JPH07278870A - Palladium plating solution - Google Patents
Palladium plating solutionInfo
- Publication number
- JPH07278870A JPH07278870A JP6093893A JP9389394A JPH07278870A JP H07278870 A JPH07278870 A JP H07278870A JP 6093893 A JP6093893 A JP 6093893A JP 9389394 A JP9389394 A JP 9389394A JP H07278870 A JPH07278870 A JP H07278870A
- Authority
- JP
- Japan
- Prior art keywords
- salt
- palladium
- acid
- plating solution
- ammonium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 92
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 44
- 238000007747 plating Methods 0.000 title claims abstract description 39
- 150000003839 salts Chemical class 0.000 claims abstract description 18
- -1 perfluoroalkyl sulfonic acid Chemical compound 0.000 claims abstract description 13
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 12
- KZVLNAGYSAKYMG-UHFFFAOYSA-N pyridine-2-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=N1 KZVLNAGYSAKYMG-UHFFFAOYSA-N 0.000 claims abstract description 12
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 claims abstract description 10
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 235000019270 ammonium chloride Nutrition 0.000 claims abstract description 6
- 150000002940 palladium Chemical class 0.000 claims abstract description 6
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims abstract description 6
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims abstract 2
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 claims description 5
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 claims description 4
- 150000003863 ammonium salts Chemical class 0.000 claims description 4
- 159000000000 sodium salts Chemical class 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 claims description 2
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 2
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 2
- CUJVBIPPAAAJMC-UHFFFAOYSA-N azane;pyridine-3-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=CN=C1 CUJVBIPPAAAJMC-UHFFFAOYSA-N 0.000 claims description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 2
- 239000004327 boric acid Substances 0.000 claims description 2
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 claims description 2
- 229960003512 nicotinic acid Drugs 0.000 claims description 2
- 235000001968 nicotinic acid Nutrition 0.000 claims description 2
- 239000011664 nicotinic acid Substances 0.000 claims description 2
- 229940081066 picolinic acid Drugs 0.000 claims description 2
- CYYDVIYDJAPSLQ-UHFFFAOYSA-M potassium;pyridine-3-sulfonate Chemical compound [K+].[O-]S(=O)(=O)C1=CC=CN=C1 CYYDVIYDJAPSLQ-UHFFFAOYSA-M 0.000 claims description 2
- DVECLMOWYVDJRM-UHFFFAOYSA-N pyridine-3-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CN=C1 DVECLMOWYVDJRM-UHFFFAOYSA-N 0.000 claims description 2
- GJAWHXHKYYXBSV-UHFFFAOYSA-N quinolinic acid Chemical compound OC(=O)C1=CC=CN=C1C(O)=O GJAWHXHKYYXBSV-UHFFFAOYSA-N 0.000 claims description 2
- 239000012190 activator Substances 0.000 claims 1
- 235000010338 boric acid Nutrition 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 239000004094 surface-active agent Substances 0.000 abstract description 5
- WYXIGTJNYDDFFH-UHFFFAOYSA-Q triazanium;borate Chemical compound [NH4+].[NH4+].[NH4+].[O-]B([O-])[O-] WYXIGTJNYDDFFH-UHFFFAOYSA-Q 0.000 abstract 1
- 239000002244 precipitate Substances 0.000 description 9
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 description 5
- 229910000388 diammonium phosphate Inorganic materials 0.000 description 5
- 235000019838 diammonium phosphate Nutrition 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940000207 selenious acid Drugs 0.000 description 1
- MCAHWIHFGHIESP-UHFFFAOYSA-N selenous acid Chemical compound O[Se](O)=O MCAHWIHFGHIESP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はパラジウムめっき用のめ
っき液に関し、特にハンダぬれ性・耐熱性等が要求され
る電気・電子部品等の材料として好適なパラジウム析出
物が得られる高純度パラジウムめっき液に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating solution for palladium plating, and in particular, high-purity palladium plating capable of obtaining a palladium precipitate suitable as a material for electric / electronic parts and the like which requires solder wettability and heat resistance. Regarding liquid.
