JPH07226465A - Filling structure of filler - Google Patents

Abstract

PURPOSE:To improve the radiating property without imposing stress on a solder part. CONSTITUTION:In an electric equipment containing a printed board 3 in a case 1 with an aperture part surface covered with a cover 2, the space between the printed board 3 and the case 1 is filled up with almost spherical insulating balls 8 in high thermal conductivity. Thus, the whole space between the printed board 3 and the case 1 is turned into a space radiating a heat generating part 4. Besides, the area conducting the heat of the heat generating part 4 to the bottom surface of the case 1 is widened for raising the radiating efficiency. Furthermore, at least the space between the printed board 3 and the bottom surface of the case 1 is filled up with a resin in relatively low hardness as a filler 7. Through these procedures, the stress imposed on a solder part can be diminished.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention stores a printed circuit board on which electrical parts are mounted in a box-shaped case having an open top surface.
In an electric device in which the opening surface of the case is covered with a lid, in order to enhance the humidity resistance and vibration resistance of the stored electric parts,
The present invention relates to a structure in which a case is filled with a filler.

[0002]

2. Description of the Related Art Moisture resistance and vibration resistance are required for electric equipment used outdoors. For example, as an electric device of this type, there is a ballast for outdoor lighting which includes a large coil in the case 1. As shown in FIG. 12, this type of electric device has a box-like shape with an opening on one side, and a cover 2 is attached to the opening side in a case 1 in which a filler (compound) such as epoxy resin or urethane resin is filled. 7 to improve the moisture resistance and vibration resistance of the component 4 such as the coil housed in the case 1.

By the way, in this kind of electric equipment, when the heat generation amount of the component 4 housed in the case 1 is large, the temperature rise of the component 4 causes the component 4 itself and lead wires to gradually deteriorate, resulting in a long service life. There was a problem of shrinking. Therefore, when such a heat-generating component is provided, as shown in FIG.
As shown in (1), it is generally known to use a mixed filler 7 ′, which is a mixture of sand-like thermal conductors having good thermal conductivity, as the filler 7 filled in the case 1. That is, the heat generated by the heat-generating component 4 is transferred to the case 1 through the mixed filler 7 ', and heat is dissipated.

[0004]

However, in the method using the above-mentioned mixed filler 7 ', in order to improve the heat radiation effect, the mixing state of the heat conductive material of the mixed filler 7'is generally uniform. There must be. However, in reality, it is very difficult to maintain a state where the heat conductive material is uniformly mixed in the whole due to precipitation of the heat conductive material before the filler of the mixed filler 7'is cured after the filling. . Further, in order to mix the whole uniformly, it is necessary to sufficiently stir before filling the case 1, and there is a drawback that workability is poor. Furthermore, in order to further improve heat dissipation, it is necessary to mix a large amount of heat conductive material, and the mixed filler 7 '
However, there is a fear that the solder becomes heavier, a large stress is applied to the soldered portion, and in the worst case, a solder crack is caused. That is, the conventional filling method has a problem that it is difficult to improve heat dissipation.

By the way, as shown in FIG.
There is one that accommodates the printed circuit board 3 on which various components are mounted. In such an electric device, the case 1 may be hermetically sealed, and a heat generating component 4 having a large heat generation such as a transformer may be mounted on the printed circuit board 3 inside. In such an electric device, when the case 1 is sealed by the lid 2 and the temperature rise of the heat-generating component 4 is abnormally high, the heat-generating component 4 itself and other components mounted on the printed circuit board 3 are deteriorated by heat. However, there was a problem of a short life. Therefore, in this type of electric device, as shown in FIG.
A heat conducting material 5 such as silicon rubber is sandwiched between the lid 2 and the lid 2, and the heat generated by the heat-generating component 4 is transmitted through the heat conducting material 5 to the lid 2
I was trying to radiate heat from.

However, according to this method, the temperature rise of the heat-generating component 4 can be reduced, but since the heat conducting material 5 repeats thermal contraction due to the change of the ambient temperature, the stress applied to the solder portion of the component becomes large, which is the worst case. In the case of, there was a risk of causing a solder crack. The present invention has been made in view of the above points, and an object of the present invention is to provide a filling structure of a filler excellent in heat dissipation without applying stress to the solder portion.

