JPH0724295B2 - Lead frame for manufacturing semiconductor components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] As shown in FIGS. 1 and 2, the present invention has external lead terminals 2 and 3 overlaid on both front and back surfaces of one semiconductor chip 1. The present invention relates to an improvement of a lead frame used for manufacturing a semiconductor component such as a diode, which is connected and hermetically sealed in a molded portion 4 made of synthetic resin.

[Conventional technology]

The applicant of the present invention has disclosed a method of manufacturing a semiconductor component such as the diode in the above-mentioned patent application (Japanese Patent Application No. 63-184283). As shown in FIG. 17, in one lead frame 10, feed pin holes 11a on the left and right sides in the longitudinal direction,
Between the two frames 11 and 12a with 12a, at intervals of a constant pitch P along the longitudinal direction of the lead frame 10, and
Appropriate angle α to the longitudinal direction of the lead frame 10
Are connected to each other by section bars 13 arranged so as to incline, and the external lead terminals 2, are provided on the inner side surfaces of the frame frames 11 and 12 between the section bars 13.
The external lead terminals 2 and 3 are integrally formed so that the external lead terminals 2 and 3 are aligned in the longitudinal direction of the lead frame 10.

． While transferring the lead frame 10 in its longitudinal direction, first, as shown in FIG. 18, for each land portion 2a at the tip of each external lead terminal 2 in the one frame frame 11, The semiconductor chip 1 is placed and bonded (die bonded).

． Next, one frame frame 11 and the other frame frame
12 and 12 in a state in which they are displaced by appropriately staggering the dimensions in the direction perpendicular to the surface of the lead frame 10 and the section bar 13 connecting them is substantially perpendicular to the longitudinal direction of the lead frame 10, As shown in FIG. 19, the land portion 3a at the tip of each external lead terminal 3 in the other frame frame 12 is displaced by the displacement in the longitudinal direction of the other frame frame 10 as shown in FIG. The semiconductor chip 1 die-bonded to the land portion 2a at the tip of 2 is superposed and bonded.

． Then, the semiconductor chip 1 is sealed with a synthetic resin mold 4 and then both external lead terminals 2 and 3 are formed.
The lead frame 10 is cut off by cutting.

We have proposed a method of manufacturing semiconductor components.

[Problems to be Solved by the Invention]

However, in the invention of this earlier application, both frame frames 11,1
At the site between each section bar 13 connecting the two to each other,
When molding the external lead terminals 2 and 3 having the land portions 2a and 3a at the tip, the portion between the respective section bars 13 is
As shown in FIG. 20, the side surface 13a of the section bar 13 concerned.
And the respective land portions 2a, 3a are formed so as to form a gap having an appropriate size S1 and also between the land portions 2a, 3a are formed so as to form a gap having an appropriate size S2 so as to be partially punched. Since it was configured, there were the following problems.

That is, as in the above-mentioned prior invention, each section bar 13
When molding the external lead terminals 2 and 3 with lands 2a and 3a between them, the part between each section bar 13 is appropriately arranged between the side surface 13a of each section bar 13 and each land 2a and 3a. Punching to form a gap having a dimension S1 and appropriately forming a gap having a dimension S2 between both land portions 2a, 3a is performed when the width dimensions W2, W3 in both land portions 2a, 3a are The size is reduced by the size of the gap S1 between the land portions 2a, 3a and the side surface 13a of the section bar 13 plus half the gap size S2 between the land portions 2a, 3a.

For this reason, high precision is required in the process of die-bonding the semiconductor chip 1 to the one land portion 2a having the narrow width dimension W2, and the other land portion 3a having the narrow width dimension W3 is leaded. Both frames in frame 10
Since high accuracy is required also in the step of stacking the semiconductor chips 1 by the displacement of 11, 12 in the longitudinal direction, a step of die-bonding the semiconductor chip 1 to the one land portion 2a, Further, not only the speed of the step of stacking the other land portion 3a on the semiconductor chip 1 cannot be increased, but also the defective product rate increases and the manufacturing cost of the semiconductor component increases.

