 is a diagram showing a detailed configuration of a sine wave oscillation circuit 1 of a first embodiment to which the present invention is applied.

As shown in the figure, the sine wave oscillation circuit 1 of the first embodiment has an inverter logic circuit 10 which functions as an inverting amplifier, and an LC element 12 in which an inductor component and a capacitor component are formed in a distributed constant. , 14 and a capacitor 16 functioning as a load.

The inverter logic circuit 10 inverts the logic of the input signal, that is, shifts the phase by 180 degrees and outputs it, and also operates as an amplifier. The inverter logic circuit 10 can be realized by using any logic such as a TTL logic. However, the CMOS logic has a high input impedance and is easy to design a circuit. Among them, a high speed is used when a high frequency sine wave is oscillated. Type 74
A CMOS logic such as HC series is suitable.

The capacitor 16 functions as a load. If the internal capacity of the inverter logic circuit 10 can also be used, the capacitor 16 can be omitted.

Each of the LC elements 12 and 14 has an inductor component and a capacitor component formed in a distributed constant, and signals are input and output through the inductor portion. Hereinafter, specific examples of the LC elements 12 and 14 will be described.

FIG. 2 is a development view of a case where an LC element is constructed by winding a strip conductor or the like. Also, FIG.
FIG. 4 is a diagram showing a state after winding the strip-shaped conductor shown in FIG. 2 and the like.

When manufacturing the LC elements 12 and 14 of the present embodiment, as shown in FIG. 2, the strip conductors 18-1 and 18-1 are used.
8-2 are laminated via the dielectric sheets 20-1 and 20-2 to form a laminated body, and the strip-shaped conductor 18-
A first inner lead 22-1 for input / output is connected near the inner end (left end in the same figure) of 1.

Next, as shown in FIG. 3A, this laminated body is wound around the rotary winding shaft 26 a plurality of times. And
The first outer lead 22-2 for input / output is connected near the outer end of the strip-shaped conductor 18-1, and the outer lead 24 for capacitor is connected near the outer end of the other strip-shaped conductor 18-2. To do. At this time, it is preferable to dispose the capacitor outer lead 24 by ½ rotation from the first outer lead 22-2 about the winding shaft 26. By such an arrangement, the strip-shaped conductor 18- After winding 1 etc., 3 leads 22-1, 22-2, 2
It becomes possible to arrange and dispose 4 in a separate manner, which is convenient for later connection.

Next, after the winding end of the winding portion 40 is fixed by heat welding or an adhesive, the winding portion 28 is removed from the winding shaft 26 and is orthogonal to the line connecting the outer leads 22-2 and 24. The winding portion 28 is pressed while being heated from the direction.

As a result, in the winding part 28, as shown in FIG. 3 (B), the air-core part 30 extracted from the winding shaft 26 is deformed, and the leads 22-1, 22-2 and 24 are aligned. As they are lined up, the spacing between the leads increases.
Thus, the substantially flat LC elements 12 and 14 as shown in FIG. 3C are completed.

In the flat-shaped LC elements 12 and 14 thus formed, the outer surface of the winding portion 28 may be covered with a casing such as a metal foil or coated with epoxy or the like, if necessary. May be.

FIG. 4 shows an LC device 1 having the above structure.
It is a figure which shows the equivalent circuit of 2 and 14. Band-shaped conductor 18-
The wound conductor 1 functions as an inductor having an inductance L1 and the strip-shaped conductor 18
-2 functions as an inductor having the inductor L2 by being wound. Further, since these two strip-shaped conductors 18-1 and 18-2 are opposed to each other and are wound concentrically, a capacitor having a capacitance C is formed between them in a distributed constant manner.

FIG. 5 is a diagram showing the characteristics of the LC elements 12 and 14 having the structures shown in FIGS. The LC elements 12 and 14 are used as 3-terminal elements, and the leads 22-2
AC signal is input between terminals 24 and 24
The results of observing the signal appearing between -1 and 24 are shown.

FIG. 6A is a diagram showing the attenuation characteristic,
The horizontal axis represents frequency and the vertical axis represents the amount of attenuation of the output signal with respect to the input signal. Near 20MHz and 150M
It can be seen that there is a large attenuation peak near Hz. In this way, the presence of multiple attenuation peaks is due to the fact that the inductor and the capacitor are formed in a distributed constant,
It is considered that this is because the diameters of the wound strip-shaped conductors 18-1 and 18-2 continuously and largely change. In particular, it has been confirmed that a plurality of attenuation peaks appear when the number of turns is set to be large so that the diameter near the inner end portion and the diameter near the outer end portion are greatly different.

FIG. 6B is a diagram showing the phase characteristics, where the horizontal axis shows the frequency and the vertical axis shows the phase shift of the output signal with respect to the input signal. Near 20MHz and 150
It can be seen that the phase abruptly changes in the vicinity of MHz (in the vicinity of the peak of sunauchi attenuation), specifically, 90 degrees or more.

In the sine wave oscillating circuit 1 of this embodiment, two LC elements 12 and 14 having such phase characteristics and the inverter logic circuit 10 are connected in a ring shape. Therefore, when the amplification degree of the inverter logic circuit 10 is set to a certain value or more, the oscillation is performed at a frequency such that the phase shift of the signal returned in one round becomes 0 degree or 360 degrees. That is, in the inverter logic circuit 10, 18
Two LC elements 1 excluding this are 0 degrees out of phase
It oscillates at a frequency such that the phase shifts 180 degrees due to 2 and 14.

In other words, since the inverter logic circuit 10 shifts the phase by 180 degrees, the LC element 12 or the like shifts the phase by 180 degrees, and the attenuation amount when the loop makes one round is an inverter logic circuit 10 which is an inverting amplifier.
If it can be compensated by the amplification factor of, the oscillation of a certain frequency will be continued.

By the way, as described with reference to FIG. 5B, since the phase of each LC element 12, 14 changes by 90 degrees or more at a certain frequency, these LC elements 12, 1
When 4 are connected in series, the phase can be shifted by 180 degrees in total, and oscillation occurs at the frequency at this time.