【０００２】[0002]
【従来の技術】パラジウムめっき液は、古くから広範囲
に研究されており、そのめっき析出物は、耐食性、耐光
性、耐磨耗性及び電気特性等に優れ、又、金めっきなど
に比べて安価であるため電気接点、コネクター、回路基
盤などの電気・電子部品関係の用途に多く利用されてい
る。パラジウムめっき液から高純度のパラジウムを析出
させる場合、析出物の内部応力が高くなり易いためにめ
っきの厚付けが困難であったり、十分な展延性が得られ
なかったりする他に電子部品用のめっきとして重要なハ
ンダぬれ性、耐熱性、ボンディング性が十分でなかった
りするというような実用的課題が残されており、その改
良技術も既に特許として開示されている。例えば、内部
応力の問題や光沢性を改善するためにセレンを添加した
もの（特開昭６３−１１１１９４号公報）やセリウムを
添加したもの（特開平２−４３３９３号公報）が知られ
ている。2. Description of the Related Art Palladium plating solutions have been extensively studied for a long time, and their plating deposits are excellent in corrosion resistance, light resistance, abrasion resistance, electrical characteristics, etc., and cheaper than gold plating. Therefore, it is widely used for electrical and electronic parts related applications such as electrical contacts, connectors and circuit boards. When depositing high-purity palladium from a palladium plating solution, the internal stress of the precipitate tends to be high, making it difficult to thicken the plating or not being able to obtain sufficient spreadability. Practical problems such as insufficient solder wettability, heat resistance, and bondability, which are important for plating, remain, and an improved technique thereof has already been disclosed as a patent. For example, selenium-added ones (JP-A-63-111194) and cerium-added ones (JP-A-2-43393) for improving the problem of internal stress and glossiness are known.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の技術にあっても、ハンダぬれ性、耐熱性、ボ
ンディング性といった実用的課題を十分に解決するもの
ではなかった。最近では、各種電子機器等において、そ
の性能がより高度化されているため、これら電子機器に
用いられるパラジウムめっき材料は、より高純度の安定
した物性のものでなくてはならず、そのためより高純度
の安定した析出物を与えるパラジウムめっき液の要求が
強くなってきている。本発明者らは、上記した従来のパ
ラジウム析出物の欠陥を解消し、高純度の安定した物性
を示すパラジウム析出物が得られるパラジウムめっき液
について種々研究をすすめた結果、ピリジンスルホン酸
あるいはその塩とフッ素系界面活性剤であるパーフルオ
ロアルキルスルホン酸及びその塩、あるいはパーフルオ
ロアルキルポリオキシエチレンエタノールをパラジウム
めっき液に用いることによって高純度の安定したパラジ
ウム析出物が得られ、このものは、ハンダぬれ性良好
で、耐熱性に優れ、電子機器用部材とした場合優れた物
性を与えることを知見して本発明に到達した。However, even such conventional techniques have not been able to sufficiently solve practical problems such as solder wettability, heat resistance, and bondability. In recent years, the performance of various electronic devices has become more sophisticated, so the palladium plating materials used for these electronic devices must have higher purity and stable physical properties, and therefore higher performance. There is an increasing demand for palladium plating solutions that provide precipitates with stable purity. The present inventors have carried out various studies on a palladium plating solution capable of eliminating the above-mentioned defects of the palladium precipitate and obtaining a palladium precipitate exhibiting highly stable and stable physical properties, and as a result, pyridinesulfonic acid or a salt thereof. By using perfluoroalkyl sulfonic acid and its salt, which are a fluorine-based surfactant, or a salt thereof, or perfluoroalkyl polyoxyethylene ethanol in a palladium plating solution, a stable palladium precipitate of high purity can be obtained. The inventors have reached the present invention by finding that they have good wettability, excellent heat resistance, and excellent physical properties when used as a member for electronic equipment.
