JPH07297154A - Substrate carrying system - Google Patents

Abstract

PURPOSE:To provide a system for satisfactorily carrying in and carrying out a substrate to/from a processing system through a simple structure in which a substrate to be processed has no adverse effect on a processed substrate. CONSTITUTION:Holding members 71A, 71B are disposed on the upper surface 38S side of a hand 38 and when a substrate W is carried into a cleaning section, the holding member 71A is located at a position for holding a substrate W whereas the other holding member 71B is located at a retracting position in order to prevent contact with the wafer W thus protecting the holding member 71B against contamination. When the substrate W is carried out from the cleaning section, the holding member 71B is located at the substrate W holding position and the other holding member 71A is located at the retracting position in order to prevent contact with the substrate W. Even if the holding member 71A is contaminated during the operation for carrying in a substrate to be cleaned, a cleaned substrate is protected against contamination because the cleaned substrate is carried out by means of the holding member 71B and prevented from touching the holding member 71A.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus such as a semiconductor manufacturing apparatus or a liquid crystal substrate manufacturing apparatus for substrates such as semiconductor wafers and liquid crystal glass rectangular substrates (hereinafter simply referred to as "substrates"). The present invention relates to a substrate transfer apparatus that carries a substrate into a processing unit that performs a predetermined process and carries out the substrate from the processing unit.

[0002]

2. Description of the Related Art As is well known in the art, in the manufacturing process of precision electronic substrates such as liquid crystal display substrates and semiconductor wafers, a processing unit for performing a predetermined process on the substrate, such as a cleaning processing unit or a heat treatment unit, is required. It is provided. Then, the substrate transfer device loads an unprocessed substrate into the processing unit and unloads the processed substrate from the processing unit. That is, the substrate transfer apparatus is provided with a hand that can move back and forth with respect to the processing unit. By moving the hand to the processing unit while holding the unprocessed substrate on the upper surface side of the hand, the substrate is transferred to the processing unit. On the other hand, after the processed substrate is transferred to the same hand, the processed substrate is carried out from the processing section by retracting the hand.

[0003]

However, when the substrates are carried in and out by the same hand as described above, the following problems occur. For example, when a substrate is transferred to the cleaning processing unit by the substrate transfer device, the entire unprocessed substrate is dirty before the cleaning process, and the dirty unprocessed substrate is carried into the cleaning processing unit by the substrate transfer device. This may contaminate the hand, but with this device, the substrate that has undergone the cleaning processing must be carried out from the cleaning processing section by the hand, and as a result, despite the cleaning processing being performed, There is a problem that the processed substrate is contaminated.

In order to solve the above-mentioned problems, for example, a substrate transfer device is provided with a transfer robot dedicated to loading a substrate and a transfer robot dedicated to unloading a substrate, and a technique for transferring a substrate by each dedicated transfer robot, and a substrate transfer device. A technique has been proposed in which two hands are provided in one and the substrate is carried in by one hand, and the substrate is carried out by the other hand. However, in any of the proposed techniques, the device configuration becomes complicated and the cost of the substrate transfer device is high. There is a problem that it invites up.

The present invention has been made in order to solve the above problems, and has a simple structure and does not adversely affect the processed substrate by the unprocessed substrate, and carries the substrate into and out of the processing unit. An object of the present invention is to provide a substrate transfer device that can carry out a substrate satisfactorily.

[0006]

SUMMARY OF THE INVENTION The present invention is a substrate transfer apparatus for carrying a substrate into a processing unit for performing a predetermined process on the substrate and carrying out the substrate from the processing unit. A hand that is movable back and forth with respect to the processing unit; driving means that drives the hand to move the hand forward and backward with respect to the processing unit; a substrate holding position above the hand; The first and second substrate holding means that can reciprocate between a lower retracted position and at least one of them moves to the substrate holding position, and a loading / unloading operation of the substrate.
And a switching unit that moves one of the first and second substrate holding units to the substrate holding position and the other to the retracted position.

