JPH07297344A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH07297344A JPH07297344A JP8613594A JP8613594A JPH07297344A JP H07297344 A JPH07297344 A JP H07297344A JP 8613594 A JP8613594 A JP 8613594A JP 8613594 A JP8613594 A JP 8613594A JP H07297344 A JPH07297344 A JP H07297344A
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- lead frame
- die
- pad
- supporting pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置用のリード
フレームに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for semiconductor devices.
【０００２】[0002]
【従来の技術】従来のリードフレームについて図５、６
を用いて説明する。図において半導体チップのベットと
なるダイパッド１０１はダイパッド１０１を支持するダ
イパッド支持ピン１０３を介してリード枠１０４に接続
されている。ダイパッド１０１裏面には、半導体装置の
表面を実装するモールド工程時において発生するモール
ドレジン（エポキシ樹脂：図示せず）とダイパッド１０
１裏面との剥離を防止するものとしてディンプル１０２
を形成し、密着性を向上させることが一般的に知られて
いる。また、ディンプル１０２形成方法としては化学的
に加工するエッチングと機械的に加工するプレス加工が
知られている。このうちエッチングについては、加工は
容易であるがディンプル形成のための工程数が多いこと
により、リードフレームの単価が高価になり、プレス加
工に比べると一般的に用いられているとはいえない。2. Description of the Related Art A conventional lead frame is shown in FIGS.
Will be explained. In the figure, a die pad 101, which is a bet for a semiconductor chip, is connected to a lead frame 104 via a die pad support pin 103 that supports the die pad 101. On the back surface of the die pad 101, a mold resin (epoxy resin: not shown) and a die pad 10 which are generated during a molding process for mounting the front surface of the semiconductor device.
1 Dimple 102 is provided to prevent separation from the back surface.
Is generally known to improve the adhesion. Further, as a method for forming the dimples 102, etching for chemically processing and press processing for mechanical processing are known. Among them, etching is easy to process, but the number of steps for forming dimples is large, so that the unit cost of the lead frame becomes expensive, and it cannot be said that it is generally used as compared with press processing.
【０００３】[0003]
【発明が解決しようとする課題】しかしながらプレス加
工においては、加工が機械的作用によるもののため、加
工の際、ダイパッドには水平方向と鉛直方向に応力が掛
かる。この水平方向の応力により図６に示すようなダイ
パッドの反り１０６が発生し、鉛直方向の応力によりダ
イパッド支持ピンの反り１０７が発生する。これら２つ
の反りにより、ダイパッドが半導体チップの搭載の不可
能な形状になってしまうという問題があった。本発明は
上記問題点に鑑み、ダイパッドの反り或いはダイパッド
支持ピンの反りが起きることのないリードフレームを提
供することにある。However, in press working, since the working is performed by a mechanical action, stress is applied to the die pad in the horizontal direction and the vertical direction during the working. The horizontal stress causes a warp 106 of the die pad as shown in FIG. 6, and the vertical stress causes a warp 107 of the die pad support pin. Due to these two warps, there is a problem that the die pad becomes a shape in which a semiconductor chip cannot be mounted. In view of the above problems, the present invention is to provide a lead frame in which the warp of the die pad or the warp of the die pad support pin does not occur.
【０００４】[0004]
【課題を解決するための手段】上記目的を達成するため
に、本発明のリードフレームでは、裏面に複数のディン
プルが施されたダイパッドと、このダイパッドとリード
枠とに接続され、機械的応力を吸収するための湾曲部が
設けられたダイパッド支持ピンとを具備することを特徴
とする。In order to achieve the above object, in the lead frame of the present invention, a die pad having a plurality of dimples on its back surface is connected to the die pad and the lead frame to prevent mechanical stress. And a die pad support pin provided with a curved portion for absorbing.
