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JPH07297526A - Printed-circuit board - Google Patents

Printed-circuit board

Info

Publication number
JPH07297526A
JPH07297526A JP8123094A JP8123094A JPH07297526A JP H07297526 A JPH07297526 A JP H07297526A JP 8123094 A JP8123094 A JP 8123094A JP 8123094 A JP8123094 A JP 8123094A JP H07297526 A JPH07297526 A JP H07297526A
Authority
JP
Japan
Prior art keywords
pads
circuit board
chip parts
printed circuit
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8123094A
Other languages
Japanese (ja)
Inventor
Hironori Urasawa
裕徳 浦沢
Shujiro Osada
修二郎 長田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niigata Fuji Xerox Manufacturing Co Ltd
Original Assignee
Niigata Fuji Xerox Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Niigata Fuji Xerox Manufacturing Co Ltd filed Critical Niigata Fuji Xerox Manufacturing Co Ltd
Priority to JP8123094A priority Critical patent/JPH07297526A/en
Publication of JPH07297526A publication Critical patent/JPH07297526A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To prevent a formation of solder balls by a method wherein a wiring foil exposure part is provided on a printed-circuit board under both side surfaces of mounted chip parts between pads that electrodes at both ends of the chip parts are soldered, and molten solder jutted out from under the chip parts is soldered in the wiring foil exposure part. CONSTITUTION:A pair of pads 20, 21 for soldering electrodes of chip parts and wiring foil exposure parts 30, 31 under a side surface of the chip parts mounted between the pads are provided on a printed-circuit board. The circumference of the pads 20, 21 and the wiring foil exposure parts 30, 31 is coated with a solder resist 1. Electrodes 60, 61 of chip parts 6 are mounted onto the pads 20, 21 via cream solders 50, 51, and thereafter the cream solders 50, 51 are heated and melted. The cream solders 50, 51 flowing into under the chip parts 6 are pushed by the chip parts 6 not to jut out towards a body side of the chip parts 6. Additionally, soldering is not performed on the wiring foil exposure part 30 and the solder is not leaked or widened and solder balls are not formed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、プリント基板に関し、
特に表面実装されるチップ部品をはんだ付けするための
パッドを有するプリント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board,
In particular, it relates to a printed circuit board having pads for soldering surface-mounted chip components.

【０００２】[0002]

【従来の技術】図６は、従来のプリント基板の一例の一
部を示す平面図である。プリント基板上に設けられた一
対のパッド２０，２１は、表面実装されるチップ部品を
リフローソルダリングによりはんだ付けするためのパッ
ドであり、プリント基板のパッド２０，２１の周囲（図
６の斜線部）は、ソルダーレジスト１にて覆われてい
た。2. Description of the Related Art FIG. 6 is a plan view showing a part of an example of a conventional printed circuit board. The pair of pads 20 and 21 provided on the printed circuit board are pads for soldering the surface-mounted chip components by reflow soldering, and the pads 20 and 21 are surrounded by the pads 20 and 21 of the printed circuit board (shaded areas in FIG. 6). ) Was covered with the solder resist 1.

【０００３】次に、抵抗コンデンサ等のチップ部品をプ
リント基板にはんだ付けする工程を図７の断面図を用い
て説明する。まず、図７（ａ）のようにプリント基板２
に設けられたパッド２０，２１にそれぞれクリームはん
だ５０，５１を塗布し、次に図７（ｂ）のようにクリー
ムはんだ５０，５１を介してパッド２０，２１上にチッ
プ部品６を搭載する。その後、クリームはんだ５０，５
１を加熱溶融して図７（ｃ）のようにチップ部品６の両
端の電極６０，６１をパッド２０，２１にはんだ付けす
る。このとき、図７（ｂ）の状態でチップ部品６の下に
流れ込んだクリームはんだ５０，５１は、はんだボール
７としてチップ部品６の電極６０，６１間の周囲の絶縁
体の部分の脇に出てくる。図８に、図７（ｃ）の斜視図
を示す。Next, the process of soldering a chip component such as a resistor capacitor to a printed board will be described with reference to the sectional view of FIG. First, as shown in FIG. 7A, the printed circuit board 2
The cream solders 50 and 51 are applied to the pads 20 and 21 provided on the pads 20 and 21, respectively, and then the chip component 6 is mounted on the pads 20 and 21 via the cream solders 50 and 51 as shown in FIG. 7B. After that, cream solder 50,5
1 is heated and melted, and the electrodes 60 and 61 at both ends of the chip component 6 are soldered to the pads 20 and 21 as shown in FIG. 7C. At this time, the cream solder 50, 51 that has flowed under the chip component 6 in the state of FIG. 7B is exposed as a solder ball 7 to the side of the surrounding insulator portion between the electrodes 60, 61 of the chip component 6. Come on. FIG. 8 shows a perspective view of FIG. 7 (c).

