JPH07297115A - Method and device for aligning mask and work - Google Patents

Abstract

(57) [Abstract] [Purpose] Highly accurate mask and workpiece positions that are compatible with high integration of mask patterns without being affected by optical path misalignment due to optical system misalignment or deformation due to vibration or thermal expansion. To provide a matching method and apparatus. [Structure] The projected image of the alignment mark MA of the mask M is monitored by a monitor 9 on which a reference line is displayed, and the mask M is moved so that the reference line and the alignment mark MA of the mask M overlap. Next, the work W is set at a predetermined position, the surface of the work W having the alignment mark WA and the projection surface of the alignment mark WA of the mask M are aligned, and the projection image of the alignment mark WA is monitored 9
And the work W is moved so that the reference line and the alignment mark WA of the work W overlap.
In addition, by using an optical member or the like, the alignment mark WA
It is also possible to match the surface on which is located with the projection surface of the alignment mark MA.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for aligning a mask and a work in an exposure apparatus used for producing a semiconductor device, a printed circuit board, an LCD or the like.

[0002]

2. Description of the Related Art In manufacturing a power transistor, a micromachine, a printed circuit board or the like, it is important to accurately expose a mask pattern onto a predetermined position of a work such as a silicon wafer or an epoxy resin. The above alignment is usually performed by superposing the alignment marks on the mask and the work.

Particularly, in a certain manufacturing process, a pattern may be printed on both surfaces of the work, and it is important to accurately align the position of the pattern on the front surface with the pattern on the back surface. For example, the precision of the positional deviation required in the manufacturing process of the micromachine is 1 μm to several μm. Conventionally, the following method has been performed as an alignment method for the above alignment.

FIG. 8 is a diagram showing a conventional alignment method. In FIG. 8, first, an alignment light source 11 located above the mask M irradiates the alignment mark 105 on the back of the mask M with light. To do. Further, the alignment mark 104 of the work 22 is irradiated with light from the alignment light source 12 installed below the work 22 to be exposed. The alignment mark 104 of the work 22 is printed on the back side of the exposed surface.

A part of the irradiated light is reflected by the front surface and the back surface of the work, and each reflected light passes through an optical system including an objective lens system 31, a half mirror 33, a reflection mirror 38, a prism 39 and the like. Then, the light enters the image processing recognition means 41 such as CCD and is monitored by the monitor 42. In this way, the alignment mark 105 of the mask M and the alignment mark of the work 22 are recognized, and the position of the mask M or the work 22 is adjusted so that the images of the two alignment marks overlap.

By the way, the above alignment method is accurately performed under the condition that the optical path of the alignment optical system including the objective lens system 31, the half mirror 33, the reflection mirror 38, and the prism 39 is fixed and does not move. However, if the optical system is displaced or deformed, accurate alignment becomes impossible. That is, when it is operated for a long period of time, the holding mechanism for the components of the alignment optical system is affected by the vibration and thermal expansion of the entire apparatus to cause positional deviation and deformation, and the mask M and the work 22 are subjected to the above-described procedure. Even if the alignment marks are overlapped with each other, since there is an abnormality in the mechanism itself, accurate alignment becomes impossible.

In order to solve the above problems, the inventor has previously proposed the following method. That is, as described below, the reference alignment mark 1 for aligning the mask M is used.
The reference mask M2 having 07 and the reference mask M1 having the reference alignment mark 106 for aligning the work 22 to be exposed are used.

The alignment method will be described with reference to FIGS. 9 and 10. First, the above method will be described with reference to FIG.
In FIG. 9, the alignment light source 12 installed below the mask M irradiates the alignment mark 105 on the back of the mask M with light. The irradiation light passes through the irradiation condenser lens 32, the reference mark M1 having the reference alignment mark 106, and the reference mark M2 having the reference alignment mark 107, and the mask M and the objective lens system 3
The light enters the first image processing recognition device 34 such as a CCD through an optical system composed of 1a and 31b and a half mirror 33. This signal is image-processed and monitored by the first monitor 36.

Therefore, the alignment mark 105 of the mask M and the reference alignment mark 1 of the reference mask M2
07 is recognized, and the mask M or the entire optical system is moved so that the two images overlap. As a result, the mask M is positioned at a position corresponding to the reference alignment mark 107 of the reference mask M2. Next, as shown in FIG. 10, the work 22 is inserted and held on the exposure surface.

Here, the alignment mark 104 of the work 22 is located on the back side of the exposure surface, and the irradiation light from the alignment light source 12 is reflected by the back surface of the work 22. For example, the objective lens system 31a and the half mirror. 33
The light enters the second image processing recognition unit 35 via the optical system including the above. This signal is image-processed and monitored by the second monitor 37.

Then, the alignment mark 104 of the work 22 and the reference alignment mark 106 of the reference mask M1 are recognized, and the work 2 is made so that the two images may overlap.
Move 2 As a result, the work 22 is placed at a position corresponding to the reference alignment mark 107 of the reference mask M1.
Is positioned. Thus, the mask M and the work 2 before exposure
The alignment of 2 is completed.

Here, in advance, a reference alignment mark 107 (reference mask M for aligning the mask M) is used.
2) and the reference alignment mark 106 (reference mask M1) for aligning the workpiece 22 are adjusted and set, the alignment mark 105 of the mask M and the reference mask M2 are adjusted as described above. By aligning the position of the alignment mark 107 of the workpiece 22 and the position of the alignment mark 104 of the workpiece 22 and the position of the alignment mark 106 of the reference mask M1.
The alignment mark 105 between the mask M and the work 22,
104 can be matched.

Further, when the next work is exposed after the exposure is finished, the alignment mark 105 of the mask M and the reference alignment mark of the reference mask M2 are again formed into the first image as described with reference to FIG. It is recognized by the processing recognition means 34, and the mask M or the entire optical system is moved so that the two images overlap. According to the method described above, even if the holding mechanism for the components of the alignment optical system or the holding mechanism for the mask M is displaced or deformed due to the influence of vibration or thermal expansion of the entire apparatus, the work is exposed. Since the position of the mask M or the entire optical system is always adjusted before, the reference alignment mark 106 (reference mask M
1) and the reference alignment mark 107 (reference mask M
Correct alignment can be performed as long as the relative position of 2) does not change.

The reference mask M1 having the reference alignment mark 106 and the reference mask M2 having the reference alignment mark 107 are held so that the reference mark unit 112 has a gap t2 of about 1 mm as shown in FIG. It is fixed by adhesion or the like.
The gap t2 is 1/100 or less as compared with the optical path length of the conventional example described in FIG.