Therefore, in order to improve this point, the pitch P between the section bars 13 may be increased to widen the width dimensions W2 and W3 of the two land portions 2a and 3a. Pitch P between bars 13
Increasing the number causes a problem that the number of semiconductor components that can be manufactured per unit length of the lead frame 10 decreases, and thus the manufacturing cost of the semiconductor components also increases.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a lead frame that can solve the problem of the lead frame in the prior invention, that is, the problem that the manufacturing cost of semiconductor components increases.

[Means for Solving the Problems]

In order to achieve this object, the first aspect of the present invention is "Inclination between both frame frames on the left and right sides in the longitudinal direction at an appropriate pitch interval along the longitudinal direction and at an appropriate angle with respect to the longitudinal direction. External lead terminals having land portions for joining a semiconductor chip to the tips are connected to each other by the section bars arranged so as to In a lead frame integrally formed so that the external lead terminals are aligned in the longitudinal direction, a land portion at a tip of each external lead terminal is integrally connected to a side surface of the section bar, A cutting line by a shearing process for cutting off the land portion from the section bar is provided at a portion of the connecting portion along the side surface of the section bar. " It was formed.

According to claim 2, "the two frame frames on both the left and right sides in the longitudinal direction are arranged so as to be inclined at an appropriate pitch along the longitudinal direction and at an appropriate angle with respect to the longitudinal direction. External lead terminals, which are connected to each other by the provided section bars, are provided on the inner side surfaces of the frame frames between the respective section bars and each of which has a land portion for joining a semiconductor chip to the tip thereof. In a lead frame in which lead terminals are integrally formed so as to be aligned in the longitudinal direction, the respective land portions are integrally connected to each other, and among the connecting portions of the respective land portions, an intermediate portion of the respective land portions is provided. A cutting line by shearing is provided on each part to cut off each land. "

Furthermore, claim 3 "is such that the space between both frame frames on the left and right sides in the longitudinal direction is inclined at an appropriate pitch along the longitudinal direction and at an appropriate angle with respect to the longitudinal direction. External lead terminals each having a land portion for joining a semiconductor chip to the tip are connected to each other on the inner side surfaces of the frame frames between the section bars by the arranged section bars. In a lead frame in which external lead terminals are integrally formed so as to be aligned in the longitudinal direction, a land portion at a tip of each external lead terminal is integrally connected to a side surface of the section bar, and the connecting portion is formed. A portion along the side surface of the section bar is provided with a cutting line by shearing for cutting each land portion from the section bar, while each land portion is It is integrally connected to each other, and a cutting line by shearing for cutting off each land part is provided at an intermediate part of the land part in the connection part of each land part. " .

[Operation] According to the configuration of claim 1, when the external lead terminals having the land portions are formed between the section bars, the land portions of the external lead terminals are formed.
Since the gap between the side surface of the section bar can be eliminated, the width of each land portion can be adjusted to the side surface of the section bar without increasing the pitch between the section bars. It is possible to widen only the close dimension, in other words, the width dimension in each land portion is set to a dimension having a gap of dimension S1 between each land portion and the side surface of the section bar as in the prior invention. In comparison, the gap size S1 can be increased.

In this case, when manufacturing a semiconductor component, after dicing the semiconductor chip onto the land part of the tip of each external lead terminal in one frame frame, both frame frames are misaligned in the direction perpendicular to the surface of the lead frame. If each section bar is also displaced in the longitudinal direction at right angles to the longitudinal direction in the state of being displaced in a circular shape, a gap will be created between the land part of each external lead terminal and the side surface of each section bar. Therefore, the mold part can be formed on the semiconductor chip part.

According to the second aspect of the present invention, when molding the external lead terminals having the land portions at the portions between the section bars, the gap between the land portions of the external lead terminals is eliminated. Because you can
The width dimension of each land portion can be increased by a dimension in which the land portions are in close contact with each other without increasing the pitch between the section bars. In other words, the width dimension of each land portion is It is possible to increase the size by half the size S2 of the gap, as compared with the case where the size S2 gap is provided between the respective land portions as in the invention of the present application.

