JPH07281163A - Anti-static method of liquid crystal substrate - Google Patents
Anti-static method of liquid crystal substrateInfo
- Publication number
- JPH07281163A JPH07281163A JP6717694A JP6717694A JPH07281163A JP H07281163 A JPH07281163 A JP H07281163A JP 6717694 A JP6717694 A JP 6717694A JP 6717694 A JP6717694 A JP 6717694A JP H07281163 A JPH07281163 A JP H07281163A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal substrate
- parts
- tape
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 230000002378 acidificating effect Effects 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 230000008961 swelling Effects 0.000 claims description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 2
- 230000003068 static effect Effects 0.000 abstract description 22
- 230000005611 electricity Effects 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 8
- 230000015556 catabolic process Effects 0.000 abstract description 3
- 230000002522 swelling effect Effects 0.000 abstract description 2
- 229920000058 polyacrylate Polymers 0.000 description 19
- 239000012986 chain transfer agent Substances 0.000 description 17
- 238000010894 electron beam technology Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 12
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- 239000004372 Polyvinyl alcohol Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229920002451 polyvinyl alcohol Polymers 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 8
- 229920000298 Cellophane Polymers 0.000 description 7
- 239000002202 Polyethylene glycol Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 229920001223 polyethylene glycol Polymers 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- -1 EV A Polymers 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
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- 125000000524 functional group Chemical group 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
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- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 2
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 241000013033 Triso Species 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 2
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 229920001477 hydrophilic polymer Polymers 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
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- 239000004033 plastic Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- YOSXAXYCARLZTR-UHFFFAOYSA-N prop-2-enoyl isocyanate Chemical compound C=CC(=O)N=C=O YOSXAXYCARLZTR-UHFFFAOYSA-N 0.000 description 2
- 238000003847 radiation curing Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229940071127 thioglycolate Drugs 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-M thioglycolate(1-) Chemical compound [O-]C(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-M 0.000 description 2
- NFPLJTNXOKFJRO-UHFFFAOYSA-N 1-ethenylpyridin-2-one Chemical compound C=CN1C=CC=CC1=O NFPLJTNXOKFJRO-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- PLDLPVSQYMQDBL-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethoxy)-2,2-bis(oxiran-2-ylmethoxymethyl)propoxy]methyl]oxirane Chemical compound C1OC1COCC(COCC1OC1)(COCC1OC1)COCC1CO1 PLDLPVSQYMQDBL-UHFFFAOYSA-N 0.000 description 1
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 description 1
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- RUDUCNPHDIMQCY-UHFFFAOYSA-N [3-(2-sulfanylacetyl)oxy-2,2-bis[(2-sulfanylacetyl)oxymethyl]propyl] 2-sulfanylacetate Chemical compound SCC(=O)OCC(COC(=O)CS)(COC(=O)CS)COC(=O)CS RUDUCNPHDIMQCY-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000005250 beta ray Effects 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- KBWLNCUTNDKMPN-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) hexanedioate Chemical compound C1OC1COC(=O)CCCCC(=O)OCC1CO1 KBWLNCUTNDKMPN-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
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- 239000003085 diluting agent Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
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- 239000012153 distilled water Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
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- 230000002265 prevention Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
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- 239000011342 resin composition Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Landscapes
- Liquid Crystal (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は液晶基板、特に内部にア
クティブ素子を有するTFT型液晶基板などの帯電防止
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antistatic method for a liquid crystal substrate, particularly a TFT type liquid crystal substrate having an active element therein.
【0002】[0002]
【従来の技術】液晶基板に搭載されるアクティブ素子
は、しきい値電圧を越える静電圧で論理反転を起こすた
め、静電破壊を起こしやすい。特に搬送時の静電気発生
は、アース回路部の面取り工程(液晶基板の製造時はア
ース回路部とその他の接続端子部とは連結されており、
その連結部を除去する工程)が終了しているためアース
されておらず、アクティブ素子にとっては致命的であ
る。2. Description of the Related Art An active element mounted on a liquid crystal substrate is prone to electrostatic breakdown because it causes logic inversion at a static voltage exceeding a threshold voltage. In particular, the static electricity generated during transportation is the chamfering process of the ground circuit part (when manufacturing the liquid crystal substrate, the ground circuit part and other connection terminals are connected,
Since the process of removing the connecting portion) is completed, it is not grounded, which is fatal to the active element.
【0003】かかる基板の帯電防止方法として一般的に
は、自己放電式または交流電源式による除電器が、また
両面を除電するためには、除電気で生成するイオンを風
で送るブロアー式除電器などを用いるのが有効である。
しかし例えば自己放電式除電器の場合、帯電体が作り出
す電荷によって放電を起こし電荷を中和するため、帯電
体の帯電レベルが低すぎると効果を発揮しない。また交
流式除電器は交流コロナ放電を利用するため、能力は比
較的高く、正負どちらの帯電極性にも対応できるが、放
電特性は、正負で同じではないから、半周期ごとに生成
される正負イオンの数が等しくなく、帯電していないフ
ィルムに作用させると、レベルは低いがどちらかの極性
に帯電してしまう。またブロアー式除電器の場合、送風
途中でイオンが減少するため除電能力に問題がある。し
かもこれらの除電方式は液晶基板の製造工程中や保管時
には有効であっても、移動・搬送時に施すのはコスト、
手間が膨大になってしまうという欠点がある。In general, as a method of preventing the electrification of such a substrate, a self-discharge type or AC power source type static eliminator is used, and in order to eliminate static electricity on both sides, a blower type static eliminator which sends ions generated by static elimination by wind. It is effective to use such as.