In the invention of claim 2, the first and second substrate holding means are provided in the hand.

In the third aspect of the invention, the first and second substrate holding means each have a suction mechanism.

[0009]

According to the present invention, the first and second substrate holding means are provided, and one of the first and second substrate holding means is placed at the substrate holding position by the switching means in response to the substrate loading / unloading operation. And holds the substrate, and the other is placed in the retracted position and is in a non-contact state with the substrate.

For example, while the first substrate holding means moves to the substrate holding position and holds the unprocessed substrate, the hand advances to the processing section, so that the unprocessed substrate is carried into the processing section. To be done. During this substrate loading operation, the second substrate holding means is in the retracted position and is in a non-contact state with the unprocessed substrate. On the contrary, when carrying out the processed substrate from the processing section, the first substrate holding means moves to the retracted position while the second substrate holding means moves to the substrate holding position to move the processed substrate. Hold. Then, in this state, the processed substrate is carried out of the processing section by retracting the hand from the processing section. Thus, one of the first and second substrate holding means functions as a dedicated substrate holding means for carrying in the substrate, and the other functions as a dedicated substrate holding means for carrying out the substrate.

Therefore, the substrate holding means in contact with the unprocessed substrate does not come into contact with the processed substrate, so that the unprocessed substrate is not adversely affected to the processed substrate and the substrate is loaded into the processing unit and is removed from the processing unit. The substrate can be carried out satisfactorily. Moreover, since the number of hands can be minimized, the structure of the device is simplified.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram showing a substrate cleaning apparatus which is suitable for a substrate transfer apparatus according to the present invention. Hereinafter, after briefly explaining the general configuration and operation of the substrate cleaning apparatus, the configuration of the substrate transfer apparatus according to the present invention will be described in detail.

This substrate cleaning apparatus includes an indexer section 1,
It is composed of a cleaning processing unit 2 and a substrate transfer device 3. The indexer unit 1 is provided with three cassette mounting portions 11 in the direction X for mounting a cassette 4 capable of storing a plurality of substrates, for example, 25 substrates. Therefore, the cassette 4 transported to the apparatus by an AGV (unmanned guided vehicle) (not shown) is transferred to each cassette mounting portion 11
When placed on the indexer unit 1, the three cassettes 4
Are arranged in the direction X, and it becomes possible to take out the substrate from the cassette 4 and store the substrate in the cassette 4 by the substrate transfer device 3 which will be described later in detail. In FIG. 1, reference numeral 12 is a cassette 4 between itself and an automatic transfer robot.
It shows a recessed portion for delivering the.

In the cleaning processing unit 2, a brush module 21 for cleaning both surfaces (or only the back surface) of the substrate,
Spin unit 22 for cleaning the substrate surface while rotating the substrate
Are spaced apart from the indexer unit 1 by a certain distance in the direction Y and are arranged to face each other substantially parallel to the arrangement direction X of the cassette 4. Further, above the brush module 21, a UV lamp house 23 is disposed which performs a process of irradiating the substrate surface with ultraviolet rays to burn organic substances on the substrate surface to ash, that is, dry cleaning. As described above, the cleaning processing unit 2 is provided with a plurality of cleaning processing units (hereinafter, this term is used to generically refer to the brush module 21, the spin unit 22, and the UV lamp house 23), and the substrate is appropriately used. The cleaning process is performed on the substrate in each cleaning process section while the substrates are sequentially conveyed. In this embodiment, as shown in FIG. 1, a transfer hand 5 for transferring a substrate from the brush module 21 to the spin unit 22 is provided on the back side of the cleaning processing unit 2 with respect to the indexer unit 1.

In the substrate cleaning apparatus thus constructed,
The substrate is washed, for example, as follows. First, an unprocessed substrate is carried into the brush module 21 from the cassette 4 by the substrate transfer device 3 which will be described in detail later, and after the brush module 21 and the spin unit 22 are cleaned in this order, the same substrate transfer device 3 is used. , Spin unit 23
The substrate is unloaded from the cassette and returned into the predetermined cassette 4. In addition,
Before the brush cleaning process by the brush module 21, U
The V lamp house 23 may perform a dry cleaning process, and the combination of cleaning processes is arbitrary.