Therefore, the deviation of the optical path due to the positional deviation or deformation of the optical system due to the vibration or thermal expansion of the entire apparatus, which greatly affects the alignment, is less than 1/100,
It can be considered that it is substantially unaffected by heat or vibration. Incidentally, in general, the alignment mark 105 of the mask M is
The alignment marks 104 of the workpiece 22 and the workpiece 22 are respectively provided on the mask M and the workpiece 22 at two or more locations. Therefore, the alignment mark optical system described above is also installed in two or more places, and the reference mark unit 1 holds the reference mask M1 and the reference mask M2 with a gap t2.
12 will also be installed in two or more places.

[0016]

By the way, FIG. 9 to FIG.
The conventional example shown in No. 1 has the following problems. (1) Each fiducial mark unit 1 installed in two or more places
12 (see FIG. 11), the variation (difference in gap) between the gaps t2 is the depth of focus of the objective lens 31a (for example, 1).
0 μm), the alignment mark 106 of one of the reference mark units 112 installed at two or more locations, which should be observed together with the alignment mark 104, is observed but the other reference mark unit 112 is observed. The alignment mark 106 of the mark unit causes a problem that the image is not visible due to blurring.

Therefore, two or more mark units 11 are provided.
The variation of the gap t2 between the two
Since it must be controlled within the focal depth of a (for example, 10 μm), strict manufacturing accuracy is required for manufacturing the reference mark unit, and the manufacturing cost becomes high. (2) The alignment accuracy of the reference alignment marks 106 and 107 in the reference mark unit 112 becomes the alignment accuracy of the mask M and the work 22. For this reason, as the alignment accuracy is increased, the reference alignment mark 10 at the time of manufacturing the reference mark unit 112 is increased.
It is required to improve the alignment accuracy of 6 and 107.

However, the reference alignment mark 106
When the positioning accuracy of the and 107 is required to be within 1 μm, there is a certain limit to the improvement of the positioning accuracy during manufacturing. Therefore, conventionally, when the reference mark unit 112 is installed, the inclination of the entire reference mark unit 112 is adjusted to correct the mutual positions of the reference alignment marks 106 and 107.

Therefore, the reference alignment mark 1
When the positioning accuracy of 06 and 107 is required to be higher, the tilt adjusting mechanism necessary for the correction work becomes complicated and the tilt adjusting work itself becomes difficult. (3) Since the reference alignment marks 106 and 107 in the reference mark unit 112 themselves have a certain width, it is possible to improve the alignment accuracy of the reference alignment marks 106 and 107 and the alignment marks of the mask M and the work 22. There are some limits.

The present invention has been made in view of the above-mentioned problems of the prior art, and an object thereof is an optical path due to displacement or deformation of an optical system caused by vibration or thermal expansion of the entire apparatus which greatly affects alignment. It is an object of the present invention to provide a highly accurate mask and work alignment method and apparatus that are not affected by the deviation of the mask pattern and can be used for high integration of the mask pattern.

[0021]

In order to solve the above-mentioned problems, the invention of claim 1 of the present invention, in a method of aligning a mask and a work, receives and image-processes a projected image of an alignment mark of the mask, Monitor the reference line on the monitor and move the projected image of the mask alignment mark or the position of the reference line based on the monitor output so that the reference line and the mask alignment mark overlap. Then, the work is set at a predetermined position, the surface having the work alignment mark and the projection surface of the alignment mark of the mask are matched, and the projected image of the work alignment mark is received and image-processed by the monitor. Monitor and move the work so that the reference line and the work alignment mark overlap based on the monitor output. Those were.

According to a second aspect of the present invention, in the method of aligning a mask and a work, the mask alignment
The projected image of the mark is received and image-processed, and it is monitored by the monitor on which the reference line is displayed. Based on the monitor output, the projected image of the alignment mark of the mask, so that the reference mark and the alignment mark of the mask overlap, Alternatively, the position of the reference line is moved, then the work is set at a predetermined position, the observation surface of the objective lens is aligned with the surface having the work alignment mark, and the projected image of the work alignment mark is received. The image is processed and monitored by a monitor, and the work is moved based on the monitor output so that the reference line and the work alignment mark overlap.

According to a third aspect of the present invention, in the method for aligning a mask and a work, the work alignment and
The surface with the mark and the projection surface of the alignment mark of the mask are matched in advance, the projected image of the alignment mark of the mask is received and image-processed, monitored by the monitor that displays the reference line, and based on the monitor output. The projected image of the mask alignment mark or the position of the reference line is moved so that the reference line and the mask alignment mark overlap, and then the work is set at a predetermined position and the work alignment mark is projected. The image is received / image-processed and monitored by a monitor, and the work is moved so that the reference line and the work alignment mark overlap each other based on the monitor output.

According to a fourth aspect of the present invention, in the method of aligning a mask and a work, the work alignment and
Align the mask alignment mark by moving the mask alignment mark projection image in advance so that the surface on which the mark is located and the mask alignment mark projection surface match.
The projected image of the mark is received and image-processed, and it is monitored by the monitor on which the reference line is displayed. Based on the monitor output, the projected image of the alignment mark of the mask, so that the reference mark and the alignment mark of the mask overlap, Alternatively, the position of the reference line is moved, then the work is set at a predetermined position, the projected image of the alignment mark of the work is received / image-processed and monitored by the monitor, and the reference line and the work are monitored based on the monitor output. The work is moved so that the alignment marks overlap.

According to a fifth aspect of the present invention, in a mask-work alignment device, image processing means for receiving and image-processing the projected images of the alignment marks of the mask and the work, and a reference line for generating a reference line. Generating means, monitoring means for monitoring both the projected image received and image-processed by the image processing means, and the reference line generated by the reference line generating means, work position moving means for moving the position of the work, and objective An alignment unit moving means for moving the position of the alignment unit provided with a lens is provided, and the reference line monitored by the monitoring means and the alignment mark of the mask and the work by the work position moving means and the alignment unit moving means are provided. Workpiece and alignment unit so that the projected images overlap. By moving the door, which is constituted so as to position the mask and the workpiece.

According to a sixth aspect of the present invention, in a mask and work alignment device, an image processing means for receiving and image-processing a projected image of the alignment mark of the mask and the work, and a reference line for generating a reference line. Generating means, monitoring means for monitoring the projection image image-received / image-processed by the image processing means, and the reference line generated by the reference line generating means; work position moving means for moving the position of the work; A reference line position moving means for moving the position of the reference line generated by the line generating means is provided, and the reference line monitored by the monitoring means by the work position moving means and the reference line position moving means and the alignment mark of the mask and the work. By moving the positions of the workpiece and reference line so that the projected images of
It is configured to align the mask and the work.