However, for example, in the case of a self-discharge type static eliminator, discharge is caused by the charge generated by the charged body to neutralize the charge, so that the effect is not exhibited if the charge level of the charged body is too low. Since the AC type static eliminator uses AC corona discharge, it has a relatively high capacity and can handle both positive and negative charging polarities, but since the discharge characteristics are not the same for positive and negative, the positive and negative generated every half cycle. When applied to an uncharged film with unequal numbers of ions, it will be charged to either polarity at a low level. Further, in the case of the blower type static eliminator, there is a problem in the static erasing ability because the number of ions is reduced during the blowing. Moreover, even though these static elimination methods are effective during the manufacturing process of the liquid crystal substrate and during storage, it is costly to move and transport.
There is a drawback that the effort becomes enormous.
【0004】移動・搬送時にも有効な静電気対策として
は、環境湿度を高めることによって静電気を空気中に放
電する方法、静電気が発生する表面を薬品処理によって
イオン化または酸化する方法、帯電防止剤の添加により
導電化を図る方法などがあるが、コスト面での優位性と
効果の確実性から、帯電防止剤の添加が最も一般的であ
った。このような帯電防止剤を使った導電化の材料とし
て、(i)金属、(ii)金属酸化物、(iii)カーボン、
(iv)界面活性剤などがある。金属やカーボンを使う場
合は、帯電防止よりも電磁波シールドが目的で、その際
通常は多量の導電性粒子が添加されるため、接着性など
のベース樹脂の基本特性が損なわれることが多かった。
一方界面活性剤を添加する方法では、帯電防止剤として
の役割を果たすため、導電性粒子同様多量に添加され、
やはりベース樹脂の基本特性(機械的、透明性)を損な
うことが多かった。いずれの場合においても、仮に基本
特性を損なわないような構成が可能であったとしても、
帯電防止の役割を達成した後に、架橋部分の帯電防止成
分の除去が困難であるなどの欠点があった。Effective measures against static electricity during movement and transportation include a method of discharging static electricity into the air by increasing environmental humidity, a method of ionizing or oxidizing the surface where static electricity is generated by chemical treatment, and addition of an antistatic agent. However, the addition of an antistatic agent is the most common method because of its superiority in terms of cost and certain effect. As materials for making conductive using such an antistatic agent, (i) metal, (ii) metal oxide, (iii) carbon,
(Iv) There are surfactants and the like. When a metal or carbon is used, the purpose is to shield electromagnetic waves rather than to prevent static electricity, and since a large amount of conductive particles are usually added at that time, the basic properties of the base resin, such as adhesiveness, are often impaired.
On the other hand, in the method of adding the surfactant, since it plays a role as an antistatic agent, it is added in a large amount like the conductive particles.
After all, the basic properties (mechanical and transparency) of the base resin were often impaired. In any case, even if a configuration that does not impair the basic characteristics is possible,
After achieving the role of antistatic, it has a drawback that it is difficult to remove the antistatic component in the crosslinked portion.
【0005】一方水で膨潤する剥離性樹脂を使った方法
が特開平5-4442号公報、特開平5-4443号公報に開示され
ているが、この際液晶基板の微小な間隙に入り込んだ樹
脂が水剥離せず残存しやすいため、その残渣が駆動回路
接続時の電気特性に悪影響を及ぼすなどの問題があっ
た。さらに市販の帯電防止テープなどを使って本目的を
達成しようとしても、テープ剥離時に発生する微量の静
電気のために、アクティブ素子が破壊されてしまうとい
う欠点があった。On the other hand, a method using a peelable resin which swells with water is disclosed in JP-A-5-4442 and JP-A-5-4443. At this time, a resin that has entered a minute gap of a liquid crystal substrate. However, there is a problem that the residue is not peeled off with water and is likely to remain, so that the residue adversely affects the electrical characteristics when the drive circuit is connected. Further, even if an attempt is made to achieve this object by using a commercially available antistatic tape or the like, there is a drawback that the active element is destroyed due to a small amount of static electricity generated when the tape is peeled off.
【0006】[0006]
【発明が解決しようとする課題】本発明はかかる点に鑑
み、鋭意検討の結果なされたもので、アース回路部の面
取り工程を終了したアクティブ素子搭載液晶基板の搬送
時に発生する静電気を除去し、アクティブ素子の静電気
による破壊を防止する簡便な方法を提供することを目的
とする。DISCLOSURE OF THE INVENTION The present invention has been made as a result of earnest studies in view of the above problems, and eliminates static electricity generated at the time of transportation of an active element-equipped liquid crystal substrate whose chamfering process of a ground circuit section has been completed, It is an object of the present invention to provide a simple method for preventing breakdown of an active element due to static electricity.
【0007】[0007]
【課題を解決するための手段】すなわち本発明は、導電
性フィルム上に接続端子を形成した有する液晶基板を載
置し、少なくとも前記導電性フィルムおよび前記液晶基
板の接続端子に接触させて、帯電防止性・感圧接着性・
水膨潤性を有するテープを貼り付け、所定の目的を達成
した後は、水、温水、酸性水溶液、アルカリ性水溶液に
より前記テープを剥離することを特徴とする液晶基板の
帯電防止方法に関する。以下本発明を詳細に説明する。That is, according to the present invention, a liquid crystal substrate having a connection terminal formed on a conductive film is placed, and at least the connection terminal of the conductive film and the connection terminal of the liquid crystal substrate is brought into contact with the substrate to charge. Prevention, pressure-sensitive adhesiveness
The present invention relates to a method for preventing electrification of a liquid crystal substrate, which comprises applying a water-swelling tape, and after achieving a predetermined purpose, peeling the tape with water, warm water, an acidic aqueous solution or an alkaline aqueous solution. The present invention will be described in detail below.
【0008】本発明の帯電防止性・感圧接着性・水膨潤
性を有するテープの帯電防止性とは、表面抵抗率が108
Ω・cm以下のものをいう。感圧接着性とは室温で粘着
性を有し、その接着力が10gf/cm(剥離速度 50mm/c
m)以上のものをいう。また水膨潤性とは透湿度が100g/
m2・24h・40℃以上のものを指す。これらを満たす構成材
料としては、次のようなものが例示される。The antistatic property of the tape of the present invention having antistatic property, pressure-sensitive adhesive property and water swelling property means that the surface resistivity is 108.
Ω · cm or less. Pressure-sensitive adhesiveness means that it has tackiness at room temperature and its adhesive force is 10gf / cm (peeling speed 50mm / c
m) The above. Water swellability means that the water vapor permeability is 100 g /
m2 · 24h · 40 ℃ or higher. Examples of the constituent materials that satisfy these requirements are as follows.
【0009】(i)テープ基材 ポリビニルアルコール、セロファン、ナイロン、EV
A、EVOH(エチレンービニルアルコール共重合体、
エチレンー酢酸ビニル共重合体)または紙などの水膨潤
性基材が適しており、10〜200μmのものが使用可能で
あるが、20〜100μm厚のものがさらに適している。(I) Tape base material Polyvinyl alcohol, cellophane, nylon, EV
A, EVOH (ethylene-vinyl alcohol copolymer,
Water-swellable base materials such as ethylene-vinyl acetate copolymer) or paper are suitable, and those having a thickness of 10 to 200 μm can be used, but those having a thickness of 20 to 100 μm are more suitable.
【0010】(ii)接着剤主成分 分子内に不飽和2重結合を有する親水性プレポリマーが
好適で、ポリオキシアルキレン型ポリマーに(メタ)ア
クリル酸とのエステル交換反応や(メタ)アクリルイソ
シアネートとの反応により得られるポリマー、ポリオキ
シアルキレングリコール酸とグリシジル(メタ)アクリ
レートとの反応により得られるポリマー、ポリオキシア
ルキレングリコールとエピクロルヒドリンとの反応によ
り得られるポリマーが使われる。たとえばポリエチレン
グリコールやポリプロピレングリコールの(メタ)アク
リル酸付加物、ポリエチレングリコールやポリプロピレ
ングリコールの(メタ)アクリルイソシアネート付加
物、ポリエチレングリコール酸やポリプロピレングリコ
ール酸のグリシジル(メタ)アクリレート付加物、ポリ
エチレングリコールモノグリシジルエーテル、ポリエチ
レングリコールジグリシジルエーテルの(メタ)アクリ
ル酸付加物が挙げられる。分子内に導入する基としては
アクリロイル基とメタクリロイル基の反応性が良く、良
好な結果が得られる(Ii) Main component of adhesive A hydrophilic prepolymer having an unsaturated double bond in the molecule is preferable, and a polyoxyalkylene type polymer is subjected to a transesterification reaction with (meth) acrylic acid or (meth) acrylic isocyanate. The polymer obtained by the reaction with, the polymer obtained by the reaction between polyoxyalkylene glycol acid and glycidyl (meth) acrylate, and the polymer obtained by the reaction between polyoxyalkylene glycol and epichlorohydrin are used. For example, (meth) acrylic acid adduct of polyethylene glycol or polypropylene glycol, (meth) acrylic isocyanate adduct of polyethylene glycol or polypropylene glycol, glycidyl (meth) acrylate adduct of polyethylene glycol acid or polypropylene glycol acid, polyethylene glycol monoglycidyl ether. , (Meth) acrylic acid adducts of polyethylene glycol diglycidyl ether. Acryloyl group and methacryloyl group have good reactivity as a group to be introduced in the molecule, and good results are obtained.
【0011】(iii)添加剤 本発明においては、上記親水性ポリマーのほかに、官能
基を有する親水性モノマーを配合するとさらに良好な結
果が得られる。かかるモノマーとしてはエポキシアクリ
レート、ウレタンアクリレート、ポリエーテルアクリレ
ート、ポリエステルアクリレートなどが挙げられる。特
にフィルムの接着性と水による剥離の容易さの点から、
エポキシアクリレート、ポリエーテルアクリレートが優
れている。エポキシアクリレートとしては、1、6-ヘキ
サンジオールジグリシジルエーテル、ネオペンチルグリ
コールジグリシジルエーテル、アリルアルコールジグリ
シジルエーテル、レゾルシノールジグリシジルエーテ
ル、アジピン酸ジグリシジルエステル、フタル酸ジグリ
シジルエステル、付加モル数が、5以下のポリエチレン
グリコールジグリシジルエーテル、トリメチロールプロ
パントリグリシジルエーテル、グリセリントリグリシジ
ルエーテル、ペンタエリスリトールテトラグリシジルエ
ーテル、ソルビトールテトラグリシジルエーテル等の
(メタ)アクリル酸付加物が挙げられる。(Iii) Additive In the present invention, better results can be obtained by incorporating a hydrophilic monomer having a functional group in addition to the above hydrophilic polymer. Examples of such a monomer include epoxy acrylate, urethane acrylate, polyether acrylate and polyester acrylate. Especially from the viewpoint of the adhesiveness of the film and the ease of peeling with water,
Epoxy acrylate and polyether acrylate are excellent. As the epoxy acrylate, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, resorcinol diglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, the number of addition moles is (Meth) acrylic acid adducts of polyethylene glycol diglycidyl ether of 5 or less, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether and the like can be mentioned.
