JPH07297595A - TCP device suction nozzle - Google Patents
TCP device suction nozzleInfo
- Publication number
- JPH07297595A JPH07297595A JP6091406A JP9140694A JPH07297595A JP H07297595 A JPH07297595 A JP H07297595A JP 6091406 A JP6091406 A JP 6091406A JP 9140694 A JP9140694 A JP 9140694A JP H07297595 A JPH07297595 A JP H07297595A
- Authority
- JP
- Japan
- Prior art keywords
- tcp device
- suction nozzle
- suction
- tcp
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】
【目的】 ＴＣＰデバイスの移載時における位置精度を
向上できるＴＣＰデバイスの吸着ノズルを提供すること
を目的とする。
【構成】 ＴＣＰデバイスＤを面状に押さえる押え部１
ｃを有する基体１と、基体１に設けられ且つＴＣＰデバ
イスＤを吸着する吸着部５，６とを備える。
(57) [Abstract] [Purpose] An object is to provide a suction nozzle of a TCP device that can improve the positional accuracy when the TCP device is transferred. [Structure] Presser 1 for pressing TCP device D in a plane
The substrate 1 having c is provided, and the adsorption portions 5 and 6 provided on the substrate 1 and adsorbing the TCP device D are provided.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＴＣＰデバイスの吸着
ノズルに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction nozzle for a TCP device.
【０００２】[0002]
【従来の技術】ＴＣＰ（Ｔａｐｅ ｃａｒｒｉｅｒ ｐ
ａｃｋａｇｅ）デバイスはＴＡＢ（Ｔａｐｅ Ａｕｔｏ
ｍａｔｅｄ Ｂｏｎｄｉｎｇ）法により、微細かつ狭ピ
ッチのリード部が形成されたフィルムキャリアテープ
に、半導体チップがボンディングされ、このフィルムキ
ャリアテープのリード部を打抜装置により打抜いて得ら
れるものである。そして、ＴＣＰデバイスは薄いフィル
ムキャリアテープにより支持されており、このフィルム
キャリアテープは通常供給リールに巻回された状態で打
抜装置に供給される。したがってフィルムキャリアテー
プの巻きぐせによって、ＴＣＰデバイスは湾曲している
ことが多い。一方ＴＣＰデバイスは極めて狭ピッチのリ
ード部を有し、このリード部が基板の電極形成面にボン
ディングされるものであり、吸着ノズルによりＴＣＰデ
バイスを吸着して基板の電極形成面に搭載する際に、高
い位置精度が必要となる。2. Description of the Related Art TCP (Tape carrier p)
ACK) device is TAB (Tape Auto)
A semiconductor chip is bonded to a film carrier tape on which fine and narrow-pitch lead portions are formed by a bonded bonding method, and the lead portions of the film carrier tape are punched by a punching device. The TCP device is supported by a thin film carrier tape, and this film carrier tape is usually supplied to the punching device in a state of being wound on a supply reel. Therefore, the TCP device is often curved due to the curl of the film carrier tape. On the other hand, the TCP device has a lead portion with an extremely narrow pitch, and this lead portion is bonded to the electrode forming surface of the substrate. When the TCP device is sucked by the suction nozzle and mounted on the electrode forming surface of the substrate. , High position accuracy is required.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
ＴＣＰデバイスの吸着ノズルでは、ＴＣＰデバイスの湾
曲を矯正できるものがなく、移載されたＴＣＰデバイス
の位置精度が低いという問題点があった。However, there is a problem in that the conventional suction nozzle of the TCP device cannot correct the curvature of the TCP device and the positional accuracy of the transferred TCP device is low.
【０００４】そこで本発明は、ＴＣＰデバイスを精度良
く移載できるＴＣＰデバイスの吸着ノズルを提供するこ
とを目的とする。Therefore, an object of the present invention is to provide a suction nozzle for a TCP device, which can transfer the TCP device with high accuracy.
【０００５】[0005]
【課題を解決するための手段】本発明のＴＣＰデバイス
の吸着ノズルは、ＴＣＰデバイスを押さえる押え部を有
する基体と、基体に設けられ、かつＴＣＰデバイスを吸
着する吸着部とを備える。A suction nozzle for a TCP device according to the present invention comprises a base having a holding portion for holding the TCP device, and a suction portion provided on the base for sucking the TCP device.