In this way, the sine wave oscillator circuit 1 of this embodiment is
Basically, a sine wave can be easily generated simply by combining a small number of components such as one inverter logic circuit 10 and two LC elements 12 and 14. In particular, the LC elements 12 and 14 are different from the LC series resonant circuit and the LC parallel resonant circuit in that the inductor and the capacitor are formed in a distributed constant in one element, and therefore, when configuring the oscillation circuit. There is no need to separately prepare and connect the inductor and the capacitor.

FIG. 6 is a diagram showing a modification of this embodiment. In the sine wave oscillating circuit 2a shown in FIG. 7A, the sine wave oscillating circuit 1 described above directly connects the outer leads 24 for capacitors of the LC elements 12 and 14, but the outer leads 24 are connected to each other. It is characterized in that it is connected via a capacitor 30 for frequency adjustment.

In the above-mentioned sine wave oscillation circuit 1, L
Since the oscillating frequency is determined by the inductors and capacitors formed in the C elements 12 and 14 in a distributed constant manner, the internal capacitance and the resistance of the inverter logic circuit 10, if the elements other than the load capacitor 16 are used, the element constants are determined. Can not be changed. Therefore, it is difficult to adjust the oscillation frequency, and the sine wave oscillation circuit 2a shown in FIG. 6A improves this point.

Specifically, LC formed in a distributed constant manner
By connecting the capacitor 30 in series with the capacitor components in the elements 12 and 14, the resonance characteristics of the LC elements 12 and 14 are changed, that is, the phase-frequency relationship shown in FIG. The oscillation frequency of the entire 2a also changes.

In this way, the oscillation frequency of the sine wave oscillation circuit 2a can be adjusted within a certain range by the capacitor 30 connected in series between the capacitor leads 24 of the LC elements 12 and 14, and the sine wave oscillation of the desired oscillation frequency can be achieved. Circuit 2a
Can be designed easily. In other words, it is possible to realize the sine wave oscillating circuit 2a that oscillates at a wide range of frequencies by changing the capacitance value of the connected capacitor 30 simply by preparing several types of LC elements 12 and 14 having different characteristics. Will be able to.

FIG. 6B shows the configuration of the sine wave oscillation circuit 2b having a configuration in which the capacitor 30 inserted between the capacitor leads 24 of the LC elements 12 and 14 in FIG. 6A is replaced with a varicap 32. FIG.

As described above, the oscillation frequency in the sine wave oscillation circuit 2a can be changed by changing the capacitance value of the capacitor 30 connected between the capacitor leads 24 of the LC elements 12 and 14. Therefore, by using the varicap 32 instead of selecting and using any one of the plurality of capacitors 30 having different capacitance values, it is possible to easily configure the voltage control type sine wave oscillation circuit 2b.

FIG. 7 is a diagram showing another modification of this embodiment. The sine wave oscillation circuit 2c shown in the figure has a configuration in which a variable voltage power supply 34 is added to the sine wave oscillation circuit 1 shown in FIG. The variable voltage power source 34 functions as an operating power source of the inverter logic circuit 10, and the applied voltage value can be arbitrarily changed.

Even if the operating power supply voltage applied to the inverter logic circuit 10 by the variable voltage power supply 34 is changed within a certain range, the oscillation frequency in the sine wave oscillation circuit 2c does not change. This is because the sine wave oscillation circuit c of this embodiment is LC
This is because the resonance of the elements 12 and 14 is used.

However, if the operating power supply voltage applied to the inverter logic circuit 10 is increased beyond a certain range,
A phenomenon occurs in which the oscillation frequency is discontinuously switched to a high frequency side about 4 to 5 times at a certain voltage value. This is because the optimum frequency (optimal operating point) of the inverter logic circuit 10 shifts to the high frequency side by changing the operating power supply voltage, so that the oscillation frequency near the resonance point corresponding to the attenuation peak on the low frequency side shown in FIG. This is because what has been oscillated near the resonance point corresponding to the attenuation peak on the high frequency side. When the sine wave oscillation circuit 2c was actually assembled and the oscillation frequency was measured, it was about 7M when the operating power supply voltage was low.
It was observed that a phenomenon in which the sine wave oscillation of Hz was observed was switched to a sine wave oscillation of approximately 30 MHz when the operating power supply voltage was increased.

Since the sine wave oscillating circuit 2c of this embodiment has such an oscillation characteristic, it is possible to generate two sine waves having different frequencies by one circuit.
For this reason, in the past, if two sine waves were to be generated, separate sine wave oscillating circuits had to be configured and the circuits to be used had to be switched appropriately, which made the entire circuit complicated. However, since the single sine wave oscillation circuit 2c is sufficient, the circuit configuration is simplified.

The operating power supply voltage applied from the variable voltage power supply 34 to the inverter logic circuit 10 does not necessarily have to be continuously changed. That is, since the oscillation frequency changes at a certain voltage value as a boundary, the variable power supply voltage 34 is formed so that the first and second operating voltages (fixed) lower or higher than this boundary voltage value can be applied. A first operating voltage is applied to the inverter logic circuit 10 to generate a low frequency sine wave, and a second operating voltage is applied to the inverter logic circuit 10 to generate a high frequency sine wave. As a matter of course, two power supplies capable of supplying the first and second operating voltages separately may be prepared, and the power supply to be used may be selected as needed.

Thus, the sine wave oscillator circuit 2 of this embodiment is
According to c, the frequencies are greatly different due to the simple configuration.
Any kind of sine wave can be generated. In addition, this 2
The frequency of the kind of sine wave can be arbitrarily changed within a certain range by changing the number of turns of the LC elements 12 and 14 having the structures shown in FIGS.

[Second Embodiment] FIG. 8 is a diagram showing a detailed configuration of a sine wave oscillation circuit 3 according to a second embodiment of the present invention. In the sine wave oscillating circuit 3 of the present embodiment, the sine wave oscillating circuits 1 and 2 of the first embodiment described above use the inverter logic circuit 10 as an inverting amplifier, whereas the sine wave oscillating circuit 3 of the first embodiment uses a MOS transistor as a grounded source. It is characterized by using a circuit.