【０００４】[0004]
【課題を解決するための手段】すなわち、本発明は、可
溶性パラジウム塩をパラジウム量として１．０〜４０．
０ｇ／ｌ、ピリジンスルホン酸あるいはその塩及び／ま
たはピリジンカルボン酸あるいはその塩０．１〜２０．
０ｇ／ｌ、フッ素系界面活性剤１．０〜２０．０ｐｐｍ
を含有することを特徴とするパラジウムめっき液であ
る。That is, according to the present invention, the soluble palladium salt is used in an amount of 1.0 to 40.
0 g / l, pyridinesulfonic acid or its salt and / or pyridinecarboxylic acid or its salt 0.1-20.
0 g / l, fluorinated surfactant 1.0 to 20.0 ppm
It is a palladium plating solution characterized by containing.
【０００５】以下、本発明を更に詳細に説明する。本発
明に用いる可溶性パラジウム塩としては、例えば、ジク
ロロジアミンパラジウム、ジクロロテトラアンミンパラ
ジウム、ジブロモジアミンパラジウム、ジブロモテトラ
アンミンパラジウム、ジニトロジアミンパラジウム、ジ
ニトロテトラアンミンパラジウム等が挙げられる。これ
らの塩は単独で用いてもよく、２種以上併用して用いて
もよい。The present invention will be described in more detail below. Examples of the soluble palladium salt used in the present invention include dichlorodiamine palladium, dichlorotetraammine palladium, dibromodiamine palladium, dibromotetraammine palladium, dinitrodiamine palladium, dinitrotetraammine palladium and the like. These salts may be used alone or in combination of two or more.
【０００６】次に、本発明に用いるピリジンスルホン酸
あるいはその塩としては、例えば、ピリジン３スルホン
酸、ピリジン３スルホン酸アンモニウム、ピリジン３ス
ルホン酸カリウム等が挙げられる。また、ピリジンカル
ボン酸あるいはその塩としては、例えば、ピコリン酸、
ニコチン酸、キノリン酸、ルチジン酸、２，６ジピコリ
ン酸およびこれらのアンモニウム塩、カリウム塩、ナト
リウム塩等が挙げられる。上記のピリジンスルホン酸あ
るいはその塩、ピリジンカルボン酸あるいはその塩は、
めっき液中に０．１〜２０．０ｇ／ｌ好ましくは、１．
０〜１０．０ｇ／ｌ配合される。また、上記のピリジン
系有機化合物は、単独ないし２種以上併用して用いるこ
とができる。Next, examples of pyridinesulfonic acid or a salt thereof used in the present invention include pyridine 3 sulfonic acid, ammonium pyridine 3 sulfonate, potassium pyridine 3 sulfonate and the like. Further, as pyridinecarboxylic acid or a salt thereof, for example, picolinic acid,
Examples thereof include nicotinic acid, quinolinic acid, lutisic acid, 2,6 dipicolinic acid and ammonium salts, potassium salts, sodium salts thereof and the like. The above-mentioned pyridinesulfonic acid or a salt thereof, pyridinecarboxylic acid or a salt thereof,
0.1 to 20.0 g / l in the plating solution, preferably 1.
It is blended from 0 to 10.0 g / l. The above pyridine-based organic compounds can be used alone or in combination of two or more.
【０００７】更に、本発明に用いるフッ素系界面活性剤
としては、例えば、パーフルオロアルキルスルホン酸あ
るいはそのアンモニウム塩、カリウム塩、ナトリウム塩
等、及びパーフルオロアルキルポリオキシエチレンエタ
ノールが挙げられる。上記のパーフルオロアルキルスル
ホン酸あるいはその塩、及びパーフルオロアルキルポリ
オキシエチレンエタノールは、めっき液中に１．０〜２
０．０ｐｐｍ好ましくは、１．０〜１０．０ｐｐｍ配合
される。Further, examples of the fluorine-based surfactant used in the present invention include perfluoroalkyl sulfonic acid or its ammonium salt, potassium salt, sodium salt and the like, and perfluoroalkyl polyoxyethylene ethanol. The above-mentioned perfluoroalkyl sulfonic acid or its salt, and perfluoroalkyl polyoxyethylene ethanol are 1.0 to 2 in the plating solution.