【０００６】[0006]
【作用】上記構成により、ＴＣＰデバイスは吸着部によ
って吸着され、基板の電極形成面へ移載される。このと
き、押え部がＴＣＰデバイスを押さえ付け、ＴＣＰデバ
イスの湾曲が取除かれ、ＴＣＰデバイスはフラットな姿
勢となる。このため、ＴＣＰデバイスの湾曲による位置
精度低下を抑制することができる。With the above structure, the TCP device is adsorbed by the adsorbing portion and transferred to the electrode forming surface of the substrate. At this time, the pressing portion presses the TCP device, the curvature of the TCP device is removed, and the TCP device becomes flat. Therefore, it is possible to suppress the deterioration of the positional accuracy due to the bending of the TCP device.
【０００７】[0007]
【実施例】次に図面を参照しながら本発明の第１の実施
例を説明する。図１は本発明の第１の実施例におけるＴ
ＣＰデバイスの吸着ノズルの斜視図、図２，図３は本発
明の第１の実施例におけるＴＣＰデバイスの吸着ノズル
の動作説明図である。図１中、１は断面逆Ｌ字状をなす
基体であり、このうち１ａは水平部、１ｂは水平部１ａ
の長手方向の一側縁から垂直下方に垂下する垂下部であ
り、垂下部１ｂの下端面は水平な押え部１ｃとなってい
る。即ち押え部１ｃは基体１の長手方向と平行に設けら
れている。また２は水平部１ａから上方に突出し、ノズ
ルホルダ３（図２参照）に着脱自在に挿入される挿入
部、２ａは挿入部２内を貫通し、吸引装置４に連通する
内筒である。また５，６は水平部１ａの下面から下方に
突設され、ゴムなどの弾性体から形成される円筒状の吸
着部であり、５ａ，６ａは吸着部５，６の吸引孔であっ
て、吸引孔５ａ，６ａは挿入部２の内筒２ａに連通す
る。また５ｂ，６ｂは吸着部５，６の下端に位置する吸
着面である。即ち、吸引装置４を駆動して吸着面５ｂ，
６ｂをＴＣＰデバイスＤ（図３参照）に接触させれば、
ＴＣＰデバイスＤを吸着すると共に押え部１ｃに押し当
てることができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows T in the first embodiment of the present invention.
FIG. 2 is a perspective view of the suction nozzle of the CP device, and FIGS. 2 and 3 are operation explanatory diagrams of the suction nozzle of the TCP device in the first embodiment of the present invention. In FIG. 1, reference numeral 1 is a base having an inverted L-shaped cross section, of which 1a is a horizontal portion and 1b is a horizontal portion 1a.
Is a drooping part that hangs vertically downward from one side edge in the longitudinal direction, and the lower end surface of the drooping part 1b is a horizontal holding part 1c. That is, the pressing portion 1c is provided in parallel with the longitudinal direction of the base 1. Further, reference numeral 2 denotes an insertion portion that projects upward from the horizontal portion 1a and is detachably inserted into the nozzle holder 3 (see FIG. 2). Reference numeral 2a denotes an inner cylinder that penetrates the insertion portion 2 and communicates with the suction device 4. Numerals 5 and 6 are cylindrical suction portions that are formed so as to project downward from the lower surface of the horizontal portion 1a and that are formed of an elastic body such as rubber, and 5a and 6a are suction holes of the suction portions 5 and 6. The suction holes 5a and 6a communicate with the inner cylinder 2a of the insertion portion 2. Further, 5b and 6b are suction surfaces located at the lower ends of the suction portions 5 and 6. That is, by driving the suction device 4, the suction surface 5b,
If 6b is brought into contact with TCP device D (see FIG. 3),
The TCP device D can be adsorbed and pressed against the pressing portion 1c.
