JPH07263609A - Semiconductor package - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a semiconductor package having external leads that are not easily deformed even when an external force is applied. [Structure] External lead 14 and side surface 1 facing side surface 12a
An insulating rigid body 16 for fixing the outer lead 14 to the side surface 12a is disposed between the rigid body 16 and the outer surface 2a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package having a package body having a chip built therein and external leads protruding from the package body.

[0002]

2. Description of the Related Art Semiconductor devices such as LSI and VLSI are usually enclosed in a resin mold or a ceramic case,
Used as a semiconductor package for mounting on a wiring board or the like. External leads for connecting the input / output ends of the semiconductor device to the circuits formed in the wiring board are provided on the semiconductor package in a protruding manner. When mounting the semiconductor package on the wiring board, the connection ends of the external leads are connected to predetermined portions of the wiring board. A coplanarity that shows not only the size, length, and thickness of the external leads, but also the degree to which the connection ends are flush with each other, in order to connect the connection ends of the external leads to the specified locations on the wiring board accurately and securely. It is required that various requirements such as the above are met within a certain range.

However, during transportation or testing of the semiconductor package, the external leads may be deformed by external force, and the connection ends may not be flush with each other, resulting in poor coplanarity. When the coplanarity deteriorates, even if the semiconductor package is placed on the wiring board, the connection end does not accurately contact the predetermined location on the wiring board, and in the worst case, the connection may not be established on the wiring board. Yes, it may cause wiring failure. Particularly, with the recent increase in density and integration, semiconductor packages represented by QFP (Quad Flat Package) and the like tend to have more and more pins. Therefore, external force acts during transportation and testing. External leads are easily deformed. Therefore, prevention of deformation of the external leads has become an important issue.

As a technique for preventing the deformation of the external leads, a semiconductor package in which the external leads are connected by an insulator has been proposed (see Japanese Patent Laid-Open No. 2-199857). In this semiconductor package, even if an external force acts on one external lead, the external force is dispersed to the other external leads, so that the external leads are not easily deformed.

[0005]

However, in the above-mentioned conventional semiconductor package, since the external leads are simply connected by the insulator, the contact end that contacts the wiring board and the root portion fixed to the package body are connected. The distance (moment length) between them is the same as the moment length of a semiconductor package without an insulator. For this reason, the moment acting on the outer lead is not reduced, so that the deformation of the outer lead is insufficiently prevented.

In view of the above circumstances, it is an object of the present invention to provide a semiconductor package having an external lead that is not easily deformed even when an external force is applied.

[0007]

A semiconductor package of the present invention for achieving the above object is a package body having a chip built-in, and a part thereof faces a side surface of the package body so as to project from the package body. In the semiconductor package having the bent external lead, the insulating package is provided between the external lead facing the side surface and the side surface, and has an insulating rigid body for fixing the external lead to the side surface. It is what

Here, the rigid body may be arranged for each one external lead, or may be arranged for each plural external leads.

[0009]

In the semiconductor package of the present invention, since the external leads are fixed to the side surface via the rigid body, the distance (moment length) between the contact end contacting the wiring board and the portion fixed to the rigid body is Shorter than conventional semiconductor packages.
Therefore, the moment acting on the outer lead is reduced and the resistance force against the deformation is increased, so that the outer lead is not easily deformed. Since the rigid body is insulative, short circuit between external leads is prevented.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the semiconductor package of the present invention will be described below with reference to the drawings. 1 is a perspective view showing a semiconductor package, and FIG. 2 is an enlarged sectional view showing external leads of the semiconductor package shown in FIG. The semiconductor package 10 includes a package body 12 in which a chip (not shown) is embedded, and a side surface 1 protruding from the package body 12.
External lead 1 bent so that a part thereof faces 2a
And 4 are provided. The external lead 14 is provided between the external lead 14 facing the side surface 12a and the side surface 12a.
An insulative rigid body 16 for fixing the to the side surface 12a is arranged. When the rigid body 16 is not arranged, the contact end 14a that contacts the wiring board (not shown) and the package body 12
The distance from the root portion 14b fixed to is the moment length. On the other hand, when the rigid body 16 is arranged, the moment length is determined by the fixed portion 14c fixed to the rigid body 16 and the contact end 14
The distance between the contact end 14a and the root portion 14b is about 1/3. For this reason, the moment acting on the outer lead is reduced and the resistance force against the deformation is greatly increased, so that the outer lead is not easily deformed. Examples of the material of the rigid body 16 include insulating resins such as epoxy resin.

Next, a method of mounting the rigid body 16 will be described. First, the semiconductor package 10 in a state before the rigid body 16 is attached is placed in a mold (not shown) with its back side facing. External lead 14 of semiconductor package 10 placed in a mold
A thermosetting gel-like insulating substance is put between the side surface 12a and the side surface 12a and heated. As a result, the outer lead 14 is fixed to the side surface 12a by the insulating rigid body 16. The rigid body 16 may be manufactured integrally with the package body 12 with the same material.

[0012]

As described above, in the semiconductor package of the present invention, the external lead is fixed to the side surface of the package body via the rigid body, so that the contact end contacting the wiring board and the portion fixed to the rigid body are provided. The distance (moment length) between them is shorter than that of the conventional semiconductor package. Therefore, the moment acting on the outer lead is reduced and the resistance force against the deformation is increased, so that the outer lead is not easily deformed. Therefore, even if an external force is applied to the external leads during transportation or testing of the semiconductor package, the external leads are less likely to be deformed, and the number of defective products can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a semiconductor package of the present invention.

2 is an enlarged cross-sectional view showing external leads of the semiconductor package shown in FIG.

[Explanation of symbols]

 10 Semiconductor Package 12 Package Body 12a Side 14 External Lead 16 Rigid Body

Claims (1)

[Claims] 1. A package body having a chip built-in,
In a semiconductor package provided with an external lead projecting from the package body and bent so that a part thereof faces a side surface of the package body, the semiconductor package is disposed between the external lead facing the side surface and the side surface, A semiconductor package comprising an insulating rigid body for fixing external leads to the side surface.