In this way, in the substrate cleaning apparatus, one substrate is subjected to a predetermined cleaning process.

Next, the details of the substrate transfer device 3 will be described.

FIG. 2 is a perspective view showing the substrate transfer device 3. The substrate transfer device 3 is arranged in a transfer path 6 (FIG. 1) sandwiched between the indexer unit 1 and the cleaning processing unit 2. In the transport passage 6, a guide rail 31 extending in the direction X is fixed to the bottom of the substrate cleaning apparatus body, and a base 32 is reciprocally movable along the guide rail 31. An X drive mechanism (not shown) is connected to the base 32, and the X drive mechanism operates according to a command from a control unit (not shown) that controls the entire substrate cleaning apparatus. 32 is moved in the direction X.

A triaxial transfer robot 33 is mounted on the base 32.
Is fixed, and the transfer robot 33 is reciprocally moved by the X drive mechanism along the arrangement of the cassettes 4 and the arrangement of the cleaning processing units in the cleaning processing unit 2, so that the cassette 4 or the cleaning processing unit can be placed in front of the arbitrary processing unit. It can be positioned.

The transfer robot 33 includes a robot body 3
4 has a column 35 that expands and contracts in the vertical direction Z,
A Z drive mechanism (not shown) connected to the column 35 receives a command from the controller and drives the column 35 to expand and contract in the direction Z. At the tip of the column 35, the first horizontally extending
One end of the arm 36 is attached rotatably around the rotation axis A1. In addition, a second arm is provided at the other end of the first arm 36.
One end of the arm 37 and the other end of the second arm 37 and one end of the hand 38 are rotatable about the rotation axes A2 and A3, respectively. Although not shown, the transfer robot 33 incorporates a motor as a drive source for rotating each part around each of the rotation axes A1, A2, A3. Therefore, in this transfer robot 33,
In the state where the substrate is sucked and held by the hand 38 as described below, the hand 3 is operated in response to a command from the control unit.
8 can be moved three-dimensionally, and the transfer robot 3
Substrate loading and unloading can be performed between the cassette 4 and the cleaning processing unit corresponding to the stop position of 3.

FIG. 3 is an enlarged plan view of the other end of the hand 38, FIG. 4 is a sectional view taken along the line AA of FIG. 3, and FIG. 5 shows a structure for sucking and holding a substrate by the hand 38. It is a schematic diagram. As shown in FIG. 5, the hand 38 has a rectangular parallelepiped holding member 7 that is separated from the hand 38 by a predetermined distance in the longitudinal direction.
1A and 71A are arranged. These holding members 71
As shown in FIG. 4, A and 71A can freely move in and out of the upper surface 38S of the hand 38 within a recess 38A provided in the hand 38, and are vertically reciprocated by an elevator mechanism (not shown). Further, the holding members 71A, 71B having the same structure as the holding members 71A, 71A are sandwiched between the holding members 71A, 71A.
It is arranged adjacent to A and is vertically reciprocated in the concave portion 38B of the hand 38 by the elevating mechanism.

A substantially L-shaped suction passage 72A extending from the upper surface to the side surface is formed in the holding member 71A. When the holding member 71A is moved to the upper position by the elevating mechanism, a main suction passage 73A formed inside the hand 38 is formed. On the other hand, when it is moved to the lower position, the side surface of the holding member 71A closes the main suction passage 73A (FIG. 6). Note that the holding member 71B also has a substantially L-shaped suction passage 72B formed in the same manner as described above, and the main suction passage formed inside the hand 38 in accordance with the vertical position of the lifting mechanism. Communication with 73B and interruption are controlled (FIGS. 4 and 6).