In this case, each land part is
After dicing a semiconductor chip into the land at the tip of each external lead terminal in one frame,
When the two frame frames are displaced by being staggered in a direction perpendicular to the surface of the lead frame, they are separated from each other.

Further, according to the third aspect of the invention, when the external lead terminals having the land portions are formed between the section bars, the land portions of the external lead terminals and the side surfaces of the section bar are formed. Since it is possible to eliminate the gap between the land portions and the gap between the land portions, it is possible to reduce the width dimension of the land portions without increasing the pitch between the section bars. , The size of each land part in contact with the side surface of the section bar can be increased by a size including the size of each land part in close contact with each other. So that the dimension S1 between each land and the side of the section bar
It is possible to widen the gap dimension S1 by a half of the gap dimension S2 as compared with the gap dimension S1 and the gap having the dimension S2 between the land portions.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings (FIGS. 3 to 16).

In this figure, reference numeral 10 indicates a lead frame, and the lead frame 10 has feed pin holes at the left and right ends in the longitudinal direction.
One frame frame 11 with 11a and also feed pin hole 1
It is configured such that the other frame frame 12 provided with 2a is formed in parallel with each other, and a space between the two frame frames 11 and 12 is arranged at a constant pitch P along the longitudinal direction of the lead frame 10.
They are integrally connected by a section bar 13 which is arranged at an interval of .alpha. And is inclined at an angle .alpha. With respect to a right angle with the longitudinal direction of the lead frame 10. In addition, narrowed constricted portions 14 and 15 are provided at the root portions of the section bars 13 with respect to the frame frames 11 and 12.

Further, in both of the frame frames 11 and 12, one external lead terminal 2 having a land portion 2a at the tip is provided between the respective section bars 13, and the other external lead terminal 2 having a land portion 3a at the tip is also provided. The external lead terminal 3 extends inward, and the external lead terminals 2 and 3 are integrally formed so as to be aligned in the longitudinal direction of the lead frame 10.

In the first embodiment, the lead frame
In 10, a part between the section bars 13 is partially punched out by a punch and a receiving die (not shown) so that the external lead terminal 2 with the land part 2a and the land part 3a
In forming the attached external lead terminal 3, the land portions 2a and 3a at the tips of the both external lead terminals 2 and 3 are integrally connected to the side surface 13a of the section bar 13 as shown in FIG. On the other hand, an appropriate dimension S2 between the two land portions 2a, 3a
The gap is formed.

Next, at the connecting portion between the side surface 13a of each section bar 13 and both lands 2a, 3a, a cutting line 16 by shearing of the upper cutting blade A and the lower cutting blade B shown in FIG. As shown in FIG. 6, the land portions 2a and 3a are cut off from each section bar 13 by being provided along the side surface 13a of the section bar 13.

By doing so, it is possible to eliminate a gap between the land portions 2a, 3a of both the external lead terminals 2, 3 and the side surface 13a of each section bar 13, so that both land portions can be eliminated.
The width dimensions W2 and W3 in 2a and 3a are set to the respective land portions without increasing the pitch P between the section bars 13.
2a, 3a can be widened by a size close to the side surface 13a of the section bar 13, in other words, width dimensions W2, W3 in both land portions 2a, 3a, as in the invention of the above-mentioned prior application,
Compared to the one in which a gap of dimension S1 is provided between both land portions 2a, 3a and the side surface 13a of section bar 13,
Only S1 can be widened.

Incidentally, the lead frame 10 configured in this manner is similar to the above-mentioned prior invention, and while the lead frame 10 is being transferred in the longitudinal direction, the one frame frame 11 is formed.
As shown in FIG. 7, the semiconductor chip 1 is die-bonded to each of the land portions 2a at the tips of the external lead terminals 2 in FIG. By sending,
One frame frame 11 and the other frame frame 12 are displaced in a direction orthogonal to the surface of the lead frame 10 in a staggered manner by appropriate dimensions, and the section bar 13 connecting them is the longitudinal direction of the lead frame 10. By displacing the lead frame 10 in the longitudinal direction so as to be perpendicular to the direction, the land portion 3a at the tip of each external lead terminal 3 in the other frame frame 12 is displaced as shown in FIG.
Is superposed on the semiconductor chip 1 die-bonded to the land portion 2a at the tip of each external lead terminal 2 in one frame frame 11, and then the land portion 3a in the other external lead terminal 3 is attached to the semiconductor chip. 1, the semiconductor chip 1 is sealed with a synthetic resin mold portion 4, and then both external lead terminals 2, 3
It is used in the manufacturing process of semiconductor parts called cutting.

The offset stacking device 20 is configured as shown in FIGS. 9 to 12.

That is, a small diameter d that comes into contact with the lower surface of one frame frame 11 of the lead frame 10 at a portion between the two guide rollers 21 and 22 that guides the lead frame 10 so as to convey the lead frame 10 in its longitudinal direction. Feed wheel 23
And a large-diameter feed wheel 24 having a diameter D that comes into contact with the lower surface of the other frame 12, and these feed wheels 23, 2
The shaft 4 is rotationally driven by the shafts 23a and 24a for each of them so that the peripheral velocities on the outer peripheral surfaces of the two feed wheels 23 and 24 become the same.

A first roller mechanism 25 is arranged between the first guide roller 21 of the two guide rollers 21 and 22 and the feed wheels 23 and 24, while the feed rollers 23 and 24 are provided.
A second roller mechanism 26 is arranged between the second guide roller 22 and the second guide roller 22.

The first roller mechanism 25 sandwiches a pair of rollers 25a and 25b that are displaced downward while sandwiching one frame frame 11 of the lead frame 10 and the other frame frame 12 of the lead frame 10. And a pair of rollers 25c and 25d configured to be displaced upward in this state, the second roller mechanism 26 is connected to the lead frame.
A pair of rollers 26a, 26b arranged to be displaced upward while sandwiching one frame frame 11 in 10 and a pair arranged to be displaced downward while sandwiching the other frame frame 12 in the lead frame 10 And rollers 26c and 26d.

In this configuration, the lead frame being transferred in the longitudinal direction
In the first roller mechanism 25, one frame frame 11 of the lead frame 10 is displaced downward and the other frame frame 12 thereof is displaced upward, so that
One frame frame 11 and the other frame frame 12 are displaced in a staggered manner by an appropriate dimension H in the direction perpendicular to the surface of the lead frame 10.

Next, one frame frame 11 in the lead frame 10
However, when the outer frame surface of the small-diameter feed wheel 23 and the other frame frame 12 circulate the outer peripheral surface of the large-diameter feed wheel 24 by an appropriate circumferential angle θ, one frame frame 11
Between the transfer in and the transfer in the other frame frame 12, since it is possible to advance or delay according to the diameter difference between the two feed wheels 23, 24, one frame frame 11 and the other frame frame 12 The lead frame 10 can be displaced so as to be advanced or delayed along the longitudinal direction of the lead frame 10.

Then, at the location of the second roller mechanism 26, one frame frame 11 is displaced upward and the other frame frame 12 is displaced downward, respectively, so that the land at the tip of each external lead terminal 3 in the other frame frame 12 is displaced. The portion 3a is a land portion at the tip of each external lead terminal 2 in one frame 12
It can be superposed on the semiconductor chip 1 provided in 2a.

By the displacement device 20, both frame frames 11 and 12
Is displaced by advancing or delaying in the longitudinal direction, each land portion 2a, 3a becomes a side surface 1 of each section bar 13.
Since the gap is formed apart from 3a, the mold portion 4 can be molded on the portion of the semiconductor chip 1.

In the displacement stacking device 20, the outer peripheral surfaces of the two feed wheels 23 and 24 are engaged with the feed pin holes 11a and 12a of the frame frames 11 and 12 of the lead frame 10 so as to be sequentially fitted. A pin may be provided, or instead of this, an endless belt guided by four pulleys 28a, 28b, 28c, 28d outside the one frame frame 11 that contacts the outer circumference of the small-diameter feed wheel 23. While pressing 27, the endless belt 29, which is also guided by the four pulleys 30a, 30b, 30c, 30d, is pressed also on the outside of the other frame frame 12 that contacts the outer circumference of the large-diameter feed wheel 24. Therefore, both frame frames 11 and 12 may be transferred by friction.