That is, the sine wave oscillating circuit 3 shown in FIG.
Is the same as the inverter logic circuit 10 shown in FIG.
6 is replaced with the resistor 38 connected to the drain side of the MOS-FET 6, and the MOS-FET 36 and the resistor 38.
And constitute a source grounded circuit that functions as an inverting amplifier.

The operating principle of the sine wave oscillating circuit 3 is the same as that of the sine wave oscillating circuit 1 described above.
14 generates a sine wave having a frequency near the resonance point that inverts the phase by 180 degrees.

Further, the LC elements 12 and 14 can be constructed by superposing and winding a strip-shaped conductor and a dielectric sheet as shown in FIGS. 2 and 3, and a connection method in a circuit is also possible. There is no difference from the sine wave oscillating circuit 1 shown in FIG. 1 except that a grounded source circuit including a MOS-FET 36 and a resistor 38 is used as an inverting amplifier.

As described above, the MOS-F is used as the inverting amplifier.
A sine wave can be generated by a simple configuration in which a source-grounded circuit including an ET 36 and a resistor 38 is used and two LC elements 12 and 14 are connected in series to this inverting amplifier in a ring shape.

9 and 10 are views showing a modified example of this embodiment. The sine wave oscillation circuit 4a shown in FIG.
The capacitor leads 24 of the LC elements 12 and 14 are connected to each other via the capacitor 30, and the sine wave oscillation circuit 2 shown in FIG. 6A of the first embodiment is used.
It corresponds to a. By arbitrarily setting the capacitance value of the capacitor 30, it is possible to arbitrarily adjust the frequency of the generated sine wave.

The sine wave oscillator circuit 4b shown in FIG.
The capacitor leads 24 of the LC elements 12 and 14 are connected to each other via the varicap 32, and correspond to the sine wave oscillation circuit 4b shown in FIG. 6B of the first embodiment. It is a thing. By variably controlling the reverse bias voltage applied to the varicap 32 from the outside, the capacitance value of the varicap 32 can be arbitrarily changed within a certain range, and the sine wave oscillation circuit 4b of the voltage control type can be easily provided. Can be configured.

The sine wave oscillator circuit 4c shown in FIG.
The operating power supply voltage of the grounded source circuit composed of the S-FET 36 and the resistor 38 is applied by the variable voltage power supply 34, and corresponds to the sine wave oscillation circuit 2c shown in FIG. 7 of the first embodiment. To do.

By continuously changing the operating power supply voltage applied to the drain side of the MOS-FET 36 through the resistor 38 by the variable voltage power supply 34 or switching the operating power supply voltage stepwise, one common simple circuit is used. It is possible to generate two sinusoidal waves having greatly different frequencies. This is because the source-drain current changes by changing the operating power supply voltage to be applied, and the optimum operating speed also changes with the change of the internal resistance of the MOS-FET 36, so that the oscillation frequency is discontinuously switched. It is a thing.

FIG. 11 is a diagram showing another modification of the present embodiment. The sine wave oscillating circuit 4d shown in the figure is characterized in that a bias circuit is added to the sine wave oscillating circuit 3 shown in FIG.

That is, the sine wave oscillating circuit 3 shown in FIG.
Then, the feedback signal via the LC elements 12 and 14 is directly MOS
-Since it is inputted to the gate of the FET 36, the capacitor 16 which becomes a load and the resistor 38 which constitutes the source grounded circuit
By properly adjusting the element constants such as
It is necessary to set the optimum operating point of T36. On the other hand, in the sine wave oscillating circuit 4d shown in FIG. 11, a bias circuit capable of setting an arbitrary gate voltage is formed by a voltage dividing circuit including resistors 40 and 42, and the MOS-FET
The optimum operating points of 36 can be easily adjusted.

The capacitor 44 is a MOS-FET.
A circuit that functions as a DC component separation circuit for removing a DC component from the signal fed back to the gate of 36 and that has a large capacitance value that does not change the phase of the input signal is preferably used. .

Although only the configuration corresponding to the sine wave oscillation circuit 3 shown in FIG. 8 has been described, the configuration shown in FIG.
A bias circuit composed of resistors 40 and 42 and a DC component separation circuit composed of a capacitor 44 are added to the sine wave oscillating circuits 4a, 4b and 4c shown in (A), (B) and FIG. 10, respectively. Good.

[Third Embodiment] FIG. 12 is a diagram showing a detailed configuration of a sine wave oscillation circuit 5 according to a third embodiment of the present invention. The sine wave oscillation circuit 5 of the present embodiment is the first
Whereas the sine wave oscillating circuits 1 and 2 of the embodiment use the inverter logic circuit 10 as the inverting amplifier, and the sine wave oscillating circuits 3 and 4 of the second embodiment use the grounded source circuit by the MOS transistor as the inverting amplifier. The feature is that the grounded-emitter circuit using the bipolar transistor is used as the inverting amplifier.

That is, the sine wave oscillation circuit 5 shown in FIG.
Has a configuration in which the inverter logic circuit 10 shown in FIG. 1 is replaced with a grounded-emitter circuit including a bipolar transistor 46 and a resistor 48, and this grounded-emitter circuit operates as an inverting amplifier.

The capacitor 51 inserted in the feedback loop functions as a DC component separation circuit for removing the DC component. Further, a predetermined bias is applied to the base of the bipolar transistor 46 from the collector through the resistor 50, whereby an appropriate operating point is set.

The operation principle of the sine wave oscillation circuit 5 is the same as that of the above-mentioned sine wave oscillation circuit 1 and the like, and the two LC elements 1
2, 14 generate a sine wave having a frequency near the resonance point such that the phase is inverted by 180 degrees.

As for the LC elements 12 and 14, similar to the first and second embodiments, the strip-shaped conductor and the dielectric sheet as shown in FIGS. 2 and 3 are overlapped and wound. 1 except that the grounded emitter circuit composed of the bipolar transistor 46 and the resistor 48 is used as the inverting amplifier.
There is no difference from the sine wave oscillating circuit 1 shown in FIG.

In this way, the bipolar transistor 46
Inverter amplifier (grounded emitter circuit)
The sinusoidal wave can be generated by a simple configuration in which the two LC elements 12 and 14 are connected in a ring shape.

