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JPH0727784A - Acceleration sensor - Google Patents

Acceleration sensor

Info

Publication number
JPH0727784A
JPH0727784A JP5173018A JP17301893A JPH0727784A JP H0727784 A JPH0727784 A JP H0727784A JP 5173018 A JP5173018 A JP 5173018A JP 17301893 A JP17301893 A JP 17301893A JP H0727784 A JPH0727784 A JP H0727784A
Authority
JP
Japan
Prior art keywords
detection element
acceleration sensor
piezoelectric ceramic
pair
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5173018A
Other languages
Japanese (ja)
Other versions
JP3136847B2 (en
Inventor
Jiyun Tahoda
純 多保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP05173018A priority Critical patent/JP3136847B2/en
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to DE69403252T priority patent/DE69403252T2/en
Priority to EP94104240A priority patent/EP0616221B1/en
Priority to SG1996003655A priority patent/SG52374A1/en
Priority to EP94104238A priority patent/EP0616222B1/en
Priority to SG1996005179A priority patent/SG52493A1/en
Priority to DE69414739T priority patent/DE69414739T2/en
Priority to US08/210,004 priority patent/US5515725A/en
Priority to US08/210,370 priority patent/US5490422A/en
Publication of JPH0727784A publication Critical patent/JPH0727784A/en
Application granted granted Critical
Publication of JP3136847B2 publication Critical patent/JP3136847B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To provide an acceleration sensor provided with a detection element composed of piezoelectric ceramic sheets which are bonded firmly without using an adhesive. CONSTITUTION:An acceleration sensor is provided with a bimorph-type detection element 1 formed in such a way that one pair of polarized piezoelectric ceramic sheets 4 in which electrodes 2, 3 are formed on main faces are opposedly bonded. In the acceleration sensor, the bimorph-type detection element 2 is manufactured in such a way that one pair of piezoelectric ceramic green sheets 5 in which electrode patterns 6, 7 are printed on main surfaces are overlapped, the green sheets are pressurized along their thickness direction and baked, and a polarization treatment is executed to each sheet of the ceramic laminated body which is obtained by baking.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は加速度センサに係り、詳
しくは、これの備えるバイモルフ型検出素子の構造に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an acceleration sensor, and more particularly to the structure of a bimorph type detection element included in the acceleration sensor.

【0002】[0002]

【従来の技術】従来から、加速度センサのうちには圧電
性素子を組み込んで構成されたものがあり、この種の圧
電性素子としては、図3で示すような両持ち梁構造とい
われるバイモルフ型検出素子(以下、検出素子という)
10を用いるのが一般的となっている。すなわち、この
検出素子10は、共に短冊形状とされたうえで主表面の
それぞれ上に信号取出電極11及び中間電極12が形成
された一対の圧電セラミック板13を対面接合したもの
であり、これらの圧電セラミック板13は中間電極12
が形成された主表面同士を接着剤14で貼り合わされる
ことによって一体化されている。なお、これら圧電セラ
ミック板13の各々に対しては、接合以前の時点におい
て、厚み方向に沿いつつ他方側とは互いに逆となる向き
(図では、矢印X,Yで示す)などのような所望の向き
に従った分極処理が施されている。
2. Description of the Related Art Conventionally, some acceleration sensors are constructed by incorporating a piezoelectric element, and a piezoelectric element of this type is a bimorph type which is called a double-supported beam structure as shown in FIG. Detection element (hereinafter referred to as detection element)
It is common to use 10. That is, the detection element 10 is formed by strip-shaped, and a pair of piezoelectric ceramic plates 13 each having a signal extraction electrode 11 and an intermediate electrode 12 formed on each of the main surfaces thereof are face-bonded to each other. The piezoelectric ceramic plate 13 is the intermediate electrode 12.
The main surfaces formed with are bonded together by an adhesive agent 14 to be integrated. It should be noted that each of the piezoelectric ceramic plates 13 has a desired direction such as a direction (indicated by arrows X and Y in the drawing) opposite to the other side along the thickness direction at the time before bonding. Is polarized according to the direction of.