【０００８】図２において、７は挿入部２をノズルホル
ダ３に着脱自在に係止する板ばね、８は液晶パネルなど
の基板９が載置される基板下受部、９ａは基板９の側部
に形成される電極形成面、１０は基板下受部８と対向
し、ＴＣＰデバイスＤを下受けするデバイス下受部、１
１はＴＣＰデバイスＤと電極形成面９ａとを圧着してボ
ンディングを行う圧着ツールである。したがって、図２
に示すようにＴＣＰデバイスＤを吸着部５，６により吸
着し、押え部１ｃに接触させた状態から、図３に示すよ
うにノズルホルダ３を下降させ、ＴＣＰデバイスＤをデ
バイス下受部１０上と電極形成面９ａ上に着地させる。
そして圧着ツール１１によりＴＣＰデバイスＤと電極形
成面９ａとを圧着するものである。In FIG. 2, 7 is a leaf spring for removably locking the insertion portion 2 to the nozzle holder 3, 8 is a substrate lower receiving portion on which a substrate 9 such as a liquid crystal panel is mounted, and 9a is the substrate 9 side. An electrode formation surface 10 formed in the portion is opposed to the substrate lower receiving portion 8 and is a device lower receiving portion for receiving the TCP device D.
Reference numeral 1 is a crimping tool for crimping and bonding the TCP device D and the electrode forming surface 9a. Therefore, FIG.
As shown in FIG. 3, the TCP device D is sucked by the suction portions 5 and 6, and the nozzle holder 3 is lowered as shown in FIG. And land on the electrode forming surface 9a.
Then, the TCP device D and the electrode forming surface 9a are pressure bonded by the pressure bonding tool 11.
【０００９】さて図４は本発明の第１の実施例における
ＴＣＰデバイスの吸着ノズルの正面図、図５，図６は本
発明の第１の実施例におけるＴＣＰデバイスの吸着ノズ
ルの動作説明図である。ここで本発明の第１の実施例で
は、吸着部５，６を弾性体（ゴムなど）により形成する
と共に、図４に示すように吸着面５ｂ，６ｂが押え部１
ｃよりもわずかに下方に突出するようにしている。この
ため、必ず押え部１ｃよりも先に吸着面５ｂ，６ｂがＴ
ＣＰデバイスＤに接触する。したがって図５に示すよう
にＴＣＰデバイスＤが湾曲していても、押え部１ｃのみ
がＴＣＰデバイスＤに接して吸着面５ｂ，６ｂが接触し
ないという事態を生ずることはなく、吸着面５ｂ，６ｂ
によりＴＣＰデバイスＤを確実に吸着することができ
る。そして図６に示すように、デバイス下受部１０上に
ＴＣＰデバイスＤを着地させた際、吸着部５，６がその
弾性により上下方向に若干縮んで押え部１ｃとデバイス
下受部１０により面状に挟んで、ＴＣＰデバイスＤの湾
曲を矯正することができる。FIG. 4 is a front view of the suction nozzle of the TCP device according to the first embodiment of the present invention, and FIGS. 5 and 6 are operation explanatory views of the suction nozzle of the TCP device according to the first embodiment of the present invention. is there. Here, in the first embodiment of the present invention, the suction portions 5 and 6 are formed of an elastic body (rubber or the like), and the suction surfaces 5b and 6b are held by the pressing portion 1 as shown in FIG.
It is designed to project slightly below c. For this reason, the suction surfaces 5b and 6b must always come to the T position before the pressing portion 1c.
Contact CP device D. Therefore, even if the TCP device D is curved as shown in FIG. 5, the situation in which only the pressing portion 1c contacts the TCP device D and the suction surfaces 5b and 6b do not contact each other does not occur, and the suction surfaces 5b and 6b do not occur.
Thus, the TCP device D can be surely adsorbed. Then, as shown in FIG. 6, when the TCP device D is landed on the device lower receiving portion 10, the suction portions 5 and 6 are slightly contracted in the vertical direction due to the elasticity thereof, so that the pressing portion 1c and the device lower receiving portion 10 provide a surface. It is possible to correct the curvature of the TCP device D by sandwiching it in the shape of.