[0027]

According to the first aspect of the present invention, the reference line and the alignment mark of the mask are made to coincide with each other, and then the work is set at a predetermined position to have a surface having the alignment mark of the work, and the mask of the mask. By aligning the projection planes of the alignment marks and moving the work so that the reference line and the work alignment marks overlap, it is possible to observe multiple alignment marks on the work with the same accuracy. Since the reference mark unit is not used, the manufacturing cost can be reduced as compared with the conventional example. Further, the correction work due to the alignment accuracy of the reference alignment mark in the conventional example becomes unnecessary, and if the magnification of the monitor, that is, the magnification of the objective lens is increased, the line width of the reference line becomes relatively narrow,
If the magnification of the objective lens is increased and the line width of the alignment mark is made finer, the alignment accuracy between the mask and the wafer can be further improved.

In the invention of claim 2 of the present invention, the reference line and the alignment mark of the mask are aligned, and then
The work is set at a predetermined position, the observation surface of the objective lens is aligned with the surface of the work having the alignment mark, and the work is moved so that the reference line and the work alignment mark overlap. An effect similar to that of the invention of Item 1 can be obtained, and Claim 1
It is not necessary to newly provide a mechanism for moving the workpiece in the Z direction (the same direction as the irradiation direction of the alignment light) as in the invention of 1), and the configuration of the device can be simplified.

According to the third aspect of the present invention, the surface of the work having the alignment mark and the projection surface of the mask alignment mark are matched in advance, and the reference line and the mask alignment mark are matched. ,next,
Since the work is moved so that the reference line and the work alignment mark overlap, the same effect as the invention of claim 1 can be obtained, and the mask or the projection lens is moved to move the work alignment mark. And the projection surface of the alignment mark of the mask can be made to coincide with each other in advance, and a mechanism for moving the work in the Z direction (the same direction as the alignment light irradiation direction) is newly added like the invention of claim 2. Since it is not necessary to provide the device, the structure of the device can be simplified.

According to a fourth aspect of the present invention, an optical member is used to adjust the alignment mark of the mask so that the surface of the workpiece on which the alignment mark is located and the projection surface of the alignment mark of the mask coincide with each other. Move the projected image in advance, align the reference line with the alignment mark of the mask, then set the work at a predetermined position, and move the work so that the reference line and the work alignment mark overlap. Therefore, it is possible to obtain the same effect as that of the invention of claim 1, and it is not necessary to move the work or the mask in the Z direction, so that the moving mechanism of the work or the like can be simplified. Further, the surface having the alignment mark of the work and the projection surface of the alignment mark of the mask can be matched with each other by a simple operation.

According to a fifth aspect of the present invention, an apparatus for aligning a mask and a work includes an image processing means for receiving and image-processing a projected image of an alignment mark of the mask and the work, and a reference for generating a reference line. Line generating means, a projection image image-received / image-processed by the image processing means, a monitoring means for monitoring both the reference line generated by the reference line generating means, and a work position moving means for moving the position of the work, It comprises an alignment unit moving means for moving the position of the alignment unit equipped with an objective lens, and the reference line monitored by the monitoring means and the alignment of the mask and the work by the work position moving means and the alignment unit moving means. Workpiece and alignment so that the projected images of the marks overlap By moving the unit,
Since the mask and the workpiece are aligned with each other, the manufacturing cost of the apparatus can be reduced as compared with the conventional example, and the work of correcting the reference alignment mark can be eliminated. Further, it is possible to improve the accuracy of alignment between the mask and the wafer.

According to a sixth aspect of the present invention, the mask and work alignment device includes an image processing means for receiving and image-processing a projected image of the alignment mark of the mask and the work, and a reference for generating a reference line. Line generating means, a projection image image-received / image-processed by the image processing means, a monitoring means for monitoring both the reference line generated by the reference line generating means, and a work position moving means for moving the position of the work, A reference line position moving means for moving the position of the reference line generated by the reference line generating means, and alignment of the reference line with the mask and the work monitored by the monitoring means by the work position moving means and the reference line position moving means.・ Move the positions of the workpiece and reference line so that the projected images of the marks overlap, and align the mask and workpiece. As described above, the same effect as that of the invention of claim 5 can be obtained, and as in the invention of claim 5, when the projected images of the alignment marks of the reference line and the mask are superposed, Since it is not necessary to move the position of the unit, the configuration of the alignment unit moving means can be simplified and the operation can be facilitated.

[0033]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a view showing the first and second embodiments of the present invention, which shows the configuration of an exposure apparatus to which the mask and workpiece alignment method of the present invention is applied. In the figure, reference numeral 1 is an exposure light irradiation device, which exposes the exposure light such as i-line and h so that the illuminance on the surface of the mask M becomes uniform.
Line, g line (i line: wavelength 365nm, h line: wavelength 405nm, g
Line: wavelength 436 nm) is applied to the mask M on which the pattern and the alignment mark MA are marked.

As shown in FIG. 2, for example, the exposure light irradiation device 1 is internally provided with a high-pressure mercury lamp 1a as a light source, and the light from the high-pressure mercury lamp 1a is condensed by an elliptical focusing mirror 1b. The mask M is irradiated through the plane reflecting mirror 1c → the integrator lens 1d → the plane reflecting mirror 1e → the condenser lens 1f. Returning to FIG. 1, reference numeral 2 denotes a mask driving device, which moves the position of the mask M in the X direction, the Y direction (two directions on a plane orthogonal to the direction of the exposure light), and the Z direction (the vertical direction in FIG. 1). Or move in the direction of rotation. Specifically, the mask driving device 2 moves the mask stage (not shown) that holds the mask M as described above, and even with manual control using a micrometer head,
It may be an automatic drive using a servo motor or the like.

A projection lens 3 projects the pattern on the mask M and the alignment mark MA onto the mask pattern projection surface 4. 31 is a projection lens driving device,
The projection lens driving device 31 moves a stage (not shown) that holds the projection lens in the Z direction, and may be manually controlled using a micrometer head or automatically controlled using a servomotor or the like. .

Reference numeral 5 denotes a work stage, for example, a wafer (work) W is sucked and held by a vacuum suction mechanism (not shown). Further, the work stage 5 has an observation hole 52 for observing the alignment mark WA printed on the back surface of the wafer W. Reference numeral 51 denotes a stage driving device, and the stage driving device 51 has a function of moving the work stage 5 like the mask driving device 2.

Reference numeral 6 denotes an alignment light irradiation device, and the alignment light irradiation device 6 irradiates the alignment mark WA of the wafer W with light through the observation hole 52 via the condenser lens 61, the half mirror 62, and the objective lens 7.
FIG. 3 is a diagram showing an example of the configuration of the alignment light irradiation device 6 described above. The alignment light irradiation device 6 includes a lamp 6a including a halogen lamp and the like and a power source 6b for the lamp 6a. Light is given to the condenser lens 61 through the infrared cut filter 6c and the optical fiber guide 6d.

