JPH0728083B2 - Semiconductor laser device - Google Patents
Semiconductor laser deviceInfo
- Publication number
- JPH0728083B2 JPH0728083B2 JP60146054A JP14605485A JPH0728083B2 JP H0728083 B2 JPH0728083 B2 JP H0728083B2 JP 60146054 A JP60146054 A JP 60146054A JP 14605485 A JP14605485 A JP 14605485A JP H0728083 B2 JPH0728083 B2 JP H0728083B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- active layer
- groove
- semiconductor laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Semiconductor Lasers (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は高出力化を図った半導体レーザ装置に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to a semiconductor laser device having a high output.
一般に半導体レーザの高出力化の方法としてキャビティ
の大型化、出射端面の保護膜の劣化防止等が図られてい
る。このような方法は夫々若干の効果は認められるもの
のこれによって実用レベルで10mW以上の高出力を得るこ
とは難しい。Generally, as a method of increasing the output of a semiconductor laser, the cavity is enlarged and the protective film on the emitting end face is prevented from being deteriorated. Although each of these methods has some effects, it is difficult to obtain a high output of 10 mW or more at a practical level.
このため従来より出射端面の構造の工夫により端面での
発光,光吸収等による損失を抑制し、また窓構造を形成
するなどの方法による高出力化が試みられている。Therefore, it has been attempted to suppress loss due to light emission and light absorption on the end face by devising the structure of the emission end face, and to increase the output by forming a window structure.
第5図は窓構造を備えた従来品の模式図であり、GaAs等
の基板11表面にその一端面側から他端面側に溝、例えば
断面逆台形状の溝11aを形成し、この溝11a上にn型クラ
ッド層12、活性層13、P型クラッド層14、キャップ層15
をこの順序に積層形成して構成してあり、活性層13への
通電により溝11aを含む窓構造のその端面から出光せし
めるようになっている。FIG. 5 is a schematic diagram of a conventional product having a window structure. A groove 11a having an inverted trapezoidal cross section is formed on the surface of a substrate 11 such as GaAs from one end surface side to the other end surface side. N-type clad layer 12, active layer 13, P-type clad layer 14, cap layer 15
Are laminated in this order, and when the active layer 13 is energized, light is emitted from the end face of the window structure including the groove 11a.
ところで上述した如き従来品にあっては窓領域がない従
来品と比較してみると端面での光吸収劣化が少なくなっ
ているものの十分なものではない。By the way, in the conventional product as described above, when compared with the conventional product having no window region, the light absorption deterioration at the end face is small, but it is not sufficient.
本発明はかかる事情に鑑みてなされたものであって、そ
の目的とするところは、端面の劣化並びに吸収損失を低
減し、出力の大幅な向上を図れるようにした半導体レー
ザ装置を提供することにある。The present invention has been made in view of the above circumstances, and an object thereof is to provide a semiconductor laser device capable of reducing deterioration of an end face and absorption loss and achieving a significant improvement in output. is there.
本発明の半導体レーザ装置は、周縁部を除く中央部に溝
を備えた基板と、該基板上に形成された活性層及び該活
性層に隣接した光ガイド層を含む複数の層と、を備え、
上記活性層及び上記光ガイド層を含む上記複数の層が、
上記周縁部上において夫々平坦且つ一様な厚さであるこ
とを特徴とする。A semiconductor laser device of the present invention includes a substrate having a groove in a central portion except a peripheral portion, and a plurality of layers including an active layer formed on the substrate and an optical guide layer adjacent to the active layer. ,
The plurality of layers including the active layer and the light guide layer,
It is characterized in that each of the peripheral portions has a flat and uniform thickness.
以下本発明をその実施例を示す図面に基づき具体的に説
明する。第1図は本発明に係る半導体レーザ装置(以下
本発明装置という)の斜視図、第2図は第1図のII−II
線による断面構造図、第3図は基板の斜視図であり、図
中1は基板、2はn型クラッド層、3は活性層、4は光
ガイド層、5はP型クラッド層、6はキャップ層を示し
ている。Hereinafter, the present invention will be specifically described with reference to the drawings illustrating the embodiments. FIG. 1 is a perspective view of a semiconductor laser device according to the present invention (hereinafter referred to as the device of the present invention), and FIG. 2 is II-II of FIG.
FIG. 3 is a perspective view of the substrate, in which 1 is a substrate, 2 is an n-type cladding layer, 3 is an active layer, 4 is an optical guide layer, 5 is a P-type cladding layer, and 6 is The cap layer is shown.
