JPH0726846Y2 - Package insertion jig - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A package insertion jig for holding a package having a semiconductor element and mounting the package in a predetermined socket of the package so that the lead terminals are not deformed when the package is mounted. And a through hole capable of pressing the back surface of the package when the socket is attached to the metal member, while forming the projecting direction of the lead terminal of the package by the inner wall of the side wall. A terminal piece connected to the ground wire is provided.

[Industrial application field]

The present invention relates to a package insertion jig for holding a package having a semiconductor element and mounting the package in a predetermined socket.

Recently, when a package having a semiconductor element such as an IC is mounted on a printed circuit board, an automatic machine is generally used, and the automatic machine is mounted on the printed circuit board.

DIP package (dual-in-l
When an ine packge is used, it is configured as shown in the explanatory view of the package in FIG. Figure 4 (a)
Is a plan view and (b) is a side view.

As shown in FIGS. 4 (a) and (b), the semiconductor device 4 forming the integrated circuit is embedded in the substrate 5D made of an insulating material, and the package 5 is formed so as to protrude from both side surfaces 5B of the package 5. The lead terminals 6 are bent at an angle of, for example, 0 to 15 ° so that the bending directions of the side surfaces 5B are widened, and the lead terminals are bent by sandwiching the side surfaces 5B of the package 5 by the hand mechanism of the automatic machine. It is formed so that the direction becomes a right angle shown by a dotted line.

Incidentally, such a substrate 5D is usually provided with a notch 5C,
When the package 5 is mounted, the mounting direction is not determined.

On the other hand, there is a case where a data writing, for example, a ROM is formed in such a package 5, and in this case, in order to write the data, a package manually mounted on a printed circuit board is used. A socket is used so that the package 5 can be easily inserted and removed, and the package 5 is formed so as to be mounted through the socket.

However, when such a package 5 is manually attached to the socket, the bending of the lead terminal 6 is not performed by a hand mechanism as in the case of an automatic machine, and therefore the package 5 is not inserted when the package 5 is inserted. Each of the five lead terminals 6 must be bent so as to match with the insertion opening of the socket at the place to be mounted.

Therefore, when the package 5 is inserted, the lead terminal 6 should be aligned with the insertion opening of the socket.
It is necessary to correct the bending angle of.

[Conventional technology]

Conventionally, the jig shown in the conventional perspective view of FIG. 3 has been used.

As shown in FIG. 3, a guide rail 13 is stretched around a table 10, and rollers 11 are arranged on both sides of the guide rail 13 so as to be rotated by pins 12.

Therefore, by sliding the package 5 along the guide rail 13 as shown by the arrow, the lead terminal 6 of the package 5 is sandwiched between the outer periphery of the roller 11 and the side surface 13A of the guide rail 13, and the bending angle of the lead terminal 6 is reduced. Will be fixed.

Therefore, when mounting the package 5 in the socket, the package 5 is slid along the guide rails 13 as shown by the arrow so that the lead terminal 6 is bent at a right angle and the package 5 is inserted into the socket. It was easy to do.

When the package 5 is held by such a human hand, it is necessary to take care so as not to damage the semiconductor element 4, and it is always carried out by wearing an earth band on the hand.

[Problems to be solved by the device]

However, by correcting the bending angle of the lead terminal 6 by sandwiching the guide rail 13 and the roller as described above, the material of the lead terminal 6 is actually different depending on the type of the package, so that the lead terminal 6 may be different due to the soft material. If it is formed, overbending may occur due to the correction of the angle, and conversely, if the lead terminal 6 is formed of a hard material, the bending angle may not be a right angle even if the angle is corrected. .

Therefore, when the package 5 is mounted on the socket manually as described above, there is a problem in that the lead terminal 6 may be deformed or otherwise damaged unless the lead terminal 6 is mounted while being adjusted so as to match the insertion / removal opening of the socket. Had.

Therefore, it is an object of the present invention to prevent the lead terminals from being deformed when the package is mounted.

[Means for Solving the Problems]

 FIG. 1 is an explanatory view of the principle of the present invention.

As shown in FIG. 1, the lead terminals of the package are formed so that the projecting direction thereof is restricted by the inner walls of the side walls, and the metal member has a through hole through which the back surface of the package can be pushed when the socket is mounted. And a terminal piece connected to the ground wire.