The light emitted from the alignment light irradiating device 6 need not be limited in wavelength.
When exposing the mask pattern on the back surface, for example,
It is desirable to emit non-exposure light that does not include the exposure wavelengths i-line, h-line, and g-line. Returning to FIG. 1, an image sensor 8 receives a projection image of the alignment mark of the mask M through the objective lens 7 and the half mirror 62 when the wafer W is not present on the work stage 5. On the other hand, when the wafer W is present on the work stage,
The projection image of the alignment mark on the wafer by the alignment light irradiation device 6 is received via the objective lens 7 and the half mirror 62.

The above-mentioned objective lens 7 and the optical parts associated therewith, for example, the alignment light irradiation device 6, the condenser lens 61, the half mirror 62, the image sensor 8 and the like constitute an alignment unit 70, which is an alignment unit. The drive device 71 has a function of moving the alignment unit 70 in the X, Y, and Z directions.

That is, when only the objective lens 7 is moved, the accompanying optical components are deviated from the image forming optical path of the objective lens 7, so that the projection image by the objective lens 7 cannot be monitored. Therefore, as described above, the objective lens 7 and the optical components accompanying it are unitized and moved by the alignment unit driving device 71. The alignment unit driving device 71 may be manually controlled or may be automatically driven like the mask driving device 2.

A monitor 9 receives a signal from the image sensor 8, processes the image, and monitors the image. Monitor 9
Causes the line generator 91 to display, for example, a cross reference line on the screen. As the line generator 91, a commercially available device having a function of superimposing an electronic line at an arbitrary position of a video signal of a TV camera or an image processing device (the position of the line can be easily adjusted by an adjusting knob or the like) An electronic line generating unit or the like can be used.

Further, in the case of automatically performing the alignment, it is desirable to use a type in which the position of the line can be adjusted by inputting an electric signal from the outside. In this embodiment, when the mask drive device 2, the stage drive device 51, and the alignment unit drive device 71 are automatically driven, the mask drive device 2, the stage drive device 51, the alignment unit drive device 71, and the monitor 9 are used. , And a control unit (not shown) connected to the line generator 91.
It is desirable that the control unit be provided with a control unit and control them.

Next, the alignment procedure of the first embodiment of the present invention will be described with reference to FIG. (1) The mask M is installed at a predetermined position. (2) The exposure light irradiation device 1 irradiates the mask M with light while the wafer W is not on the stage 5. The pattern of the mask M and the alignment mark MA are projected by the projection lens 3 onto the mask pattern projection surface 4.

Here, the mask M or the projection lens 3 is
The mask driving device 2 or the projection lens driving device 3 is preliminarily set so that the mask pattern projection surface 4 and the surface of the wafer W are aligned with each other.
It is adjusted by 1. (3) The objective lens 7 is moved in the X direction, the Y direction, or the Z direction by using the alignment unit driving device 71 so that the image of the alignment mark MA of the mask M is formed on the image sensor 8. This adjustment, once performed, need not be performed as long as the mask M is installed.

The alignment mark MA of the mask M received by the image sensor 8 is monitored on the screen of the monitor 9. FIG. 4 shows the arrangement of the alignment mark MA (two alignment marks are shown in the figure) and the objective lens 7 on the mask M, and
6 is a diagram showing an image displayed on the monitor 9. FIG.

As shown in (a), (b) and (c) of FIG. 7, a cross reference line 92, for example, is set by the line generator 91 at the center of the screen of the monitor 9 and is displayed on the screen of the monitor 9. The two alignment marks MA observed by the objective lens 7 are displayed. (4) On the screen of the monitor 9, as shown in FIG. 4, the reference line 92 of the cross and the alignment mark MA of the mask M are displayed.
The alignment unit driving device 71 moves the two or more alignment units 70 including the objective lens 7 in the X direction or the Y direction so that they overlap each other.

Here, the X-direction or Y-direction distance between the two or more cross reference lines is substantially equal to the distance between the objective lenses 7, so that the cross reference line 92 and the alignment mark MA of the mask M overlap each other. 2 to do
It is necessary to match the X-direction or Y-direction interval of the alignment marks MA provided at more than one place with the X-direction or Y-direction interval of the cross reference line 92.

Therefore, even if only the mask M is moved, the intervals between the alignment marks MA provided at two or more places cannot be changed, and the cross reference line 92 and the mask M are not changed.
The alignment marks MA of No. cannot be overlapped. Therefore, it is necessary to move the alignment units 70 at two or more places in the X direction or the Y direction as described above.

That is, from the state shown in FIG. 4A, as shown in FIG. 4B, one alignment unit 70 is moved to align one alignment mark MA with the reference line 92, and then, , The other alignment unit 70 is moved to align the other alignment mark MA with the reference line 92, as shown in FIG.

As described above, the alignment unit 70 may be moved so that the cross reference line 92 and the alignment mark MA of the mask M are overlapped with each other. By using the line moving function of the line generator 91, the cross reference lines on the monitor 9 at two or more places are moved in the X direction or the Y direction so that the cross reference line 92 and the alignment mark MA of the mask M are overlapped. .

When the reference line is moved as described above, it is not necessary to move the alignment unit 70. Therefore, in an apparatus in which the alignment unit 70 is structurally difficult to move, this method is used to cross the reference line. 92
And the alignment mark MA can be overlapped. The mask driving device 2 is used to move the mask M so that one alignment mark MA is aligned with the reference line 92, and then the alignment unit 70 is moved or the reference line 92 is moved to move the other mark. The alignment mark MA is aligned with the reference line 92.

The above adjustment is performed manually while observing the monitor 9. As described above, if the monitor 9, the alignment unit driving device 71, the line generator 91, and the mask driving device 2 are controlled by the controller (not shown), automatic control is also possible. (5) The irradiation of light from the exposure light irradiation device 1 to the mask M is stopped. (6) The wafer W is set on the work stage 5. Alignment mark WA on the back or both sides of wafer W
Is pre-marked. The back surface referred to here is a surface that does not face the mask M.

The wafer W is preset by abutting against a positioning means such as a positioning pin provided on the work stage 5 for installation. For this reason, the alignment mark WA on the back surface of the wafer W has the observation hole 52.
Located near the. (7) Light is emitted from the alignment light irradiation device 6. The light is applied to the back surface of the wafer W through the observation hole 52 of the work stage 5. At this time, when the mask pattern is also exposed on the back surface of the wafer W, the alignment light irradiation device 6 emits non-exposure light that does not include, for example, the exposure wavelengths i-line, g-line, and h-line. Is desirable. (8) Since the objective lens 7 is in an image-forming relationship with the mask pattern projection surface 4, alignment of the back surface of the wafer W
In order that the image of the mark WA is formed on the image sensor 9, the stage drive unit 51 moves the work stage 5 to the Z position.
In this direction, the mask pattern projection surface 4 and the back surface of the wafer W are aligned with each other.