【０００５】[0005]
【作用】本発明ではダイパッド裏面のディンプルをプレ
ス加工する際に生ずる応力を湾曲部が吸収するため、ダ
イパッド裏面のディンプルをプレス加工により形成する
際に生ずるダイパッドの反りやダイパッド支持ピンの反
りを防止することができる。According to the present invention, since the curved portion absorbs the stress generated when the dimples on the back surface of the die pad are pressed, the warp of the die pad and the warp of the die pad support pins which occur when the dimples on the back surface of the die pad are formed are prevented. can do.
【０００６】[0006]
【実施例】本発明の第１の実施例であるリードフレーム
について図１、２を用いて説明する。図１、２において
半導体チップがその表面に載置されるダイパッド１の裏
面には複数のディンプル２が設けられている。このディ
ンプル２はモールド工程の際、モールド材であるエポキ
シ樹脂とリードフレームとの熱膨張率の差によるリード
フレームへの応力集中を防止する役割を果たしている。
このディンプルにより半導体チップの割れや欠け、パッ
ケージの割れや欠けを防止することができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS A lead frame which is a first embodiment of the present invention will be described with reference to FIGS. In FIGS. 1 and 2, a plurality of dimples 2 are provided on the back surface of the die pad 1 on which the semiconductor chip is mounted. During the molding process, the dimples 2 play a role of preventing stress concentration on the lead frame due to the difference in coefficient of thermal expansion between the epoxy resin as the molding material and the lead frame.
This dimple can prevent cracks and chips in the semiconductor chip and cracks and chips in the package.
【０００７】このダイパッド１はダイパッド支持ピン３
に支持され、リード枠４に接続される。このダイパッド
支持ピン３のほぼ中央部にはダイパッド支持ピンを曲げ
ることにより湾曲部５が形成される。この湾曲部５はリ
ードフレーム１０の材質によって大きさが異なり、材質
が鉄のような硬質の材料である場合には湾曲部は小さく
てよく、材質がアルミニウムのような軟質の材料である
場合には湾曲部は大きい方がよい。この湾曲部５がダイ
パッド１をプレス加工する際にかかる水平方向の応力と
鉛直方向の応力を吸収するため、ダイパッドの反りやダ
イパッド支持ピンの反りを防止することが可能となる。The die pad 1 is a die pad support pin 3
And is connected to the lead frame 4. A curved portion 5 is formed at a substantially central portion of the die pad support pin 3 by bending the die pad support pin. The curved portion 5 has a different size depending on the material of the lead frame 10. The curved portion may be small when the material is a hard material such as iron, and may be small when the material is a soft material such as aluminum. The larger the curved portion, the better. Since the curved portion 5 absorbs the stress in the horizontal direction and the stress in the vertical direction applied when the die pad 1 is pressed, it is possible to prevent the warp of the die pad and the warp of the die pad support pin.
【０００８】次に本発明の第１の実施例であるリードフ
レームの製造方法について図１、２を用いて説明する。
まず、リードフレーム１０の形状にカットする前のリー
ドフレーム材の湾曲部に対応する部分に湾曲部を形成す
る。次にリードフレーム材をプレスすることによりリー
ドフレーム１０の形状にカットすると同時にダイパッド
１の裏面にディンプル２を形成する。本発明の第１の実
施例により、このディンプル２形成工程におけるダイパ
ッドの反りやダイパッド支持ピンの反りを防止すること
ができる。Next, a method of manufacturing a lead frame which is a first embodiment of the present invention will be described with reference to FIGS.
First, a curved portion is formed in a portion corresponding to the curved portion of the lead frame material before being cut into the shape of the lead frame 10. Next, the lead frame material is pressed to cut it into the shape of the lead frame 10, and at the same time, the dimples 2 are formed on the back surface of the die pad 1. According to the first embodiment of the present invention, it is possible to prevent the warp of the die pad and the warp of the die pad support pin in the dimple 2 forming step.