【0012】本発明で連鎖移動剤を使用する場合、1分
子中に少なくとも2個以上のメルカプト基を有するチオ
ール化合物が必要であり、たとえばトリメチロールプロ
パントリスー(βーチオプロピオネート)、トリメチロ
ールプロパントリスー(チオグリコレート)、ペンタエ
リスリトールテトラキスー(チオグリコレート)などが
有効である。これらの連鎖移動剤は、放射線硬化時に架
橋を分散させるために添加されるが、その添加量は上記
親水性プレポリマー100重量部に対して0.5〜50重量部、
好ましくは1〜30部の範囲で選択するのがよい。When the chain transfer agent is used in the present invention, a thiol compound having at least two or more mercapto groups in one molecule is necessary. For example, trimethylolpropane tris (β-thiopropionate), trialkyl Methylolpropane triso (thioglycolate), pentaerythritol tetrakisoo (thioglycolate) and the like are effective. These chain transfer agents are added to disperse the crosslinks during radiation curing, but the addition amount is 0.5 to 50 parts by weight with respect to 100 parts by weight of the hydrophilic prepolymer,
It is preferable to select in the range of 1 to 30 parts.
【0013】次に官能基を有するアクリルポリマーにつ
いて述べる。ポリマーを構成するモノマーとしては、メ
チル(メタ)アクリレート、エチル(メタ)アクリレー
ト、ブチル(メタ)アクリレートなどの(メタ)アクリ
ル酸エステルの他に、アクリル酸、イタコン酸、ヒドロ
キシエチル(メタ)アクリレート、エトキシエチルアク
リレート、(メタ)アクリルアミド、ジアセトノアクリ
ルアミド、N-メチロール(メタ)アクリルアミド、ジ
メチルアミノエチル(メタ)アクリレート、N-ビニル
ピドリドンなどの親水性官能基含有モノマーが挙げられ
る。ポリマーの重量平均分子量は、開始剤の濃度やメル
カプト化合物などの連鎖移動剤の濃度の調整により可能
で、500〜50,000の範囲にあるものが選択される。本発
明で使用する樹脂には必要に応じて、光開始剤、増感
剤、希釈剤、可塑剤、酸化防止剤、充填剤や膨潤剤など
の添加剤を配合してもよい。Next, the acrylic polymer having a functional group will be described. As the monomer constituting the polymer, in addition to (meth) acrylic acid esters such as methyl (meth) acrylate, ethyl (meth) acrylate and butyl (meth) acrylate, acrylic acid, itaconic acid, hydroxyethyl (meth) acrylate, Examples include hydrophilic functional group-containing monomers such as ethoxyethyl acrylate, (meth) acrylamide, diacetonoacrylamide, N-methylol (meth) acrylamide, dimethylaminoethyl (meth) acrylate, and N-vinylpyridone. The weight average molecular weight of the polymer can be adjusted by adjusting the concentration of the initiator and the concentration of the chain transfer agent such as a mercapto compound, and a polymer having a weight average molecular weight of 500 to 50,000 is selected. If necessary, the resin used in the present invention may contain additives such as a photoinitiator, a sensitizer, a diluent, a plasticizer, an antioxidant, a filler and a swelling agent.
【0014】(iv)接着剤の配合・テープ基材への塗工 親水性ポリマーであるポリオキシアルキレン型ポリマー
100重量部に対し、アクリルモノマーが1〜300重量部、
アクリル系ポリマーを5〜50重量部を併用して配合した
場合がもっとも良好なテープ特性が得られる。接着剤層
の厚さは、0.1〜100μmの範囲であるが、耐熱性、取り
扱いやすさ、コストなどの点から1〜30μmが好まし
く、上述したテープ基材に塗工され、必要に応じて乾燥
工程に供される。(Iv) Blending of Adhesive / Coating on Tape Base Material Polyoxyalkylene type polymer which is a hydrophilic polymer
1 to 300 parts by weight of acrylic monomer for 100 parts by weight,
The best tape characteristics can be obtained when 5 to 50 parts by weight of an acrylic polymer is used in combination. The thickness of the adhesive layer is in the range of 0.1 to 100 μm, but 1 to 30 μm is preferable from the viewpoints of heat resistance, handleability, cost, etc., and it is applied to the above-mentioned tape base material and dried if necessary. Be used for the process.