At this time, instead of moving the work stage 5 in the Z direction, the alignment unit 70
Is driven by the alignment unit driving device 71,
It is also possible to move the objective lens 7 in the Z direction so that the back surface of the wafer W and the image sensor have an image forming relationship. According to the above, it is not necessary to provide a mechanism for moving the work stage 5 in the Z direction, and the structure of the device can be simplified.

The above adjustment is performed manually while observing the monitor 9. Further, as described above, if the monitor 9 and the stage driving device 51 are controlled by a controller (not shown), automatic adjustment is possible. (9) After that, on the screen of the monitor 9, the work stage 5 is moved in the X direction, the Y direction, or the rotation direction by the stage driving device 51 so that the cross reference line 92 and the alignment mark WA on the back surface of the wafer W overlap. Let

FIG. 5 shows alignment on the work W.
FIG. 9 is a diagram showing the arrangement of a mark WA (the case where there are two alignment marks in the figure) and the objective lens 7, and an image displayed on the monitor 9. The same figure (a)
As shown in (b), for example, a cross reference line 92 is set by the line generator 91 in the center of the screen of the monitor 9, and the two reference lines 92 observed by the objective lens 7 are displayed on the screen of the monitor 9. The alignment marks WA are displayed respectively.

As described above, since each cross reference line 92 is adjusted so as to coincide with the alignment mark MA of the mask M, the distance between the cross reference lines 92 is two alignments of the work. The distance between the marks WA is substantially the same, and the reference line 92 and the alignment mark WA are first displayed on the monitor 9 as shown in FIG.

By moving the work stage 5 in the X direction, the Y direction, or the rotation direction from the state shown in FIG. 7A by the stage drive device 51, as shown in FIG. 92 and the alignment mark WA on the back surface of the wafer W can be overlapped. This adjustment is performed manually while observing the monitor 9. Further, as described above, if the monitor 9 and the stage driving device 51 are controlled by a controller (not shown), automatic adjustment is possible. (10) Set the work stage 5 to Z in (8) above.
When moved in the direction, the mask pattern projection surface 4 and the back surface of the wafer W are aligned. For this reason, the work stage 5 is moved in the opposite direction by the same amount as the amount moved in (8) by using the stage drive device, and the surface of the wafer W and the mask pattern projection surface are matched.

The alignment of the mask M and the wafer W is completed by the above procedure. When the next wafer W is set and aligned after the main exposure is completed by performing the alignment as described above, it is not necessary to adjust the position of the objective lens 7 thereafter. Is the above (2), (4),
(5), (6), (7), (8), (9) and (10) may be performed.

In the steps (3) and (8) of this embodiment, the alignment unit driving device 71 is used so that the image of the alignment mark MA of the mask M is formed on the image sensor 9. Although the position of the lens 7 is adjusted, the image sensor driving device for driving the image sensor 8 is provided, and the position of the image sensor 8 is adjusted while the objective lens 7 is fixed to adjust the alignment mark MA of the mask M. The image may be formed on the image sensor 8.

As described above, in the present embodiment, the reference line 92 and the alignment mark MA of the mask M are aligned with each other, then the work W is set at a predetermined position and the work W is moved in the Z direction. , Work W alignment mark W
The surface having A is aligned with the projection surface of the alignment mark MA of the mask M, and the work W is aligned so that the reference line 92 and the alignment mark WA of the work W overlap.
Since the is moved, the following effects can be obtained. For example, a plurality of alignment marks on a work can be observed with the same accuracy. Since the reference mark unit is not used, the manufacturing cost can be reduced as compared with the conventional example. The correction work due to the alignment accuracy of the reference alignment mark in the conventional example is unnecessary. By changing the magnification of the monitor, that is, the magnification of the objective lens, the relative line width of the reference line on the monitor with respect to the fine alignment mark can also be made smaller, so that the mask and wafer alignment accuracy can be improved. Becomes

Further, in the above (8), instead of moving the work W in the Z direction, the alignment unit 70 is driven by the alignment unit driving device 71, and the objective lens 7 is moved in the Z direction to move the wafer W. If the back surface of the workpiece and the image sensor are in an image forming relationship, it is not necessary to newly provide a mechanism for moving the work W in the Z direction, and the configuration of the apparatus can be simplified.

Next, the alignment procedure of the second embodiment of the present invention will be described with reference to FIG. This embodiment uses the mask driving device 2 or the projection lens driving device 31,
This is an embodiment in which the mask pattern projection surface and the back surface of the wafer W are aligned with each other, and other parts are basically the same as those in the first embodiment. (1) The mask M is installed at a predetermined position. (2) The exposure light irradiation device 1 irradiates the mask M with light while the wafer W is not on the stage 5. The pattern of the mask M and the alignment mark MA are projected by the projection lens 3 onto the mask pattern projection surface 4.

Here, the mask M or the projection lens 3 is
The mask driving device 2 or the projection lens driving device 3 is preliminarily set so that the mask pattern projection surface 4 and the surface of the wafer W are aligned with each other.
It is adjusted by 1. (3) Mask driving device 2 or projection lens driving device 31
Using, the mask M or the projection lens 3 is moved in the Z direction by the same amount as the thickness of the wafer W, and the mask pattern projection surface and the back surface of the wafer W are aligned. (4) Using the alignment unit 71, the objective lens 7 is moved in the X direction, the Y direction, or the Z direction so that the image of the alignment mark MA of the mask M is formed on the image sensor 8. This adjustment, once performed, need not be performed as long as the mask M is installed.

The alignment mark MA of the mask M received by the image sensor 8 is monitored on the screen of the monitor 9. On the screen of the monitor 9, as shown in FIG. 4, the cross reference line 92 generated by the line generator 91 and the two alignment marks MA observed by the objective lens 7 are displayed. . (5) On the screen of the monitor 9, as described with reference to FIG. 4, the alignment unit driving device 71 is used to configure the objective lens 7 so that the cross reference line 92 and the alignment mark MA of the mask M overlap each other. Two or more alignment units 70 in the X direction or Y
Move in the direction.

As described above, the alignment unit 70 is moved to overlap the reference line 92 of the cross and the alignment mark MA of the mask M, and the line generator is used as described in the first embodiment. Using the line movement function of 91, the cross reference lines on the monitor 9 at two or more places are moved in the X direction or the Y direction so that the cross reference line 92 and the alignment mark MA of the mask M are overlapped.
The mask driving device 2 is used to move the mask M to align one alignment mark MA with the reference line 92,
Then, the alignment unit 70 may be moved or the reference line 92 may be moved so that the other alignment mark MA is aligned with the reference line 92.

The above adjustment is performed manually while observing the monitor 9. As described above, if the monitor 9, the alignment unit driving device 71, the line generator 91, and the mask driving device 2 are controlled by the controller (not shown), automatic control is also possible. (6) The irradiation of light from the exposure light irradiation device 1 to the mask M is stopped. (7) The wafer W is set on the work stage 5. Alignment mark WA on the back or both sides of wafer W
Is pre-marked. The back surface referred to here is a surface that does not face the mask M.