0.0 ppm Preferably, it is 1.0 to 10.0 ppm.
【０００８】また、本発明では、めっき液に導電性と緩
衝性を付与するためにリン酸水素２アンモニウム、塩化
アンモニウム、硫酸アンモニウム、硝酸アンモニウム、
臭化アンモニウム及びホウ酸等が添加される。これらの
化合物は、単独で用いてもよく２種以上併用して用いる
こともできる。Further, in the present invention, in order to impart conductivity and buffering property to the plating solution, diammonium hydrogen phosphate, ammonium chloride, ammonium sulfate, ammonium nitrate,
Ammonium bromide and boric acid are added. These compounds may be used alone or in combination of two or more.
【０００９】そして、本発明のめっき液のｐＨは、６〜
１２、好ましくは７〜９に調整される。ｐＨ調整は、ア
ンモニア水または希硫酸によって行なわれる。めっき液
の温度は３０〜７０℃、好ましくは４５〜５５℃であ
る。また、陰極電流密度は、ラック時０．５〜１０Ａ／
ｄｍ2 、好ましくは３〜８Ａ／ｄｍ2 で行なわれる。The plating solution of the present invention has a pH of 6 to
It is adjusted to 12, preferably 7 to 9. The pH is adjusted with aqueous ammonia or diluted sulfuric acid. The temperature of the plating solution is 30 to 70 ° C, preferably 45 to 55 ° C. The cathode current density is 0.5 to 10 A / rack
dm 2 , preferably 3 to 8 A / dm 2 .
【００１０】[0010]
【実施例】以下、実施例により本発明を更に具体的に説
明する。The present invention will be described in more detail with reference to the following examples.
【００１１】実施例１ ジクロロジアミンパラジウム １０ｇ／ｌ（Ｐｄ量として） リン酸水素２アンモニウム ７５ｇ／ｌ 塩化アンモニウム ７５ｇ／ｌ ピリジンスルホン酸 ３ｇ／ｌ パーフルオロアルキルスルホン酸カリウム塩 ３ｐｐｍ アンモニア水にてｐＨ７．７に調整する。上記のパラジ
ウムめっき液を用いて、液温５０℃、電流密度７Ａ／ｄ
ｍ2 、めっき時間６秒の条件のもとで得られたパラジウ
ム析出物は、金線ワイヤボンディングに問題はなく、４
００℃２分間の耐熱性試験においても変色しなかった。
またその後のハンダぬれ性は良好であった。Example 1 Dichlorodiaminepalladium 10 g / l (as Pd amount) Diammonium hydrogen phosphate 75 g / l Ammonium chloride 75 g / l Pyridine sulfonic acid 3 g / l Perfluoroalkyl sulfonic acid potassium salt 3 ppm pH 7 with ammonia water. Adjust to 7. Using the above palladium plating solution, the solution temperature is 50 ° C. and the current density is 7 A / d.
The palladium precipitate obtained under the conditions of m 2 and plating time of 6 seconds showed no problem in gold wire wire bonding.
No discoloration was observed in a heat resistance test at 00 ° C for 2 minutes.
The solder wettability thereafter was good.