13 and 14 are views showing a modification of this embodiment. The sine wave oscillation circuit 6a shown in FIG.
Is a structure in which the capacitor leads 24 of the LC elements 12 and 14 are connected to each other via a capacitor 30, and FIG. 6A of the first embodiment or FIG. 9A of the second embodiment. It corresponds to the sine wave oscillation circuits 2a and 4a shown in FIG. By arbitrarily setting the capacitance value of the capacitor 30, it is possible to arbitrarily adjust the frequency of the generated sine wave.

The sine wave oscillating circuit 6b shown in FIG.
Is a structure in which the capacitor leads 24 of the LC elements 12 and 14 are connected to each other via a varicap 32. FIG. 6B of the first embodiment or FIG. 9B of the second embodiment. This corresponds to the sine wave oscillation circuits 2b and 4b shown in B). By variably controlling the reverse bias voltage applied to the varicap 32 from the outside, the capacitance of the varicap 32 can be arbitrarily changed within a fixed range, and the voltage control type sine wave oscillation circuit 6b can be easily configured. can do.

The sine wave oscillating circuit 6c shown in FIG. 14 is one in which the operating power supply voltage of the inverting amplifier composed of the bipolar transistor 46 and the resistor 48 is applied by the variable voltage power supply 34. 7 or the sine wave oscillator circuits 2c and 4 shown in FIG. 10 of the second embodiment.
It corresponds to c.

By changing the operating power supply voltage applied to the collector side of the bipolar transistor 46 via the resistor 48 by the variable voltage power supply 34 continuously or discontinuously, one common simple The circuit can generate two sine waves with different frequencies. This is because the optimum operating speed of the bipolar transistor 46 also changes by changing the operating power supply voltage to be applied, so that the oscillation frequency switches discontinuously, and basically, the MOS-FET 36.
Is the same as in.

It should be noted that the resistor 4 as shown in FIG. 11 is used without using the resistor 50 for bias application connected to the collector.
A voltage divider circuit of 0 and 42 may be added to apply a constant bias voltage to the base of the bipolar transistor 46. As described above, by separately providing a voltage dividing circuit for bias application, a constant bias voltage can be applied regardless of the voltage level appearing at the collector, and a stable operating point of the bipolar transistor 46 can be secured. Will be able to.

[Other Embodiments] Next, other embodiments to which the present invention is applied will be described. Various embodiments described below are realized by the LC elements 12 and 14 used in the above-described first to third embodiments with other structures.

FIG. 15 is a diagram showing a schematic structure of an LC element in another embodiment.

The LC element 12a (or LC
The element 14a) is composed of an insulating substrate 52 and two spiral electrodes 54-1 and 54-2 formed substantially on the surface of the insulating substrate 52.
It is configured to include and. One spiral electrode 5
4-1 is the strip-shaped conductor 18-1 shown in FIG. 2, and the other spiral electrode 54-2 is the strip-shaped conductor 18-2 shown in FIG.
And an insulating film (not shown) is formed between these two spiral electrodes 54-1 and 54-2.

Therefore, one spiral electrode 54
By providing input / output terminals corresponding to the leads 22-1 and 22-2 shown in FIG. 2 at both ends of -1, this spiral electrode 54-1 can be used as an inductor. Further, the other spiral electrode 54-2 is formed so as to substantially overlap the spiral electrode 54-1.
A distributed constant capacitor is formed between these two electrodes 54-1 and 54-2, and the relationship between the inductor component and the capacitor component is the same as that of the LC elements 12 and 14 used in the first embodiment. It will be exactly the same.

Therefore, the LC element 12a shown in FIG.
14a of each spiral electrode 54-1 is connected in series, and one end of each spiral electrode 54-2 is directly connected or connected via the capacitor 30 and the varicap 32. A sine wave oscillator circuit similar to the sine wave oscillator circuit 1 shown in the example can be obtained.

In particular, the LC elements 12a and 1 shown in FIG.
Since 4a can form electrodes and the like on the insulating substrate 52 by using a thin film forming technique, it is possible to easily downsize and simplify the manufacturing process. In addition, the two insulating substrates 52
Common to the adjacent substrate on the insulating substrate 52
By forming the electrodes for the elements 12a and 14a, the LC element 1
If the wiring between 2a and 14a is also provided, it is possible to further reduce the size of the component and simplify the manufacturing process.

FIG. 16 shows an LC whose schematic structure is shown in FIG.
It is a figure which shows an example of the manufacturing process of an element. The figure shows the sectional structure of the LC element in the order of each step. Note that the reference numerals with parentheses at the beginning of the following sentences correspond to the reference numerals used in FIG.

(A) An insulating substrate 52 is prepared. As the insulating substrate 52, various materials such as ceramics, glass or synthetic resin can be used.

(B) A metal film is formed on the insulating substrate 52,
For example, the aluminum film 54a is deposited. Note that the metal film may be formed of another material such as gold or copper.

(C) A spiral photoresist 56a pattern is formed on the aluminum film 54a. The formation of this pattern can be performed by, for example, a photo-etching method.

(D) Using the photoresist 56a as a mask, the aluminum film 54a is partially removed to form the spiral electrode 54-2. Then, the photoresist 56a is washed off.

(E) The end (outer peripheral side end) of the spiral electrode 54-2 thus formed is masked by the photoresist 56b.

(F) Anodization is performed to form an insulating oxide film 58 on the surface of the remaining portion (the portion not masked) of the spiral electrode 54-2. This insulating oxide film 58
Corresponds to the dielectric sheet 20-1 shown in FIG.

(G) Again, a metal film is formed on the entire surface, for example, an aluminum film 54b is vapor-deposited.

(H) A pattern of a spiral photoresist 56c and a pattern of a photoresist 56d corresponding to the extraction electrode 60 formed at the end of the spiral electrode 54-2 are formed on the aluminum film 54b. This pattern is formed, for example, by the photoresist 56a described above.
Similar to the above case, it can be performed by a photo-etching method.