【０００４】[0004]

【発明が解決しようとする課題】この従来のプリント基
板では、パッドに塗布したクリームはんだの一部がチッ
プ部品の下側に流れ込んだものがリフローソルダリング
によりチップ部品とパッドをはんだ付けするときにチッ
プ部品のボディ脇にはんだボールとしてはみ出してく
る。このはみ出してきたはんだボールが外れて移動した
りすると、電気的障害を引き起こす恐れがある。また、
このはんだボールを除去するためには多くの工数が必要
となるという問題点があった。In this conventional printed circuit board, a part of the cream solder applied to the pad flows into the lower side of the chip component, and when the chip component and the pad are soldered by reflow soldering. It sticks out as a solder ball on the side of the chip component body. If the protruding solder balls come off and move, there is a risk of causing an electrical failure. Also,
There has been a problem that many steps are required to remove the solder balls.

【０００５】[0005]

【課題を解決するための手段】本発明は、チップ部品が
表面実装されるプリント基板において、前記チップ部品
の両端の電極がはんだ付けされるパッドの間で前記チッ
プ部品の両側面の下部に配線箔露出部を設け、前記パッ
ド及び前記配線箔露出部の周囲をソルダーレジストで覆
ったことを特徴とする。SUMMARY OF THE INVENTION According to the present invention, in a printed circuit board on which a chip component is surface-mounted, wiring is provided below the both side surfaces of the chip component between pads to which electrodes on both ends of the chip component are soldered. A foil exposed portion is provided, and the periphery of the pad and the wiring foil exposed portion is covered with a solder resist.

【０００６】[0006]

【実施例】次に、本発明について図面を参照して説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

【０００７】図１は、本発明の一実施例のプリント基板
の一部を示す平面図である。FIG. 1 is a plan view showing a part of a printed circuit board according to an embodiment of the present invention.

【０００８】チップ部品の電極をはんだ付けするための
一対のパッド２０，２１と、そのパッド間で搭載される
チップ部品の側面の下部の配線箔露出部３０，３１とが
プリント基板上に設けられ、パッド２０，２１及び配線
箔露出部３０，３１の周囲のプリント基板は、ソルダー
レジスト１で覆われている。配線箔露出部３０，３１
は、プリント基板の回路上全く関係ない他の回路と絶縁
された独立した配線箔である。A pair of pads 20 and 21 for soldering the electrodes of the chip component, and wiring foil exposed portions 30 and 31 on the lower side surface of the chip component mounted between the pads are provided on the printed circuit board. The printed boards around the pads 20, 21 and the exposed portions of the wiring foil 30, 31 are covered with the solder resist 1. Wiring foil exposed parts 30, 31
Is an independent wiring foil that is insulated from other circuits that are completely unrelated to the printed circuit board.