【００１２】実施例２ ジブロモジアミンパラジウム １０ｇ／ｌ（Ｐｄ量として） リン酸水素２アンモニウム ５０ｇ／ｌ 臭化アンモニウム ５０ｇ／ｌ ピリジンスルホン酸 ３ｇ／ｌ パーフルオロアルキルスルホン酸カリウム塩 ３ｐｐｍ アンモニア水にてｐＨ７．７に調整する。上記のパラジ
ウムめっき液を用いて、液温５０℃、電流密度６Ａ／ｄ
ｍ2 、めっき時間７秒の条件のもとで得られたパラジウ
ム析出物は、金線ワイヤボンディングに問題はなく、４
００℃２分間の耐熱性試験においても変色しなかった。
またその後のハンダぬれ性は良好であった。Example 2 Dibromodiamine palladium 10 g / l (as Pd amount) Diammonium hydrogen phosphate 50 g / l Ammonium bromide 50 g / l Pyridinesulfonic acid 3 g / l Perfluoroalkylsulfonic acid potassium salt 3 ppm pH 7 with aqueous ammonia Adjust to 7. Using the above palladium plating solution, the liquid temperature is 50 ° C. and the current density is 6 A / d.
The palladium precipitate obtained under the conditions of m 2 and plating time of 7 seconds showed no problem in gold wire wire bonding.
No discoloration was observed in a heat resistance test at 00 ° C for 2 minutes.
The solder wettability thereafter was good.
【００１３】実施例３ ジクロロジアミンパラジウム １０ｇ／ｌ（Ｐｄ量として） リン酸水素２アンモニウム ７５ｇ／ｌ 塩化アンモニウム ７５ｇ／ｌ ピリジンスルホン酸 ５ｇ／ｌ パーフルオロアルキルポリオキシエチレン エタノール ５ｐｐｍ アンモニア水にてｐＨ７．７に調整する。上記のパラジ
ウムめっき液を用いて、液温５０℃、電流密度７Ａ／ｄ
ｍ2 、めっき時間６秒の条件のもとで得られたパラジウ
ム析出物は、金線ワイヤボンディングに問題はなく、４
００℃２分間の耐熱性試験においても変色しなかった。
またその後のハンダぬれ性は良好であった。Example 3 Dichlorodiaminepalladium 10 g / l (as Pd amount) Diammonium hydrogen phosphate 75 g / l Ammonium chloride 75 g / l Pyridinesulfonic acid 5 g / l Perfluoroalkylpolyoxyethylene ethanol 5 ppm pH in ammonia water 7. Adjust to 7. Using the above palladium plating solution, the solution temperature is 50 ° C. and the current density is 7 A / d.
The palladium precipitate obtained under the conditions of m 2 and plating time of 6 seconds showed no problem in gold wire wire bonding.
No discoloration was observed in a heat resistance test at 00 ° C for 2 minutes.
The solder wettability thereafter was good.
【００１４】比較例 ジクロロジアミンパラジウム １０ｇ／ｌ（Ｐｄ量として） リン酸水素２アンモニウム ７５ｇ／ｌ 塩化アンモニウム ７５ｇ／ｌ ピリジンスルホン酸 ５ｇ／ｌ 亜セレン酸 １０ｐｐｍ アンモニア水にてｐＨ７．７に調整する。上記のパラジ
ウムめっき液を用いて、液温５０℃、電流密度７Ａ／ｄ
ｍ2 、めっき時間６秒の条件のもとで得られたパラジウ
ム析出物は、金線ワイヤボンディング性がよくなく、４
００℃２分間の耐熱性試験で変色を生じた。Comparative Example Dichlorodiamine palladium 10 g / l (as Pd amount) Diammonium hydrogen phosphate 75 g / l Ammonium chloride 75 g / l Pyridine sulfonic acid 5 g / l Selenious acid 10 ppm pH is adjusted to 7.7 with aqueous ammonia. Using the above palladium plating solution, the solution temperature is 50 ° C. and the current density is 7 A / d.
The palladium deposit obtained under the conditions of m 2 and plating time of 6 seconds had poor gold wire wire bonding property and 4
Discoloration occurred in a heat resistance test at 00 ° C for 2 minutes.
【００１５】[0015]
【発明の効果】本発明のパラジウムめっき液を使用して
得たパラジウム析出物は、特に、ハンダぬれ性が極めて
良好であり、かつ耐熱性に非常に優れているため高温に
おいて変色することがない。また、ワイヤボンディング
性においても問題は無い。従って、Ｌ／Ｆ用パラジウム
めっき液等として有効である。INDUSTRIAL APPLICABILITY The palladium deposit obtained by using the palladium plating solution of the present invention has extremely good solder wettability and excellent heat resistance, and therefore does not discolor at high temperature. . Further, there is no problem in wire bondability. Therefore, it is effective as a palladium plating solution for L / F.