【0003】さらに、このようにして作製された検出素
子10の長手方向に沿う両端縁は、側面視「コ」字形状
となった一対の挟持部品15によって固定支持されてい
る。そして、各圧電セラミック板13上に形成された信
号取出電極11のそれぞれは挟持部品15それぞれの異
なる端面ごとに形成された外部引出電極16,17の各
々に対して接続されたうえ、これらを通じてセンサ基板
上の配線パターン(いずれも図示していない)に接続さ
れている。なお、挟持部品15が上記形状とされている
のは、加速度Gの作用に伴う慣性力によって変形する検
出素子10自身の撓み代を確保するためである。
Further, both end edges along the longitudinal direction of the detection element 10 thus manufactured are fixedly supported by a pair of holding parts 15 having a "U" shape in a side view. Each of the signal extraction electrodes 11 formed on each piezoelectric ceramic plate 13 is connected to each of the external extraction electrodes 16 and 17 formed on each different end face of the sandwiching component 15, and the sensor is connected through these electrodes. It is connected to a wiring pattern (not shown) on the substrate. The sandwiching component 15 has the above-described shape in order to secure a bending margin of the detection element 10 itself which is deformed by the inertial force caused by the action of the acceleration G.

【0004】[0004]

【発明が解決しようとする課題】ところで、前記従来構
成とされた検出素子10を作製する際には、図4で示す
ように、主表面上に信号取出電極11及び中間電極12
となる電極層(図示していない)がそれぞれ形成された
一対のセラミック親基板18と、内表面側の所定位置ご
とに所定幅の凹溝が形成された一対の挟持部品用親基板
19とを用意したうえ、セラミック親基板18同士を接
着剤(図示していない)によって貼り合わせ、かつ、セ
ラミック親基板18それぞれの外側から挟持部品用親基
板19の各々を当てつけて一体に接合した後、これらの
全体を交差状として設定された切断線Sの各々に沿いな
がら切断することになる。
By the way, when manufacturing the detecting element 10 having the above-mentioned conventional structure, as shown in FIG. 4, the signal extracting electrode 11 and the intermediate electrode 12 are formed on the main surface.
A pair of ceramic parent boards 18 each having an electrode layer (not shown) formed thereon and a pair of parent board 19 for holding parts in which a groove having a predetermined width is formed at each predetermined position on the inner surface side. After being prepared, the ceramic parent boards 18 are bonded to each other with an adhesive (not shown), and the parent board 19 for holding parts is abutted from the outside of each ceramic parent board 18 to integrally bond them. Will be cut along each of the cutting lines S set as intersecting shapes.

【0005】しかしながら、セラミック親基板18同士
を接着剤によって貼り合わせた場合には、セラミック親
基板18間の全面にわたって均一な厚みの接着剤が漏れ
なく付着しているとは限らないのが実情であり、全く接
着剤が付着していない部分や接着剤の厚みが厚い部分な
どが局所的にばらついた状態で存在することになってし
まう。そこで、挟持部品用親基板19を接合したうえで
の切断によって作製された検出素子10のうちには、こ
れを構成する一対の圧電セラミック板13同士が接着剤
14によって全く接合されていなかったり、接合状態が
不十分であったりするものが含まれていることになる結
果、製品である検出素子10相互の加速度検出精度が一
致せずにばらつくことが起こってしまう。
However, when the ceramic parent substrates 18 are adhered to each other by an adhesive agent, the adhesive agent having a uniform thickness does not always adhere to the entire surface between the ceramic parent substrates 18 without leakage. Therefore, a portion where no adhesive is attached or a portion where the thickness of the adhesive is thick are locally dispersed. Therefore, in the detection element 10 manufactured by cutting after the parent substrate 19 for sandwiching components is bonded, the pair of piezoelectric ceramic plates 13 forming the same are not bonded at all with the adhesive 14. As a result, the bonding state is insufficient, and as a result, the detection accuracy of the accelerations of the detection elements 10 that are the products do not match and vary.

