JPH07286279A - Electroless plating method - Google Patents
Electroless plating methodInfo
- Publication number
- JPH07286279A JPH07286279A JP8180894A JP8180894A JPH07286279A JP H07286279 A JPH07286279 A JP H07286279A JP 8180894 A JP8180894 A JP 8180894A JP 8180894 A JP8180894 A JP 8180894A JP H07286279 A JPH07286279 A JP H07286279A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating solution
- soln
- electroless plating
- sulfate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000007772 electroless plating Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims description 14
- 238000007747 plating Methods 0.000 claims abstract description 60
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims abstract description 25
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 claims abstract description 9
- 229910001863 barium hydroxide Inorganic materials 0.000 claims abstract description 9
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 6
- 239000002244 precipitate Substances 0.000 abstract description 9
- 239000002699 waste material Substances 0.000 abstract description 8
- 239000000243 solution Substances 0.000 description 49
- 238000003756 stirring Methods 0.000 description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 239000007795 chemical reaction product Substances 0.000 description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- BDOYKFSQFYNPKF-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetic acid;sodium Chemical compound [Na].[Na].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O BDOYKFSQFYNPKF-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 1
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910001429 cobalt ion Inorganic materials 0.000 description 1
- 229910000361 cobalt sulfate Inorganic materials 0.000 description 1
- 229940044175 cobalt sulfate Drugs 0.000 description 1
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000909 electrodialysis Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003014 ion exchange membrane Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Landscapes
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば、プリント配線
板等の表面処理に用いられる無電解めっき方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroless plating method used for surface treatment of printed wiring boards and the like.
【０００２】[0002]
【従来の技術】従来、無電解めっき方法では、電気めっ
き方法に比べて、反応生成物が蓄積し易い。すなわち、
めっき液の調整や、銅イオン、ニッケルイオン若しくは
コバルトイオン等の金属イオンの補給時に、硫酸銅、硫
酸ニッケル若しくは硫酸コバルト等を使用するとき又は
無電解めっきを一時中断する場合で硫酸を使用するとき
には、特に硫酸根〔ＳＯ4 2- 〕が蓄積する。硫酸根等の
反応生成物が蓄積してくると、均質な被膜を形成し難く
なってしまう。すなわち、常に均質な被膜を形成させて
いくためには、反応生成物の蓄積しためっき液をめっき
廃液として廃却し、常に新鮮な状態のめっき液を使用し
なければならず、めっき廃液の量が多くなってしまうと
いう問題点があった。2. Description of the Related Art Conventional electroless plating methods tend to accumulate reaction products more easily than electroplating methods. That is,
When adjusting the plating solution or replenishing metal ions such as copper ions, nickel ions or cobalt ions, when using copper sulfate, nickel sulfate or cobalt sulfate, or when using sulfuric acid when suspending electroless plating , Especially sulfate radical [SO 4 2− ] accumulates. When reaction products such as sulfate radicals are accumulated, it becomes difficult to form a uniform film. In other words, in order to always form a uniform coating, the plating solution in which the reaction products have accumulated must be discarded as a plating waste solution, and a fresh plating solution must always be used. There was a problem that the number would increase.
【０００３】そこで、電気透析法を用いて、反応生成物
の蓄積しためっき液を処理し、硫酸根等の反応生成物を
除去する試みがなされているが、この場合めっき液が濃
縮されるため、不要な反応生成物のみでなく、めっきに
必要なイオンも無電解めっき装置の配管内やイオン交換
膜に析出してしまうという問題があった。Therefore, an attempt has been made to remove the reaction products such as sulfate radicals by treating the plating solution in which the reaction products have accumulated by using the electrodialysis method, but in this case, the plating solution is concentrated. However, there is a problem that not only unnecessary reaction products but also ions necessary for plating are deposited in the pipe of the electroless plating apparatus or on the ion exchange membrane.