基板1は第3図に示す如くその表面の周縁部を除く中央
部に長手方向に沿って平面視長方形状で、且つ断面が逆
台形状をなす溝1aが形成され、この溝1aを含む基板1の
表面に前記したn型クラッド層2、活性層3、光ガイド
層4、P型クラッド層5及びキャップ層6がこの順序で
エピタキシー法等にて結晶成長せしめられている。n型
クラッド層2は溝1a内を略充足するよう形成され、また
溝1a以外の部分では略一様な厚さに形成されているが、
その表面の高さは溝1aの裏面では他の部分よりも僅かに
低く溝1a側に湾曲しており、従ってこのn型クラッド層
2上に積層形成された活性層3は溝1a上を除く基板1上
では、略一様の厚さに形成されているものの溝1aに対応
する部分ではその表面が若干溝1a側に湾曲している。こ
の活性層3上に形成された光ガイド層4は下面は湾曲し
ているが表面は平坦面となるように形成されている。As shown in FIG. 3, the substrate 1 is provided with a groove 1a having a rectangular shape in plan view and an inverted trapezoidal cross section along the longitudinal direction at the central portion of the surface except the peripheral portion, and the substrate including this groove 1a. The n-type cladding layer 2, the active layer 3, the optical guide layer 4, the P-type cladding layer 5 and the cap layer 6 described above are crystal-grown in this order on the surface of 1 by an epitaxy method or the like. The n-type clad layer 2 is formed so as to substantially fill the inside of the groove 1a, and is formed to have a substantially uniform thickness in the portion other than the groove 1a.
The height of the surface is slightly lower on the back surface of the groove 1a than on other portions and curved toward the groove 1a side. Therefore, the active layer 3 laminated on the n-type clad layer 2 except the groove 1a. Although the substrate 1 is formed to have a substantially uniform thickness, the surface of the portion corresponding to the groove 1a is slightly curved toward the groove 1a. The light guide layer 4 formed on the active layer 3 has a curved lower surface but a flat surface.
而して上述した如き、本発明装置にあっては、活性層3
の湾曲部で発せられた光は、活性層3から光ガイド層4
内に移ってこれに案内されつつ断面積の大きい光ガイド
層4の端面から出射せしめられ、端面での劣化が減少す
る。なお仮令光ガイド層4が存在しない場合には活性層
3の端部近傍で光が基板1に吸収されてしまうこととな
る。また、これを避けるために活性層3を湾曲させるこ
となく平坦にすることも考えられるが、平坦にすると利
得導波が強くなり、電流注入領域が広くなって閾値の上
昇が生じ、結局高出力用として不利な結果を招く。As described above, in the device of the present invention, the active layer 3
The light emitted from the curved portion of the
While being guided to the inside, the light is emitted from the end face of the light guide layer 4 having a large cross-sectional area, and deterioration at the end face is reduced. If the provisional light guide layer 4 does not exist, light will be absorbed by the substrate 1 near the end of the active layer 3. In order to avoid this, the active layer 3 may be flattened without being curved, but if it is flattened, the gain waveguide becomes stronger, the current injection region becomes wider, and the threshold rises, and eventually the high output power is obtained. Result in unfavorable results.
更に光ガイド層4の存在によって、従来の窓構造レーザ
装置において問題とされている非点収差をも解消し得る
効果が得られる。そのうえn型クラッド層2、活性層
3、光ガイド層4の各組成を示すGaxAl1-xAsにおける比
率xが夫々基板1における中央部、即ち溝1a上における
部分と周縁部とでは異なることとなり、光は端面部での
吸収が低減され端面の劣化も抑制される。Further, the presence of the light guide layer 4 has an effect of eliminating astigmatism, which is a problem in the conventional window structure laser device. In addition, the ratio x in GaxAl 1-x As showing the composition of each of the n-type cladding layer 2, the active layer 3 and the optical guide layer 4 is different in the central portion of the substrate 1, that is, the portion on the groove 1a and the peripheral portion. The absorption of light at the end face is reduced, and deterioration of the end face is also suppressed.
次に本発明についての数値例を示す。Next, numerical examples of the present invention will be shown.
基板1としてn型GaAs基板の表面にその長手方向の両端
側に夫々40μmずつを残して幅4μm、深さ1.5μmの
溝1aを形成し、この溝1aを含む基板1の表面に液相成長
法により、0.4℃/分の降温率でn型Ga0.60Al0.40Asク
ラッド層(Teドープ)、Ga0.92Al0.08As活性層、P型Ga
0.92Al0.08As光ガイド層(Geドープ)、P型Ga0.06Al
0.40Asクラッド層(Geドープ)、P型GaAsキャップ層
(Geドープ)を連続して成長せしめた。なお成長開始温
度は800℃であった。As a substrate 1, a groove 1a having a width of 4 μm and a depth of 1.5 μm is formed on the surface of an n-type GaAs substrate, leaving 40 μm at each end in the longitudinal direction, and liquid phase growth is performed on the surface of the substrate 1 including the groove 1a. N-type Ga 0.60 Al 0.40 As cladding layer (Te-doped), Ga 0.92 Al 0.08 As active layer, P-type Ga
0.92 Al 0.08 As Optical guide layer (Ge-doped), P-type Ga 0.06 Al
A 0.40 As clad layer (Ge-doped) and a P-type GaAs cap layer (Ge-doped) were continuously grown. The growth start temperature was 800 ° C.