The wafer W is preset by abutting against a positioning means such as a positioning pin provided on the work stage 5 for installation. For this reason, the alignment mark WA on the back surface of the wafer W has the observation hole 52.
Located near the. (8) Light is emitted from the alignment light irradiation device 6. The light is applied to the back surface of the wafer W through the observation hole 52 of the work stage 5. At this time, when the mask pattern is also exposed on the back surface of the wafer W, the alignment light irradiation device 6 emits non-exposure light that does not include, for example, the exposure wavelengths i-line, g-line, and h-line. Is desirable. (9) The objective lens 7 is in an image-forming relationship with the mask pattern projection surface 4, that is, the back surface of the wafer W.

Therefore, as described with reference to FIG. 5 in the first embodiment, the cross reference line 9 is displayed on the screen of the monitor 9.
The work stage 5 is moved in the X direction, the Y direction, or the rotation direction by the stage driving device 51 so that 2 and the alignment mark WA on the back surface of the wafer W overlap each other. This adjustment is performed manually while observing the monitor 9. Further, as described above, the monitor 9 and the stage drive device 51
If it is controlled by a controller not shown, automatic adjustment is also possible. (10) Since the mask pattern projection surface 4 and the back surface of the wafer W coincide with each other, the mask M or the projection lens 3 is used by the mask driving device 2 or the projection lens driving device 31 by the same amount as the thickness of the wafer W. It is moved in the direction opposite to the direction moved in (3), and the mask pattern projection plane 4 and the wafer W surface are aligned.

The alignment of the mask M and the wafer W is completed by the above procedure. When the next wafer W is set and aligned after the main exposure is completed by performing the alignment as described above, it is not necessary to adjust the position of the objective lens 7 thereafter. Is the above (2), (3),
(5), (6), (7), (8), (9) and (10) may be performed.

As described above, in this embodiment, the mask M or the projection lens 3 is moved in the Z direction so that the surface having the alignment mark WA of the work W and the projection surface of the alignment mark MA of the mask M are moved. In advance, the reference line 92 and the alignment mark MA of the mask M are aligned, and then the work W is moved so that the reference line 92 and the alignment mark WA of the work W overlap. It is possible to obtain the same effect as that of the first embodiment, and it is not necessary to newly provide a mechanism for moving the work W in the Z direction, and the configuration of the device can be simplified.

FIG. 6 is a diagram showing a third embodiment of the present invention, which is similar to the first embodiment and shows the configuration of an exposure apparatus to which the mask and workpiece alignment method of the present invention is applied. This embodiment shows an embodiment in which an optical member is used to align the surface of the workpiece with the alignment mark with the projection surface of the mask alignment mark. A third embodiment of the present invention will be described with reference to FIG.

In the figure, those having the same functions as those shown in FIG. 1 are designated by the same reference numerals, 1 is an exposure light irradiation device, 2 is a mask driving device, 3 is a projection lens, 4 is a mask pattern projection plane, 5 is a work stage,
52 is an observation hole. 6 is an alignment light irradiation device, 6
Reference numeral 1 is a condenser lens, 62 is a half mirror, and 7 is an objective lens. The objective lens 7 and its associated optical components such as an alignment light irradiation device 6, a condenser lens 61, a half mirror 62, and an image sensor 8 are used for alignment. The unit 70 is configured, and the alignment unit 70 is the alignment unit driving device 7
Driven by 1. 8 is an image sensor, 9 is a monitor, and 91 is a line generator.

Although the stage drive unit 51 in this embodiment linearly moves or rotates the position of the work stage 5 in the X and Y directions, it does not move the work stage 5 as in the first embodiment. It is not necessary to have the function of moving in the Z direction. L is an optical member in the form of a parallel plate, and as shown in the figure, the optical member L is inserted in the optical path where the alignment mark MA of the mask M is projected onto the mask pattern projection surface 4 by the projection lens 3. Was released,
The insertion position is the projection lens 3 and the mask pattern projection surface 4.
Is in between.

When the optical member L is inserted, the optical member L shown in FIG.
As indicated by the dotted line of, the position of the projection image of the alignment mark MA of the mask M on the mask pattern projection surface 4 is moved in the Z direction. As described above, since the exposure light emitted from the exposure light irradiation device 1 passes through the optical member L, the glass material of the exposure light (e.g., i-ray, h
It is desirable that the transmittance of the exposure light of the X-ray and the g-ray) is high, and the change of the transmittance with time is small. Specifically, quartz glass,
Blue plate glass, white plate glass, etc. are selected as the glass material.

The thickness d of the optical member L is determined by the following equation based on the refractive index n of the glass material used and the thickness dw of the wafer (workpiece). d = dw / {1- (1 / n)} = {n / (n-1)} d
w The optical member position control device L1 inserts / removes the optical member L in the middle of the optical path in which the alignment mark MA of the mask M is projected by the projection lens 3 onto the mask pattern projection surface 4. The member L is linearly moved or rotated in the X direction, the Y direction, and the Z direction.

That is, the optical member position control device L1 has both the insertion / removal function of the optical member L and the insertion position adjustment function, and both functions are independent. Then, once the insertion position is adjusted, the insertion position does not change even if the optical member L is repeatedly inserted and removed. The optical member position control device L1 specifically moves, for example, a mask stage (not shown) that holds the optical member L as described above, and even by manual control using a micrometer head or the like, It may be an automatic control using a servo motor or the like.

Mask drive device 2 and stage drive device 5
1. When automatically driving the alignment unit driving device 71 and the optical member position control device L1, the mask driving device 2, the optical member position control device L1, the stage driving device 51, the alignment unit driving device 71 and the monitor 9 are used. It is desirable to provide a connected control unit (not shown) and control them by the control unit.

Next, the alignment procedure in the exposure apparatus of the third embodiment of the present invention will be described. (1) A wafer W having an alignment mark WA on its back surface or a reference work is set on the work stage 5, and light is emitted by the alignment light irradiation device 6.
The wafer W or the reference work is the work stage 5
It is preset by abutting against a positioning means such as a positioning pin provided on the position. Therefore, the alignment mark WA on the back surface of the wafer W is located near the observation hole 52.

The light is applied to the back surface of the wafer W or the reference work through the observation hole 52 of the work stage 5. At this time, when the mask pattern is also exposed on the back surface of the wafer W, the alignment light irradiation device 6
For example, it is desirable to emit non-exposure light that does not include the exposure wavelengths i-line, g-line, and h-line. (2) Use the alignment unit driving device 71 to move the objective lens 7 in the X direction, the Y direction, or the Z direction so that the image of the alignment mark WA on the wafer W or the back surface of the work as a reference is formed on the image sensor 8. Move in the direction. The wafer W received by the image sensor 8 or the alignment mark WA on the back surface of the reference work is
The screen of the monitor 9 is monitored.