(I) These photoresists 56c, 56
The aluminum film 54b is partially removed using d as a mask to form the spiral electrode 54-1 and the extraction electrode 60 is formed at the end of the lower spiral electrode 54-2. Then, the photoresist 56
Wash off c and 56d.

FIG. 17 is a diagram showing the planar shapes of the LC elements 12a and 14a formed on the insulating substrate 52 through the above steps. As shown in the figure, the LC elements 12a and 14a of the present embodiment have spiral electrodes 54-1 on the surface.
And the spiral electrode 54-2 is formed.
The extraction electrode 60 provided at the end portion of is exposed. Both ends of the spiral electrode 54-1 formed on the surface and the extraction electrode 60 are bonded and housed in a case to complete the LC elements 12a and 14a.

In order to construct the circuit shown in FIG. 1 or the like using these LC elements 12a and 14a, the case where the LC elements 12a and 14a housed in the case are used as a single component and wiring is performed mutually is performed. In addition, the state (bare chip) shown in FIG. 17 is arranged on a part of the wiring board so that both ends of the spiral electrode 54-1 formed on the surface and the extraction electrode 60 are directly wired to other parts. Good.

FIG. 18 shows an LC whose schematic structure is shown in FIG.
It is a figure which shows the other example of the manufacturing process of an element. According to the manufacturing process shown in FIG. 16, an LC element is manufactured in which the two spiral electrodes 54-1 and 54-2 are insulated by the insulating oxide film 58 formed by anodic oxidation. According to the manufacturing process shown in FIG.
The difference is that an LC element is manufactured by replacing the element with a silicon oxide film formed by a chemical vapor deposition method (CVD). Note that the reference numerals in parentheses below in FIG.
It corresponds to the code used in.

(A) An insulating substrate 52 is prepared. As the insulating substrate 52, various materials such as ceramics, glass, or synthetic resin can be used, as in the case of using the manufacturing process shown in FIG.

(B) A first silicon oxide film 130 is formed on the insulating substrate 52 by the chemical vapor deposition method. However, both the insulating substrate 52 and the first silicon oxide film 130 are insulators, and this step can be omitted.

(C) On the first silicon oxide film 130, a metal film such as gold, tungsten, molybdenum, tantalum or niobium which can withstand the following chemical vapor deposition process 1
32a is vapor-deposited.

(D) A spiral photoresist 56a pattern is formed on the metal film 132a. The formation of this pattern can be performed by, for example, a photo-etching method.

(E) Using the photoresist 56a as a mask, the metal film 132a is partially removed to form the spiral electrode 54-2. Then, the photoresist 56a is washed off.

(F) A second silicon oxide film 134 is formed on the spiral electrode 54-2 and the exposed first silicon oxide film 130 by the chemical vapor deposition method.

(G) A metal film 132b is deposited on the second silicon oxide film 134. Since there is no chemical vapor deposition method in the subsequent step, the metal film 132b can be an aluminum film, but may be formed of another metal material such as gold or copper.

(H) A spiral photoresist 56c pattern is formed on the metal film 132b. The formation of this pattern can be performed by a photo-etching method as in the case of the photoresist 56a described above.

(I) Using this photoresist 56c as a mask, a spiral electrode 54-having terminal electrodes at its ends is formed.
1 is formed. Then, the photoresist 56c is washed off.

By using such a process,
It is possible to manufacture an LC element having a planar structure shown in FIG.

19 and 20 are views showing the structure of another example of the LC element. FIG. 19 shows the developed state, and FIG. 20 shows an external perspective view.

The LC element 12b (or LC element 14b) shown in these figures is composed of a plurality of insulating plates 64-1 and 64-.
A laminated body 62 formed by laminating 2, ..., 64-4,
Interlayers 68-2, 68-3, 68-4 of these insulating plates 64
A first conductor 72 that forms a coil of a predetermined number of turns provided on the insulating layer 64 and the interlayers 68-1, 68-2, 68 of the insulating plate 64.
-3 includes a second conductor 82 provided so as to face the first conductor 72 via the insulating plate 64.
The first conductor 72 corresponds to the strip-shaped conductor 18-1 shown in FIG. 2, and the second conductor 82 corresponds to the strip-shaped conductor 18-2 shown in FIG.

The above-mentioned insulating plate 64 is made of various insulating materials as required, but is made of various materials such as ceramics, glass, or synthetic resin. Further, the first and second conductors 72 and 82 are arranged to face each other on both sides of the insulating plate 64 by using various techniques such as printing, vapor deposition or plating of various metal materials such as aluminum and copper. The coating is formed.

Further, in the laminated body 62, in order to prevent the first conductor 72 and the second conductor 82 from being short-circuited, the insulating plates 64 are provided via the interlayer insulating sheets 66-1, 66-2, 66-3. Are stacked. Then, the uppermost insulating plate 64-1
The terminals 74a and 74b of the first conductor 72 and the terminals 84a and 84b of the second conductor 82 are coated on the surface of the lowermost insulating sheet 66-3.

In addition, the first conductor 72 and the second conductor 8
2 is an interlayer 68-1, 68-2, ..., 68 of the insulating plate 64.
-4, a plurality of first conductive elements 76-1, 76-2, 7 that continuously circulate from one layer to another layer
6-3 and the second conductive element 86-1, 86-
2,86-3.

In the LC elements 12b and 14b of this embodiment having such a structure, the first and second conductive elements 76 and 86 face each other with the insulating plate 64 interposed therebetween,
It has a feature that a capacitance is continuously formed between both. Therefore, the first and second conductors 7
Each of the coils 2 and 82 functions as a coil having a predetermined number of turns, that is, an inductor, and a capacitor is continuously formed between the first and second conductors 72 and 82 via an insulating plate 64. The capacitor will be formed in a distributed constant manner between the first and second conductors 72, 82.

The terminals 84a formed on the surface of the insulating plate 64-1 are connected to the insulating plate 64 through the through holes 65.
-2 is connected to the second conductive element 86-1 provided above. Similarly, the terminal 84b formed on the lowermost insulating sheet 66-3 is also covered with the second conductive element 86 via the through holes 67 and 65 provided in the insulating sheet 66-3 and the insulating plate 64-4. -3 is connected.