With this configuration, the above-mentioned problems can be solved.

[Action]

That is, the package is inserted into a metal member having a side wall that is bent so as to regulate the protruding direction of the lead terminal, and the socket is mounted with the package inserted in the metal member.

Further, at the time of insertion, it is possible to connect the ground wire and push the back surface of the package through the through hole provided in the metal member to insert the lead terminal into the socket.

Therefore, it is possible to prevent the lead terminal from being deformed due to the excess or deficiency of the bending angle of the lead terminal as in the conventional case,
The package can be easily inserted and removed.

〔Example〕

 Hereinafter, the present invention will be described in detail with reference to FIG.

FIG. 2 is an explanatory view of an embodiment according to the present invention, (a) is a perspective view and (b) is an explanatory view. Throughout the drawings, the same reference numerals denote the same objects.

As shown in FIG. 2 (a), a through hole 9 and a terminal piece 7 for connecting the ground wire 8 are provided in the back surface 1A of the metal member 1 made of a conductive material formed in a U shape. The lead terminals 6 protruding from the side surface 5B of the substrate 5D are guided to the side wall 2 so that the package 5 can be inserted.

Further, the metal member 1 is provided with the contact surface 1B, and the end surface 5E of the package 5 is brought into contact with the contact surface 1B, so that the metal member 1 receives the package 5
The notch 5C is formed so that the notch 5C can be seen even when the is inserted.

Therefore, the metal member 1 is connected to the ground via the ground wire 8, and the package 5 is inserted into the metal member 1 as indicated by an arrow A shown in (b).

By this insertion, the bending of the lead terminal 6 is regulated by the inner wall 2A of the side wall 2 as shown in the portion B, and for example, even if the bending angle of the lead terminal 6 before insertion is a wide angle, it becomes a right angle. be able to.

Next, with the package 5 inserted in the metal member 1, as shown by a dotted arrow C, the package 5 is inserted into the socket 15 fixed to the printed board 14.

In this case, since the bending angle of the lead terminal 6 is regulated at a right angle, the tip of the lead terminal 6 can be aligned with the insertion / removal port 15A of the socket 15.

Also, when inserting the lead terminal 6 into the insertion / removal port 15A of the socket 15, insert a finger through the through hole 9
By pushing 5A, the package 5 is removed from the metal member 1 and the lead terminal 6 is inserted at the same time.

Therefore, even if the bending angle of the lead terminal 6 is formed to be wide, the bending angle is restricted to a right angle by the inner wall 2A of the side wall 2, and the lead terminal 6 can be mounted in the socket 15 without trouble.

[Effect of device]

As described above, according to the present invention, even in a package in which the bending angle of the lead terminal is widened, the bending angle of the lead terminal is corrected by inserting it into a metal member, and the lead terminal is inserted into the socket as it is. It can be performed.

Therefore, when inserting it into the socket, the bending angle correction will differ due to the difference in the material of the lead terminal as in the past, and it will not be difficult to insert the socket, and it will not be necessary to attach a ground band. The efficiency can be improved and the practical effect is great.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the present invention, FIG. 2 is an explanatory view of an embodiment according to the present invention, (a) is a perspective view, (b) is an explanatory view, and FIG. 3 is a conventional perspective view. Figure 4 is an illustration of the package, (a) is a plan view,
(B) shows a side view. As shown in the figure, 1 is a metal member, 2 is a side wall, 3 is a socket, 4 is a semiconductor element, 5 is a package, 6 is a lead terminal, 7 is a terminal piece, 8 is a ground wire, 9 is a through hole, 2A inner wall , 5A indicates the back.

Claims (1)

[Scope of utility model registration request] 1. A package (5) comprising a U-shaped metal member (1), wherein a side wall (2) of the metal member (1) holds a package (5) having a semiconductor element (4).
Is a jig for inserting a package into a predetermined socket (3), wherein the projecting direction of the lead terminal (6) of the package (5) is regulated by the inner wall (2A) of the side wall (2). When the socket (3) is attached to the metal member (1), the back surface (5) of the package (5) is formed.
A package insertion jig comprising a through hole (9) capable of pressing A) and a terminal piece (7) connected to a ground wire (8).