【0006】また、このような不都合の発生を避けるた
めには、接着剤を用いて貼り合わせる際に、セラミック
親基板18同士の厚み方向に沿って十分に大きな圧力を
加えながら接着剤を硬化させることも考えられるのであ
るが、このようにした場合には、各セラミック親基板1
8の厚みが100〜150μm程度と薄いために破損す
るというような不都合が生じることになる。そこで、こ
れらセラミック親基板18の厚みを当初から厚くしてお
いたり、これら間に金属板を介装したうえでの貼り合わ
せを行うことも提案されているのであるが、これらの手
立てを講じた場合には製品として完成した検出素子10
における出力感度の低下を招くことが起こってしまう。
In order to avoid such an inconvenience, the adhesive is hardened by applying a sufficiently large pressure along the thickness direction of the ceramic parent substrates 18 when the adhesive is used for bonding. However, in this case, each ceramic mother board 1
Since the thickness of No. 8 is as thin as about 100 to 150 μm, there is an inconvenience of being damaged. Therefore, it has been proposed to increase the thickness of these ceramic parent substrates 18 from the beginning, or to attach them after interposing a metal plate between them, but these measures were taken. In some cases, the detection element 10 completed as a product
In this case, the output sensitivity may be lowered.

【0007】本発明は、このような不都合に鑑みて創案
されたものであって、接着剤を用いることなく強固に対
面接合された一対の圧電セラミック板からなる検出素子
を備えた加速度センサの提供を目的としている。
The present invention was devised in view of such inconvenience, and provides an acceleration sensor having a detection element composed of a pair of piezoelectric ceramic plates that are firmly face-to-face joined without using an adhesive. It is an object.

【0008】[0008]

【課題を解決するための手段】本発明に係る加速度セン
サは、主表面上に電極が形成されて分極処理された一対
の圧電セラミック板を対面接合してなる検出素子を備え
たものであり、この検出素子は、主表面上に電極パター
ンが印刷された一対の圧電セラミックグリーンシート
(以下、グリーンシートという)を重ね合わせ、かつ、
これらを厚み方向に沿って加圧したうえで焼成した後、
焼成によって得られたセラミック積層体のそれぞれに対
する分極処理を行って作製されたものとなっている。
An acceleration sensor according to the present invention comprises a detection element comprising a pair of piezoelectric ceramic plates, each having a main surface on which electrodes are formed and polarized, and which are face-to-face bonded to each other. This detection element is constructed by stacking a pair of piezoelectric ceramic green sheets (hereinafter referred to as “green sheets”) on the main surface of which electrode patterns are printed, and
After firing these under pressure along the thickness direction,
Each of the ceramic laminates obtained by firing is subjected to a polarization treatment to be produced.

【0009】[0009]

【作用】上記手段によれば、検出素子を構成するセラミ
ック親基板同士は一対のグリーンシートを重ね合わせた
うえでの焼成によって強固に対面接合されることになる
結果、これらを接着剤によってわざわざ対面接合する必
要はないことになる。
According to the above-mentioned means, the ceramic parent substrates constituting the detection element are firmly face-to-face joined by firing a pair of green sheets, and as a result, they are purposely face-to-face with an adhesive. There will be no need to join.

【0010】[0010]

【実施例】以下、本発明の実施例を図面に基づいて説明
する。
Embodiments of the present invention will be described below with reference to the drawings.

【0011】図1は本実施例に係る加速度センサを構成
する際に用いられる検出素子を取り出して示す外観斜視
図、図2はその作製手順の一部を示す分解斜視図であ
り、図1における符号1は両持ち梁構造とされた検出素
子を示している。なお、この図1において、従来例を示
す図3と互いに同一となる部品及び部分については同一
符号を付している。
FIG. 1 is an external perspective view showing a detection element used in constructing the acceleration sensor according to this embodiment, and FIG. 2 is an exploded perspective view showing a part of a manufacturing procedure thereof. Reference numeral 1 indicates a detection element having a double-supported beam structure. In FIG. 1, parts and portions which are the same as those in FIG. 3 showing the conventional example are denoted by the same reference numerals.