Similarly, the one input terminal 74b provided on the surface of the insulating plate 64-1 is connected to each of the insulating plates 64-1 and 64-1.
Through hole 65 and conductive pattern 7
First through the back surface of the insulating plate 64-2 via
Connected to the end of the conductive element 76-1.
Similarly, the other input / output terminal 74 a provided on the lowermost interlayer insulating sheet 66-3 is covered with the first conductive element 76 formed on the insulating plate 64-4 through the through hole 67. -3 is connected.

In addition, each insulating plate 64-2, 64-3, 64
-4, the first conductive element 76 and the second conductive element 86, which are formed by coating, are formed on these insulating plates 6 respectively.
Through hole 67, conductive pattern 7 formed on 4
8, 88 and the through-hole 67 provided on the interlayer insulating sheet 66 from one interlayer 68 to another interlayer 6
It is electrically connected to circulate over 8.

As a result, the LC element 12b of this embodiment,
14b, the first conductor 72 has terminals 74 at both ends thereof.
It is connected to a and 74b and functions as an inductor having a predetermined inductance. Similarly, the second conductor 82 has its both ends connected to the terminals 84a and 84b,
It will function as an inductor having a predetermined inductance. Moreover, as described above, the capacitance is formed between the first and second conductors 72 and 82 substantially continuously and in a distributed constant manner. Therefore, the circuit of FIG. 4 can be applied as it is to the equivalent circuit of the LC elements 12b and 14b.
b and 14b, the first conductors 72 are connected in series, and the second conductors 82 are directly connected to each other or the capacitor 3 is connected.
0, the sine wave oscillation circuit shown in FIG. 1 and the like can be configured by connecting via the varicap 32.

The LC elements 12b and 14b of this embodiment are
Has the configuration shown in FIG. 19, so the first and second
Each of the conductors 72 and 82 is formed in a spiral shape having substantially the same diameter. Therefore, these LC elements 1
The attenuation curves of 2b and 14b do not always have clear peaks as shown in FIG. Therefore, when it is desired to change the operating power supply voltage of the inverter logic circuit 10 shown in FIG.
First and second conductive elements 76, 86 shown in FIG.
The diameter may be increased or decreased every time the layers are changed.

21 and 22 are views showing the structure of another example of the LC element, and details of each step are shown.

The LC element 12c (or 14c) shown in these figures is the LC element shown in FIGS. 19 and 20 formed by the film forming technique. That is,
The LC element shown in FIG. 19 and the like uses the insulating plate 64 as the insulating layer, but the LC elements 12c and 14c of this embodiment are characterized in that an insulating thin film or an insulating thick film is used as the insulating layer. Hereinafter, the structure of the LC elements 12c and 14c will be described through manufacturing steps. The reference numerals in parentheses at the beginning of the following sentences correspond to the reference numerals used in FIGS. 21 and 22.

(A) The surface of the insulating substrate 90 is covered with the auxiliary lead portion 92a from the back surface side to the side surface, and the surface of the insulating substrate 90 has an I-shaped slit pattern 94 continuous from the auxiliary lead portion 92a. Coating the first conductive element 98-1. As the insulating substrate 90, for example, an insulating material such as glass, synthetic resin, or ceramics is used.

(B) An insulating thin film (or insulating thickness) is formed on the surface of the insulating substrate 90 on which the first conductive element 98-1 is formed so that the end of the first conductive element 98-1 is exposed. Membrane 100-1 is coated.

(C) The auxiliary lead portion 114 is formed by coating from the back surface side to the side surface of the insulating substrate 90, and is continuous from the auxiliary lead portion 114 on the insulating thin film 100-1, and the insulating thin film 100-1 is sandwiched therebetween. Second conductive element 1 facing the first conductive element 98-1
12-1 is formed by coating. The second conductive element 112-1 is also provided with an I-shaped slit pattern 116 facing the slit pattern 94 described above.

(D) Each conductive element 98-1, 112
The insulating thin film 100-2 is formed by coating so that the end of -1 is exposed.

(E) The planar first conductive element 98-2 electrically connected to the exposed end of the first conductive element 98-1 is formed on the insulating film 100-2. To do. An I-shaped slit pattern 94 is provided on the first conductive element 98-2 in the direction opposite to that of the first conductive element 98-1. As a result, the first conductive elements 98-1 and 98-2 form a current path that continuously circulates from one layer to another layer.

(F) The insulating thin film 100-3 is formed by coating so that each end of the first conductive element 98-2 and the second conductive element 112-1 is exposed.

(G) The second conductive element 112-2 and the first conductive element 98 are formed on the insulating thin film 100-3.
-2 is formed in a planar shape so as to face -2.

(H) to (T) The thin film forming step and the element forming step are repeated to form a laminated body.
At this time, in the process of FIG.
First conductive element 98 over the sides and surface of the
The auxiliary lead portion 92b continuous from -5 is formed by coating.

(U) In the final step, the terminals 120a, 120b, 122 electrically connected to the auxiliary lead portions 92a, 92b, 114 are formed on the surface of this laminate by coating.

By the steps as described above, LC elements 12c and 14c functionally equivalent to LC elements 12b and 14b shown in FIGS. 19 and 20 can be formed.

23, 24 and 25 are views showing the structure of another example of the LC element. 23 and 24 show a developed state, and FIG. 25 shows an external perspective view.

The LC element 12d (or 14d) shown in these figures is a long insulating sheet 140 which is alternately folded at a plurality of locations in opposite directions, and this insulating sheet 140.
And second formed so as to substantially face both sides of the
Of the conductors 160 and 170.

In manufacturing the LC elements 12d and 14d of this embodiment, first, the first insulating sheet 14 shown in FIG.
Form 0. The first insulating sheet 140 includes a plurality of folding portions 142-1 and 142-that are folded and stacked.
2, ..., 142-8 are continuously arranged via the bent portion 144. Each bent portion 144 has
Perforations are formed in advance to facilitate the bending. Further, the folding portion 142 shown in FIG. 24 is formed in a substantially square shape, but if it is stacked on each other when folded, the shape such as a rectangle or a parallelogram can be arbitrarily formed.