As shown in FIG. 5, the main suction passages 73A and 73B are connected to a vacuum generating source such as a vacuum pump via auto valves 74A and 74B, respectively. Therefore, for example, when the holding members 71A, 71A are moved to the upper position so that the suction passage 72A communicates with the main suction passage 73A and the automatic valve 74A is opened, the upper surface of the hand 38 is held by the holding members 71A, 71A. 38S
The substrate W is supported in a state of being separated from the above by a predetermined distance, and a negative pressure is applied to the back surface side of the substrate W, and the holding members 71A and 71A suck and hold the substrate W. However, at this time, with respect to the holding member 71B, the holding member 71B is located at the lower position and is kept in non-contact with the substrate W, and the auto valve 74B is in the "closed" state.

Holding members 71A, 71B and auto valve 7
4A and 74B, an auto valve 74C is connected to the main suction passages 73A and 73B.
By opening C, the space between the suction path 72A-main 73A and the suction path 72B-main 73B can be opened to the atmosphere, and the substrate W can be easily transferred.

As described above, in the substrate transfer device 3 according to this embodiment, the holding members 71A and 71B are moved by the elevating mechanism.
The vertical position of the auto valves 74A, 74B,
By controlling 74C, the suction holding of the substrate W by the holding member 71A and the suction holding of the substrate W by the holding member 71B are appropriately switched. That is, in this embodiment, the lifting mechanism and the auto valves 74A, 74B, 74
The switching means is composed of C.

For the sake of convenience of the following description, in this specification, the position where the holding member is moved to the upper position to hold the substrate W is referred to as "substrate holding position", while it is moved to the lower position. The position in which the substrate W is not in contact with the substrate W is referred to as a "retracted position".

Next, focusing on the transfer operation of the substrate W by the substrate transfer device 3 configured as described above, (1) an operation of taking out the unprocessed substrate W from the unprocessed substrate cassette 4,
The operation of (2) the cleaning process in the brush module 21 and the spin unit 22, and (3) the operation of taking out the cleaned substrate W from the spin unit 22 and returning it to the processed substrate cassette 4 will be sequentially described.

First, after the transfer robot 33 is moved in the direction X and stopped before the unprocessed substrate cassette 4A,
The column 35 is raised to position the hand 38 at a position slightly lower than the height of the unprocessed substrate W in the cassette 4A (FIG. 7). At this time, in the hand 38, the holding member 71A is raised to the substrate holding position to project upward from the upper surface 38S of the hand 38 to support the substrate W, and the holding member 71B is lowered to the retracted position. It is located below the upper surface 38S of the hand 38, that is, it is buried in the hand 38 as shown in FIG. The auto valves 74A, 74B and 74C are all in the "closed" state.

Then, the motor for rotating the respective parts around the respective rotation axes A1, A2, A3 is driven, and the hand 38
Are advanced to just below the back surface of the unprocessed substrate W. After that, the column 35 is further raised to place the substrate W on the holding members 71A and 71A of the hand 38, and then the holding member 7
Auto valve 74 connected between 1A and vacuum source
A is set to "open" to start vacuum suction by the holding member 71A. As a result, the substrate W moves to the upper surface 38S of the hand 38.
Is held by suction on the holding member 71A in a state of being separated from the holding member by a predetermined distance. The holding member 71B is kept in non-contact with the substrate W (FIG. 8).

When the transfer of the substrate W from the cassette 4A to the hand 38 is completed as described above, the hand 38 is retracted to take out the substrate W from the cassette 4, and the transfer robot 33 is moved to the substrate loading port of the brush module 21. After moving to the brush module 21, the hand 38 is advanced to the brush module 21 side while holding the substrate W by suction.
The loader position, that is, the substrate W is positioned on the transport roller 21A that transports the substrate W in a predetermined direction by rotating around the rotation axis RA. Then, the auto valve 74A connected between the holding member 71A and the vacuum generation source is opened to stop the vacuum suction of the substrate W by the holding member 71A,
The auto valve 74C for opening to the atmosphere is opened to open the holding member 71A to the atmosphere, and the suction holding of the substrate W by the holding member 71A is completed. Then, the column 35 is lowered to place the substrate W on the transport roller 21, and the transfer of the substrate W to the brush module 21 is completed. The holding member 71B that does not adsorb and hold the substrate W is also opened to the atmosphere by opening the atmospheric opening auto valve 74C.