【0012】本実施例に係る加速度センサの備える検出
素子1は、共に短冊形状とされたうえで主表面のそれぞ
れ上に薄膜状の信号取出電極2及び中間電極3が形成さ
れ、かつ、分極処理された一対の圧電セラミック板4か
らなっており、これらの圧電セラミック板4は中間電極
3を介したうえで対面接合されている。そして、これら
対面接合された圧電セラミック板4の長手方向に沿う両
端縁は、従来例同様、側面視「コ」字形状となった一対
の挟持部品15によって固定支持されており、各圧電セ
ラミック板4上に形成された信号取出電極2の各々は挟
持部品15それぞれの異なる端面ごとに形成された外部
引出電極16,17を通じたうえでセンサ基板上の配線
パターン(いずれも図示していない)に接続されてい
る。
The detection element 1 included in the acceleration sensor according to the present embodiment is formed into a strip shape, and a thin film signal extraction electrode 2 and an intermediate electrode 3 are formed on each of the main surfaces, and a polarization treatment is performed. It is composed of a pair of piezoelectric ceramic plates 4 which are connected to each other, and these piezoelectric ceramic plates 4 are face-to-face bonded via the intermediate electrode 3. Both end edges along the longitudinal direction of the face-to-face bonded piezoelectric ceramic plates 4 are fixed and supported by a pair of sandwiching parts 15 having a "U" shape in a side view as in the conventional example. Each of the signal extraction electrodes 2 formed on the wiring 4 is passed through the external extraction electrodes 16 and 17 formed on each different end face of the sandwiching component 15 and then formed into a wiring pattern (neither is shown) on the sensor substrate. It is connected.

【0013】なお、図1では、各圧電セラミック板4に
おける分極の向きがそれぞれの厚み方向に沿いつつ他方
側とは互いに逆となる向き(図では、矢印X,Yで示
す)にそろえられているが、これらの方向のみに限定さ
れるものではなく、加速度Gの作用方向を考慮したうえ
での所望の向きに従った分極処理が施されるのは勿論で
ある。すなわち、各圧電セラミック板4の長手方向領域
を例えば3つの部分に区分けしたうえ、図1中の仮想線
で表された矢印で示すように、各圧電セラミック板4の
中央部分及び端部分のそれぞれを互いに逆向きとしなが
ら他方側とも逆向きとなるように分極しておいてもよ
く、このような分極処理を施した場合には、検出素子1
における検出感度の向上が図れることになる。
In FIG. 1, the polarization directions of the piezoelectric ceramic plates 4 are aligned in the directions (indicated by arrows X and Y in the figure) which are opposite to the other side along the respective thickness directions. However, the polarization processing is not limited to these directions, and it goes without saying that polarization processing is performed in accordance with a desired direction in consideration of the acting direction of the acceleration G. That is, the longitudinal region of each piezoelectric ceramic plate 4 is divided into, for example, three parts, and each of the central portion and the end portion of each piezoelectric ceramic plate 4 is divided as indicated by an arrow represented by a virtual line in FIG. May be polarized so that they are opposite to each other while the other side is also opposite. When such polarization treatment is performed, the detection element 1
Therefore, the detection sensitivity can be improved.