By the above operation, the position of the objective lens 71 is set. If this adjustment is performed once, the mask M
Need not be done as long as is set. In the above description, the alignment mark WA is used to adjust the position of the objective lens 7, but the alignment mark WA is not necessarily limited to this, and another suitable pattern that allows observation through the observation hole 52 may be used. (3) The emission of light from the alignment light irradiation device 6 is stopped, and the wafer W or the reference work is removed from the work stage 5. (4) The exposure light irradiation device 1 starts irradiation of the mask M with the exposure light. (5) The optical member position control device L1 inserts the optical member L into the space between the projection lens 3 and the mask pattern projection surface. As shown in FIG. 7, the optical member L moves the position of the projection image of the alignment mark MA of the mask M on the mask pattern projection surface 4 in the Z direction when it is inserted. (6) The insertion position of the optical member is adjusted by the optical member position control device L1 so that the optical path of the projected image of the alignment mark MA of the mask M is not blocked when the optical member L is inserted.

Note that this adjustment need not be performed thereafter unless the positions of the mask M and the work stage 5 change. The image of the alignment mark MA of the mask M is projected by the insertion of the optical member L in the vicinity of the position where the alignment mark WA on the back surface of the wafer W or the reference work in (2) was located. 7. An image is formed on the image sensor 8 through the half mirror 62. The alignment mark MA of the mask M received by the image sensor 8 is monitored on the screen of the monitor 9. A cross-shaped reference line 92 is set by the line generator 91 at the center of the screen of the monitor 9, as in the first embodiment. (7) On the screen of the monitor 9, as described with reference to FIG. 4, the alignment unit driving device 71 is used to configure the objective lens 7 so that the cross reference line 92 and the alignment mark MA of the mask M overlap each other. Two or more alignment units 70 in the X direction or Y
Move in the direction.

As described above, the alignment unit 70 is moved so that the cross reference line 92 and the alignment mark MA of the mask M are overlapped with each other.
As described in the above embodiment, by using the line moving function of the line generator 91, the cross reference lines on the monitors 9 at two or more places are moved in the X direction or the Y direction to make the cross reference line 92 and the mask. The alignment marks MA of M are overlapped, the mask M is moved by using the mask driving device 2 to align one alignment mark MA with the reference line 92, and then the alignment unit 70 is moved, or It is also possible to move the reference line 92 so that the other alignment mark MA coincides with the reference line 92.

This adjustment is performed manually while observing the monitor 9. As described above, if the monitor 9, the alignment unit driving device 71, the line generator 91, and the mask driving device 2 are controlled by the controller (not shown), automatic control is also possible. (8) The irradiation of light from the exposure light irradiation device 1 to the mask M is stopped. (9) The optical member L is separated from the space of the mask pattern projection surface 4 of the projection lens 2 by the optical member position control device L1. (10) The wafer W, which is a work to be exposed, is set at a predetermined position on the work stage 5. The wafer W is preset by being placed against a positioning means such as a positioning pin provided on the work stage 5. Therefore, the alignment mark WA on the back surface of the wafer W is located near the observation hole 52. (11) Light is emitted from the alignment light irradiation device 6.
The light passes through the observation hole 52 of the work stage 5 and passes through the wafer W.
Is illuminated on the back side of. At this time, when the mask pattern is also exposed on the back surface of the wafer W, the alignment light irradiating device 6 may be used to expose, for example, i-line, h-line, g
It is desirable to emit non-exposure light that does not contain lines. (12) Then, as shown in FIG. 5, on the screen of the monitor 9, the stage drive unit 51 moves the work stage 5 in the X direction or so that the cross reference line 92 and the alignment mark WA on the back surface of the wafer W overlap. Move in Y direction or rotation direction.

This adjustment is performed manually while observing the monitor 9. Further, as described above, if the monitor 9 and the stage driving device 51 are controlled by a controller (not shown), automatic adjustment is possible. The alignment of the mask M and the wafer W is completed by the above procedure. After the main exposure is completed by performing the alignment as described above, when the next wafer W is set and aligned, the position of the objective lens 7 and the insertion position of the optical member L are adjusted thereafter. Since there is no need to perform the procedure, the procedure for alignment is (4), (5),
(7), (8), (9), (10), (11), (1
2) should be performed.

In the procedure (2) of this embodiment,
Alignment of the wafer W or the back surface of the work to be the reference
The alignment unit driving device 71 is used to adjust the position of the objective lens 7 so that the image of the mark WA is formed on the image sensor 8. However, the image sensor 8 is driven as in the first embodiment. It is also possible to provide an image sensor driving device for controlling the position of the image sensor 8 while the objective lens 7 remains fixed so that the image of the alignment mark MA of the mask M is formed on the image sensor 8.

As described above, in this embodiment, the same effect as in the first and second embodiments can be obtained, and the optical member L is inserted / removed to project the alignment mark of the mask. Since the image is moved so that the surface of the workpiece having the alignment mark and the projection surface of the mask alignment mark are aligned, the stage driving device 5
1 does not need to have a function of moving the work stage 5 in the Z direction, the work moving mechanism can be simplified, and the surface having the work alignment mark and the alignment mark of the mask can be easily operated. The projection planes of can be matched.

By the way, in the third embodiment,
The optical member L is inserted into the space between the projection lens 3 and the mask pattern projection surface, and the alignment mark MA of the mask M is inserted.
Although the position of the projected image of the objective lens 7 is moved in the Z direction, the optical member L is inserted / removed between the workpiece W and the objective lens 7 in the first embodiment, and the observation surface of the objective lens 7 is detected by the optical member L. By moving in the Z direction, the back surface of the wafer W and the image sensor 8 can be brought into an imaging relationship.

That is, in the above-described first embodiment, in the procedure (3), the optical member L is inserted so that the image of the alignment mark MA of the mask M is imaged on the image sensor 8. -The objective lens 7 is moved in the X direction, the Y direction, or the Z direction by using the unit driving device 71. Then, after going through the steps (4) to (7), the optical member L is removed in (8). This allows the back surface of the wafer W and the image sensor to be in an image forming relationship without moving the objective lens 7 in the Z direction.

According to the above arrangement, since it is not necessary to move the work stage 5 in the Z direction or the objective lens, the structure of the apparatus can be simplified and the operation can be performed easily. can do.