【０００９】次に、本発明の第２の実施例であるリード
フレームについて図３、４を用いて説明する。第１の実
施例との違いは湾曲部が複数形成されており、これらで
バネ形状を構成していることである。それ以外について
は第１の実施例と同様であるため図に同一番号を付し、
説明を省略する。第２の実施例においては本発明の第１
の実施例の効果が得られるのと同時に、ダイパッド支持
ピン３の中途にバネが形成されているのと同様の効果を
果たすため、ダイパッド支持ピン３に大きな応力が掛か
ったとしてもかなりの部分を吸収することができると同
時に捻れの力に対してもそれを吸収することが可能であ
る。また、モールド工程後、モールド部分とダイパッド
支持ピン３との間に隙間ができたとき、複数の湾曲部に
よりこの隙間から入ってくる水分を閉止することができ
る。Next, a lead frame which is a second embodiment of the present invention will be described with reference to FIGS. The difference from the first embodiment is that a plurality of curved portions are formed and they form a spring shape. Other than that, since it is the same as the first embodiment, the same numbers are attached to the drawings,
The description is omitted. In the second embodiment, the first embodiment of the present invention
At the same time that the effect of the embodiment is obtained, the same effect as the spring is formed in the middle of the die pad support pin 3 is achieved. Therefore, even if a large stress is applied to the die pad support pin 3, a considerable portion is It is possible to absorb the twisting force at the same time as it can absorb it. Further, after the molding process, when a gap is formed between the mold portion and the die pad support pin 3, the moisture entering from the gap can be closed by the plurality of curved portions.
【００１０】[0010]
【発明の効果】本発明により、ダイパッド裏面のディン
プルをプレス加工により形成する際に生ずるダイパッド
の反りやダイパッド支持ピンの反りを防止することがで
きる。According to the present invention, it is possible to prevent the warp of the die pad and the warp of the die pad support pin that occur when the dimples on the back surface of the die pad are formed by press working.
【図１】本発明の第１の実施例であるリードフレームの
斜視図FIG. 1 is a perspective view of a lead frame that is a first embodiment of the present invention.
【図２】本発明の第１の実施例であるリードフレームの
Ａ−Ａ’における断面図FIG. 2 is a sectional view taken along the line AA ′ of the lead frame according to the first embodiment of the present invention.
【図３】本発明の第２の実施例であるリードフレームの
斜視図FIG. 3 is a perspective view of a lead frame that is a second embodiment of the present invention.
【図４】本発明の第２の実施例であるリードフレームの
Ｂ−Ｂ’における断面図FIG. 4 is a cross-sectional view taken along the line BB ′ of the lead frame according to the second embodiment of the present invention.
【図５】従来のリードフレームの斜視図FIG. 5 is a perspective view of a conventional lead frame.
【図６】従来のリードフレームのＣ−Ｃ’における断面
図FIG. 6 is a cross-sectional view taken along the line CC ′ of the conventional lead frame.
１、１０１ ダイパッド ２、１０２ ディンプル ３、１０３ ダイパッド支持ピン ４、１０４ リード枠 ５ 湾曲部 １０ リードフレーム １０６ ダイパッドの反り １０７ ダイパッド支持ピンの反り 1, 101 Die pad 2, 102 Dimple 3, 103 Die pad support pin 4, 104 Lead frame 5 Curved portion 10 Lead frame 106 Die pad warp 107 Die pad support pin warp
Claims (3)
パッドと、 このダイパッドとリード枠とに接続され、機械的応力を
吸収するための湾曲部が設けられたダイパッド支持ピン
とを具備することを特徴とするリードフレーム。1. A die pad having a plurality of dimples on its back surface, and a die pad support pin connected to the die pad and the lead frame and provided with a curved portion for absorbing mechanical stress. And lead frame.
複数連続して形成されることを特徴とする請求項１記載
のリードフレーム。2. The lead frame according to claim 1, wherein a plurality of the curved portions are continuously formed on the die pad support pins.