Subsequently, the motor 38 is controlled to retract the hand 38 to return the transfer robot 33 to the state shown in FIG. 7, and further, the atmosphere opening auto valve 74C is "closed" to wait for the next operation. . As described above, in the substrate transfer device 3 according to the present embodiment, the holding member 71A is located at the substrate holding position to hold the substrate W, and the other holding member 71B is located at the retracted position so as not to contact the substrate W. Since the substrate W is carried in to the brush module 21 that is the cleaning processing unit in the contact state, the holding member 71B is prevented from being contaminated even if the unprocessed substrate W before the cleaning processing is dirty. It

On the other hand, the substrate W delivered to the brush module 21 is conveyed in a horizontal posture by the conveying roller 21A, and a roll brush (not shown) is pressed against the front and back surfaces to wash both the front and back surfaces. The substrate on which the brush cleaning process has been completed is carried into the spin unit 22 by the transport hand 5, and is rotatably supported by a large number of substrate support pins 22e (FIG. 10) provided on the spin chuck 22d (FIG. 10). It Then, while rotating the substrate together with the spin chuck 22d, a cleaning treatment is performed on the surface of the substrate by the revolving brush 22a, and ultrasonic waves are applied to the surface of the substrate by ultrasonic vibration from the ultrasonic cleaning nozzle 22b. Shower cleaning process and pure water nozzle 22c
The pure water rinsing process is performed in this order.

When the spin cleaning process in the spin unit 22 is completed in this way, the transfer robot 33 is moved to the spin unit 22.
(Fig. 10). At this time, hand 3
In FIG. 8, the holding member 71B is raised to the substrate holding position by the elevating mechanism to project upward from the upper surface 38S of the hand 38 to support the substrate W, and the holding member 71A is lowered to the retracted position in the recess 38B. To be buried in. The auto valves 74A, 74B and 74C are all in the "closed" state. On the other hand, in the spin unit 22, the substrate W is placed on the spin chuck 22d.

Next, as shown in FIG. 11, the substrate W placed on the spin chuck 22d is pushed upward by a push-up pin (not shown), and the substrate can be transferred to and from the transfer robot 33. Subsequently, the motor is driven to move the hand 38 forward to the spin chuck 22d side and move it to a position directly below the substrate W pushed up by the push-up pin. Then, by lowering the push-up pin, the substrate W is placed on the holding member 71B protruding from the upper surface 38S of the hand 38. After that, the auto valve 74B connected between the holding member 71B and the vacuum source is opened, and the vacuum suction by the holding member 71B is started. As a result, the substrate W is moved to the hand 3
8 is sucked and held on the holding member 71B in a state of being separated from the upper surface 38S of 8 by a constant distance, and contact with the holding member 71A is prevented (FIG. 12). Therefore, even if the holding member 71A of the hand 38 is contaminated when the unprocessed substrate is loaded into the brush module 21, the spin unit 2 that is the cleaning processing unit.
The processed substrate W is unloaded from the substrate 2 by the holding member 71B, and the holding member 71A is prevented from coming into contact with the processed member W, so that the processed substrate W can be prevented from being contaminated.

After that, the motor is driven to move the hand 38 to the processed substrate cassette 4B side while the substrate W is suction-held by the holding member 71B. Then, the auto valve 74B connected between the holding member 71B and the vacuum generation source is "opened" to stop the vacuum suction of the substrate W by the holding member 71B, and the auto valve 74C for opening to the atmosphere is "opened". Then, the holding member 71B is opened to the atmosphere, and the suction holding of the substrate W by the holding member 71B is completed. Then, the column 35 is lowered to place the substrate W on a predetermined shelf in the cassette 4B, and the transfer of the processed substrate W to the cassette 4B is completed. The holding member 71A that is not holding the substrate W by suction is also opened by opening the auto valve 74C for opening to the atmosphere.

Subsequently, the motor 38 is driven to retract the hand 38 from the cassette 4B to return to the state shown in FIG. 10, and finally the atmospheric opening auto valve 74C is "closed" to wait for the next operation.

As described above, in this embodiment, the holding member 71A functions as a substrate holding means dedicated to carrying the substrate into the cleaning processing section, while the holding member 71B is used to carry the substrate out of the cleaning processing section. Since it functions as a holding unit, the substrate holding unit that comes into contact with the unprocessed substrate does not come into contact with the processed substrate, and the unprocessed substrate is not adversely affected by the unprocessed substrate and the substrate is not loaded into the processing unit. It is possible to favorably carry out the substrate from the processing section. Moreover, the number of hands can be minimized, that is, to one, and the device configuration can be simplified.

In the above embodiment, the holding members 71A, 7A
Although both 1B have been described as being vertically movable, the same effect can be achieved if only one is vertically movable. That is, it is only necessary that one protrudes upward from the hand 38 and the other can move up and down between the retracted position of the hand surface height and the substrate holding position further above one protruding height.

In the above embodiment, the holding members 71A,
Both 71B are in the retracted position and the upper surface 3 of the hand 38
Although it is configured to be located below 8S and buried in the hand 38, the present invention is not limited to this, and the holding member does not need to be buried in the hand at the retracted position. Further, in the above embodiment, the guide rail 31
Is fixed to the bottom of the substrate cleaning apparatus main body, the guide rail 31 may be fixed to the side wall of the substrate cleaning apparatus main body. In addition, in the above-mentioned embodiment, the rectangular parallelepiped holding member 71A,
Although 71B was used, the shape of the holding member is not limited to a rectangular parallelepiped, and various shapes can be used.

In the above embodiment, the holding members 71A,
71B are provided at different positions, and the holding members 71A and 71B are selectively moved up and down, but the following may be adopted.

FIG. 14 is a view showing a modified example of the substrate transfer device according to the present invention. As shown in the figure, in this device, a concave portion 38C having an opening in the direction of the upper surface 38S is provided on the upper surface 38S side of the hand 38, and the holding member 81 is rotatable around the rotation shaft 82 in the concave portion 38C. ing. Further, the holding member 81 is formed with flat surfaces 81A and 81B capable of making surface contact with the substrate W. By rotating the holding member 81 around a rotation shaft 82 by a rotation drive mechanism (not shown), these flat surfaces are formed. 81A and 81B respectively project from the upper surface 38S of the hand 38 and can support the substrate W. For example, as shown in FIG. 7A, when the flat surface 81A faces upward, the substrate W can be placed on the flat surface 81A. Further, the holding member 8
In FIG. 1, substantially L-shaped suction paths 83A and 83B are formed so as to reach the planes 81A and 81B, respectively.
When A faces upward ((a) in the figure), the suction passage 83A communicates with the main suction passage 84 formed in the hand 38, while the flat surface 81B faces upward ((c) in the figure). Suction path 8
3B is configured to communicate with the main suction passage 84.

Therefore, for example, when the unprocessed substrate W is carried into the cleaning processing section, the flat surface 81A of the holding member 81 is located on the upper side so that the flat surface 81A can suck and hold the substrate W. On the other hand, untreated substrate W
When unloading the flat surface 81B from the cleaning processing unit, the flat surface 81B of the holding member 81 is positioned on the upper side,
Thus, the substrate W can be suction-held. That is, the surface for sucking and holding the substrate W can be switched by rotating the holding member 81 by the rotation drive mechanism in accordance with the loading and unloading operations of the substrate, and as a result, the substrate holding means in contact with the unprocessed substrate. (Plane 81A) does not come into contact with the processed substrate, and the same effect as that of the above embodiment can be obtained.