【０００９】次に、本実施例のプリント基板にチップ部
品をはんだ付けする工程を図４の断面図を用いて説明す
る。まず、図４（ａ）に示すようにプリント基板２に設
けられたパッド２０，２１の上にクリームはんだ５０，
５１を塗布し、その後、図４（ｂ）に示すように、パッ
ド２０，２１の上にクリームはんだ５０，５１を介して
チップ部品６の電極６０，６１を搭載させる。その後、
クリームはんだ５０，５１を加熱溶融して図４（ｃ）に
示すように、はんだ付けが完了する。図４（ｂ）の状態
のときにチップ部品６の下に流れ込んだクリームはんだ
５０，５１は、加熱溶融されたときチップ部品６に押さ
れて行き場を失ないチップ部品６のボディ脇へはみ出し
てくる。このはみ出してきた溶融はんだは、配線箔露出
部３０にはんだ付けされ、濡れ広がり、はんだボールを
形成することはない。Next, the process of soldering the chip parts to the printed circuit board of this embodiment will be described with reference to the sectional view of FIG. First, as shown in FIG. 4A, the cream solder 50, is placed on the pads 20, 21 provided on the printed board 2.
51 is applied, and thereafter, as shown in FIG. 4B, the electrodes 60 and 61 of the chip component 6 are mounted on the pads 20 and 21 via the cream solders 50 and 51. afterwards,
The cream solders 50 and 51 are heated and melted to complete soldering as shown in FIG. The cream solder 50, 51 that has flowed under the chip component 6 in the state of FIG. 4B does not lose its place by being pushed by the chip component 6 when it is heated and melted, and sticks out to the side of the body of the chip component 6. come. The protruding molten solder is soldered to the exposed portion 30 of the wiring foil, does not spread wet, and does not form a solder ball.

【００１０】図５は、本実施例のプリント基板にチップ
部品をはんだ付けした状態を示す図４（ｃ）の斜視図で
ある。FIG. 5 is a perspective view of FIG. 4 (c) showing a state in which chip components are soldered to the printed circuit board of this embodiment.

【００１１】図２は、本発明の他の実施例のプリント板
の部分平面図で、パッド２０，２１の間に設けられた配
線箔露出部３２，３３はプリント配線板上の配線パター
ン４０，４１に接続している。図２に示す実施例ではパ
ッド２０，２１及び配線箔露出部３２，３３はソルダー
レジスト１に覆われていないが配線パターン４０，４１
はソルダーレジスト１に覆われている。FIG. 2 is a partial plan view of a printed board according to another embodiment of the present invention. Wiring foil exposed portions 32 and 33 provided between the pads 20 and 21 are wiring patterns 40 on the printed wiring board. It is connected to 41. In the embodiment shown in FIG. 2, the pads 20, 21 and the wiring foil exposed portions 32, 33 are not covered with the solder resist 1, but the wiring patterns 40, 41 are formed.
Is covered with the solder resist 1.

【００１２】図３は、本発明のさらに他の実施例のプリ
ント板の部分平面図で、パッド２０，２１の間に設けら
れた配線箔露出部３４，３５はそれぞれパッド２０，２
１に接続している。FIG. 3 is a partial plan view of a printed board according to still another embodiment of the present invention. Wiring foil exposed portions 34 and 35 provided between the pads 20 and 21 are pads 20 and 2, respectively.
Connected to 1.

【００１３】[0013]

【発明の効果】以上説明したように本発明によるプリン
ト基板は、チップ部品をリフローソルダリングによりは
んだ付けしたとき、チップ部品の両端の電極がはんだ付
けされるパッド間のチップ部品のボディ脇、すなわち両
側面の下部に配線箔露出部を設けていることにより、チ
ップ部品の下からはみ出てきた溶融はんだが配線箔露出
部にはんだ付けされるため、はんだボールとなることは
ない。従って、はんだボールの除去作業の必要がなくな
るため大きな工数削減ができるという効果がある。な
お、の配線露出部がはんだ付けされも、プリント基板の
回路機能上の問題はない。As described above, in the printed circuit board according to the present invention, when the chip component is soldered by reflow soldering, the electrodes on both ends of the chip component are soldered to the sides of the body of the chip component, that is, By providing the exposed portions of the wiring foil on the lower portions of both side surfaces, the molten solder protruding from the bottom of the chip component is soldered to the exposed portions of the wiring foil, so that it does not become a solder ball. Therefore, there is no need to remove the solder balls, which has the effect of significantly reducing the number of steps. Even if the exposed wiring portion is soldered, there is no problem in the circuit function of the printed circuit board.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例のプリント基板の部分平面図
である。FIG. 1 is a partial plan view of a printed circuit board according to an embodiment of the present invention.

【図２】本発明の他の実施例のプリント基板の部分平面
図である。FIG. 2 is a partial plan view of a printed circuit board according to another embodiment of the present invention.

【図３】本発明のさらに他の実施例のプリント基板の部
分平面図である。FIG. 3 is a partial plan view of a printed circuit board according to still another embodiment of the present invention.