【0015】(v)接着剤の硬化方法 本発明で放射線硬化方式を使う場合、α線、β線、γ
線、中性子線、X線や加速電子線、紫外線などの活性エ
ネルギー線を使うことができる。その被照射線量は電子
線の場合通常0.1〜100Mradの範囲で使用されるが、1〜2
0Mradが望ましい。紫外線の場合は0.01〜10J/cm2で
0.1〜3J/cm2が特に好適である。照射の際注意を要
するのは活性ラジカルの酸素による失活である。これを
防ぐためには、窒素などの不活性ガスを用いて適当な酸
素濃度にする必要がある。(V) Curing method of adhesive When the radiation curing method is used in the present invention, α ray, β ray, γ ray
Active energy rays such as X-rays, neutron rays, X-rays, accelerated electron rays, and ultraviolet rays can be used. The irradiation dose is usually 0.1 to 100 Mrad for electron beams, but 1 to 2
0Mrad is desirable. 0.01 to 10 J / cm2 for ultraviolet rays
0.1 to 3 J / cm @ 2 is particularly suitable. What needs attention during irradiation is the deactivation of active radicals by oxygen. In order to prevent this, it is necessary to use an inert gas such as nitrogen to obtain an appropriate oxygen concentration.
【0016】(vi)導電性フィルム 本発明で用いる導電性フィルムとしては、金属蒸着フィ
ルム、金属箔−プラスチックの2(多)層フィルムが挙
げられる。蒸着フィルムのプラスチック基材としてはP
VA(ポリビニルアルコール)、ナイロン、セロファ
ン、EVA、EVOH(エチレン−ビニルアルコール共
重合体、エチレン−酢酸ビニル共重合体)などを使うこ
とができる。蒸着金属フィルムの場合、これらのプラス
チックフィルム上に、アルミニウム、銅などを必要に応
じて10〜10、000オングストローム真空蒸着することに
よって導電性にすることができる。また2(多)層フィ
ルム用の金属箔としては、アルミ、銅、金、銀等0.1μ
m以上100μm以下のものを使うことができ、これらを
適当な接着剤等で貼り合わせることによって導電性の2
(多)層フィルムを得ることができる。(Vi) Conductive Film Examples of the conductive film used in the present invention include a metal vapor deposition film and a metal foil-plastic two-layer film. P as a plastic substrate for vapor-deposited films
VA (polyvinyl alcohol), nylon, cellophane, EVA, EVOH (ethylene-vinyl alcohol copolymer, ethylene-vinyl acetate copolymer) and the like can be used. In the case of vapor-deposited metal films, aluminum, copper or the like can be made electrically conductive by vacuum-depositing aluminum, copper or the like on these plastic films, if necessary, in the range of 10 to 10,000 angstroms. Also, as the metal foil for the 2 (multi-layer) film, aluminum, copper, gold, silver, etc. 0.1 μm
It is possible to use a material having a size of at least m and less than 100 μm, and to make it conductive by attaching them with an appropriate adhesive.
A (multi) layer film can be obtained.
【0017】(vii)本発明による液晶基板の保護方法
は次のいずれかによる。 (a)液晶基板の表面積よりも大きく切り取った導電性
フィルムの金属蒸着(または金属箔)面に、液晶基板の
底面を重ね、本発明で作製したテープを液晶基板の表面
積よりも大きく切り取って、その接着剤面を液晶基板の
接続端子を含む表面に貼付ける。液晶基板からはみ出し
た該テープは、やはり液晶基板からはみ出した反対面の
導電性フィルムと貼り合わされる(図1)。 (b)本発明で作製したテープを液晶基板の表面積より
も大きく切り取って、その接着剤面を液晶基板の表面に
貼り合わせ、液晶基板の表面積よりも大きく切り取った
導電性フィルムの金属蒸着(または金属箔)面を、液晶
基板の接続端子を含む底面に貼付ける。液晶基板からは
み出した導電性フィルムは、やはり液晶基板からはみ出
した反対面の該テープと貼り合わされる(図2)。 また(a)方法で、該テープを適当な大きさに細断し、
液晶基板の端子部等の一部だけに貼り付けても構わな
い。(Vii) The method of protecting the liquid crystal substrate according to the present invention is as follows. (A) The bottom surface of the liquid crystal substrate is overlaid on the metal vapor deposition (or metal foil) surface of the conductive film that is cut out larger than the surface area of the liquid crystal substrate, and the tape produced by the present invention is cut off larger than the surface area of the liquid crystal substrate, The adhesive surface is attached to the surface of the liquid crystal substrate including the connection terminals. The tape protruding from the liquid crystal substrate is bonded to the conductive film on the opposite surface, which also protrudes from the liquid crystal substrate (FIG. 1). (B) The tape produced by the present invention is cut into a larger amount than the surface area of the liquid crystal substrate, the adhesive surface is attached to the surface of the liquid crystal substrate, and the metal vapor deposition of the conductive film (or the larger amount than the surface area of the liquid crystal substrate) (or Attach the (metal foil) surface to the bottom surface including the connection terminals of the liquid crystal substrate. The conductive film protruding from the liquid crystal substrate is bonded to the tape on the opposite surface, which also protrudes from the liquid crystal substrate (FIG. 2). Also, by the method (a), the tape is cut into a suitable size,
It may be attached only to a part such as a terminal portion of the liquid crystal substrate.
