JPH07276644A - Ink jet recording head, its manufacture and recording with the recording head - Google Patents

Abstract

PURPOSE:To make it possible to miniaturize a head mounted on a printer which is operated at a high speed and is capable of producing a brilliant color image by supplying a bent type ink jet recording head which does not generate damage to a protecting membrane for a thermal resistor and a heat accumulation layer in a manufacturing step. CONSTITUTION:In a side-type ink jet recording head consisting of an ink discharge orifice for discharging ink provided over a substrate, a heat accumulation layer 2 of an organic resin is laminated on the substrate 1 which is bent with a thermal resistor 3 and wiring 4 patterned on the heat accumulation layer 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a side type ink jet recording head in which an ink ejection port for ejecting ink is provided above a substrate, a method for manufacturing the same, and a recording apparatus equipped with the recording head, and more particularly to heat generation. The present invention relates to a bending type inkjet recording head in which a substrate surface on which a resistor is formed and a substrate surface on which external connection terminals are formed have an angle of at least larger than 0 °.

[0002]

2. Description of the Related Art An on-demand type ink jet recording head using a conventional heating resistor has an edge type ink jet recording head in which an ink ejection port is formed at the end of a substrate as shown in FIG. 7 and an ink jet recording head as shown in FIG. 2 of the side type inkjet recording head in which the ink ejection port is formed above the substrate
The species is known.

In the edge type ink jet recording head shown in FIG. 7, since the normal line of the wiring surface and the ink ejection direction form an angle of approximately 90 degrees, the distance between the paper and the ejection port is an IC for driving. Since it does not depend on the mounting method, it has an advantage that various methods such as wire bonding, TAB, and flip chip are possible as a method for electrical connection. However, in this type of head, since the ink discharge nozzles are arranged in a line, a similar fine pattern is required to form a head that enables a fine line drawing. The more difficult it is, the more difficult it becomes.

Further, since the thermal ink jet head has a property of ejecting ink having higher viscosity as the distance between the heating resistor and the ink ejection port is shorter, it can be said to be a fatal defect of the ink jet after being left for a long time. It is difficult to find a good result with the edge type head for printing, and the ink ejection port of the head is capped,
Under the current circumstances, measures such as sucking ink from the direction of the ink ejection port are taken after leaving it for a long time.

In the side type ink jet recording head shown in FIG. 8, since the ink discharge ports can be formed by photolithography, the positions of the ink discharge ports can be precisely adjusted regardless of the fine print arrangement or the staggered arrangement. Even if the ejection ports are formed at a pitch twice as large as that of the fine pattern, it is possible to easily form a head that can deal with the fine pattern. Further, since the distance between the ink ejection port and the heating resistor is determined by the thickness of the ink ejection port forming plate (orifice plate) and the thickness of the ink flow path forming resin, there is an advantage that ink can be ejected even for high viscosity ink. To have.

However, in this type of recording head, the ink ejection direction and the normal to the wiring surface are parallel to each other. Therefore, in order to make the distance between the ink ejection port and the paper as short as necessary to maintain the printing quality. It is necessary to mount and connect a driving IC of low height. Therefore, TAB is usually used. This method has a problem that the price is high and it is difficult to improve the reliability of the connection.

Further, since it is necessary to supply the ink from the back surface of the head, it is necessary to make a hole in the substrate, and it is difficult to change the ink supply speed (refill) with the accuracy. Further, there is a drawback that it is difficult to form a large head because the strength is insufficient when a large head is formed due to the holes in the substrate.

[0008]

At the present time, computers are becoming faster in color and at higher speeds, and printers are required to be higher in color, faster, and more vivid as well as the performance of computers. However, the recording head provided in the above-mentioned conventional printer does not sufficiently meet these requirements.

Therefore, a bent type ink jet recording head in which a part of the head is bent is proposed as a modification of the side type ink jet recording head. Figure 9
FIG. 6 is a schematic diagram showing an example of a conventional bending type inkjet recording head. In this method, a bendable material is used for the substrate, and the head is patterned and then bent. This type of inkjet recording head can shorten the distance between the heater and the ejection port, so even if printing is performed after long-term storage, there is relatively little ejection failure. And IC
By bending the board so that the plane on which the components are mounted is not on the same plane, the height of the mounting portion can be set freely. This has the advantage that the distance between them can be maintained appropriately.

However, the heat storage layer formed on the substrate and the protective film formed to prevent the oxidation of the heating resistor of the head have different amounts of extension between the front and back of the bent substrate and pull the film. Since a peeling force is generated or the elongation itself cannot be endured, the curvature cannot be endured, and peeling, cracking or the like as shown in FIG. 9 may occur.

In view of the current state of the head, it is an object of the present invention to provide a side type ink jet recording head which is capable of high speed, color and high definition and can be mounted on a printer in a small size.

[0012]

According to the present invention to achieve the above object, in a side type ink jet recording head in which an ink ejection port for ejecting ink is provided above a substrate, the substrate is made of an organic resin. An ink jet recording head in which a heat storage layer is laminated, a heating resistor and wiring are patterned on the heat storage layer, and then the substrate is bent.

In the ink jet recording head of the present invention, a metal protective film is formed on the patterned heating resistor and wiring, and after the substrate is bent, at least the metal protective film on the heating resistor is insulated. It includes the following.

Further, the ink jet recording head of the present invention includes one using an organic resin as a wiring protective film.

Further, the ink jet recording head of the present invention includes one in which a part of the heating resistor is anodized after the substrate is bent.

Further, the ink jet recording head of the present invention includes one in which the substrate is curved after the heating resistor and the wiring are patterned.

The ink jet recording head of the present invention includes one in which at least a part of the wiring portion of the external connection terminal draws an arc from the rear end of the heating resistor.

Further, the ink jet recording head of the present invention includes one in which the substrate in the portion where the ink flow path is not formed is bent.

Further, according to the present invention, an ink ejection port for ejecting ink is provided above the substrate, and a normal line of the substrate surface on which the heating resistor is formed and a substrate surface on which the external connection terminal is formed. In a method of manufacturing a bent type inkjet recording head in which an angle θ with a normal line is not 0 °, a heat storage layer made of an organic resin is laminated on a substrate, and a heating resistor and wiring are patterned on the heat storage layer. After that, the method for manufacturing an inkjet recording head is characterized in that the substrate is bent.

Further, in the manufacturing method of the present invention, a metal protective film is formed on the patterned heating resistor and the wiring, and after the substrate is bent, at least the metal protective film on the heating resistor is insulated. It includes.

Further, the manufacturing method of the present invention includes using an organic resin as the wiring protective film.

Further, the manufacturing method of the present invention comprises bending the substrate and then anodizing a part of the heating resistor.

Further, the manufacturing method of the present invention includes bending the substrate after patterning the heating resistor and the wiring.

Further, the manufacturing method of the present invention includes bending from the rear end of the heating resistor so that at least a part of the wiring portion of the external connection terminal draws an arc.

Further, the manufacturing method of the present invention includes bending the portion of the substrate where the ink flow path is not formed.

Further, according to the present invention, the ink jet recording head according to any one of the above, which is provided with an ink ejection port for ejecting ink toward a recording surface of a recording medium, and the ink jet recording head is mounted thereon. And a member for operating the recording device.

[0027]

The present invention uses a substrate made of a bendable material,
(1) To form a heating resistor that does not require a protective film,
(2) The protective film of the heating resistor is first made of metal and the substrate is bent, and then the metal protective film is insulated. (3) An organic resin that does not easily crack even when bent is used as the protective film of the wiring. (4) forming a wiring protective film of metal and bending the substrate before insulating the metal protective film; (5) a circle having an arc from the heating resistor portion to the external connection terminal in the entire substrate. It is possible to provide a bending-type inkjet head in which the protective film and the heat storage layer of the heating resistor are not cracked or peeled off by curving the entire substrate so as to draw. Further, the ink ejection port is provided substantially above the heating resistor provided on the substrate.

The ink jet recording head of the present invention is of the side type, and in addition to the side surface, the substrate surface (hereinafter referred to as the heating resistor forming surface) and the substrate surface where the external connection terminals are formed at the position where the heating resistor is formed. (Hereinafter, the external connection terminal forming surface) is a bending type inkjet recording head having a surface angle of at least greater than 0 degree. FIG. 10 is a schematic view for explaining the angle between the heating resistor formation surface and the external connection terminal formation surface. Where θ
Is the angle formed by the normal line of the heating resistor forming surface 19 and the normal line of the external connection terminal forming surface 20, and ψ is the heating resistor forming surface 1
9 is the outer angle of the angle between the tangent line 9 and the tangent line of the external connection terminal forming surface 20. The substrate can be bent by making a notch in the bottom. A metal is suitable as such a substrate material, and Al, Al alloys, iron, stainless steel, copper and the like are particularly preferable.

Further, in the present invention, "bend" has a broad meaning including curvature. As a method of bending the substrate,
There are a method of bending the substrate in advance into a desired shape and applying pressure from the outside, a method of holding one end of the substrate and displacing the other end in the bending direction. A metal is suitable as such a substrate material, and particularly Al, Al alloy,
Iron, stainless steel, copper and the like are preferable.

As a material for the heat storage layer, a material which does not cause cracks or the like due to bending, particularly an organic resin is suitable, and for example, polyimide, polyamide, polyamideimide, polyetherimide, polyetheramide or the like can be used.

As the material of the heating resistor, TaAl, T
By using aAlPt, TaIr, TaPt, or the like, it is possible to form a heating resistor body that does not require a protective film.

As the wiring material, Al, copper, gold, platinum,
A multi-layered wiring material in which anodizable Al, TaAl, or the like is formed on tungsten may be used as long as it is normally used for an inkjet recording head.

Examples of the organic resin used as the wiring protection film include polyimide, polyamideimide, polyetherimide, polyetheramide and the like.

Examples of the method for insulating the metal protective film or the heating resistor include an anodic oxidation method (barrier anodic oxidation method, porous anodic oxidation method) and the like.

The present invention provides excellent effects particularly in a recording head and a recording apparatus of the inkjet recording system in which flying droplets are formed by utilizing thermal energy among the inkjet recording systems.

Regarding the typical structure and principle thereof, see, for example, US Pat. Nos. 4,723,129 and 4740.
What is done using the basic principles disclosed in 796 is preferred. This method can be applied to both the so-called on-demand type and continuous type, but especially in the case of the on-demand type, liquid (ink)
By applying at least one drive signal to the electrothermal converter arranged corresponding to the sheet or liquid path in which is stored, which corresponds to the recorded information and causes a rapid temperature rise exceeding nucleate boiling. It is advantageous because it generates heat energy in the electrothermal converter, causes film boiling on the heat acting surface of the recording head, and consequently forms bubbles in the liquid (ink) corresponding to this drive signal on a one-to-one basis. Is. The liquid (ink) is ejected through the ejection openings by the growth and contraction of the bubbles to form at least one droplet. It is more preferable to make the driving signal into a pulse shape because bubbles can be grown and contracted immediately and appropriately, and thus a liquid (ink) with excellent responsiveness can be ejected.

As the pulse-shaped drive signal, those described in US Pat. Nos. 4,463,359 and 4,345,262 are suitable. still,
US Patent No. 4 of the invention relating to the rate of temperature rise of the heat acting surface
If the conditions described in the specification of No. 313124 are adopted, more excellent recording can be performed.

As the constitution of the recording head, in addition to the combination constitution of the discharge port, the liquid passage, and the electrothermal converter (the linear liquid passage or the right-angled liquid passage) as disclosed in the above-mentioned respective specifications. The present invention also includes configurations using US Pat. No. 4,558,333 and US Pat. No. 4,459,600, which disclose a configuration in which a heat acting portion is arranged in a bending region.

In addition, JP-A-59-123670, which discloses a structure in which a common slit is used as a discharge portion of the electrothermal converter for a plurality of electrothermal converters, and a pressure wave of thermal energy is absorbed. The present invention is also effective as a configuration based on Japanese Patent Application Laid-Open No. 59-138461, which discloses a configuration in which an opening corresponds to a discharge portion.

Further, as a full line type recording head having a length corresponding to the width of the maximum recording medium which can be recorded by the recording apparatus, a combination of a plurality of recording heads as disclosed in the above-mentioned specification provides the length. The present invention can exert the above-mentioned effects more effectively, although it may have a configuration that satisfies the above requirement or a configuration as one recording head integrally formed.

In addition, by being mounted on the apparatus main body, it can be electrically connected to the apparatus main body and can be supplied with ink from the apparatus main body by a replaceable chip type recording head or the recording head itself. The present invention is also effective when a cartridge-type recording head provided with an ink tank is used.

Further, it is preferable to add recovery means for the recording head, preliminary auxiliary means, etc., which are provided as a configuration of the recording apparatus of the present invention, because the effects of the present invention can be further stabilized. If you list these specifically,
Capping means, cleaning means, pressurizing or sucking means for the recording head, preheating means by an electrothermal converter or another heating element or a combination thereof, and a preliminary ejection mode for performing ejection other than recording It is also effective to perform stable recording.

Further, the recording mode of the recording apparatus is not limited to the mode in which only the mainstream color such as black is recorded, but the recording head may be integrally formed or a plurality of them may be combined. The present invention is extremely effective for an apparatus provided with at least one of full color by color mixing.

In the embodiments of the present invention described above, the liquid ink is used for the description. However, the ink solidifies at room temperature or lower and softens at room temperature, or is a liquid, or the above-mentioned. In the inkjet method, since the temperature of the ink itself is adjusted within a range of 30 ° C. or higher and 70 ° C. or lower to control the temperature of the ink so that the viscosity of the ink is within a stable ejection range, the ink is applied when a use recording signal is applied. May be liquid.

In addition, the temperature rise due to thermal energy is positively prevented by using it as the energy for changing the state of the ink from the solid state to the liquid state, or the ink is left standing for the purpose of preventing ink evaporation. In either case, the ink is liquefied by applying thermal energy according to the recording signal of the thermal energy and ejected as a liquid ink, or when it reaches the recording medium, it already begins to solidify. The use of an ink having the property of liquefying only when heat energy is applied is also applicable to the present invention. In such a case, the ink is disclosed in JP-A-54-56847 or JP-A-60-7126.
As described in Japanese Patent Laid-Open No. 0-202, it may be configured to face the electrothermal converter in a state of being held as a liquid or a solid in the concave portion or the through hole of the porous sheet.
In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

In addition, as a form of the recording apparatus according to the present invention, in addition to a recording apparatus provided integrally or separately as an image output terminal of information processing equipment such as a word processor or a computer, a copying apparatus combined with a reader or the like, May take the form of a facsimile machine having a transmission / reception function.

[0047]

EXAMPLES The present invention will be specifically described below with reference to examples.

Example 1 FIG. 1 shows an example according to the present invention. Flexible board 1
An Al substrate was used as the heat storage layer 2, and the heat storage layer 2 was made of polyimide that did not crack even when bent and could withstand the high temperature during printing. The above-mentioned polyimide was applied onto a substrate with a spin coater at a rotation speed of 50 Hz, and cured at 100 ° C., 400 ° C. for 2 minutes and 2 hours. The film thickness after curing is 0.5 μm. After that, Ta / Ir is 100 nm for the heating resistor and Al for the wiring.
Was sputtered for 500 nm. Ta / Ir and Al were patterned by photolithography to form the heating resistor 3 and the wiring 4 (step (a) in the figure).
The flow path forming resist 6 for forming the nozzle is 30 to
50 μm was applied and dried. Next, the epoxy resin 7 for forming the liquid chamber and the ink flow path was poured (step (b) in the figure). This is cured to form an epoxy resin layer, on which a Si-based resist 8 is applied and dried, then exposed and developed,
An ink ejection port pattern was formed by dry etching with CF ₄ + O ₂ (step (c) in the figure). Si resist 8
After the flow path forming resist 6 is removed to form the ink ejection port 22 and the ink inflow port 23, the angle θ formed by the normal line of the heating resistor forming surface 19 and the normal line of the external connection terminal forming surface 20 is formed. The substrate was bent so that the angle was 60 ° (step (c) in the figure). The bending was performed by making a cut in the substrate and bending the portion. Unlike the conventional head, an inorganic film was not used for the protective film and the heat storage layer of the heating resistor, and the heat storage layer was made of an organic resin, so even if the substrate was bent, no cracking or peeling occurred.

After bending the board, the external connection terminals 18
An IC for driving the head was connected to. The external connection terminal is a portion that is not covered with the wiring protective film at the wiring end portion where the ejection port is not formed. The ink tank 21 was attached so as to cover the circumference of the ink inflow port formed at the edge portion of the recording head so that the ink in the ink tank 21 could flow from the ink inflow port 23 into the ink flow path. Figure 1
FIG. 1 is a sectional view showing an example of an inkjet recording head to which an ink tank is attached. The inkjet recording head according to the present invention was completed through the above steps.

Embodiment 2 FIG. 2 shows another embodiment according to the present invention. An Al substrate was used as the bendable substrate 1, and the heat storage layer 2 was made of polyimide that did not crack even when bent and could withstand the high temperature during printing. The above-mentioned polyimide was applied with a spin coater at a rotation speed of 50 Hz and cured at 100 ° C., 400 ° C. for 2 minutes and 2 hours. The film thickness after curing was 0.5 μm. After that, Ta / Ir is 100 nm for the heating resistor and Al for the wiring.
Was sputtered for 500 nm. Ta / Ir and Al were patterned by photolithography to form the heating resistor 3 and the wiring 4. Further, as the wiring protective film 5, polyimide was applied by spin coating to a thickness of 2 to 3 μm (step (a) in the figure). The rotation speed during spin coating was 50 Hz. This polyimide is cured to form a flow path forming resist 6 to 30 to 5 in order to form a nozzle.
0 μm was applied and dried. Next, the epoxy resin 7 for forming the liquid chamber and the ink flow path was poured (step (b) in the figure). In FIG. 2, (b ′) is a cross-sectional view of the XY cut surface of the head shown in step (b) as seen from the arrow direction. By curing this, a Si-based resist 8 is applied on the epoxy resin.
Was applied, dried, exposed and developed, and an ink discharge port pattern was formed by dry etching with CF ₄ + O ₂ (step (c) in the figure). In FIG. 2, (c ′) is a cross-sectional view of the XY cut surface of the head shown in step (c) as seen from the arrow direction.
After removing the Si-based resist 8 and the flow path forming resist 6 to form the ink ejection port 22 and the ink inflow port 23,
Normal line of heating resistor forming surface 19 and external connection terminal forming surface 20
The substrate was bent in the same manner as in Example 1 such that the angle θ formed by the normal line of (2) was 60 ° (step (d) in the figure). Unlike the conventional head, an inorganic film was not used for the protective film and the heat storage layer of the heating resistor, and the heat storage layer was made of an organic resin, so even if the substrate was bent, no cracking or peeling occurred.

After bending the board, the external connection terminals 18
A head driving IC was connected to the same as in Example 1. The ink tank 21 was attached in the same manner as in Example 1. The inkjet recording head according to the present invention was completed through the above steps.

Embodiment 3 FIG. 3 shows another embodiment according to the present invention. Polyimide was applied as a heat storage layer 2 on the bendable substrate 1 by spin coating at 50 Hz. Curing was performed in an inert gas oven at 400 ° C. for 2 hours, and Ta was sputtered as a heating resistor and Al was sputtered as a wiring material. The film thickness is 100 nm and 500 nm, respectively. After patterning the heating resistor 3 and the wiring 4 by photolithography, Al was sputtered as a protective film 9 for the wiring 4 and the heating resistor 3. The film thickness is 100 nm.

Al on the flow path forming surface cannot be anodized once the flow path is formed. Therefore, the flow path forming resist 6 was first formed with the flow path forming resist 6 (step (a) in the figure). This was immersed in an anodizing solution to oxidize the exposed portion. While this resist was left as it was, the epoxy resin 7 forming the ink flow path was poured (step (b) in the figure), and the Si-based resist 8 was further applied. After curing at a temperature of about 80 ° C. and forming a pattern for the ink discharge port with the Si-based resist 8, the epoxy resin 7
Was dry-etched with CF ₄ + O ₂ gas to pattern the discharge port (step (c) in the figure). Si resist 8
The flow path forming resist 6 which was peeled off and further used for formation
By cleaning and removing the ink, the ink ejection port 22 and the ink inflow port 23
After forming, cut the substrate according to the size of the head,
Normal line of heating resistor forming surface 19 and external connection terminal forming surface 20
The substrate was bent so that an angle θ formed by the normal line of (6) was 60 ° (step (d) in the figure). Al anodized previously
Is located at a position where it is not affected by bending on the substrate, so there is no major problem even if cracks are generated by bending. Since Al on the heating resistor remains a metal, peeling or cracking does not occur even when bent. After that, Al in a portion that is not anodized (corresponding to the ink flow path) was oxidized by anodization to be insulated. The ink tank 21 was attached to the recording head as in the first embodiment.

The ink jet recording head according to the present invention was completed by connecting (wire bonding) the external connection terminals 18 on which no insulating film was formed on the wiring and the head driving ICs.

Embodiment 4 FIG. 4 shows another embodiment of the present invention. Polyimide was applied as a heat storage layer 2 on the bendable substrate 1 by 0.5 μm spin coating. The rotation is 50 Hz. 100
After condensing and curing with step cure at ℃ and 400 ℃,
Ta is used as the heating resistor and Al is used as the wiring 16
Sputtering was performed at 0 nm and 500 nm. The wiring 4 and the heating resistor 3 were patterned by photolithography. Polyimide 2 to 3 μm was applied and cured as a protective film 5 for the wiring while avoiding the heating resistor portion (step (a) in the figure). After that, the photo-curing epoxy resin 15 was applied to the substrate, the ink flow path pattern was exposed, and the epoxy resin 7 for closing the flow path without development was applied (step (b) in the figure). The upper epoxy 7 was temporarily cured to form an ink discharge port pattern (step (c) in the figure). After the epoxy exposed to the ink flow path pattern is washed away from the ejection port and then fully cured to form the ink ejection port 22 and the ink inflow port 23, the normal line of the heating resistor forming surface 19 and the external connection terminal forming surface 20 are formed. The substrate was bent so that the angle θ with the normal was 60 °.
This substrate was put in an anodizing solution, and an electrode previously connected to the whole was used as an anode, and a platinum electrode was used as a cathode to anodize the exposed portion of the heating resistor (step (d) in the figure).

The ink tank 21 was attached in the same manner as in Example 1, and the ICs for driving the heating resistors were wire-bonded to the external connection terminals 18 which were not anodized to complete the ink jet recording head according to the present invention. .

Embodiment 5 FIG. 5 shows another embodiment according to the present invention. Polyimide was applied as a heat storage layer 2 on the bendable substrate 1 by spin coating at 50 Hz. Curing was performed in an inert gas oven at 400 ° C. for 2 hours, and Ta was sputtered as a heating resistor and Al was sputtered as a wiring material. Film thickness is 100n
m and 500 nm. After patterning the heating resistor 3 and the wiring 4 by photolithography, Al was sputtered as a protective film 17 for the wiring and the heating resistor. The film thickness is 100 nm.

The substrate having Al formed on the entire surface was immersed in an anodizing solution to anodize the entire surface of the remaining wiring portion except the wiring portion to be the external connection terminal. At this time, it is necessary to determine the voltage so as to completely oxidize the Al film thickness (100 nm in this case). This time it was 100V. Further, when the substrate is bent in the next step, Al which becomes a protective film for the wiring is formed.
A protective film 16 made of an organic resin is further laid on the wiring in preparation for the occurrence of cracks in the oxide film. This time, polyimide was applied in a thickness of 2 to 3 μm (step (a) in the figure). Then, a portion to be a flow channel was formed with a flow channel forming resist 6. While this resist was left as it was, the epoxy resin 7 forming the ink flow path was poured (step (b) in the figure), and the Si-based resist 8 was further applied. Cures at a temperature of about 80 ° C,
After forming the pattern for the ink ejection port with a resist, the epoxy resin 7 was dry-etched with CF ₄ + O ₂ gas to form the pattern of the ejection port (step (c) in the figure). After removing the Si-based resist 8 and washing and removing the flow path forming resist 6 used for the formation to form the ink ejection port 22 and the ink inflow port 23, the substrate is removed according to the size of the head. After cutting, the substrate was bent so as to draw a large arc while keeping the vicinity of the heating resistor flat. (Step (d) in the figure). As a bending method, the heating resistor forming surface 1
Angle θ formed by the normal line 9 and the normal line of the external connection terminal forming surface 20
The substrate was put on a mold that had been previously deformed so that the angle was 60 degrees, and was gradually deformed by applying pressure gradually from the direction opposite to the mold.

Here, although the anodized Al is present on the entire surface of the substrate, since the particularly important heating resistor portion is a flat surface, cracks do not occur, and if it is bent, cracks occur on the wiring. As described above, there is no problem because the organic protective film is formed on the organic protective film.

The ink tank 21 is attached in the same manner as in the first embodiment, and the external connection terminal 1 in which the insulating film on the wiring is not formed
8 and a head driving IC were connected (wire bonding) to complete the ink jet recording head according to the present invention.

Embodiment 6 FIG. 6 shows another embodiment according to the present invention. Polyimide was applied as a heat storage layer 2 on the bendable substrate 1 by spin coating at 50 Hz. Curing was performed in an inert gas oven at 400 ° C. for 2 hours, and Ta was sputtered as a heating resistor and Al was sputtered as a wiring material. Film thickness is 100n
m and 500 nm. After patterning the heating resistor 3 and the wiring 4 by photolithography, the wiring 4
Then, Al was sputtered as the protective film 17 of the heating resistor 3. The film thickness is 100 nm.

The substrate on which Al was entirely formed was dipped in an anodizing solution to anodize the entire surface of the remaining wiring portion except for the wiring portion to be the external connection terminal. At this time, it is necessary to determine the voltage so as to completely oxidize the Al film thickness (100 nm this time). This time it was 100V. Furthermore, when the substrate is bent in the next step, a protective film 16 made of an organic resin is further laid on the wiring in preparation for cracks in the Al oxide film, which serves as a protective film on the wiring. This time, polyimide was applied in a thickness of 2 to 3 μm (step (a) in the figure). Then, a portion to be a flow channel was formed with a flow channel forming resist 6. While this resist was left as it was, the epoxy resin 7 forming the ink flow path was poured (step (b) in the figure), and the Si-based resist 8 was further applied. After curing at a temperature of about 80 ° C. and forming a pattern for the ink ejection port with the Si-based resist 8, the epoxy resin 7 is etched with CF ₄ + O ₂ gas to form the pattern of the ejection port (step (in the figure, c)). The Si-based resist 8 is peeled off, and the flow path forming resist 6 used for forming the resist 6
By cleaning and removing the ink, the ink ejection port 22 and the ink inflow port 23
After the formation, the substrate is cut in accordance with the size of the head, and while keeping the vicinity of the heating resistor and the surface where the ink flow path is formed into a flat surface, The substrate was bent so that the angle θ formed by the normal to the external connection terminal forming surface 20 was 60 ° (step (d) in the figure).

Here, although the anodized Al is present on the entire surface of the substrate, no crack is generated because the heating resistor portion and the ink flow path, which are particularly important, are made flat. Even if it occurs, there is no problem because the organic protective film is present thereon as described above.

The ink tank 21 is attached in the same manner as in the first embodiment, and the external connection terminal 1 on which the insulating film on the wiring is not formed
8 was connected to a head driving IC (wire bonding) to complete an ink jet recording head according to the present invention.

[0065]

According to the present invention, it is possible to provide a side type and bending type head in which the protective film of the heating resistor and the heat storage layer are not cracked or peeled off in the manufacturing process thereof. The invention has the effect of providing a compact and highly reliable head.

Further, since it is not necessary to make a hole in the substrate for ink supply, the problem of the prior art that the speed of ink supply changes depending on the accuracy at the time of making a hole can be solved. Further, since it is not necessary to make a hole in the substrate for supplying ink, the problem of the prior art such as insufficient strength is solved, which is advantageous for forming a large head.

[Brief description of drawings]

FIG. 1 is a process drawing showing an example of a manufacturing process of an inkjet recording head according to the present invention.

FIG. 2 is a process drawing showing another example of the manufacturing process of the inkjet recording head according to the present invention.

FIG. 3 is a process drawing showing another example of the manufacturing process of the inkjet recording head according to the present invention.

FIG. 4 is a process drawing showing another example of the manufacturing process of the inkjet recording head according to the present invention.

FIG. 5 is a process drawing showing another example of the manufacturing process of the inkjet recording head according to the present invention.

FIG. 6 is a process drawing showing another example of the manufacturing process of the inkjet recording head according to the present invention.

FIG. 7 is a schematic cross-sectional view showing an example of a conventional edge-type inkjet recording head.

FIG. 8 is a schematic cross-sectional view showing an example of a conventional side type inkjet recording head.

FIG. 9 is a schematic cross-sectional view showing an example of a conventional bending type inkjet recording head.

FIG. 10 is a schematic diagram illustrating an angle between a heating resistor formation surface and an external connection terminal formation surface.

FIG. 11 is a schematic view showing an example of an inkjet recording head to which an ink tank is attached.

[Explanation of symbols] 1 substrate 2 heat storage layer 3 heating resistor 4 wiring 5 wiring protective film 6 flow path forming resist 7 epoxy resin 8 Si-based resist 9 Al (heat generating resistor protective film) 10 anodized film 11 anodized film 12 Channels and Liquid Chambers 13 Ink Supply Ports 14 Ink Drops 15 Photo-curing Epoxy Resin 16 Organic Protective Film 17 Protective Films for Heating Resistors and Wirings 18 External Connection Terminals 19 Surfaces on which Heating Resistors are Formed 20 External Connection Terminals on Surface 21 Ink Tank 22 ink outlet 23 ink inlet

Claims (15)

[Claims] 1. A side type ink jet recording head having an ink ejection port for ejecting ink provided above a substrate, wherein a heat storage layer made of an organic resin is laminated on the substrate, and a heat generating resistor is formed on the heat storage layer. An inkjet recording head in which a substrate is bent after a body and wiring are patterned. 2. The metal protective film is formed on the patterned heating resistor and the wiring, and after the substrate is bent, at least the metal protective film on the heating resistor is insulated. Inkjet recording head. 3. The ink jet recording head according to claim 1, wherein an organic resin is used as the wiring protective film. 4. The ink jet recording head according to claim 3, wherein a part of the heating resistor is anodized after the substrate is bent. 5. The ink jet recording head according to claim 1, wherein the substrate is curved after the heating resistor and the wiring are patterned. 6. The ink jet recording head according to claim 5, wherein at least a part of the wiring portion of the external connection terminal draws an arc from the rear end of the heating resistor. 7. The ink jet recording head according to claim 1, wherein the substrate in a portion where the ink flow path is not formed is bent. 8. An ink ejection port for ejecting ink is provided above the substrate, and a normal line to the substrate surface on which the heating resistor is formed and a normal line to the substrate surface on which the external connection terminals are formed. In a method of manufacturing a bent type inkjet recording head having an angle θ of at least greater than 0 °, a method of
A method for manufacturing an ink jet recording head, comprising laminating a heat storage layer made of an organic resin, patterning a heating resistor and wiring on the heat storage layer, and bending the substrate. 9. The manufacturing method according to claim 8, wherein a metal protective film is formed on the patterned heating resistor and the wiring, and after bending the substrate, at least the metal protective film on the heating resistor is insulated. . 10. The manufacturing method according to claim 8, wherein an organic resin is used as the wiring protection film. 11. The manufacturing method according to claim 10, wherein after the substrate is bent, a part of the heating resistor is anodized. 12. The manufacturing method according to claim 8, wherein the substrate is curved after the heating resistor and the wiring are patterned. 13. The manufacturing method according to claim 12, wherein at least a part of the wiring portion of the external connection terminal is curved so as to form an arc from the rear end of the heating resistor. 14. The manufacturing method according to claim 8, wherein the substrate in a portion where the ink flow path is not formed is bent. 15. The ink jet recording head according to claim 1, further comprising an ink ejection port for ejecting ink toward the recording surface of the recording medium. A recording device, comprising: a member for setting.