【0014】ところで、この検出素子1は、図2で示す
ような手順に従って作製されたものである。すなわち、
まず、所要の厚み及び大きさを有する一対のグリーンシ
ート5を用意し、各グリーンシート5の主表面上には製
品における信号取出電極2及び中間電極3となるべき電
極パターン6,7のそれぞれを導電ペーストの印刷によ
って形成する。なお、この際、図2で示したように、中
間電極3となる電極パターン7については、いずれか一
方側(図2では下側)に位置するグリーンシート5の内
向き主表面上にのみ印刷しておけばよい。
By the way, the detecting element 1 is manufactured according to the procedure as shown in FIG. That is,
First, a pair of green sheets 5 having a required thickness and size are prepared. On the main surface of each green sheet 5, the electrode patterns 6 and 7 to be the signal extraction electrodes 2 and the intermediate electrodes 3 in the product are respectively provided. It is formed by printing a conductive paste. At this time, as shown in FIG. 2, the electrode pattern 7 serving as the intermediate electrode 3 is printed only on the inward main surface of the green sheet 5 located on either side (lower side in FIG. 2). Just keep it.

【0015】次に、図示していないが、電極パターン7
を挟み込むようにして一対のグリーンシート5を互いに
重ね合わせた後、これらを厚み方向に沿って加圧したう
えで焼成する。すると、これらのグリーンシート5は焼
成されることによってセラミック積層体であるセラミッ
ク親基板となり、予め加圧されて密着していたグリーン
シート5からなる一対のセラミック親基板同士は強固に
対面接合されていることになる。そして、この際、グリ
ーンシート5それぞれの主表面上に形成されていた電極
パターン6,7は、焼成に伴う焼き付けによって信号取
出電極2及び中間電極3を構成する電極層となり、セラ
ミック親基板同士は中間電極3となる電極層を介したう
えで対面接合されている。
Next, although not shown, the electrode pattern 7
After the pair of green sheets 5 are overlapped with each other so as to sandwich them, they are pressed along the thickness direction and then fired. Then, these green sheets 5 become a ceramic mother board which is a ceramic laminated body by being fired, and the pair of ceramic mother boards composed of the green sheets 5 which have been pressed and brought into close contact are firmly face-to-face joined. Will be there. Then, at this time, the electrode patterns 6 and 7 formed on the main surfaces of the green sheets 5 become the electrode layers forming the signal extraction electrode 2 and the intermediate electrode 3 by baking accompanying the firing, and the ceramic parent substrates are separated from each other. Face-to-face bonding is performed via an electrode layer which becomes the intermediate electrode 3.

【0016】さらに、このようにして得られたセラミッ
ク積層体としてのセラミック親基板のそれぞれに対し、
例えば、図1で示したような所望の向きとなる分極処理
を施す。その後、図4で示したと同様、予め別途用意し
ておいた挟持部品用親基板19、すなわち、内表面側の
所定位置ごとに所定幅の凹溝が形成された挟持部品用親
基板19の各々を対面接合されたセラミック親基板それ
ぞれの外側から当てつけて一体に接合した後、これらの
全体を交差状として設定された切断線Sの各々に沿いな
がら切断すると、図1で示した構造の検出素子1が作製
されたことになる。
Further, with respect to each of the ceramic parent substrates as the ceramic laminated body thus obtained,
For example, the polarization process is performed in a desired direction as shown in FIG. Then, as shown in FIG. 4, each of the sandwiching component parent substrates 19 prepared separately in advance, that is, each of the sandwiching component parent substrates 19 in which a groove having a predetermined width is formed at each predetermined position on the inner surface side. 1 is applied from the outside of each of the face-to-face joined ceramic mother substrates to be joined integrally, and then the whole of them is cut along each of the cutting lines S set as intersecting shapes, whereby the detection element having the structure shown in FIG. 1 has been created.