【図４】図１に示す実施例のプリント基板にチップ部品
をはんだ付けする工程を示す断面図である。FIG. 4 is a cross-sectional view showing a process of soldering chip components to the printed circuit board of the embodiment shown in FIG.

【図５】図４（ｃ）に示す状態のチップ部品の斜視図で
ある。5 is a perspective view of the chip part in the state shown in FIG. 4 (c).

【図６】従来のプリント基板の部分平面図である。FIG. 6 is a partial plan view of a conventional printed circuit board.

【図７】図６に示す従来のプリント基板にチップ部品を
はんだ付けする工程を示す断面図である。FIG. 7 is a cross-sectional view showing a step of soldering a chip component to the conventional printed board shown in FIG.

【図８】図７（ｃ）に示す状態のチップ部品の斜視図で
ある。FIG. 8 is a perspective view of the chip part in the state shown in FIG. 7 (c).

【符号の説明】[Explanation of symbols]

１ ソルダーレジスト ２ プリント基板 ６ チップ部品 ７ はんだボール ３０〜３５ 配線箔露出部 ４１，４２ 配線パターン ５０，５１ クリームはんだ 1 Solder Resist 2 Printed Circuit Board 6 Chip Component 7 Solder Ball 30-35 Wiring Foil Exposed Area 41, 42 Wiring Pattern 50, 51 Cream Solder

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 チップ部品が表面実装されるプリント基
板において、前記チップ部品の両端の電極がはんだ付け
されるパッドの間で前記チップ部品の両側面の下部に配
線箔露出部を設け、前記パッド及び前記配線箔露出部の
周囲をソルダーレジストで覆ったことを特徴とするプリ
ント基板。1. In a printed circuit board on which chip components are surface-mounted, wiring foil exposed portions are provided at lower portions of both side surfaces of the chip components between pads to which electrodes at both ends of the chip components are soldered, And a printed circuit board characterized in that the exposed portion of the wiring foil is covered with a solder resist. 【請求項２】 配線箔露出部は他の回路から絶縁された
請求項１記載のプリント基板。2. The printed circuit board according to claim 1, wherein the exposed portion of the wiring foil is insulated from other circuits. 【請求項３】 配線箔露出部は他の配線パターンに接続
されている請求項１記載のプリント基板。3. The printed circuit board according to claim 1, wherein the exposed portion of the wiring foil is connected to another wiring pattern.
JP8123094A 1994-04-20 1994-04-20 Printed-circuit board Pending JPH07297526A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8123094A JPH07297526A (en) 1994-04-20 1994-04-20 Printed-circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8123094A JPH07297526A (en) 1994-04-20 1994-04-20 Printed-circuit board

Publications (1)

Publication Number Publication Date
JPH07297526A true JPH07297526A (en) 1995-11-10

Family

ID=13740663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8123094A Pending JPH07297526A (en) 1994-04-20 1994-04-20 Printed-circuit board

Country Status (1)

Country Link
JP (1) JPH07297526A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374060A (en) * 2001-06-15 2002-12-26 Mitsubishi Electric Corp Electronic circuit board
KR20030057283A (en) * 2001-12-28 2003-07-04 가부시끼가이샤 도시바 Printed wiring board having pads to solder circuit component, circuit module having the printed wiring board, and electronic apparatus equipped with the circuit module
CN100407413C (en) * 2002-10-11 2008-07-30 精工爱普生株式会社 Circuit substrate, mounting structure of solder ball grid array and electro-optical device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244098A (en) * 1988-08-04 1990-02-14 Matsushita Electric Ind Co Ltd Polycrystalline mn-zn ferrite and magnetic head using same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244098A (en) * 1988-08-04 1990-02-14 Matsushita Electric Ind Co Ltd Polycrystalline mn-zn ferrite and magnetic head using same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374060A (en) * 2001-06-15 2002-12-26 Mitsubishi Electric Corp Electronic circuit board
KR20030057283A (en) * 2001-12-28 2003-07-04 가부시끼가이샤 도시바 Printed wiring board having pads to solder circuit component, circuit module having the printed wiring board, and electronic apparatus equipped with the circuit module
CN100407413C (en) * 2002-10-11 2008-07-30 精工爱普生株式会社 Circuit substrate, mounting structure of solder ball grid array and electro-optical device

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Effective date: 19960402