Then, on the surface 140a side of the first insulating sheet 140, the first conductor 1 having the pattern shown in FIG. 24 is formed.
60, and the second conductor 170 is provided on the back surface 140b side.

The above-mentioned first conductor 160 has the folding portions 142-1, 142-2, ...
The ring-shaped first conductors 162-1, 162-2, ...
162-7 alternately and continuously in the opposite direction, the first
When the insulating sheets 140 of No. 2 are alternately folded and laminated in the opposite direction as shown in FIG.
In the case of 3, a coil of 4 turns) is formed.

The input / output terminal 1 is provided on both ends of the first conductor 160.
64a and 164b are provided. One input / output terminal 164a is provided at the end of the folded portion 142-1 and the other input / output terminal 164b is provided in the folded portion 142-8.
It is provided at the end of. And these input / output terminals 1
64a and 164b have leads 166a and 1 for input / output.
66b is attached and fixed as a conductor for external connection.

The second conductor 170 described above includes the second conductor 176-1 provided on the back surface side 140b of each of the folded portions 142-1, 142-2, ..., 142-7.
176-2, ..., 176-7. Each of the second conductors 176-1, 176-2, ...,
176-7 is the above-mentioned first conductor 162-1, 16
2-2, ..., 162-7 are continuously provided so as to face each other, and a capacitor is formed between the first conductor 160 and the second conductor.

An input / output terminal 173 is provided at one end of the second conductor 170. The input / output terminal 173 is an end portion of the folded portion 142-8, and is provided at a position substantially at the center of the above-described two input / output terminals 164a and 164b when the insulating sheet 140 is folded and stacked. . An input / output lead 172 is attached and fixed to the input / output terminal 173.

The leads 22-1 and 22 shown in FIG.
−2 and 24 are the leads 166 shown in FIG.
a, 166b, 174.

By the way, the first conductor 160 and the second conductor 170 described above are formed on both surfaces of the first insulating sheet 140 by various methods such as printing, etching and plating, or are formed on the first insulating sheet 140. It can be formed by any method such as sticking.

Further, in the present embodiment, the above-mentioned first
The second conductors 160 and 170 are covered with an insulating layer (not shown) on the surface thereof, and when the insulating sheet 140 is folded, the first conductors 162 or the second conductors 176 are short-circuited. Is being prevented.

As shown in FIG. 24, instead of coating these insulating layers, a second insulating sheet 150 having the same structure as the first insulating sheet 140 is prepared, and this is used as the first insulating sheet. You may make it fold simultaneously with 140 and may be laminated | stacked. Further, in the following description, for simplicity of description, the case where the insulating sheet 150 is not used will be described as an example.

Next, the first and second conductors 16 are formed on both surfaces.
The insulating sheet 160 coated with 0 and 170 is shown in FIG.
As shown in FIG. 3, the folded portions 144-1, 142-2, ...
..., 142-8 are laminated. As a result, FIG.
The laminated body 180 shown in is formed. Then, the ring-shaped conductors 162-1, 162-2, ...
, 162-7 overlap each other to form a coil in which one conductor is wound a plurality of turns. At the same time, the second conductor 170 is connected to the first conductor 160 and the insulating sheet 14.
They are opposed to each other through 0, and a capacitor is formed between them. Therefore, the LC element 12 having such a structure
d and 14d will have an equivalent circuit as shown in FIG. In addition, as shown in FIG. 25B, these LC elements 12d and 14d are formed by connecting the laminated body 180 to the leads 166.
Molding is performed using a resin such as epoxy except for a, 166b, and 174, and then connection with other parts shown in FIG. 1 and the like is performed.

The present invention is not limited to the above embodiments, but various modifications can be made within the scope of the gist of the present invention.

For example, in each of the above-described embodiments, two LC elements 12 and 14 (or LC elements 12a and 14a) in which inductors and capacitors are distributedly formed.
a) and so on are connected in series, but three or more LC
You may make it connect an element.

FIG. 26 is a diagram showing the configuration of a sine wave oscillator circuit using three LC elements. Basically, it has a configuration in which an LC element 13 is added to the sine wave oscillation circuit 2a shown in FIG. As shown in FIG. 26, the LC element 13
The LC element 13 may be mainly used as an inductor element with the capacitor leads opened, but the capacitor leads of the LC elements 12, 13 and 14 may be directly connected or the capacitors 30 and 30 may be connected between them. You may make it connect via the varicap 32. Also,
The number of LC elements used in the sine wave oscillating circuit 2a shown in FIG.
There may be more than one.

The various LC elements whose schematic structures are shown in FIG. 2 and FIG. 15 have the length of one conductor serving as a signal input / output path and the other used for forming a distributed constant capacitor. The case where the length of the conductor is set to be substantially equal has been described as an example, but the length of the other conductor may be set to be short. In this case, since the capacitance formed in a distributed constant becomes small, the oscillation frequency when the sine wave oscillation circuit is constructed also changes. That is, the oscillation frequency can be adjusted by changing the relative lengths of the two conductors.

Similarly, the other conductor used to form the capacitor may be divided into a plurality of pieces, and the ends of each divided piece may be connected to a common capacitor lead. In this case, since the self-inductance of the other conductor itself becomes small, the resonance characteristic of the LC element also changes, and the oscillation frequency can be adjusted as in the case described above.

Further, in the LC element 12 and the like in each of the above-mentioned embodiments, the strip-shaped conductors and the spiral electrodes forming the two inductors are arranged so as to face each other, but they are offset so as to partially face each other. You may do it. In this case, since the inductance can be left unchanged and only the capacitance can be reduced, the oscillation frequency can be adjusted as in the case described above.

[0152]

As described above, according to the first aspect of the invention, sinusoidal oscillation is performed only by connecting the inverting amplifier and the LC element in a ring shape, and it is possible to combine fewer types of components. A sine wave can be easily generated.

According to the invention of claim 2, the frequency adjusting capacitor is connected in series with the capacitor components of the plurality of LC elements described above, and the frequency adjusting capacitor is changed by changing the element constant. The frequency of the sinusoidal wave can be easily adjusted within a certain range.