[0007]

In order to achieve the above object, according to the invention of claim 1, in a box-shaped case having an upper surface opened, an electric component having substantially the same size as the inner shape of the case is provided on the upper surface. In an electrical device that accommodates the mounted printed circuit board and covers the opening surface of the case with a lid, the structure is such that the case is filled with a filler to improve the moisture resistance and vibration resistance of the accommodated electrical components. Between the printed circuit board and the bottom surface of the case, the diameter is larger than the gap between the inner surface of the case and the printed circuit board, and the diameter is smaller than the distance between the printed circuit board and the bottom surface of the case. An insulating heat conductive material having a high conductivity is filled, and a resin having a relatively low hardness is filled as a filler between at least the printed circuit board and the bottom surface of the case.

As described in claim 2, the heat conductive material may be filled on the component mounting surface side of the printed circuit board. Further, when the heat generation amount of the heat generating component is extremely large, as described in claim 3, the heat conductive material should be filled both between the printed circuit board and the bottom surface of the case and on the component mounting surface side of the printed circuit board. May be.

Further, as described in claim 4, the heat conducting material may be filled only in the vicinity of the heat generating component. In the invention of claim 4, as a specific method of filling the heat conductive material only in the vicinity of the heat generating component,
As shown in, a partition member may be used to partition the heat generating component from other components.

Here, as the partition member, as shown in claim 6, a heat-generating component itself can be used. Further, as described in claim 7, a heat sink may be used as the partition member. Further, as described in claim 8, a spacer may be used as a partition member arranged between the pattern of the printed board and the case.

According to a ninth aspect of the present invention, a mixed filler made by mixing a sandy heat conductive material having a high thermal conductivity and the filler is filled on the component mounting surface side of the printed circuit board. May be. Further, in the invention of claim 1 or claim 9, the heat conductive material may be filled without contacting the printed circuit board.

In order to achieve the above object, in the eleventh aspect of the present invention, two printed circuit boards for individually mounting a heat-generating component and other components are provided upright in a box-shaped case having an open upper surface. In an electric device in which the case's open surface is covered with a lid, a substantially spherical insulating material with high thermal conductivity is filled between the printed circuit board on which the heat-generating components are mounted and the inner surface of the case. A resin having a relatively low hardness is filled as a filler.

According to the twelfth aspect of the present invention, in a box-shaped case having an open top surface, a printed board having heat-generating components mounted on the lower part and other components mounted on the upper part is erected and housed, and the opening surface of the case is accommodated. In electrical equipment that covers with
Between the lower part of the printed circuit board on which the heat-generating components are mounted and the inner surface of the case, fill a substantially spherical insulating conductive material with high thermal conductivity, and fill resin with relatively low hardness as a filler. There is.

[0014]

According to the first aspect of the present invention, the entire space between the printed circuit board and the bottom surface of the case is heated by filling an insulating heat conductive material having high thermal conductivity between the printed circuit board and the bottom surface of the case. The space for radiating the components is made large, and the area for transmitting the heat of the heat-generating components to the bottom surface of the case is widened to enhance the radiation efficiency. In addition, as the heat conductive material, a substantially spherical material having a diameter larger than the gap between the inner surface of the case and the printed circuit board and smaller than the distance between the printed circuit board and the bottom surface of the case is used. The heat radiation area is widened with a smaller amount than the sand-like one, and the weight is relatively light despite the good heat radiation efficiency. Further, by filling a resin having a relatively low hardness as a filler between at least the printed circuit board and the bottom surface of the case, solder stress is reduced.

According to the second aspect of the present invention, by filling the heat conductive material on the component mounting surface side of the printed circuit board, it is possible to radiate the heat of the heat generating component directly to the case through the heat conductive material, and the heat radiation efficiency. Improve According to the third aspect of the present invention, the heat conducting material is filled both between the printed board and the bottom surface of the case and on the component mounting surface side of the printed board to further increase the heat radiation area and improve the heat radiation efficiency.

According to the fourth aspect of the present invention, the heat conductive material is filled only in the vicinity of the heat generating component to prevent the heat of the heat generating component from being conducted to other components via the heat conductive material. According to the invention of claim 5, by using a partition member for partitioning the heat generating component from other components, it is possible to fill the heat conducting material only in the vicinity of the heat generating component as in the invention of claim 4. To do.

In a ninth aspect of the present invention, a heat generating component is obtained by filling a component mounting surface side of a printed circuit board with a mixed filler formed by mixing a sandy heat conducting material having a high thermal conductivity and the filler. It is possible to radiate the heat of the above directly to the case through the heat conductive material, and further improve the heat radiation efficiency. According to the tenth aspect of the invention, by filling the heat conductive material without contacting the printed circuit board, it is possible to improve the adhesion between the printed circuit board and the filler.