【0017】なお、以上説明した本実施例においては、
多数個の検出素子1を作製するのに見合った大きさを有
するグリーンシート5を重ね合わせたうえで焼成するこ
とによって多数個分のセラミック積層体を一括的に作製
するものとしているが、これに限られることはなく、予
め単一個の検出素子1に見合う大きさとされたグリーン
シート5を重ね合わせて加圧したうえで焼成することに
よって単一個分のみのセラミック積層体を作製すること
も可能である。また、本実施例では、「コ」字形状とさ
れた挟持部品15で検出素子1の長手方向に沿う両端縁
を保持しているが、例えば、検出素子1の長手方向に沿
う一端縁のみを挟持部品15で保持することによって片
持ち梁構造の検出素子1を構成することも可能であるこ
とは勿論である。
In the embodiment described above,
It is supposed that a large number of ceramic laminated bodies are collectively manufactured by stacking and firing the green sheets 5 having a size suitable for manufacturing a large number of detecting elements 1. There is no limitation, and it is also possible to fabricate a single ceramic laminate by stacking green sheets 5 each having a size suitable for a single detection element 1 in advance, applying pressure, and then firing. is there. In addition, in the present embodiment, the both end edges along the longitudinal direction of the detection element 1 are held by the sandwiching component 15 having the “U” shape. However, for example, only one end edge along the longitudinal direction of the detection element 1 is held. Needless to say, the detection element 1 having a cantilever structure can also be configured by holding it by the sandwiching component 15.

【0018】[0018]

【発明の効果】以上説明したように、本発明に係る加速
度センサの備える検出素子は、グリーンシートを重ね合
わせ、かつ、これらを厚み方向に沿って加圧したうえで
焼成した後、焼成によって得られたセラミック親基板の
それぞれに対する分極処理を行ったうえで切断されたも
のであり、検出素子を構成する一対の圧電セラミック板
同士は中間電極を介したうえ焼成によって強固に対面接
合されている。したがって、従来例のように、接着剤を
用いて圧電セラミック板同士をわざわざ接合する必要は
全くないことになり、接着剤の使用に伴う不都合が生じ
ることは起こり得なくなる。その結果、製品である検出
素子相互の加速度検出精度は極めて良く一致しているこ
とになり、出力感度の低下を招く恐れもないという優れ
た効果が得られる。
As described above, the detection element provided in the acceleration sensor according to the present invention is obtained by stacking green sheets, pressing them along the thickness direction, firing them, and then firing them. Each of the obtained ceramic parent substrates is subjected to polarization treatment and then cut, and the pair of piezoelectric ceramic plates constituting the detection element are firmly face-to-face joined by firing through the intermediate electrode. Therefore, unlike the conventional example, there is no need to purposely bond the piezoelectric ceramic plates to each other by using an adhesive agent, and it is impossible to cause a disadvantage associated with the use of the adhesive agent. As a result, the acceleration detection precisions of the detection elements, which are products, are extremely well matched, and there is an excellent effect that there is no fear of causing a reduction in output sensitivity.

【図面の簡単な説明】[Brief description of drawings]

【図1】本実施例に係る加速度センサの検出素子を示す
外観斜視図である。
FIG. 1 is an external perspective view showing a detection element of an acceleration sensor according to an embodiment.

【図2】本実施例に係る検出素子の作製手順の一部を示
す分解斜視図である。
FIG. 2 is an exploded perspective view showing a part of the manufacturing procedure of the detection element according to the present embodiment.

【図3】従来例に係る検出素子を示す外観斜視図であ
る。
FIG. 3 is an external perspective view showing a detection element according to a conventional example.

【図4】従来例に係る検出素子の作製手順を示す分解斜
視図である。
FIG. 4 is an exploded perspective view showing a procedure for manufacturing a detection element according to a conventional example.

【符号の説明】[Explanation of symbols]

1 検出素子(バイモルフ型検出素子) 2 信号取出電極 3 中間電極 4 圧電セラミック板 5 グリーンシート(圧電セラミックグリーンシー
ト) 6 電極パターン 7 電極パターン
1 detection element (bimorph type detection element) 2 signal extraction electrode 3 intermediate electrode 4 piezoelectric ceramic plate 5 green sheet (piezoelectric ceramic green sheet) 6 electrode pattern 7 electrode pattern