13 and 14 show a second embodiment. In the second embodiment, the portion between the section bars 13 in the lead frame 10 is divided into a punch and a receiving die. In order to form the external lead terminal 2 with the land portion 2a and the external lead terminal 3 with the land portion 3a by punching the two land portions 2a, 3a together as shown in FIG. While connected, both land parts 2a, 3
Punching into a form in which a gap having an appropriate dimension S1 is appropriately formed between a and the side surface 13a of the section bar 13, and then,
At the connecting portion between the two land portions 2a and 3a, the fifth
As shown in FIG. 14, a cutting line 17 formed by shearing the upper cutting blade A and the lower cutting blade B shown in FIG.
By installing it at a position just in the middle of a, both land parts 2a,
3a is configured to be cut off from each other.

According to the second embodiment, it is possible to eliminate the gap between the land portions 2a and 3a of the external lead terminals 2 and 3, so that the width dimension W of the land portions 2a and 3a is reduced.
2, W3 can be widened by a size in which the land portions 2a, 3a are in close contact with each other without increasing the pitch P between the section bars 13, in other words, the width of the land portions 2a, 3a. Dimension W2, W3, like the invention of the prior application
The size can be increased by half the size S2 of the gap as compared with the case where the space S2 is provided between the lands 2a and 3a.

Furthermore, FIGS. 15 and 16 show a third embodiment, in which the portion between the section bars 13 of the lead frame 10 is formed by a punch and a receiving die. In forming the external lead terminals 2 with lands 2a and the external lead terminals 3 with lands 3a by partially punching, as shown in FIG. 15, the lands at the tips of both external lead terminals 2, 3 are formed. The portions 2a and 3a are configured to be integrally connected to the side surface 13a of the section bar 13, and both land portions 2a and 3a are configured to be integrally connected to each other, and then, As shown in FIG. 16, at the connecting portion between the side surface 13a of each section bar 13 and both land portions 2a, 3a, the cutting upper blade A shown in FIG.
By providing a cutting line 16 by shearing between the cutting lower blade B and the cutting lower blade B along the side surface 13a of the section bar 13, both land portions 2a, 3a are cut off from each section bar 13, and A cutting line 17 formed by the shearing process of the upper cutting blade A and the lower cutting blade B shown in FIG. 2 is provided at the connecting portion between the two land portions 2a, 3a. The land portions 2a and 3a are cut off from each other by being provided at the intermediate portion.

According to the third embodiment, it is possible to eliminate the gap between the land portions 2a and 3a of both the external lead terminals 2 and 3 and the side surface 13a of each section bar 13, and at the same time, to the both land portions 2a and 3a. Since it is possible to eliminate a gap between the two land portions 2a, 3a, the width dimension W2, W3
Without increasing the pitch P between the section bars 13, the two land portions 2a, 3a are
The width dimension W2, W3 in both land portions 2a, 3a can be increased by adding the dimension in which both land portions 2a, 3a are in close contact with each other to the side surface 13a. Like the invention of, both land portions 2a, 3a and section bar 1
Compared with the case where a gap of dimension S1 is provided between the two and the land portions 2a, 3a, the gap dimension S1
Therefore, it is possible to widen the size by adding half of the gap size S2.

It goes without saying that the lead frame 10 in the second embodiment and the lead frame 10 in the third embodiment can also be used in the manufacturing process of semiconductor components in the same manner as in the first embodiment.

〔The invention's effect〕

As described above, according to the present invention, the width dimension of each land portion can be widened without increasing the pitch between the section bars, and the land size of one of the external lead terminals can be increased. Required for the step of die-bonding the semiconductor chip to the semiconductor chip and the step of stacking the land portion of the other external lead terminal on the semiconductor chip by shifting displacement of both frame frames in the lead frame in the longitudinal direction. Since the precision can be loosened, the speed of the die bonding step and the step of stacking by the displacement displacement can be increased, the rate of defective products can be reduced, and the manufacturing cost of semiconductor parts can be significantly reduced. Have an effect.