Claims (5)
て１．０〜４０．０ｇ／ｌ、ピリジンスルホン酸あるい
はその塩及び／またはピリジンカルボン酸あるいはその
塩０．１〜２０．０ｇ／ｌ、フッ素系界面活性剤１．０
〜２０．０ｐｐｍを含有することを特徴とするパラジウ
ムめっき液。1. A soluble palladium salt as a palladium amount of 1.0 to 40.0 g / l, pyridinesulfonic acid or a salt thereof and / or pyridinecarboxylic acid or a salt of 0.1 to 20.0 g / l, a fluorine-based interface. Activator 1.0
A palladium plating solution containing ˜20.0 ppm.
なり、その塩化物、臭化物、亜硝酸塩の中から選ばれた
少なくとも１種であることを特徴とする請求項１記載の
パラジウムめっき液。2. The palladium plating solution according to claim 1, wherein the soluble palladium salt comprises an amine compound and is at least one selected from chloride, bromide and nitrite thereof.
リジン３スルホン酸、ピリジン３スルホン酸アンモニウ
ム、ピリジン３スルホン酸カリウムであり、ピリジンカ
ルボン酸あるいはその塩がピコリン酸、ニコチン酸、キ
ノリン酸、ルチジン酸、２，６−ジピコリン酸及びそれ
らのアンモニウム塩、カリウム塩、ナトリウム塩であ
り、これらの中から選ばれた少なくとも１種であること
を特徴とする請求項１記載のパラジウムめっき液。3. Pyridine sulfonic acid or a salt thereof is pyridine 3 sulfonic acid, ammonium pyridine 3 sulfonate, potassium pyridine 3 sulfonate, and pyridine carboxylic acid or a salt thereof is picolinic acid, nicotinic acid, quinolinic acid, rutidic acid, 2. The palladium plating solution according to claim 1, which is 2,6-dipicolinic acid and an ammonium salt, potassium salt, or sodium salt thereof, and is at least one selected from these.
キルスルホン酸及びそのアンモニウム塩、カリウム塩、
ナトリウム塩、パーフルオロアルキルポリオキシエチレ
ンエタノールの中から選ばれた少なくとも１種であるこ
とを特徴とする請求項１記載のパラジウムめっき液。4. The fluorosurfactant is perfluoroalkyl sulfonic acid and its ammonium salt, potassium salt,
The palladium plating solution according to claim 1, which is at least one selected from sodium salt and perfluoroalkyl polyoxyethylene ethanol.