【０００４】[0004]
【発明が解決しようとする課題】本発明は上記の事情に
鑑みてなされたもので、その目的とするところは、めっ
き廃液の発生量が少なく、かつ、長期間に渡り安定した
品質のめっき被膜が得られる無電解めっき方法を提供す
ることにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to generate a plating waste liquid in a small amount and to provide a plating film of stable quality for a long period of time. It is to provide an electroless plating method that can obtain
【０００５】[0005]
【課題を解決するための手段】本発明に係る無電解めっ
き方法は、無電解めっきにより発生するめっき液７中の
過剰な硫酸根を除去する無電解めっき方法であって、無
電解めっき液槽１から移送した過剰な硫酸根を含有した
めっき液７に水酸化バリウムを添加して、過剰な硫酸根
を硫酸バリウムとして沈殿させ、この硫酸バリウムを濾
過してめっき液７と分離し、この分離しためっき液７を
無電解めっき液槽１に戻して無電解めっきをすることを
特徴とする。The electroless plating method according to the present invention is an electroless plating method for removing excessive sulfate radicals in the plating solution 7 generated by electroless plating. Barium hydroxide was added to the plating solution 7 containing excess sulfate radicals transferred from 1 to precipitate the excess sulfate radicals as barium sulfate, and the barium sulfate was filtered to separate it from the plating solution 7, and this separation It is characterized in that the prepared plating solution 7 is returned to the electroless plating solution tank 1 to perform electroless plating.
【０００６】[0006]
【作用】本発明に係る無電解めっき方法では、無電解め
っきにより発生するめっき液７中の過剰な硫酸根〔ＳＯ
4 2- 〕を水酸化バリウム〔Ｂａ（ＯＨ）2 〕と反応さ
せ、硫酸バリウム〔ＢａＳＯ4 〕の沈殿物を生成する。
この硫酸バリウム〔ＢａＳＯ4 〕を濾過して取り除くこ
とにより、硫酸根〔ＳＯ4 2- 〕を除去する。In the electroless plating method according to the present invention, the excess sulfuric acid radical [SO
4 2-] is reacted with barium hydroxide [Ba (OH) 2], to produce a precipitate of barium sulfate [BaSO 4].
By removing the barium sulfate [BaSO 4 ] by filtration, the sulfate radical [SO 4 2− ] is removed.
【０００７】[0007]
【実施例】次に、図面に基づいて本発明の一実施例を示
す。An embodiment of the present invention will be described below with reference to the drawings.
【０００８】図１は、本発明の一実施例の概略図であ
る。図１に示すように、めっきを行う無電解めっき液槽
１の材質として耐熱塩化ビニル又はポリプロピレン等が
用いられ、この無電解めっき液槽１には、被めっき処理
物にめっきを施すためのめっき液７が満たされている。
このめっき液７には、例えば銅イオン等の金属イオンと
して硫酸銅五水和物等、錯化剤として例えばエチレンジ
アミン四酢酸二ナトリウム等、ｐＨ調整剤として例えば
水酸化ナトリウム等、還元剤として例えば３５％ホルマ
リン水溶液等、安定剤として例えばシアン化ナトリウム
等及び界面活性剤として例えばポリエチレングリコール
等が含まれている。このめっき液７の成分の濃度やｐＨ
等をコントロールするのがコントローラ２であり、この
コントローラ２は、銅イオン、ホルマリン及びエチレン
ジアミン四酢酸二ナトリウム等の濃度を測定する吸光光
度計並びにｐＨを測定するｐＨ計を備えている。上記コ
ントローラ２により、銅イオン、ホルマリン及びエチレ
ンジアミン四酢酸二ナトリウム等の不足分が補給され、
めっき液７の中の各成分の濃度が一定に保たれ、またｐ
Ｈを一定に保つため、水酸化ナトリウム等のｐＨ調整剤
が添加される。FIG. 1 is a schematic diagram of an embodiment of the present invention. As shown in FIG. 1, heat-resistant vinyl chloride, polypropylene, or the like is used as a material for the electroless plating solution tank 1 for plating, and the electroless plating solution tank 1 is plated for plating an object to be plated. Liquid 7 is full.