Further, in this modified example, since the suction path is switched by the rotational movement of the holding member 81, there is an effect that the piping becomes simpler as compared with the above-mentioned embodiment.

In the above description, the case where the present invention is applied to the substrate cleaning apparatus has been described. However, the apparatus to which the present invention is applicable is not limited to the above substrate cleaning apparatus, and a predetermined substrate may be used. The present invention can be applied to all substrate processing apparatuses provided with a processing unit that performs the above processing.

Further, in the above, the substrate is sucked and held by the holding member, but the substrate may be mechanically held by a holding member such as a mechanical pin.

[0046]

As described above, according to the present invention, the switching means is provided, and the first means is provided according to the loading and unloading operations of the substrate.
When one of the second substrate holding means and the second substrate holding means moves to the substrate holding position, the other one is in the retracted position to prevent contact with the substrate, so that the structure is simple and there is no adverse effect due to the unprocessed substrate. It is possible to favorably carry the substrate in and out of the processing unit without giving it to the processed substrate.

Further, according to the second aspect of the present invention, the substrate can be carried in and out of the processing section satisfactorily without adversely affecting the processed substrate by the adverse effect of the unprocessed substrate.

According to the third aspect of the present invention, the substrate can be surely held, and the unprocessed substrate is not adversely affected by the untreated substrate, and the substrate can be carried in and out of the processing section favorably. It can be carried out.

[Brief description of drawings]

FIG. 1 is a side view showing an example of a substrate processing apparatus in which a substrate transfer apparatus according to the present invention is incorporated.

FIG. 2 is a perspective view of a substrate transfer device.

FIG. 3 is a partially enlarged plan view of a hand.

4 is a cross-sectional view taken along the line AA of FIG.

FIG. 5 is a schematic diagram showing a configuration for sucking and holding a substrate with a hand.

6 is a cross-sectional view taken along the line AA of FIG.

FIG. 7 is a diagram for explaining an operation of taking out a substrate before a cleaning process from an unprocessed substrate cassette.

FIG. 8 is a diagram for explaining an operation of taking out a substrate before a cleaning process from an unprocessed substrate cassette.

FIG. 9 is a diagram for explaining an operation of taking out a substrate before a cleaning process from an unprocessed substrate cassette.

FIG. 10 is a diagram for explaining the operation of taking out the substrate W after the cleaning processing from the spin unit and returning it to the processed substrate cassette.

FIG. 11 is a diagram for explaining the operation of taking out the substrate W after the cleaning processing from the spin unit and returning it to the processed substrate cassette.

FIG. 12 is a view for explaining the operation of taking out the substrate W after the cleaning processing from the spin unit and returning it to the processed substrate cassette.

FIG. 13 is a view for explaining the operation of taking out the substrate W after the cleaning processing from the spin unit and returning it to the processed substrate cassette.

FIG. 14 is a partial cross-sectional view showing a modified example of the substrate transfer device according to the present invention.

[Explanation of symbols]

 2 Brush Cleaning Section 3 Substrate Transfer Device 21 Brush Module 22 Spin Section 23 UV Lamp House 38 Hands 71A, 71B, 81 Holding Member

Claims (3)

[Claims] 1. A substrate transfer device for loading a substrate into a processing unit that performs a predetermined process on the substrate and unloading the substrate from the processing unit, wherein the hand is movable back and forth with respect to the processing unit. A driving unit that drives the hand to move the hand forward and backward with respect to the processing unit, a substrate holding position above the hand, and a retreat position lower than the substrate holding position can be reciprocally moved. At least one of the first and second substrate holding means holds the substrate by moving to the substrate holding position, and one of the first and second substrate holding means depending on the substrate loading / unloading operation. A substrate transfer apparatus comprising: a switching unit that moves the substrate to the substrate holding position and moves the other to the retracted position. 2. The substrate transfer apparatus according to claim 1, wherein the first and second substrate holding means are provided in the hand. 3. The substrate transfer apparatus according to claim 1, wherein each of the first and second substrate holding means has a suction mechanism.