【0018】(viii)テープの剥離方法 かかる工程を経て作製された帯電防止テープは、液晶基
板の帯電防止用途に供され、使用後は水、温水、酸性水
溶液、アルカリ性水溶液を噴霧または全面浸漬すること
によって速やかに液晶基板から剥離除去される。(Viii) Peeling method of tape The antistatic tape produced through these steps is used for antistatic purposes for liquid crystal substrates, and after use, sprayed or soaked with water, warm water, acidic aqueous solution, alkaline aqueous solution. As a result, the liquid crystal substrate is quickly separated and removed.
【0019】[作用]本発明の効果が発現する理由は必
ずしも明確ではないが、以下のように推察される。 (i)本構成物が液晶基板の帯電防止を発現する理由 液晶基板の帯電防止方法として最も効果があるのは、面
取り工程部をアースすることである。本構成の液晶基板
保護方法では面取り工程を終了した端子部が帯電防止能
を備えたテープによって保護されている上、仮にテープ
上に微小電荷が発生しても反対面の導電性フィルム上に
流れるため、その効果が大きいものと考えられる。 (ii)本構成物を水、酸性水溶液、アルカリ性水溶液、
または有機溶媒二進せきしたときテープが液晶基板から
良好に剥離する理由 親水性プレポリマーおよび多官能モノマー中の不飽和2
重結合がラジカル連鎖反応し、高度に架橋された網目構
造体を形成する。多官能モノマーの反応点は非常に多い
ため重合収縮が生じるが、基材上に樹脂が拘束されてい
る間は見かけ上の収縮は起こらず、残留応力を持つこと
になる。この親水性基材フィルム上から水等が浸水し、
フィルムおよび樹脂が膨潤するため残留応力が開放さ
れ、テープは容易に液晶基板のガラス面から剥離を起こ
すものと考えられる。次に実施例に於いて本発明を詳述
するが、本発明はこれに限定されるものではない。[Action] The reason why the effect of the present invention is exhibited is not always clear, but it is presumed as follows. (I) Reason why this composition develops antistatic properties for the liquid crystal substrate The most effective antistatic method for the liquid crystal substrate is to ground the chamfering process section. In the liquid crystal substrate protection method of this configuration, the terminal portion after the chamfering process is protected by the tape having the antistatic function, and even if a minute charge is generated on the tape, it flows on the conductive film on the opposite surface. Therefore, it is considered that the effect is great. (Ii) The composition is treated with water, an acidic aqueous solution, an alkaline aqueous solution,
Or the reason why the tape peels well from the liquid crystal substrate when the organic solvent is binary. Unsaturation in hydrophilic prepolymer and polyfunctional monomer 2
The heavy bonds undergo a radical chain reaction to form a highly crosslinked network structure. Polymerization shrinkage occurs because there are so many reaction points of the polyfunctional monomer, but apparent shrinkage does not occur while the resin is constrained on the base material, resulting in residual stress. Water and the like will infiltrate from above this hydrophilic substrate film,
It is considered that the residual stress is released due to the swelling of the film and the resin, and the tape easily peels off from the glass surface of the liquid crystal substrate. Next, the present invention will be described in detail with reference to Examples, but the present invention is not limited thereto.
【0020】[0020]
<親水性プレポリマー1>ポリプロピレングリコールジ
メタクリレート(Mw=13、000) <親水性プレポリマー2>ポリエチレングリコールジア
クリレート(Mw=800) <アクリルポリマー1>ブチルメタクリレート40部、エ
チルアクリレート50部、アクリル酸10部、β-メルカプ
トプロピオン酸2.5部、4,4′-アゾビス-4-シアノバレリ
ン酸3部をN2下70℃で5時間反応させた後、ハイドロキノ
ン0.01部を加えてアクリルポリマーを得た。Mw約50
万、NV=10% <アクリルポリマー2>ブチルメタクリレート80部、ア
クリロニトリル12.5部、アクリル酸7.5部、β-メルカプ
トプロピオン酸2.5部、4,4′-アゾビス-4-シアノバレリ
ン酸3部をN2下70℃で5時間反応させた後、ハイドロキノ
ン0.01部を加えてアクリルポリマーを得た。Mw約15
万、NV=20% <連鎖移動剤1>トリメチロールプロパントリスー(β
ーチオプロピオネート) <連鎖移動剤2>ペンタエリスリトールテトラキスー
(チオグリコレート)<Hydrophilic prepolymer 1> Polypropylene glycol dimethacrylate (Mw = 13,000) <Hydrophilic prepolymer 2> Polyethylene glycol diacrylate (Mw = 800) <Acrylic polymer 1> 40 parts butyl methacrylate, 50 parts ethyl acrylate, acrylic After reacting 10 parts of acid, 2.5 parts of β-mercaptopropionic acid, and 3 parts of 4,4′-azobis-4-cyanovaleric acid under N 2 at 70 ° C. for 5 hours, 0.01 part of hydroquinone was added to obtain an acrylic polymer. Mw about 50
10,000%, NV = 10% <Acrylic polymer 2> 80 parts of butyl methacrylate, 12.5 parts of acrylonitrile, 7.5 parts of acrylic acid, 2.5 parts of β-mercaptopropionic acid, 3 parts of 4,4′-azobis-4-cyanovaleric acid and 70 parts of N2 under 70%. After reacting at 5 ° C for 5 hours, 0.01 part of hydroquinone was added to obtain an acrylic polymer. Mw about 15