In this plating solution 7, for example, copper sulfate pentahydrate or the like as metal ions such as copper ions, ethylenediaminetetraacetic acid disodium or the like as a complexing agent, sodium hydroxide or the like as a pH adjusting agent, and 35 as a reducing agent are used. % Formalin aqueous solution and the like, and stabilizers such as sodium cyanide and the like and surfactants such as polyethylene glycol and the like are included. Concentration and pH of the components of this plating solution 7
It is the controller 2 that controls the above, and the controller 2 is provided with an absorptiometer for measuring the concentrations of copper ions, formalin, ethylenediaminetetraacetic acid disodium and the like, and a pH meter for measuring the pH. The controller 2 supplies copper ions, formalin, ethylenediaminetetraacetic acid disodium, etc.
The concentration of each component in the plating solution 7 is kept constant, and p
In order to keep H constant, a pH adjusting agent such as sodium hydroxide is added.
【０００９】上記無電解めっき液槽１と撹拌槽４とをつ
なぐ、めっき液移送用の配管８ａとこの配管８ａの中間
に設置された例えば第１のポンプ３等のめっき液移送手
段とを用いることにより、めっき液７を無電解めっき液
槽１から撹拌槽４に移送する。次いでこの撹拌槽４に水
酸化バリウム〔Ｂａ（ＯＨ）2 〕の粉末又は水溶液を添
加して撹拌する。水酸化バリウムの添加は、硫酸根〔Ｓ
Ｏ4 2- 〕の生成速度によって決定されるものでり、めっ
き前後の硫酸根の濃度が変化しないことがめっき成膜の
品質上好ましい。すなわち、無電解めっきにより発生す
るめっき液７中の過剰な硫酸根〔ＳＯ4 2- 〕を水酸化バ
リウム〔Ｂａ（ＯＨ）2 〕と反応させ、硫酸バリウム
〔ＢａＳＯ4 〕の沈殿物を生成する。この硫酸バリウム
〔ＢａＳＯ 4 〕の沈殿物を含有しためっき液７を上記撹
拌槽４と濾過機６とをつなぐ、めっき液移送用の配管８
ｂとこの配管８ｂの中間に設置された例えば第２のポン
プ５等のめっき液移送手段とを用いることにより、めっ
き液７を撹拌槽４から濾過機６に移送して、濾過し、め
っき液７と硫酸バリウム〔ＢａＳＯ4 〕の沈殿物とを分
離する。この濾過機６には、例えば樹脂製等のカートリ
ッジフィルタを備えている。次いで、過剰の硫酸根〔Ｓ
Ｏ4 2- 〕を除去しためっき液７を上記濾過機６と無電解
めっき液槽１とをつなぐ、めっき液移送用の配管８ｃと
この配管８ｃの中間に設置された例えば第３のポンプ９
等のめっき液移送手段とを用いることにより、めっき液
７を濾過機６から無電解めっき液槽１にリサイクルす
る。The electroless plating bath 1 and the stirring bath 4 are connected together.
The middle of the pipe 8a for transferring the plating solution and this pipe 8a
The plating solution transfer hand such as the first pump 3 installed in the
By using the step, the plating solution 7 can be used as an electroless plating solution.
Transfer from the tank 1 to the stirring tank 4. Then water is added to the stirring tank 4.
Barium oxide [Ba (OH)2] Powder or aqueous solution
Add and stir. Addition of barium hydroxide is based on sulfate radical [S
OFour 2-] It is determined by the generation rate of
The fact that the concentration of sulfate groups does not change before and after
Good quality. That is, it is generated by electroless plating
Excess sulfate in the plating solution 7 [SOFour 2-] Hydroxide
Lithium [Ba (OH)2] And reacted with barium sulfate
[BaSOFour] The precipitate is formed. This barium sulfate
[BaSO Four] The plating solution 7 containing the precipitate of
Pipe 8 for connecting the stirring tank 4 and the filter 6 for transferring the plating solution
b and this pipe 8b, for example, a second pump installed between the two
By using a plating solution transfer means such as
The liquid 7 is transferred from the stirring tank 4 to the filter 6 and filtered.