[Brief description of drawings]

FIG. 1 is a front view of a diode which is one embodiment of a semiconductor component, FIG. 2 is a plan view of FIG. 1, FIGS. 3 to 8 show the first embodiment, and FIG. Top view of the frame,
4 is an enlarged view of an essential part of FIG. 3, FIG. 5 is a sectional view showing a state in which a cutting line is provided by shearing, FIG. 6 is an enlarged view of an essential part after the cutting line is provided, and FIG. FIG. 9 is a plan view showing a state in which the semiconductor chips are diphone-bonded, FIG. 8 is a plan view after offset stacking, and FIGS. 9 to 12 are views showing the offset stacking apparatus. FIG. FIG. 11 is an enlarged sectional view taken along line XX in FIG. 9, and FIG. 11 is an enlarged sectional view taken along line XI-XI in FIG.
2 is an enlarged sectional view taken along the line XII-XII in FIG. 9, FIGS. 13 and 14 are views showing a second embodiment, FIGS. 15 and 16 are views showing a third embodiment, and FIG. 18 and 19 are views showing the method of the invention of the prior application, and FIG. 20 is an enlarged view of the essential parts of FIG. 1 ... Semiconductor chip, 2,3 ... External lead terminals, 2a, 3a ...
… Land part, 4 …… Mold part, 10 …… Lead frame, 11 …… One frame frame, 12 …… Other frame frame, 13 …… Section bar, 13a …… Section bar side, 14,15… … Constricted area, A, B …… Cutting blade for shearing, 16,17 …… Cutting line.

Claims (3)

[Claims] 1. A section arranged between both frame frames on the left and right sides in the longitudinal direction at an appropriate pitch along the longitudinal direction and at an appropriate angle with respect to the longitudinal direction. Connected to each other by a bar, at the site between the section bars on the inner surface of the both frame frames,
In a lead frame formed by integrally molding external lead terminals each having a land portion for joining a semiconductor chip to a tip thereof so that the respective external lead terminals are aligned in the longitudinal direction, a tip of each of the external lead terminals The land portion of the section bar is integrally connected to the side surface of the section bar, and a cutting line by shearing for cutting the land section from the section bar at a portion of the connection section along the side surface of the section bar. A lead frame for manufacturing a semiconductor component, wherein the lead frame is provided. 2. A section arranged between both frame frames on the left and right sides in the longitudinal direction at an appropriate pitch along the longitudinal direction and at a proper angle with respect to the longitudinal direction. Connected to each other by a bar, at the site between the section bars on the inner surface of the both frame frames,
In a lead frame formed by integrally molding external lead terminals each having a land portion for joining a semiconductor chip at its tip so that the external lead terminals are arranged in the longitudinal direction, the land portions are integrated with each other. Of the semiconductor parts characterized in that a cutting line by shearing for cutting off each land part is provided at an intermediate part of the land part among the connection parts of the respective land parts. Manufacturing lead frame. 3. A section arranged between both frame frames on the left and right sides in the longitudinal direction at an appropriate pitch along the longitudinal direction and at an appropriate angle with respect to the longitudinal direction. Connected to each other by a bar, at the site between the section bars on the inner surface of the both frame frames,
In a lead frame formed by integrally molding external lead terminals each having a land portion for joining a semiconductor chip to a tip thereof so that the respective external lead terminals are aligned in the longitudinal direction, a tip of each of the external lead terminals The land portion in the above is integrally connected to the side surface of the section bar, and the portion along the side surface of the section bar of the connection portion is cut by shearing to separate the land portion from the section bar. While providing a line, the land portions are integrally connected to each other, and a cutting operation by shearing is performed to cut each land portion at an intermediate portion of the land portions of the connection portions of the land portions. A lead frame for manufacturing a semiconductor component, which is provided with a wire.