を特徴とする請求項１記載のリードフレーム。3. The lead frame according to claim 1, wherein the curved portion has a spring shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8613594A JPH07297344A (en) | 1994-04-25 | 1994-04-25 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8613594A JPH07297344A (en) | 1994-04-25 | 1994-04-25 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07297344A true JPH07297344A (en) | 1995-11-10 |
Family
ID=13878279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8613594A Pending JPH07297344A (en) | 1994-04-25 | 1994-04-25 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07297344A (en) |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002057365A (en) * | 2000-08-08 | 2002-02-22 | Nec Corp | Lead frame, semiconductor device manufactured using the same, and method of manufacturing the same |
| JP2002093983A (en) * | 2000-09-13 | 2002-03-29 | Murata Mfg Co Ltd | Isolation structure for electronic component |
| US6455348B1 (en) | 1998-03-12 | 2002-09-24 | Matsushita Electric Industrial Co., Ltd. | Lead frame, resin-molded semiconductor device, and method for manufacturing the same |
| US6833609B1 (en) | 1999-11-05 | 2004-12-21 | Amkor Technology, Inc. | Integrated circuit device packages and substrates for making the packages |
| US6847099B1 (en) | 2003-02-05 | 2005-01-25 | Amkor Technology Inc. | Offset etched corner leads for semiconductor package |
| JP2005216968A (en) * | 2004-01-27 | 2005-08-11 | Matsushita Electric Works Ltd | Circuit board and manufacturing method therefor |
| JP2009283663A (en) * | 2008-05-22 | 2009-12-03 | Powertech Technology Inc | Semiconductor package and lead frame |
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US8866278B1 (en) | 2011-10-10 | 2014-10-21 | Amkor Technology, Inc. | Semiconductor device with increased I/O configuration |
| US8900995B1 (en) | 2010-10-05 | 2014-12-02 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US8981572B1 (en) | 2011-11-29 | 2015-03-17 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
| US9048298B1 (en) | 2012-03-29 | 2015-06-02 | Amkor Technology, Inc. | Backside warpage control structure and fabrication method |
| US9082833B1 (en) | 2011-01-06 | 2015-07-14 | Amkor Technology, Inc. | Through via recessed reveal structure and method |
| US9129943B1 (en) | 2012-03-29 | 2015-09-08 | Amkor Technology, Inc. | Embedded component package and fabrication method |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| CN105470229A (en) * | 2015-12-26 | 2016-04-06 | 中国电子科技集团公司第十三研究所 | Housing lead wire used for surface-mount package of microwave device and connecting structure thereof |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US9631481B1 (en) | 2011-01-27 | 2017-04-25 | Amkor Technology, Inc. | Semiconductor device including leadframe with a combination of leads and lands and method |
| US9673122B2 (en) | 2014-05-02 | 2017-06-06 | Amkor Technology, Inc. | Micro lead frame structure having reinforcing portions and method |
| US9691734B1 (en) | 2009-12-07 | 2017-06-27 | Amkor Technology, Inc. | Method of forming a plurality of electronic component packages |
| US9704725B1 (en) | 2012-03-06 | 2017-07-11 | Amkor Technology, Inc. | Semiconductor device with leadframe configured to facilitate reduced burr formation |
| US10811341B2 (en) | 2009-01-05 | 2020-10-20 | Amkor Technology Singapore Holding Pte Ltd. | Semiconductor device with through-mold via |
-
1994
- 1994-04-25 JP JP8613594A patent/JPH07297344A/en active Pending
Cited By (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6455348B1 (en) | 1998-03-12 | 2002-09-24 | Matsushita Electric Industrial Co., Ltd. | Lead frame, resin-molded semiconductor device, and method for manufacturing the same |
| US6833609B1 (en) | 1999-11-05 | 2004-12-21 | Amkor Technology, Inc. | Integrated circuit device packages and substrates for making the packages |
| JP2002057365A (en) * | 2000-08-08 | 2002-02-22 | Nec Corp | Lead frame, semiconductor device manufactured using the same, and method of manufacturing the same |