According to the eleventh aspect of the present invention, the heat conductive material is filled between the printed board on which the heat generating component is mounted and the inner surface of the case, so that the heat generated by the heat generating component is radiated to the case via the heat conductive material. In addition, by mounting the heat-generating component and the other component on separate printed circuit boards, it is possible to prevent the heat of the heat-generating component from being transmitted to the other component, and to radiate heat efficiently and satisfactorily. Moreover, since the heat-conducting material is substantially spherical, the heat-dissipating area can be increased with a smaller amount than when the heat-conducting material is sand-like, and the heat-dissipating efficiency is good, but it is relatively lightweight. To do. Further, by filling a resin having a relatively low hardness as a filler, the solder stress is reduced.

According to the twelfth aspect of the invention, heat is generated by filling a substantially spherical insulating conductive material having a high thermal conductivity between the lower part of the printed circuit board on which the heat-generating component is mounted and the inner surface of the case. It is difficult to transfer the heat of the heat generating component to other components by dissipating the heat generated by the component to the case through the heat conductive material and by mounting the heat generating component and other components separately on the upper and lower sides of the printed circuit board. It is possible to radiate heat efficiently and satisfactorily. Moreover, since the heat-conducting material is substantially spherical, the heat-dissipating area can be increased with a smaller amount than when the heat-conducting material is sand-like, and the heat-dissipating efficiency is good, but it is relatively lightweight. To do. Further, by filling a resin having a relatively low hardness as a filler, the solder stress is reduced.

[0020]

【Example】

(Embodiment 1) FIG. 1 shows an embodiment of the present invention. In the present embodiment, in the electric device shown in FIG. 12, as shown in FIG. 1, between the printed circuit board 3 and the bottom surface of the case 1, an insulating heat conducting material 8 having a high heat conductivity such as a ceramic ball is used. And a resin having a relatively low hardness such as urethane resin is filled as the filler (compound) 7. The case where ceramic balls are used as the heat conductive material 8 will be described below.

Here, the diameter of the ceramic ball 8 is larger than the clearance a between the printed board 3 and the inner surface of the case 1 in FIG.
A distance smaller than the distance b from the bottom surface of is used. That is, the ceramic balls 8 having a diameter larger than the gap a between the printed circuit board 3 and the inner surface of the case 1 are used because the ceramic balls 8 do not move to the component 4 mounting surface side when the filling material 7 is filled. In order to do so, the reason why the gap b between the printed circuit board 3 and the bottom surface of the case 1 is used is to spread the ceramic balls 8 between the printed circuit board 3 and the bottom surface of the case 1.

In this embodiment, by using the ceramic balls 8, the entire space between the printed board 3 and the bottom surface of the case 1 can be used as a space for radiating the heat-generating component 4, and the heat of the heat-generating component 4 can be transferred to the bottom surface of the case 1. The heat dissipation efficiency can be improved by increasing the area transmitted to the. Further, when the ceramic balls 8 are used, the filling is easy and the amount can be adjusted arbitrarily. Moreover, as the heat conducting material 8, the diameter is larger than the gap a between the inner surface of the case 1 and the printed circuit board 3, By using a substantially spherical material having a diameter smaller than the distance b between the substrate 3 and the bottom surface of the case 1, that is, a ceramic ball, the heat dissipation area can be increased with a smaller amount than when the heat conductive material is sandy. , Despite good heat dissipation efficiency
It can be relatively lightweight. Further, by filling a resin having a relatively low hardness such as urethane resin as the filler 7, the solder stress can be reduced.

Here, the ceramic balls 8 and the filler 7
As a filling method, the ceramic balls 8 may first be filled in the case 1, then the printed circuit board 3 may be housed, and the filling material 7 may be filled. Alternatively, the printed board 3 may be housed after the ceramic balls 8 are filled and the filling material 7 is filled. (Embodiment 2) FIG. 2 shows another embodiment of the present invention. The present embodiment is characterized in that the ceramic balls 8 are filled on the component mounting surface side of the printed circuit board 3. The other points are similar to those of the first embodiment. In the case of the present embodiment, the printed circuit board 3 may be placed in the case 1, the filling material 7 may be filled in that state, and finally the ceramic balls 8 may be filled.

As in this embodiment, by filling the ceramic ball 8 on the component mounting surface side of the printed circuit board 3, the heat of the heat generating component 4 is transferred to the side surface of the case 1 via the ceramic ball 8. By doing so, the heat of the heat-generating component 4 can be directly transferred to the case 1, and therefore, there is an advantage that the heat radiation efficiency is further improved as compared with the case of the first embodiment.