10,000, NV = 20% <Chain transfer agent 1> Trimethylolpropane triso (β
-Thiopropionate) <Chain transfer agent 2> Pentaerythritol tetrakis (thioglycolate)
【0021】以上のようにして得られた親水性プレポリ
マー、アクリルポリマーに多官能連鎖移動剤、熱架橋剤
(ポリイソシアネート)を所定量混合し攪拌した。この
樹脂組成物を30〜40μmのPVAまたはセロファンフィ
ルム上に、乾燥後の塗布厚が25μmになるように塗布
し、90℃で20分間加熱した。得られた構成物に(a)空
気中で一定線量の紫外線を照射(b)窒素ガスをパージ
しながら酸素濃度が500ppm以下になるようにして、加速
電圧が175KVの電子線照射装置で所定量電子線を照射し
た。面取り工程が終了した液晶基板に上述した方法で、
このテープと500オングストロームのアルミを蒸着した
フィルムで挟み込み、所定量の静電気を静電気発生装置
で強制的に印加し、帯電防止テープの耐静電圧を測定し
た。測定後テープを蒸留水に浸漬して基材から剥離し、
液晶基板の表面状態を観察した。The hydrophilic prepolymer and acrylic polymer obtained as described above were mixed with a polyfunctional chain transfer agent and a thermal crosslinking agent (polyisocyanate) in predetermined amounts and stirred. This resin composition was applied onto a PVA or cellophane film having a thickness of 30 to 40 μm so that the coating thickness after drying would be 25 μm, and heated at 90 ° C. for 20 minutes. The resulting composition is (a) irradiated with a certain dose of ultraviolet rays in the air (b) while purging with nitrogen gas so that the oxygen concentration is 500 ppm or less, and an accelerating voltage of 175 KV is applied to a predetermined amount with an electron beam irradiation device. It was irradiated with an electron beam. By the method described above on the liquid crystal substrate after the chamfering process,
This tape was sandwiched between 500 angstrom aluminum vapor-deposited films, and a predetermined amount of static electricity was forcibly applied by a static electricity generator to measure the electrostatic withstand voltage of the antistatic tape. After measurement, dip the tape in distilled water and peel it from the substrate,
The surface condition of the liquid crystal substrate was observed.
【0022】実施例1 親水性プレポリマー1 100部 アクリルポリマー1 20部 連鎖移動剤1 5部 基材 PVA30μm 電子線照射線量 5MradExample 1 Hydrophilic prepolymer 1 100 parts Acrylic polymer 1 20 parts Chain transfer agent 1 5 parts Substrate PVA 30 μm Electron beam irradiation dose 5 Mrad
【0023】実施例2 親水性プレポリマー1 100部 アクリルポリマー1 20部 連鎖移動剤1 5部 コロネートL(3官能イソシアネート)2.5部 基材 PVA30μm 電子線照射線量 5MradExample 2 Hydrophilic prepolymer 1 100 parts Acrylic polymer 1 20 parts Chain transfer agent 1 5 parts Coronate L (trifunctional isocyanate) 2.5 parts Substrate PVA 30 μm Electron beam irradiation dose 5 Mrad
【0024】実施例3 親水性プレポリマー1 100部 アクリルポリマー1 10部 連鎖移動剤1 2.5部 基材 PVA40μm 電子線照射線量 10MradExample 3 Hydrophilic Prepolymer 1 100 parts Acrylic Polymer 1 10 parts Chain Transfer Agent 1 2.5 parts Substrate PVA 40 μm Electron Beam Irradiation Dose 10 Mrad
【0025】実施例4 親水性プレポリマー2 100部 アクリルポリマー1 40部 連鎖移動剤1 10部 コロネートL(3官能イソシアネート)2部 基材 PVA30μm 電子線照射線量 5MradExample 4 Hydrophilic prepolymer 2 100 parts Acrylic polymer 1 40 parts Chain transfer agent 1 10 parts Coronate L (trifunctional isocyanate) 2 parts Substrate PVA 30 μm Electron beam irradiation dose 5 Mrad
【0026】実施例5 親水性プレポリマー2 100部 アクリルポリマー2 15部 連鎖移動剤2 15部 基材 PVA30μm 電子線照射線量 5MradExample 5 Hydrophilic Prepolymer 2 100 parts Acrylic polymer 2 15 parts Chain transfer agent 2 15 parts Substrate PVA 30 μm Electron beam irradiation dose 5 Mrad
【0027】実施例6 親水性プレポリマー1 100部 アクリルポリマー1 20部 連鎖移動剤1 5部 基材 PVA30μm 電子線照射線量 20MradExample 6 Hydrophilic Prepolymer 1 100 parts Acrylic Polymer 1 20 parts Chain Transfer Agent 1 5 parts Substrate PVA 30 μm Electron beam irradiation dose 20 Mrad
【0028】実施例7 親水性プレポリマー1 100部 アクリルポリマー1 20部 連鎖移動剤1 5部 基材 セロファン30μm 電子線照射線量 5MradExample 7 Hydrophilic Prepolymer 1 100 parts Acrylic Polymer 1 20 parts Chain Transfer Agent 1 5 parts Substrate Cellophane 30 μm Electron beam irradiation dose 5 Mrad
【0029】実施例8 親水性プレポリマー1 100部 アクリルポリマー1 20部 連鎖移動剤1 5部 基材 セロファン30μm 紫外線照射線量 1.0J/cm2Example 8 Hydrophilic Prepolymer 1 100 parts Acrylic Polymer 1 20 parts Chain Transfer Agent 1 5 parts Base material Cellophane 30 μm Ultraviolet irradiation dose 1.0 J / cm 2