Plating liquid 7 and barium sulfate [BaSOFour] Precipitate and
Let go. The filter 6 includes, for example, a cartridge made of resin or the like.
Equipped with a filter. Then, excess sulfate [S
OFour 2-] The plating solution 7 from which the
A pipe 8c for connecting the plating solution tank 1 and a plating solution transfer line
For example, a third pump 9 installed in the middle of the pipe 8c
Plating liquid transfer means such as
7 is recycled from the filter 6 to the electroless plating bath 1
It
【００１０】すなわち、本発明の無電解めっき方法によ
ると、めっき液７中の老廃物である過剰の硫酸根を連続
的に除去することによって、硫酸根の蓄積が抑えられ、
被めっき処理物に対して長期間に渡り安定した品質のめ
っき皮膜が得られるとともに、めっき廃液の発生量を低
減することができる。 （実施例１）めっき液７として、水１リットルに対して
硫酸銅五水和物を１０ｇ／リットル、エチレンジアミン
四酢酸二ナトリウムを３０ｇ／リットル、水酸化ナトリ
ウムをめっき液７をｐＨ１２とする量、３５％ホルマリ
ン水溶液を５ミリリットル／リットル、シアン化ナトリ
ウムを１０ｍｇ／リットル及びポリエチレングリコール
を１００ｍｇ／リットル含有しているものを使用した。
めっき液７の温度を６０℃にした。そして、無電解めっ
き液槽１には、上記めっき液７が３５０リットル入って
おり、無電解めっき装置を作動することにより、硫酸根
の生成速度が０．０４モル／リットルであった。無電解
めっき液槽１と撹拌槽４とをつなぐ、めっき液移送用の
配管８ａとこの配管８ａの中間に設置された第１のポン
プ３とを用いることにより、めっき液７を無電解めっき
液槽１から撹拌槽４に２０リットル／分の流量で１０リ
ットルを移送した。次いでこの撹拌槽４に水酸化バリウ
ム〔Ｂａ（ＯＨ）2 〕の粉末を０．２５２モル添加して
１０分間撹拌した。すなわち、無電解めっきにより発生
するめっき液７中の過剰な硫酸根〔ＳＯ4 2- 〕を水酸化
バリウム〔Ｂａ（ＯＨ）2 〕と反応させ、硫酸バリウム
〔ＢａＳＯ4 〕の沈殿物を生成した。この硫酸バリウム
〔ＢａＳＯ4 〕の沈殿物を含有しためっき液７を上記撹
拌槽４と濾過機６とをつなぐ、めっき液移送用の配管８
ｂとこの配管８ｂの中間に設置された第２のポンプ５と
を用いることにより、めっき液７を撹拌槽４から濾過機
６に２０リットル／分の流量で移送して、濾過し、めっ
き液７と硫酸バリウム〔ＢａＳＯ4 〕の沈殿物とを分離
した。次いで、過剰の硫酸根〔ＳＯ4 2- 〕を除去しため
っき液７を上記濾過機６と無電解めっき液槽１とをつな
ぐ、めっき液移送用の配管８ｃとこの配管８ｃの中間に
設置された第３のポンプ９とを用いることにより、めっ
き液７を濾過機６から無電解めっき液槽１にリサイクル
した。これら一連の操作を無電解めっき処理中繰り返し
た。 （比較例１）実施例１において、撹拌槽４に水酸化バリ
ウム〔Ｂａ（ＯＨ）2 〕を添加しなかった以外は、実施
例１と同様に無電解めっき処理を行った。That is, according to the electroless plating method of the present invention, the accumulation of sulfate radicals is suppressed by continuously removing excess sulfate radicals, which are waste products in the plating solution 7.
It is possible to obtain a plating film of stable quality over a long period of time with respect to the object to be plated and reduce the amount of plating waste liquid generated. (Example 1) As the plating solution 7, 10 g / liter of copper sulfate pentahydrate, 30 g / liter of disodium ethylenediaminetetraacetate, and sodium hydroxide to pH 1 of the plating solution 7 with respect to 1 liter of water, A 35% formalin aqueous solution containing 5 ml / liter, sodium cyanide 10 mg / liter and polyethylene glycol 100 mg / liter was used.