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 主表面上に電極(2,3)が形成されて
分極処理された一対の圧電セラミック板(4)を対面接
合してなるバイモルフ型検出素子(1)を備えた加速度
センサであって、 バイモルフ型検出素子(1)は、主表面上に電極パター
ン(6,7)が印刷された一対の圧電セラミックグリー
ンシート(5)を重ね合わせ、かつ、これらを厚み方向
に沿って加圧したうえで焼成した後、焼成によって得ら
れたセラミック積層体のそれぞれに対する分極処理を行
って作製されたものであることを特徴とする加速度セン
サ。
1. An acceleration sensor comprising a bimorph type detection element (1) comprising a pair of piezoelectric ceramic plates (4) having electrodes (2, 3) formed on a main surface and polarized, which are face-to-face bonded. Therefore, the bimorph type detection element (1) has a main surface on which a pair of piezoelectric ceramic green sheets (5) on which electrode patterns (6, 7) are printed are superposed, and these are applied along the thickness direction. An acceleration sensor manufactured by subjecting each of the ceramic laminates obtained by firing to pressure and firing, and then subjecting each to a polarization treatment.
JP05173018A 1993-03-19 1993-07-13 Method of manufacturing acceleration sensor Expired - Lifetime JP3136847B2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP05173018A JP3136847B2 (en) 1993-07-13 1993-07-13 Method of manufacturing acceleration sensor
EP94104240A EP0616221B1 (en) 1993-03-19 1994-03-17 Acceleration sensor
SG1996003655A SG52374A1 (en) 1993-03-19 1994-03-17 Acceleration sensor
EP94104238A EP0616222B1 (en) 1993-03-19 1994-03-17 Acceleration sensor
DE69403252T DE69403252T2 (en) 1993-03-19 1994-03-17 Accelerometer
SG1996005179A SG52493A1 (en) 1993-03-19 1994-03-17 Acceleration sensor
DE69414739T DE69414739T2 (en) 1993-03-19 1994-03-17 Accelerometer
US08/210,004 US5515725A (en) 1993-03-19 1994-03-18 Piezoelectric bimorph type acceleration sensor
US08/210,370 US5490422A (en) 1993-03-19 1994-03-18 Acceleration sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05173018A JP3136847B2 (en) 1993-07-13 1993-07-13 Method of manufacturing acceleration sensor

Publications (2)

Publication Number Publication Date
JPH0727784A true JPH0727784A (en) 1995-01-31
JP3136847B2 JP3136847B2 (en) 2001-02-19

Family

ID=15952685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05173018A Expired - Lifetime JP3136847B2 (en) 1993-03-19 1993-07-13 Method of manufacturing acceleration sensor

Country Status (1)

Country Link
JP (1) JP3136847B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768532A2 (en) * 1995-10-09 1997-04-16 Matsushita Electric Industrial Co., Ltd Acceleration sensor and method for producing the same, and shock detecting device using the same
FR2784753A1 (en) * 1998-10-19 2000-04-21 Murata Manufacturing Co ACCELERATION SENSOR AND ACCELERATION DETECTION DEVICE
JP2002062310A (en) * 2000-08-23 2002-02-28 Hokuriku Electric Ind Co Ltd Piezoelectric acceleration sensor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768532A2 (en) * 1995-10-09 1997-04-16 Matsushita Electric Industrial Co., Ltd Acceleration sensor and method for producing the same, and shock detecting device using the same
EP0768532A3 (en) * 1995-10-09 1997-07-23 Matsushita Electric Ind Co Ltd Acceleration sensor and method for producing the same, and shock detecting device using the same
US6098460A (en) * 1995-10-09 2000-08-08 Matsushita Electric Industrial Co., Ltd. Acceleration sensor and shock detecting device using the same
FR2784753A1 (en) * 1998-10-19 2000-04-21 Murata Manufacturing Co ACCELERATION SENSOR AND ACCELERATION DETECTION DEVICE
JP2002062310A (en) * 2000-08-23 2002-02-28 Hokuriku Electric Ind Co Ltd Piezoelectric acceleration sensor
JP4573969B2 (en) * 2000-08-23 2010-11-04 北陸電気工業株式会社 Piezoelectric three-axis acceleration sensor

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