ム、硝酸アンモニウム、硫酸アンモニウム、塩化アンモ
ニウム、ホウ酸の中から選ばれた少なくとも１種を含有
することを特徴とする請求項１記載のパラジウムめっき
液。5. The palladium plating solution according to claim 1, wherein the plating solution further contains at least one selected from ammonium hydrogenphosphate, ammonium nitrate, ammonium sulfate, ammonium chloride and boric acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6093893A JPH07278870A (en) | 1994-04-08 | 1994-04-08 | Palladium plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6093893A JPH07278870A (en) | 1994-04-08 | 1994-04-08 | Palladium plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07278870A true JPH07278870A (en) | 1995-10-24 |
Family
ID=14095167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6093893A Pending JPH07278870A (en) | 1994-04-08 | 1994-04-08 | Palladium plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07278870A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001262390A (en) * | 2000-01-12 | 2001-09-26 | Furukawa Electric Co Ltd:The | Palladium plating liquid |
| WO2002103084A1 (en) * | 1999-10-27 | 2002-12-27 | Kojima Chemicals Co., Ltd | Palladium plating solution |
| JP2003517190A (en) * | 1998-06-30 | 2003-05-20 | セミトウール・インコーポレーテツド | Metal-coated structures for microelectronic applications and methods of forming the structures |
| AU2001274534B2 (en) * | 2001-06-15 | 2004-10-07 | Kojima Chemicals Co., Ltd. | Palladium plating solution |
| JP4790191B2 (en) * | 2000-04-06 | 2011-10-12 | メタロール テクノロジー フランス エス アー エス | Electrolytic bath for electrochemical deposition of palladium or its alloys |
-
1994
- 1994-04-08 JP JP6093893A patent/JPH07278870A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003517190A (en) * | 1998-06-30 | 2003-05-20 | セミトウール・インコーポレーテツド | Metal-coated structures for microelectronic applications and methods of forming the structures |
| WO2002103084A1 (en) * | 1999-10-27 | 2002-12-27 | Kojima Chemicals Co., Ltd | Palladium plating solution |
| GB2382353A (en) * | 1999-10-27 | 2003-05-28 | Kojima Chemicals Co Ltd | Palladium Plating Solution |
| GB2382353B (en) * | 1999-10-27 | 2004-10-27 | Kojima Chemicals Co Ltd | Palladium Plating Solution |
| JP2001262390A (en) * | 2000-01-12 | 2001-09-26 | Furukawa Electric Co Ltd:The | Palladium plating liquid |
| JP4570213B2 (en) * | 2000-01-12 | 2010-10-27 | 古河電気工業株式会社 | Palladium plating solution |
| JP4790191B2 (en) * | 2000-04-06 | 2011-10-12 | メタロール テクノロジー フランス エス アー エス | Electrolytic bath for electrochemical deposition of palladium or its alloys |
| AU2001274534B2 (en) * | 2001-06-15 | 2004-10-07 | Kojima Chemicals Co., Ltd. | Palladium plating solution |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101079554B1 (en) | Electrolytic gold plating solution and gold film obtained using same | |
| US5552031A (en) | Palladium alloy plating compositions | |
| USRE45297E1 (en) | Method for enhancing the solderability of a surface | |
| CA2023871C (en) | Electrodeposition of palladium films | |
| JP5175156B2 (en) | Palladium alloy plating solution and plating method | |
| TW201229327A (en) | Gold plating solution | |
| US6743346B2 (en) | Electrolytic solution for electrochemical deposit of palladium or its alloys | |
| WO2023050980A1 (en) | Plating solution for electroplating gold on nickel plating, method for electroplating gold on nickel plating, and gold-plated item | |
| JPH07278870A (en) | Palladium plating solution | |
| JPH0711476A (en) | Palladium plating solution | |
| JPH0711475A (en) | Palladium plating solution | |
| JP2722328B2 (en) | White Palladium Electroplating Bath and Method | |
| JP5268883B2 (en) | Electrolytic gold plating solution and gold film obtained using the same | |
| US7267259B2 (en) | Method for enhancing the solderability of a surface | |
| JP2005529241A (en) | Acidic solution for silver deposition and method for depositing a silver layer on a metal surface | |
| JP4588173B2 (en) | Palladium electroplating solution and plating method using the same | |
| JP4570213B2 (en) | Palladium plating solution | |
| US6090493A (en) | Bismuth coating protection for copper | |
| JPH06104902B2 (en) | Electroless copper nickel alloy plating method | |
| US3387987A (en) | Bath and process for producing platinum metal immersion deposits | |
| JP2003147542A (en) | Electroless substitution type gold plating solution | |
| JP3601005B2 (en) | Palladium plating solution | |
| JP4728462B2 (en) | Tin electroplating solution and plating method | |
| KR20010107073A (en) | Nickel-gold alloy plating composition and process of plating same | |
| JP2003328182A (en) | Tin-silver alloy plating bath for rackless plating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080522 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 11 Free format text: PAYMENT UNTIL: 20090522 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090522 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100522 Year of fee payment: 12 |
|
| LAPS | Cancellation because of no payment of annual fees |