【００１０】次に第２の実施例について説明する。図７
は本発明の第２の実施例におけるＴＣＰデバイスの吸着
ノズルの斜視図、図８は本発明の第２の実施例における
ＴＣＰデバイスの吸着ノズルの正面図、図９，図１０は
本発明の第２の実施例におけるＴＣＰデバイスの吸着ノ
ズルの動作説明図である。第２の実施例では、第１の実
施例に対し基体の構成が相違する。１２は略門形の基体
であり、１２ａはその水平部、１２ｂ，１２ｃは水平部
１２ａの長手方向の両端部から下方に垂下する一対の垂
下部であり、垂下部１２ｂ，１２ｃの下端面は、水平な
押え部１２ｅ，１２ｄとなっている。また図８に示すよ
うに、第１の実施例と同様、押え部１２ｅ，１２ｄより
も吸着面５ｂ，６ｂはわずかに下方に突出している。こ
のため、図９に示すように押え部１２ｅ，１２ｄより
も、必ず吸着面５ｂ，６ｂがＴＣＰデバイスＤに接触
し、吸着ミスを防止できる。ここで第２の実施例では、
図１０に示すように、押え部１２ｅ，１２ｄは、デバイ
ス下受部１０と共に、ＴＣＰデバイスＤを面状に挟み込
み、湾曲を矯正する。Next, a second embodiment will be described. Figure 7
Is a perspective view of the suction nozzle of the TCP device in the second embodiment of the present invention, FIG. 8 is a front view of the suction nozzle of the TCP device in the second embodiment of the present invention, and FIGS. 9 and 10 are the front views of the present invention. FIG. 7 is an explanatory diagram of the operation of the suction nozzle of the TCP device in the second embodiment. The second embodiment differs from the first embodiment in the structure of the base body. Reference numeral 12 is a substantially gate-shaped base body, 12a is a horizontal portion thereof, 12b and 12c are a pair of hanging parts that hang downward from both ends in the longitudinal direction of the horizontal part 12a, and lower end surfaces of the hanging parts 12b and 12c are , Horizontal pressing portions 12e and 12d. Further, as shown in FIG. 8, similarly to the first embodiment, the suction surfaces 5b and 6b project slightly below the pressing portions 12e and 12d. Therefore, as shown in FIG. 9, the suction surfaces 5b and 6b are always in contact with the TCP device D rather than the pressing portions 12e and 12d, and the suction error can be prevented. Here, in the second embodiment,
As shown in FIG. 10, the holding portions 12e and 12d, together with the device lower receiving portion 10, sandwich the TCP device D in a planar shape and correct the curvature.
【００１１】[0011]
【発明の効果】本発明のＴＣＰデバイスの吸着ノズル
は、ＴＣＰデバイスを押さえる押え部を有する基体と、
基体に設けられ、かつＴＣＰデバイスを吸着する吸着部
とを備えるので、ＴＣＰデバイスの湾曲を矯正し、移載
時の位置精度低下を抑制することができる。The adsorption nozzle of the TCP device of the present invention comprises a base having a pressing portion for pressing the TCP device,
Since it is provided on the base body and has the adsorption portion that adsorbs the TCP device, it is possible to correct the curvature of the TCP device and suppress deterioration of the positional accuracy during transfer.
【図１】本発明の第１の実施例におけるＴＣＰデバイス
の吸着ノズルの斜視図FIG. 1 is a perspective view of a suction nozzle of a TCP device according to a first embodiment of the present invention.
【図２】本発明の第１の実施例におけるＴＣＰデバイス
の吸着ノズルの動作説明図FIG. 2 is an operation explanatory diagram of the suction nozzle of the TCP device according to the first embodiment of the present invention.
【図３】本発明の第１の実施例におけるＴＣＰデバイス
の吸着ノズルの動作説明図FIG. 3 is an operation explanatory diagram of a suction nozzle of the TCP device according to the first embodiment of the present invention.
【図４】本発明の第１の実施例におけるＴＣＰデバイス
の吸着ノズルの正面図FIG. 4 is a front view of the suction nozzle of the TCP device according to the first embodiment of the present invention.
【図５】本発明の第１の実施例におけるＴＣＰデバイス
の吸着ノズルの動作説明図FIG. 5 is an operation explanatory diagram of the suction nozzle of the TCP device according to the first embodiment of the present invention.
【図６】本発明の第１の実施例におけるＴＣＰデバイス
の吸着ノズルの動作説明図FIG. 6 is an operation explanatory diagram of a suction nozzle of the TCP device according to the first embodiment of the present invention.
【図７】本発明の第２の実施例におけるＴＣＰデバイス
の吸着ノズルの斜視図FIG. 7 is a perspective view of a suction nozzle of a TCP device according to a second embodiment of the present invention.
【図８】本発明の第２の実施例におけるＴＣＰデバイス
の吸着ノズルの正面図FIG. 8 is a front view of a suction nozzle of a TCP device according to a second embodiment of the present invention.