(Embodiment 3) FIG. 3 is a combination of Embodiment 1 and Embodiment 2, in which a printed circuit board 3 and a case 1 are used.
The ceramic balls 8 are filled both between the bottom surface of the printed circuit board 3 and the component mounting surface side of the printed circuit board 3. In this embodiment, first, the case 1 may be filled with the ceramic balls 8, then the printed circuit board 3 may be housed, the ceramic balls 8 may be further filled, and finally the filling material 7 may be filled. In this case, it is effective when the heat generation amount of the heat generating component 4 is extremely large.

(Embodiment 4) FIG. 4 shows a structure in which the ceramic balls 8 are wholly filled in the third embodiment, but only the periphery of the heat generating component 4 is filled. By doing so, the influence of the heat of the heat-generating component 4 on other components can be prevented as much as possible, and the weight can be reduced. In this case, it is desirable that the heat-generating component 4 be arranged as close to the side surface of the case 1 as possible at the end of the printed circuit board 3.

(Fifth Embodiment) FIG. 5 shows a more practical embodiment than the fourth embodiment. In this embodiment, a partition plate 9 is provided between the heat generating component 4 and other components, and the ceramic balls 8 are filled only in the portion of the heat generating component 4. By doing so, the location where the ceramic balls 8 are filled can be specified, and the filling of the ceramic balls 8 can be performed easily.

By the way, although the partition plate 9 is used in the above-mentioned case, as shown in FIG. 6, the heat-generating component 4 itself may be used as a member for partitioning the ceramic balls 8. As the partition plate, as shown in FIG. 7, a heat dissipation plate 10 may be used, or a heat shield plate may be used. Furthermore,
As the partition plate 9 on the pattern surface side of the printed circuit board 3,
A spacer that holds the gap between the lower surface of the printed board 3 and the bottom surface of the case 1 may also be used.

(Embodiment 6) FIG. 8 shows another embodiment. In the present embodiment, a resin having a relatively low hardness such as urethane resin is not filled as the filling material (compound) 7 as in the first embodiment, but the space between the printed circuit board 3 and the bottom surface of the case 1 is not provided. Mixed filler 7a filled with the filler 7, and a sand-like heat conductive material (filler) having high thermal conductivity mixed with the filler 7 on the component mounting surface side of the printed circuit board 3.
It is characterized in that it was filled with. Other configurations are common to those of the first embodiment.

In the case of the present embodiment, the filling material 7 may be filled by the method shown in the first embodiment, and the mixed filling material 7a may be filled after the filling material 7 is cured. In this embodiment, the component mounting surface side of the printed circuit board 3 is filled with a mixed filler 7a in which a resin having a relatively low hardness such as a urethane resin and a sand-like thermal conductive material (filler) having a high thermal conductivity are mixed. By doing so, the heat of the heat-generating component 4 can be conducted not only to the bottom surface of the case 1 but also to the side surface of the case 1 through the mixed filling material 7a to dissipate the heat. Can be better.

By the way, in this embodiment, the component mounting surface side of the printed circuit board 3 is filled with the mixed filling material 7a without filling the ceramic balls 8 because the component mounting surface side of the printed circuit board 3 has a gap between the respective components. This is because the ceramic balls 8 cannot be filled in the gaps narrower than the diameter of the ceramic balls 8 due to the nonuniformity, and a sufficient heat dissipation effect may not be obtained. Therefore, the component mounting surface side of the printed circuit board 3 where the solder stress is not applied is filled with the mixed filler 7a so that the heat generation of each component can be conducted to the side surface of the case 1. .

In this embodiment, the boundary surface between the filling material 7 and the mixed filling material 7a is set to be substantially at the center position in the thickness direction of the printed circuit board 3. When a board is used, the solder also sucks up to the component mounting surface side, so the boundary surface may be changed to the upward direction of the printed circuit board 3 (component mounting surface side).

(Embodiment 7) FIG. 9 shows the embodiment 6 in which the ceramic balls 8 are brought into contact with the printed circuit board 3 and
What is filled between the bottom surface of the case 1 and the bottom of the case 1 is such that the ceramic balls 8 are not brought into contact with the printed circuit board 3. In this way, the adhesion between the surface of the printed board 3 and the filler 7 can be improved. That is, when the ceramic balls 8 are brought into contact with the printed circuit board 3 as in the sixth embodiment, the filler 7 cannot be interposed between the ceramic balls 8 and the printed circuit board 3, and so-called voids or the like are formed on the surface of the printed circuit board 3. However, the voids and the like can be prevented by using this embodiment.