[0091]

As described above, according to the present invention, the objective lens or the reference line or the mask is moved so that the projected image of the alignment mark of the mask and the reference line on the monitor are overlapped, and then, Since the work is set at a predetermined position and the work is moved so that the projected image of the work alignment mark and the reference line are overlapped with each other, the following effects can be obtained. It is possible to observe a plurality of alignment marks on a work with the same accuracy. Since the reference mark unit is not used, the manufacturing cost can be reduced as compared with the conventional example. The correction work due to the alignment accuracy of the reference alignment mark in the conventional example is unnecessary. If the magnification of the monitor, that is, the magnification of the objective lens is increased and the line width of the alignment mark is miniaturized,
The accuracy of alignment between the mask and the wafer can be improved.

Further, instead of moving the workpiece in the Z direction, the objective lens is moved in the Z direction, or the back surface of the wafer and the image sensor are formed into an image-forming relationship by using an optical member, or If the mask or the projection lens is moved in the Z direction so that the surface having the work alignment mark and the projection surface of the mask alignment mark match, it is necessary to newly provide a mechanism for moving the work in the Z direction. There is no need, and the configuration of the device can be simplified.

Furthermore, the projection image of the alignment mark of the mask is moved by the optical member so that the surface having the alignment mark of the workpiece and the projection surface of the alignment mark of the mask coincide with each other, whereby the movement mechanism of the workpiece is set. It can be simplified, and the alignment of the surface with the work alignment mark and the mask can be performed with a simple operation.
The projection planes of the marks can be matched.

[Brief description of drawings]

FIG. 1 is a diagram showing first and second embodiments of the present invention.

FIG. 2 is a diagram showing an example of a configuration of an exposure light irradiation device.

FIG. 3 is a diagram showing an example of a configuration of an alignment light irradiation device 6.

FIG. 4 is a diagram illustrating a method of aligning an alignment mark and a reference line.

FIG. 5 is a diagram illustrating a method of aligning an alignment mark and a reference line.

FIG. 6 is a diagram showing a third embodiment of the present invention.

FIG. 7 is a diagram illustrating an optical path when an optical member is inserted / removed.

FIG. 8 is a diagram illustrating a conventional mask and work alignment method.

FIG. 9 is a diagram illustrating another conventional method for aligning a mask with a work.

FIG. 10 is a diagram illustrating another conventional mask and work alignment method.

FIG. 11 is a diagram showing a configuration of a reference mark unit.

[Explanation of symbols]

1 Exposure Light Irradiation Device 2 Mask Driving Device 3 Projection Lens 31 Projection Lens Driving Device 4 Mask Pattern Projection Surface 5 Work Stage 51 Stage Driving Device 52 Observation Hole 6 Alignment Light Irradiation Device 61 Condenser Lens 62 Half Mirror 7 Objective Lens 70 Alignment Unit 71 Alignment Unit Driving Device 8 Image Sensor 9 Monitor 91 Line Generator 92 Reference Line M Mask W Wafer (Work) MA Alignment Mark on Mask WA Alignment Mark on Wafer (Work) L Optical Member L1 Optical Member Position Control Device d Thickness of optical member L n Refractive index dw Thickness of wafer (work) 11, 12 Light source for alignment 22 Work 31, 31a, 31b Objective lens system 32 Condensing lens for illumination 33 Half mirror 34, 35, 1 Image Processing Recognizing Means 36 First Monitor 37 Second Monitor 38 Reflecting Mirror 39 Prism 42 Monitors 104, 105 Alignment Marks 106, 107 Reference Alignment Marks 112 Reference Mark Units M1, M2 Reference Masks t2 Reference Masks M1 and M2 Gap

Claims (6)

[Claims] 1. A projected image of an alignment mark of a mask is received and image-processed and monitored by a monitor on which a reference line is displayed. Based on the monitor output, the reference line and the alignment mark of the mask are overlapped, The projected image of the alignment mark of the mask or the position of the reference line is moved, then the work is set at a predetermined position, and the surface having the work alignment mark and the projection surface of the alignment mark of the mask are A mask characterized by matching, receiving and image-processing the projected image of the work alignment mark, monitoring it with a monitor, and moving the work so that the reference line and the work alignment mark overlap based on the monitor output. Workpiece alignment method. 2. A projection image of a mask alignment mark is received and image-processed, and is monitored by a monitor on which a reference line is displayed. Based on the monitor output, the reference line and the mask alignment mark are overlapped, The projected image of the alignment mark of the mask or the position of the reference line is moved, then the work is set at a predetermined position, the observation surface of the objective lens is aligned with the surface having the work alignment mark, and A mask and work alignment method characterized by receiving and processing the projected image of the alignment mark, monitoring it with a monitor, and moving the work so that the reference line and the work alignment mark overlap based on the monitor output. . 3. A monitor on which a projection line of a mask alignment mark is preliminarily matched with a surface of a workpiece having an alignment mark, a projected image of the mask alignment mark is received and image-processed, and a reference line is displayed. Monitor, and based on the monitor output, move the projected image of the mask alignment mark or the position of the reference line so that the reference line and the mask alignment mark overlap, and then place the workpiece at the specified position. Then, the projected image of the work alignment mark is received and image-processed and monitored by a monitor, and the work is moved so that the reference line and the work alignment mark overlap based on the monitor output. Alignment method. 4. The projection of the alignment mark of the mask is performed by moving the projection image of the alignment mark of the mask in advance so that the surface on which the alignment mark of the work is located and the projection surface of the alignment mark of the mask match. The image is received and image-processed, and it is monitored by a monitor that displays a reference line.The projected image of the mask alignment mark or the reference image is displayed so that the reference line and the mask alignment mark overlap based on the monitor output. Move the position of the line, then place the work in a predetermined position, receive and image-process the projected image of the work alignment mark, and monitor it with a monitor.Based on the monitor output, the reference line and work alignment mark A method for aligning a mask and a work, wherein the work is moved so that the two overlap. 5. An image processing means for receiving and image-processing a projected image of an alignment mark of a mask and a work, a reference line generating means for generating a reference line, and a projected image image-received and image-processed by the image processing means. Monitoring means for monitoring the reference line generated by the reference line generating means, work position moving means for moving the position of the work, and alignment unit moving means for moving the position of the alignment unit having the objective lens. By including the work position moving means and the alignment unit moving means, the work and the alignment unit are moved so that the reference line monitored by the monitoring means and the projected images of the alignment marks of the mask and the work overlap with each other. You can align the mask with the workpiece. Positioning device of the mask and the workpiece, characterized in. 6. An image processing means for receiving and image-processing a projected image of an alignment mark of a mask and a work, a reference line generating means for generating a reference line, and a projected image image-received and image-processed by the image processing means. Monitoring means for monitoring the reference line generated by the reference line generating means, work position moving means for moving the position of the work, and reference line position movement for moving the position of the reference line generated by the reference line generating means Means, and by the work position moving means and the reference line position moving means,
A mask characterized in that the mask and the work are aligned by moving the positions of the work and the reference line so that the reference line monitored by the monitoring means and the projected images of the alignment marks of the mask and the work overlap. Work alignment device.