【図９】本発明の第２の実施例におけるＴＣＰデバイス
の吸着ノズルの動作説明図FIG. 9 is an operation explanatory diagram of the suction nozzle of the TCP device according to the second embodiment of the present invention.
【図１０】本発明の第２の実施例におけるＴＣＰデバイ
スの吸着ノズルの動作説明図FIG. 10 is an operation explanatory diagram of a suction nozzle of a TCP device according to the second embodiment of the present invention.
１ 基体 １ｃ 押え部 ５ 吸着部 ６ 吸着部 １２ 基体 １２ｄ 押え部 １２ｅ 押え部 Ｄ ＴＣＰデバイス DESCRIPTION OF SYMBOLS 1 Base 1c Pressing part 5 Adsorption part 6 Adsorption part 12 Base 12d Pressing part 12e Pressing part D TCP device
Claims (5)
基体と、前記基体に設けられ、かつＴＣＰデバイスを吸
着する吸着部とを備えることを特徴とするＴＣＰデバイ
スの吸着ノズル。1. A suction nozzle for a TCP device, comprising: a base having a pressing portion for pressing the TCP device; and a suction portion provided on the base for sucking the TCP device.
ることを特徴とする請求項１記載のＴＣＰデバイスの吸
着ノズル。2. The suction nozzle of a TCP device according to claim 1, wherein the suction portion is formed of an elastic body.
記押え部よりも下方に突出していることを特徴とする請
求項１記載のＴＣＰデバイスの吸着ノズル。3. The suction nozzle for a TCP device according to claim 1, wherein a suction surface located at a lower end of the suction portion projects below the pressing portion.
に設けられていることを特徴とする請求項１記載のＴＣ
Ｐデバイスの吸着ノズル。4. The TC according to claim 1, wherein the pressing portion is provided in parallel with a longitudinal direction of the base body.
P device suction nozzle.
部から下方に垂下する一対の垂下部の下端面からなるこ
とを特徴とする請求項１記載のＴＣＰデバイスの吸着ノ
ズル。5. The suction nozzle for a TCP device according to claim 1, wherein the holding portion is composed of a pair of lower end faces of a pair of hanging portions that hang downward from both longitudinal end portions of the base body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6091406A JP2976804B2 (en) | 1994-04-28 | 1994-04-28 | Bonding method for TCP device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6091406A JP2976804B2 (en) | 1994-04-28 | 1994-04-28 | Bonding method for TCP device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07297595A true JPH07297595A (en) | 1995-11-10 |
| JP2976804B2 JP2976804B2 (en) | 1999-11-10 |
Family
ID=14025507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6091406A Expired - Fee Related JP2976804B2 (en) | 1994-04-28 | 1994-04-28 | Bonding method for TCP device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2976804B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009036646A1 (en) * | 2007-09-21 | 2009-03-26 | Changzhou Asian Packing Co., Ltd. | Electric appliance positioning and mounting soft seat |
| JP2009066719A (en) * | 2007-09-14 | 2009-04-02 | Ibiden Engineering Kk | Board adsorption carrying device |
| JP2012069730A (en) * | 2010-09-24 | 2012-04-05 | Hitachi High-Tech Instruments Co Ltd | Die bonder and bonding method |
| US10052705B2 (en) | 2012-08-30 | 2018-08-21 | Universal Instruments Corporation | 3D TSV assembly method for mass reflow |
| US11363725B2 (en) | 2017-11-02 | 2022-06-14 | Universal Instruments Corporation | Fixture to hold part before and after reflow, and method |
-
1994
- 1994-04-28 JP JP6091406A patent/JP2976804B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009066719A (en) * | 2007-09-14 | 2009-04-02 | Ibiden Engineering Kk | Board adsorption carrying device |
| WO2009036646A1 (en) * | 2007-09-21 | 2009-03-26 | Changzhou Asian Packing Co., Ltd. | Electric appliance positioning and mounting soft seat |
| JP2012069730A (en) * | 2010-09-24 | 2012-04-05 | Hitachi High-Tech Instruments Co Ltd | Die bonder and bonding method |
| US10052705B2 (en) | 2012-08-30 | 2018-08-21 | Universal Instruments Corporation | 3D TSV assembly method for mass reflow |
| US11363725B2 (en) | 2017-11-02 | 2022-06-14 | Universal Instruments Corporation | Fixture to hold part before and after reflow, and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2976804B2 (en) | 1999-11-10 |
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