The temperature of the plating solution 7 was set to 60 ° C. The electroless plating solution tank 1 contained 350 liters of the plating solution 7 described above, and the sulfate generation rate was 0.04 mol / liter by operating the electroless plating apparatus. The plating solution 7 is transferred to the electroless plating solution by using the plating solution transfer pipe 8a for connecting the electroless plating solution tank 1 and the stirring tank 4 and the first pump 3 installed in the middle of the pipe 8a. 10 liters were transferred from the tank 1 to the stirring tank 4 at a flow rate of 20 liters / minute. Next, 0.252 mol of powder of barium hydroxide [Ba (OH) 2 ] was added to the stirring tank 4 and stirred for 10 minutes. That is, excess sulfate radical [SO 4 2− ] in the plating solution 7 generated by electroless plating is reacted with barium hydroxide [Ba (OH) 2 ] to form a barium sulfate [BaSO 4 ] precipitate. . A pipe 8 for transferring the plating solution 7 containing the precipitate of barium sulfate [BaSO 4 ] for connecting the stirring tank 4 and the filter 6 to each other.
b and the second pump 5 installed in the middle of the pipe 8b, the plating solution 7 is transferred from the stirring tank 4 to the filter 6 at a flow rate of 20 liter / min, filtered, and the plating solution 7 and the precipitate of barium sulfate [BaSO 4 ] were separated. Next, a plating solution 7 from which excess sulfate [SO 4 2− ] has been removed is installed between the filter 6 and the electroless plating solution tank 1 and a pipe 8c for transferring the plating solution and an intermediate part of this pipe 8c. The plating solution 7 was recycled from the filter 6 to the electroless plating solution tank 1 by using the third pump 9. These series of operations were repeated during the electroless plating process. (Comparative Example 1) An electroless plating treatment was performed in the same manner as in Example 1 except that barium hydroxide [Ba (OH) 2 ] was not added to the stirring tank 4.
【００１１】以上の結果、実施例１では、無電解めっき
処理を１２０時間実施してもめっき液７は、安定であっ
た。ところが、比較例１では、無電解めっき処理を６０
時間実施した後に、めっき液７は、不安定になった。す
なわち、実施例１では、比較例１に比べて、めっき廃液
の発生量が半分以下に抑えることができた。As a result, in Example 1, the plating solution 7 was stable even after the electroless plating treatment was carried out for 120 hours. However, in Comparative Example 1, the electroless plating treatment was performed at 60
The plating solution 7 became unstable after a long time. That is, in Example 1, as compared with Comparative Example 1, the generation amount of the plating waste liquid could be suppressed to half or less.
【００１２】[0012]
【発明の効果】本発明に係る無電解めっき方法は、上記
のように構成されているので、めっき廃液の発生量が少
なく、かつ、長期間に渡り安定した品質のめっき被膜が
得られる。EFFECTS OF THE INVENTION Since the electroless plating method according to the present invention is constructed as described above, the amount of waste plating solution generated is small and a plating film of stable quality for a long period of time can be obtained.
【図１】本発明の実施例に係る無電解めっき方法の概略
図である。FIG. 1 is a schematic view of an electroless plating method according to an embodiment of the present invention.