| JP4505967B2 (en) * | 2000-09-13 | 2010-07-21 | 株式会社村田製作所 | Electronic component separation structure |
| JP2002093983A (en) * | 2000-09-13 | 2002-03-29 | Murata Mfg Co Ltd | Isolation structure for electronic component |
| US8952522B1 (en) | 2002-11-08 | 2015-02-10 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US9871015B1 (en) | 2002-11-08 | 2018-01-16 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US10665567B1 (en) | 2002-11-08 | 2020-05-26 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US9406645B1 (en) | 2002-11-08 | 2016-08-02 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US9054117B1 (en) | 2002-11-08 | 2015-06-09 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US6847099B1 (en) | 2003-02-05 | 2005-01-25 | Amkor Technology Inc. | Offset etched corner leads for semiconductor package |
| JP2005216968A (en) * | 2004-01-27 | 2005-08-11 | Matsushita Electric Works Ltd | Circuit board and manufacturing method therefor |
| JP2009283663A (en) * | 2008-05-22 | 2009-12-03 | Powertech Technology Inc | Semiconductor package and lead frame |
| US10811341B2 (en) | 2009-01-05 | 2020-10-20 | Amkor Technology Singapore Holding Pte Ltd. | Semiconductor device with through-mold via |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US10546833B2 (en) | 2009-12-07 | 2020-01-28 | Amkor Technology, Inc. | Method of forming a plurality of electronic component packages |
| US9691734B1 (en) | 2009-12-07 | 2017-06-27 | Amkor Technology, Inc. | Method of forming a plurality of electronic component packages |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US8900995B1 (en) | 2010-10-05 | 2014-12-02 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
| US9082833B1 (en) | 2011-01-06 | 2015-07-14 | Amkor Technology, Inc. | Through via recessed reveal structure and method |
| US9631481B1 (en) | 2011-01-27 | 2017-04-25 | Amkor Technology, Inc. | Semiconductor device including leadframe with a combination of leads and lands and method |
| US9978695B1 (en) | 2011-01-27 | 2018-05-22 | Amkor Technology, Inc. | Semiconductor device including leadframe with a combination of leads and lands and method |
| US8866278B1 (en) | 2011-10-10 | 2014-10-21 | Amkor Technology, Inc. | Semiconductor device with increased I/O configuration |
| US10410967B1 (en) | 2011-11-29 | 2019-09-10 | Amkor Technology, Inc. | Electronic device comprising a conductive pad on a protruding-through electrode |
| US9947623B1 (en) | 2011-11-29 | 2018-04-17 | Amkor Technology, Inc. | Semiconductor device comprising a conductive pad on a protruding-through electrode |
| US8981572B1 (en) | 2011-11-29 | 2015-03-17 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
| US9431323B1 (en) | 2011-11-29 | 2016-08-30 | Amkor Technology, Inc. | Conductive pad on protruding through electrode |
| US11043458B2 (en) | 2011-11-29 | 2021-06-22 | Amkor Technology Singapore Holding Pte. Ltd. | Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode |
| US9704725B1 (en) | 2012-03-06 | 2017-07-11 | Amkor Technology, Inc. | Semiconductor device with leadframe configured to facilitate reduced burr formation |
| US10090228B1 (en) | 2012-03-06 | 2018-10-02 | Amkor Technology, Inc. | Semiconductor device with leadframe configured to facilitate reduced burr formation |
| US9048298B1 (en) | 2012-03-29 | 2015-06-02 | Amkor Technology, Inc. | Backside warpage control structure and fabrication method |
| US10014240B1 (en) | 2012-03-29 | 2018-07-03 | Amkor Technology, Inc. | Embedded component package and fabrication method |
| US9129943B1 (en) | 2012-03-29 | 2015-09-08 | Amkor Technology, Inc. | Embedded component package and fabrication method |
| US9673122B2 (en) | 2014-05-02 | 2017-06-06 | Amkor Technology, Inc. | Micro lead frame structure having reinforcing portions and method |
| CN105470229A (en) * | 2015-12-26 | 2016-04-06 | 中国电子科技集团公司第十三研究所 | Housing lead wire used for surface-mount package of microwave device and connecting structure thereof |
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