このようにして構成した第1,2図に示す如き半導体レー
ザ装置について出力、閾値を測定した結果、出力は140m
W、閾値は30mAであった。As a result of measuring the output and threshold value of the semiconductor laser device as shown in FIGS. 1 and 2 configured in this way, the output is 140 m
W, the threshold was 30 mA.
これは従来品の出力10mW、閾値と比較して格段に向上し
ていることが解る。It can be seen that this is a marked improvement in the output of the conventional product of 10 mW, compared with the threshold value.
また電流I(mA)と出力L(mW)との関係についても調
査した結果第4図に示す如き結果が得られた。第4図は
横軸に電流を、また縦軸に出力をとって示してあり、こ
のグラフが明らかなように出力の損失が極めて少なくな
っていることが解る。As a result of investigating the relationship between the current I (mA) and the output L (mW), the result shown in FIG. 4 was obtained. In FIG. 4, the horizontal axis represents current and the vertical axis represents output, and it is clear from this graph that output loss is extremely small.
本発明の半導体レーザ装置は、周縁部を除く中央部に溝
を備えた基板と、該基板上に形成された活性層及び該活
性層に隣接した光ガイド層を含む複数の層と、を備え、
上記活性層及び上記光ガイド層を含む上記複数の層が、
上記周縁部上において夫々平坦且つ一様な厚さであるの
で、端面部における横方向の屈折率分布は一様になる。
従って、活性層で生じた光は、断面積の大きい光ガイド
層から出射されるので、端面での光出力密度が小さくな
る。A semiconductor laser device of the present invention includes a substrate having a groove in a central portion except a peripheral portion, and a plurality of layers including an active layer formed on the substrate and an optical guide layer adjacent to the active layer. ,
The plurality of layers including the active layer and the light guide layer,
Since each of the peripheral portions has a flat and uniform thickness, the refractive index distribution in the lateral direction at the end face portion becomes uniform.
Therefore, the light generated in the active layer is emitted from the light guide layer having a large cross-sectional area, so that the light output density at the end face becomes small.
この結果、端面での吸収損失並びに端面の劣化が十分に
低減されるので、出力の大幅な向上が図れる。As a result, the absorption loss at the end face and the deterioration of the end face are sufficiently reduced, so that the output can be greatly improved.
第1図は本発明装置の模式的斜視図、第2図は第1図の
II−II線による断面図、第3図は本発明装置における基
板の模式図、第4図は本発明装置における電流と出力と
の関係を示すグラフ、第5図は従来装置の模式的斜視図
である。 1……基板、1a……溝、2……クラッド層、3……活性
層、4……光ガイド層、5……クラッド層、6……キャ
ップ層1 is a schematic perspective view of the device of the present invention, and FIG. 2 is a schematic perspective view of FIG.
A sectional view taken along line II-II, FIG. 3 is a schematic view of a substrate in the device of the present invention, FIG. 4 is a graph showing a relation between current and output in the device of the present invention, and FIG. 5 is a schematic perspective view of a conventional device. Is. 1 ... Substrate, 1a ... Groove, 2 ... Clad layer, 3 ... Active layer, 4 ... Optical guide layer, 5 ... Clad layer, 6 ... Cap layer
Claims (1)
該基板上に形成された活性層及び該活性層に隣接した光
ガイド層を含む複数の層と、を備え、上記活性層及び上
記光ガイド層を含む上記複数の層が、上記周縁部上にお
いて夫々平坦且つ一様な厚さであることを特徴とする半
導体レーザ装置。1. A substrate having a groove in a central portion except a peripheral portion,
A plurality of layers including an active layer formed on the substrate and a light guide layer adjacent to the active layer, wherein the plurality of layers including the active layer and the light guide layer are provided on the peripheral portion. A semiconductor laser device having a flat and uniform thickness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60146054A JPH0728083B2 (en) | 1985-07-02 | 1985-07-02 | Semiconductor laser device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60146054A JPH0728083B2 (en) | 1985-07-02 | 1985-07-02 | Semiconductor laser device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS625678A JPS625678A (en) | 1987-01-12 |
JPH0728083B2 true JPH0728083B2 (en) | 1995-03-29 |
Family
ID=15399045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60146054A Expired - Fee Related JPH0728083B2 (en) | 1985-07-02 | 1985-07-02 | Semiconductor laser device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0728083B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2222307B (en) * | 1988-07-22 | 1992-04-01 | Mitsubishi Electric Corp | Semiconductor laser |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58216488A (en) * | 1982-06-09 | 1983-12-16 | Nec Corp | Semiconductor laser |
-
1985
- 1985-07-02 JP JP60146054A patent/JPH0728083B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPS625678A (en) | 1987-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |