JPH0726862Y2 - Hybrid integrated circuit board module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to an improvement of a hybrid integrated circuit board module in which a child circuit board is mounted on a parent circuit.

[Prior Art] A conventional hybrid integrated circuit module in which a so-called single-in-line child circuit board is mounted on a parent circuit board will be described with reference to FIGS. 5 and 6.
That is, as shown in FIG. 5, the terminal electrodes 7, 7 ... Are provided along the side edges of the subsidiary circuit board 4, and the lead terminals 9,
9 are soldered, and these lead terminals 9, 9 ... Are projected from the side of the subsidiary circuit board 4 at a constant interval.

On the other hand, in the parent circuit board 1 on which the child circuit board 4 is mounted,
The through holes 8 and 8 according to the intervals of the lead terminals 9 and 9 ...
.. are perforated, and soldered electrodes 3, 3 ... With a conductor film are formed on the wall surface and around the opening. Then, as shown in FIG. 6, lead terminals 9, 9 are provided in the through holes 8, 8 ,.
... is inserted and the lead terminals 9 and 9 are soldered to the through-hole conductors formed on the periphery thereof and on the wall surfaces of the through holes 8, 8.

In FIGS. 5 and 6, reference numeral 5 denotes an electronic component mounted on the subsidiary circuit board 4.

However, the conventional hybrid integrated circuit board module has the following problems. That is, since the lead terminals 9, 9 ... Are pierced through the through holes 8, 8 ... For soldering, the back surface of the parent circuit board 1 is also occupied by the mounting of the child circuit board 4, and the components on the back surface are correspondingly occupied. The mounting area is reduced, which is an obstacle to high-density mounting. Further, such mounting means has a problem that the mounting height of the child circuit board 4 from the board surface of the parent circuit board 1 becomes high, and it is difficult to downsize the hybrid integrated circuit board module.

In order to solve such a problem, there has been proposed a means for soldering the terminal electrode printed on the side surface or the end surface of the child circuit board to the solder electrode printed on the surface of the parent circuit board without using the lead terminal. However, in this case, the parent circuit board 1
However, it is unstable when the child circuit board 4 is mounted on the parent circuit board 1, the workability of soldering is poor, and the child circuit board is not easily mounted.

Therefore, for example, as shown in FIG. 4, a through hole or a recess 12 is formed on the parent circuit board 1, and the board supporting protrusions 2 are projected from the child circuit board 4 so as to correspond to the through hole or the recess 12. Then, the substrate supporting protrusions 2 and 2 are formed in the through holes or the recesses 12.
A hybrid integrated circuit board module fitted to the above has also been proposed. In this hybrid integrated circuit board module, the terminal electrodes 6, 6 ... And the soldering electrodes 3, 3 ...

In this hybrid integrated circuit board module, the terminal electrodes 6, 6
.. and the soldering electrodes 3, 3, ... are brought into surface contact with each other by soldering instead of through-hole connection, so that the child circuit board 4 is mounted on the back surface side of the parent circuit board 1 on which the child circuit board 4 is mounted. It is not occupied, and the mounting height from the board surface of the parent circuit board 1 can be kept low. Moreover, by mounting the board supporting protrusions 2 and 2 projecting from the child circuit board 4 into the through holes or the recesses 12 of the parent circuit board 1, the child circuit board 4 becomes self-supporting when mounted on the parent circuit board 1. , And mounting and soldering can be done easily.

[Problems to be Solved by the Invention] However, the parent circuit of the child circuit board 4 is formed by fitting the board supporting protrusions 2 of the child circuit board 4 into the through holes or the recesses 12 of the parent circuit board 1 as described above. When self-sustaining on the board 1, the positional accuracy of the through holes or recesses 12 in the parent circuit board 1 and the soldering electrodes 3, 3, ..., And the board supporting protrusions 2 and 2 and the terminal electrodes 6 in the child circuit board 4, Position accuracy with 6 ... Is extremely important.

That is, when the child circuit board 4 is mounted on the parent circuit board 1, the positioning of the parent circuit board 1 and the child circuit board 4 is performed by fitting the through holes or the recesses 12 and the board supporting protrusions 2 and 2. It Therefore, due to misalignment of the printing position, etc., the through hole or recess 12 in the parent circuit board 1 and the solder electrodes 3, 3
.., or the substrate support protrusions 2, 2 on the child circuit board 4 and the terminal electrodes 6, 6 ... Are misaligned with the solder electrodes 3, 3 ,. The terminal electrodes 6, 6 ... Of the subsidiary circuit board 4 are displaced from each other. Therefore, a connection failure or a short circuit between the soldering electrodes 3, 3 ... And the terminal electrodes 6, 6 ... Will occur.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to solve the above problems and provide a hybrid integrated circuit board module in which the soldering electrodes on the parent circuit board and the terminal electrodes of the child circuit board can be accurately aligned.

[Means for Solving the Problem] That is, in order to achieve the above-mentioned object, a hybrid integrated circuit board module according to the present invention has a child circuit board 4 mounted on a parent circuit board 1 and a circuit configured on the child circuit board 4. And a circuit configured on the parent circuit board 1 are connected to each other. In the hybrid integrated circuit board module, the terminal electrodes 6 and 6 ′ are arranged near the lower side of the side surface of the child circuit board 4, and Substrate supporting projections 2 and 2 are fixed to the terminal electrodes 6'and their tips are projected from the lower surface of the child circuit board 4, and the soldering electrodes 3 are provided on the parent circuit board 1 so as to correspond to the terminal electrodes 6 and 6 ', respectively. ,
3'is formed and through holes 11, 11 or recesses are provided at the positions of the soldering electrodes 3'corresponding to the terminal electrodes 6'of the subsidiary circuit board 4 to which the board supporting protrusions 2, 2 are fixed. , 11
Alternatively, the board supporting protrusions 2 and 2 of the child circuit board 4 are fitted and fixed in the recesses, and the terminal electrodes 6 and 6 ′ of the child circuit board 4 are respectively soldered to the corresponding solder electrodes 3 on the parent circuit board 1. It is characterized by being soldered to 3 '.

[Operation] In the hybrid integrated circuit board module according to the present invention, the soldering electrodes 3, 3'formed on one side of the parent circuit board 1 are close to the lower side of the side surface of the child circuit board 4 without using through holes. Since the terminal electrodes 6 and 6 ′ formed in the portions are soldered, the rear circuit board 4 does not occupy the back surface side of the parent circuit board 1 on which the child circuit board 4 is mounted, and from the plate surface of the parent circuit board 1. The mounting height of is also kept low. Moreover, the child circuit board 4 is
Through holes formed in the parent circuit board 1 with the board supporting protrusions 2 and 2
Since the sub circuit board 4 is self-supporting because it is fitted in the 11, 11, or the recesses 12, 12, the sub circuit board 4 can be easily mounted and soldered on the main circuit board 1, and the terminal electrodes 6, 6'and the soldered electrodes Positioning with 3, 3'can be performed accurately and surely.

Further, the board supporting projections 2, 2 of the child circuit board 4 are fixed to a part of the terminal electrodes 6 ', and
Since the through holes 11, 11 or the recesses are provided at the positions of the soldering electrodes 3'of the parent circuit board 1 corresponding to the above, the board supporting protrusions of the child circuit board 4 are provided in the through holes 11, 11 or the recesses of the parent circuit board 1. When 2 and 2 are fitted together, the soldering electrode 3 of the parent circuit board 1
3'and the terminal electrodes 6, 6'of the sub circuit board 4 are necessarily aligned. That is, the board supporting protrusions 2 and 2 fixed to the terminal electrodes 6'of the child circuit board 4 are formed in the through holes 11, 11 formed in the soldering electrodes 3'of the parent circuit board 1 or in the recesses. Since they fit together, the other soldering electrodes 3 and terminal electrodes 6
Also correspond at the same position, and their displacement cannot occur.

[Embodiment] Next, an embodiment of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, the sub circuit board 4 has a circuit formed by forming an electric circuit pattern (not shown) on the surface or inside of the ceramic substrate and mounting the electronic parts 5, 5, ... On the electric circuit pattern. ing. The terminal electrodes 6 and 6'are formed from the portion near the lower side of the side surface of the child circuit board 4 to the lower surface. The terminal electrodes 6 and 6'are connected to an electric circuit formed on the sub circuit board 4 through a circuit pattern.

Further, the board supporting protrusions 2 are attached to the child circuit board 4. For example, as the substrate support protrusions 2 and 2,
The same lead terminal made of a metal such as copper or nickel having good solderability is used, and one end portion is formed on both side surfaces of the child circuit board 4 as shown in FIGS. 2 and 3. Of the terminal electrodes 6, 6 ', only the terminal electrodes 6', 6'at both ends are conductively fixed with the solder 10. The mounting positions of the board supporting protrusions 2, 2, ... May be, for example, the central portion of the sub circuit board 4, and the number thereof may be one or three.

The parent circuit board 1 is formed by forming a circuit pattern (not shown) on the surface or inside of a substrate made of ceramic or resin.
Here, the child circuit board 4 and other electronic components as described above are mounted. On the parent circuit board 1, terminal electrodes 6 formed on a portion near the lower side of the side surface of the child circuit board 4,
Soldering electrodes 3, 3'are formed in accordance with the interval 6 '. The soldering electrodes 3 and 3'are formed by forming a circuit pattern on the surface of the parent circuit board 1 and, at the same time, printing a conductive paste, baking, forming a metal film, etching and the like. Also, through holes 11, 11 are provided in the soldering electrodes 3 ', 3'corresponding to the terminal electrodes 6', 6'to which the substrate supporting protrusions 2, 2 of the child circuit board 4 are fixed, and the through holes 11, 11 are formed. A conductor film is formed around the opening.

As shown in FIG. 2, the child circuit board 4 is placed on the horizontally held parent circuit board 1, and the board supporting protrusions 2 and 2 are fitted into the through holes 11 and 11 of the parent circuit board 1. At the same time, the lower side of the side where the terminal electrodes 6, 6 ′ are formed is brought into substantially surface contact with the plate surface of the parent circuit board 1. In this state, the substrate supporting protrusions 2 and 2 and the through holes 11 and 11 are fitted to each other so that the terminal electrodes 6 and 6'and the soldering electrodes 3 and 3'are aligned with each other. Then, as shown in FIG. 3, the terminal electrodes 6, 6'and the soldering electrodes 3, 3'are soldered.
While being electrically conductively fixed by 10, the substrate supporting protrusions 2, 2, ... Are also fixed by solder 10 to the solder electrodes 3 ', 3'. As a result, the terminal electrodes 6 ', 6'of the end are soldered to the soldering electrodes 3', 3'through the substrate supporting protrusions 2, 2, ..., And the other terminal electrodes 6, 6 ,. Attached electrodes 3, 3 ...
To be soldered to.

Needless to say, the through holes 11, 11 of the parent circuit board 1 into which the board supporting protrusions 2, 2 of the child circuit board 4 are fitted can be replaced with recesses that do not penetrate to the back surface side of the board 1.

[Effect of the Invention] As described above, in the present invention, the through holes are not formed in the parent circuit board 1 by the number of the terminal electrodes 6 and 6'of the child circuit board 4,
The child circuit board 4 can be surface-mounted thereon, and at the same time, the child circuit board 4 can be mounted and soldered easily because the child circuit board 4 is self-supporting on the parent circuit board 1. further,
The soldering electrodes 3, 3'of the parent circuit board 1 and the terminal electrodes 6, 6'of the child circuit board 4 are surely aligned. As a result, there is an effect that high density mounting and downsizing of the hybrid integrated circuit board module can be easily achieved.

[Brief description of drawings]

FIG. 1 is a perspective view of a hybrid integrated circuit board module before mounting a child circuit board according to an embodiment of the present invention, and FIG.
FIG. 3 is a perspective view of a hybrid integrated circuit board module in which a child circuit board according to an embodiment of the present invention is mounted. FIG. 3 shows a terminal electrode of the child circuit board soldered to a soldering electrode on a parent circuit board. FIG. 4 is a perspective view showing a hybrid integrated circuit board module before mounting the child circuit board of the conventional example, and FIG. 5 is a hybrid view before mounting the child circuit board of the conventional example. FIG. 6 is a perspective view of an integrated circuit board module, and FIG. 6 is a perspective view of a hybrid integrated circuit board module in a state where a child circuit board showing another conventional example is mounted. DESCRIPTION OF SYMBOLS 1 ... Parent circuit board, 2 ... Board | substrate support protrusion, 3 and 3 '... Solder electrode, 4 ... Child circuit board, 6, 6' ... Terminal electrode

Claims (1)

[Scope of utility model registration request] 1. A child circuit board (4) is mounted on a parent circuit board (1), and the circuit formed on the child circuit board (4) is connected to the circuit formed on the parent circuit board (1). In the hybrid integrated circuit board module, the terminal electrodes (6) and (6) 'are arranged near the lower side of the side surface of the child circuit board (4), and a part of the terminal electrodes (6') supports the board. The protrusions (2) and (2) are fixed and the tip is attached to the sub circuit board (4).
Of the substrate supporting protrusions (3) and (3 ') corresponding to the terminal electrodes (6) and (6') on the parent circuit board (1). 2),
Terminal electrodes (6 ') of the child circuit board (4) to which (2) is fixed
At the position of the soldering electrode (3 ') corresponding to
(11) or a recess is provided, and the board supporting protrusions (2) and (2) of the child circuit board (4) are fitted and fixed in the through holes (11), (11) or the recess, and the child is also attached. It is characterized in that the terminal electrodes (6) and (6 ') of the circuit board (4) are soldered to the corresponding solder electrodes (3) and (3') on the parent circuit board (1), respectively. Hybrid integrated circuit board module.