１ 無電解めっき液槽 ７ めっき液 1 Electroless plating bath 7 Plating bath
Claims (1)
（７）中の過剰な硫酸根を除去する無電解めっき方法で
あって、無電解めっき液槽（１）から移送した過剰な硫
酸根を含有しためっき液（７）に水酸化バリウムを添加
して、過剰な硫酸根を硫酸バリウムとして沈殿させ、こ
の硫酸バリウムを濾過してめっき液（７）と分離し、こ
の分離しためっき液（７）を無電解めっき液槽（１）に
戻して無電解めっきをすることを特徴とする無電解めっ
き方法。1. An electroless plating method for removing excess sulfate radicals in a plating solution (7) generated by electroless plating, which comprises excess sulfate radicals transferred from the electroless plating bath (1). Barium hydroxide was added to the prepared plating solution (7) to precipitate excess sulfate as barium sulfate, and the barium sulfate was filtered to separate it from the plating solution (7), and the separated plating solution (7) Is returned to the electroless plating bath (1) to perform electroless plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8180894A JPH07286279A (en) | 1994-04-20 | 1994-04-20 | Electroless plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8180894A JPH07286279A (en) | 1994-04-20 | 1994-04-20 | Electroless plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07286279A true JPH07286279A (en) | 1995-10-31 |
Family
ID=13756798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8180894A Withdrawn JPH07286279A (en) | 1994-04-20 | 1994-04-20 | Electroless plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07286279A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8057678B2 (en) | 2004-01-20 | 2011-11-15 | Enthone Inc. | Maintenance of metallization baths |
| US8420215B2 (en) | 2007-07-18 | 2013-04-16 | Sued-Chemie Ip Gmbh & Co. Kg | Cyclic process for the preparation of barium sulphate and lithium metal phosphate compounds |
| CN114031103A (en) * | 2021-11-22 | 2022-02-11 | 湖南工程学院 | A kind of method for preparing spherical barium sulfate from chemical nickel plating waste liquid |
-
1994
- 1994-04-20 JP JP8180894A patent/JPH07286279A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8057678B2 (en) | 2004-01-20 | 2011-11-15 | Enthone Inc. | Maintenance of metallization baths |
| US8420215B2 (en) | 2007-07-18 | 2013-04-16 | Sued-Chemie Ip Gmbh & Co. Kg | Cyclic process for the preparation of barium sulphate and lithium metal phosphate compounds |
| CN114031103A (en) * | 2021-11-22 | 2022-02-11 | 湖南工程学院 | A kind of method for preparing spherical barium sulfate from chemical nickel plating waste liquid |
| CN114031103B (en) * | 2021-11-22 | 2023-12-05 | 湖南工程学院 | Method for preparing spherical barium sulfate from chemical nickel plating waste liquid |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4425205A (en) | Process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath | |
| JPH10317154A (en) | Method for reclaiming solution for tin plating and apparatus therefor | |
| USH36H (en) | Electroplating process with inert anodes | |
| US4549946A (en) | Process and an electrodialytic cell for electrodialytically regenerating a spent electroless copper plating bath | |
| US4076618A (en) | Treatment of liquids containing complexed heavy metals and complexing agents | |
| JPH07286279A (en) | Electroless plating method | |
| CA1093911A (en) | Electroless copper plating | |
| JPS6115979A (en) | Plating method from electroless plating bath | |
| JPH0416549B2 (en) | ||
| US6387243B1 (en) | Separation of metal ions absorbed on a resin and installation for recycling photographic effluents including an exchanger and an electrolytic vessel | |
| JPS62243776A (en) | Method and apparatus for regenerating electroless copper plating bath | |
| JPH06272096A (en) | Refining of cyanide-free copper plating bath | |
| JPS62247884A (en) | Treatment of iron ion-containing liquid | |
| Chang et al. | Alternative waste minimization analyses for the printed circuit board industry: Examples for small and large manufacturers | |
| JPH1112753A (en) | Electroless gold plating method | |
| JP3468650B2 (en) | Electroless nickel plating method | |
| JPS6224257A (en) | Photographic processing machine and silver recovery device | |
| JPS634634B2 (en) | ||
| JP2769774B2 (en) | Method and apparatus for regenerating electroless nickel plating wastewater | |
| KR870001547B1 (en) | Process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath | |
| JPH03506052A (en) | Method for dissolving copper particles formed during electroless copper coating | |
| JPS599159A (en) | Method and apparatus for adjusting concentration of electroless plating bath | |
| JP3111614B2 (en) | Regeneration method of electroless nickel plating bath | |
| JP2001020085A (en) | Treatment of etching waste liquid and device for treatment of etching waste liquid | |
| JPS60138079A (en) | Regenerating method of black chromate bath |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20010703 |