According to the third aspect of the present invention, the frequency adjusting capacitor is replaced with a varicap and the reverse bias voltage applied to the varicap is controlled so that the frequency of the generated sine wave falls within a certain range. The voltage-controlled sine wave oscillation circuit can be easily realized.

According to the invention of claim 4 or 5,
The inverting amplifier described above is configured to include an inverter logic circuit, a grounded source circuit, or a grounded emitter circuit,
A sine wave can be easily generated simply by combining an element having such a simple structure and an LC element.

Further, according to the inventions of claims 6 to 9, the inductor component and the capacitor component are equal to 1 by a simple structure.
It is possible to easily realize an LC element formed in one element in a distributed constant manner, and by using this LC element, it is possible to reduce the types of components that form the sine wave oscillation circuit.

According to the tenth aspect of the invention, the oscillation frequency is discontinuously switched by changing the operating power supply voltage of the above-mentioned inverting amplifier, and two types of sine waves having widely different frequencies are separated. It can be generated by a single circuit without combining the above circuits, and the circuit scale can be reduced.

[Brief description of drawings]

FIG. 1 is a diagram showing a detailed configuration of a sine wave oscillator circuit according to a first embodiment of the present invention.

FIG. 2 is a development view of a case where an LC element is formed by winding a strip conductor or the like.

FIG. 3 is a diagram showing a state after winding the strip-shaped conductor shown in FIG. 2 and the like.

4 is a diagram showing an equivalent circuit of the LC element shown in FIG.

5 is a diagram showing characteristics of the LC element shown in FIG.

FIG. 6 is a diagram showing a modification of the first embodiment.

FIG. 7 is a diagram showing another modification of the first embodiment.

FIG. 8 is a diagram showing a detailed configuration of a sine wave oscillation circuit according to a second embodiment of the present invention.

FIG. 9 is a diagram showing a modification of the second embodiment.

FIG. 10 is a diagram showing another modification of the second embodiment.

FIG. 11 is a diagram showing another modification of the second embodiment.

FIG. 12 is a diagram showing a detailed configuration of a sine wave oscillation circuit according to a third embodiment of the present invention.

FIG. 13 is a diagram showing a modification of the third embodiment.

FIG. 14 is a diagram showing another modification of the third embodiment.

FIG. 15 is a diagram showing another example of the LC element.

16 is a diagram showing an example of a manufacturing process of the LC element of FIG.

17 is a diagram showing a plan view of the LC element shown in FIG.

FIG. 18 is a diagram showing another example of the manufacturing process of the LC element in FIG. 15.

FIG. 19 is an exploded perspective view showing another example of the LC element.

20 is a perspective view showing an appearance of the LC element shown in FIG. 18. FIG.

FIG. 21 is a diagram showing a manufacturing process of another example of the LC element.

FIG. 22 is a diagram showing a manufacturing process of another example of the LC element.

FIG. 23 is a development view showing another example of the LC element.

FIG. 24 is a development view showing another example of the LC element.

25 is an external perspective view of the LC element shown in FIGS. 23 and 24. FIG.

FIG. 26 is a diagram showing a modified example of a sine wave oscillation circuit using three LC elements.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Sine wave oscillation circuit 10 Inverter logic circuit 12,14 LC element 16 Capacitor 18-1, 18-2 Band-shaped conductor 20-1, 20-2 Dielectric sheet 22-1, 22-2, 24 Lead

Claims (10)

[Claims] 1. An inverting amplifier that amplifies an input signal and performs phase inversion, two inductors, one of which is used as a signal input / output path, and a capacitor between them are formed in a distributed constant manner. And a plurality of LC elements in which one of the inductors used as the signal input / output path is connected to each other in series and the other inductor is connected to each other, and the output of the inverting amplifier is connected in series. A sine wave oscillation circuit which performs sine wave oscillation by feeding back to the input side via the plurality of inductors. 2. The sine wave oscillation circuit according to claim 1, wherein the other inductors of the plurality of LC elements are connected to each other via a frequency adjustment capacitor. 3. The sine wave oscillation circuit according to claim 1, wherein the other inductors of the plurality of LC elements are connected to each other via a varicap. 4. The sine wave oscillator circuit according to claim 1, wherein the inverting amplifier is composed of an inverter logic circuit. 5. The sine wave oscillation circuit according to claim 1, wherein the inverting amplifier is composed of a grounded source circuit or a grounded emitter circuit. 6. The LC element according to claim 1, wherein each of the plurality of LC elements is concentrically wound by alternately stacking a plurality of strip-shaped conductors functioning as the inductor and a dielectric sheet. And a sine wave oscillation circuit, wherein any one of the plurality of strip conductors is used as the signal input / output path. 7. The spiral element according to claim 1, wherein each of the plurality of LC elements is formed on substantially the same plane, and each of the plurality of spiral electrodes functions as the inductor. An insulating layer formed between the plurality of spiral electrodes, and an insulating substrate having the plurality of spiral electrodes formed on one surface so as to substantially overlap with each other with the insulating layer interposed therebetween. And a sine wave oscillation circuit in which any one of the plurality of spiral electrodes is used as the signal input / output path. 8. The plurality of LC elements according to claim 1, wherein each of the plurality of LC elements has respective winding portions with different layers, and a plurality of spiral electrodes that entirely function as the inductor. , An insulating plate or an insulating film inserted between the spiral parts of the spiral electrodes when the spiral parts are alternately stacked, and any one of the spiral electrodes is provided.
A sine wave oscillating circuit, characterized in that one is used as the signal input / output path. 9. The insulating sheet according to claim 1, wherein each of the plurality of LC elements has a plurality of folding portions that are alternately folded and laminated in opposite directions, and both sides of the insulating sheet. And a plurality of conductors each of which functions as the inductor of a predetermined number of turns when the folded portions are alternately folded and laminated so as to face each other, and one of the plurality of conductors is formed. A sine wave oscillator circuit, one of which is used as the signal input / output path. 10. The oscillation frequency is switched by changing the diameter of each of the plurality of inductors for each different winding portion and changing the operating power supply voltage of the inverting amplifier according to any one of claims 1 to 9. A sine wave oscillation circuit characterized by the above.