【0030】比較例1 親水性プレポリマー1 100部 アクリルポリマー なし 連鎖移動剤1 5部 基材 PVA30μm 電子線照射線量 5Mrad 比較例2 親水性プレポリマー1 100部 アクリルポリマー1 20部 連鎖移動剤 なし 基材 セロファン30μm 電子線照射線量 5MradComparative Example 1 Hydrophilic Prepolymer 1 100 parts Acrylic Polymer None Chain Transfer Agent 1 5 parts Substrate PVA 30 μm electron beam irradiation dose 5 Mrad Comparative Example 2 Hydrophilic Prepolymer 1 100 parts Acrylic Polymer 1 20 parts Chain Transfer Agent None Group Material Cellophane 30 μm Electron beam irradiation dose 5 Mrad
【0031】比較例3 親水性プレポリマー2 100部 アクリルポリマー1 20部 連鎖移動剤1 5部 基材 ポリエチレンフィルム40μm 電子線照射線量 5Mrad 比較例4 親水性プレポリマー2 100部 アクリルポリマー2 20部 連鎖移動剤2 5部 基材 セロファン30μm 電子線照射線量 50MradComparative Example 3 Hydrophilic Prepolymer 2 100 parts Acrylic Polymer 1 20 parts Chain Transfer Agent 1 5 parts Base Material Polyethylene Film 40 μm Electron Beam Dose 5 Mrad Comparative Example 4 Hydrophilic Prepolymer 2 100 parts Acrylic Polymer 2 20 parts Chain Transfer agent 2 5 parts Base material Cellophane 30 μm Electron beam irradiation dose 50 Mrad
【0032】[0032]
【表1】 ───────────────────────────────── 耐静電圧(V) 剥離時間(分) 剥離後の液晶基板の 表面状態 ───────────────────────────────── 実施例1 >3000 1 異常なし 2 〃 3 〃 3 〃 2 〃 4 〃 3 〃 5 〃 0.5 〃 6 〃 2 〃 7 〃 1 〃 8 〃 1 〃 ───────────────────────────────── 比較例1 接着せず − − 2 未硬化 − − 3 800 剥離不能 − 4 2000 〃 − ─────────────────────────────────[Table 1] ───────────────────────────────── Withstand voltage (V) Peeling time (min) After peeling Surface state of the liquid crystal substrate of ───────────────────────────────── Example 1 > 3000 1 No abnormality 2 〃 3 〃 3 〃 2 〃 4 〃 3 〃 5 〃 0.5 〃 6 〃 2 〃 7 〃 1 〃 8 〃 1 〃 ──────────────────────── ──────── Comparative Example 1 No adhesion −−2 Unhardened −− 3 800 Not peelable − 4 2000 〃 − ──────────────────── ─────────────
【0033】[0033]
【発明の効果】本発明の接着テープによる液晶基板の帯
電防止方法は、実施例からも明らかなように、帯電防止
性、接着性が良好で使用後は水で容易に剥離することが
できるので、液晶基板、特に内部にアクティブ素子を有
するTFT型液晶基板などの帯電防止方法として有益で
ある。As is apparent from the examples, the antistatic method for liquid crystal substrates using the adhesive tape of the present invention has good antistatic properties and adhesive properties, and can be easily peeled off with water after use. It is useful as an antistatic method for a liquid crystal substrate, particularly a TFT type liquid crystal substrate having an active element inside.
【図1】 本発明方法の実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the method of the present invention.
【図2】 本発明方法の別の実施例を示す断面図。FIG. 2 is a sectional view showing another embodiment of the method of the present invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 三上 善勝 東京都新宿区西新宿二丁目1番1号 日立 化成工業株式会社内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Yoshikatsu Mikami 2-1-1, Nishishinjuku, Shinjuku-ku, Tokyo Inside Hitachi Chemical Co., Ltd.
Claims (1)
有する液晶基板を載置し、少なくとも前記導電性フィル
ムおよび前記液晶基板の接続端子に接触させて、帯電防
止性・感圧接着性・水膨潤性を有するテープを貼り付
け、用済後、水、温水、酸性水溶液、アルカリ性水溶液
により前記テープを剥離することを特徴とする液晶基板
の帯電防止方法。1. A liquid crystal substrate having a connection terminal formed on a conductive film is placed and brought into contact with at least the connection terminals of the conductive film and the liquid crystal substrate to provide antistatic property, pressure-sensitive adhesive property, and water. A method for preventing electrification of a liquid crystal substrate, which comprises applying a swelling tape, peeling the tape with water, warm water, an acidic aqueous solution or an alkaline aqueous solution after use.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6717694A JPH07281163A (en) | 1994-04-05 | 1994-04-05 | Anti-static method of liquid crystal substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6717694A JPH07281163A (en) | 1994-04-05 | 1994-04-05 | Anti-static method of liquid crystal substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07281163A true JPH07281163A (en) | 1995-10-27 |
Family
ID=13337326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6717694A Pending JPH07281163A (en) | 1994-04-05 | 1994-04-05 | Anti-static method of liquid crystal substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07281163A (en) |
-
1994
- 1994-04-05 JP JP6717694A patent/JPH07281163A/en active Pending
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