In this embodiment, the mixed filler 7a is filled on the component mounting surface side of the printed circuit board 3 as in the case of the sixth embodiment. Needless to say, it may be filled. (Embodiment 8) FIG. 10 shows still another embodiment. In this embodiment, the heat-generating component 4 and other components (high-temperature component and low-temperature component) are mounted on individual printed circuit boards 3, and the respective printed circuit boards 3 are erected from the bottom with their pattern surfaces facing each other. It is stored inside 1. The heat-generating component 4 includes one or a plurality of components. And the heat generating component 4
A ceramic ball 8 is filled between the printed circuit board 3 on which is mounted and the inner surface of the case 1 where the component mounting surfaces of the printed circuit board 3 face each other, and a resin having a relatively low hardness such as urethane resin is used as the filler 7. It is filled.

In the structure of this embodiment, the ceramic balls 8 are filled so as to surround the heat-generating component 4, so that the heat dissipation efficiency is improved. Moreover, since the heat-generating component 4 and the other components are completely separated from each other, the other component 4 is separated from the heat-generating component 4.
There is an advantage that it can be less affected by the temperature. (Embodiment 9) FIG. 11 shows another embodiment. In this embodiment, the printed circuit board 3 is installed upright in the case 1, and the heat generating component (high temperature component) 4 is mounted on the lower part of the printed circuit substrate 3.
Other components (low temperature components) are mounted on the upper portion, the ceramic balls 8 are filled in the lower portion containing the heat-generating components 4, and a resin having a relatively low hardness such as urethane resin is filled with the filler 7. .

Also in the case of this embodiment, since the heat generating component 4 and the other components are separated above and below the printed circuit board 3, the influence of the temperature of the heat generating component 4 can be suppressed. It should be noted that the heat generated by the heat-generating component 4 can be prevented from reaching other components by placing the lid 2 side down when mounting.

[0037]

As described above, according to the first aspect of the present invention, in the box-shaped case having an open upper surface, the printed circuit board having electric components mounted on the upper surface and having substantially the same size as the internal shape of the case is housed. In an electric device in which an opening surface of a case is covered with a lid, a structure is used in which a filling material is filled in the case in order to enhance moisture resistance and vibration resistance of an electric component to be housed. Between the inner surface of the case and the printed circuit board, the diameter is larger than the space between the printed circuit board and the bottom surface of the case, and is a substantially spherical shape. Filled with conductive material,
At least the printed board and the bottom surface of the case are filled with a resin having a relatively low hardness as a filler, and an insulating heat conductive material having a high thermal conductivity is provided between the printed board and the bottom surface of the case. By filling the space, the entire space between the printed circuit board and the bottom of the case can be used as a space for radiating heat-generating components, and the area for transmitting the heat of the heat-generating components to the bottom of the case can be increased to improve heat dissipation efficiency. You can In addition, as the heat conductive material, a substantially spherical material having a diameter larger than the gap between the inner surface of the case and the printed circuit board and smaller than the distance between the printed circuit board and the bottom surface of the case is used. The heat dissipation area can be increased with a smaller amount than the case of sandy ones, and the heat dissipation efficiency is good, but the weight is relatively light. Further, by filling a resin having a relatively low hardness as a filler between at least the printed circuit board and the bottom surface of the case, solder stress can be reduced.

According to the second aspect of the present invention, by filling the heat-conducting material on the component mounting surface side of the printed circuit board, the heat of the heat-generating component can be radiated directly to the case via the heat-conducting material. Get better. According to the third aspect of the present invention, by filling the space between the printed board and the bottom surface of the case and the component mounting surface side of the printed board with the heat conductive material, the heat dissipation area can be further increased and the heat dissipation efficiency can be improved. It can be improved, and is effective when the amount of heat generated by the heat generating component is significantly large.

According to the fourth aspect of the present invention, by filling the heat conducting material only in the vicinity of the heat generating component, it is possible to prevent the heat of the heat generating component from being conducted to other components via the heat conducting material. Moreover, since the amount of the heat conducting material is reduced, the weight can be reduced. According to the invention of claim 5, by using a partition member for partitioning the heat-generating component from other components, the heat-conducting material can be filled only in the vicinity of the heat-generating component as in the invention of claim 4.

According to a ninth aspect of the present invention, a heat generating component is obtained by filling the component mounting surface side of the printed circuit board with a mixed filler formed by mixing a sandy heat conducting material having a high thermal conductivity with the filler. The heat can be radiated directly to the case via the heat conductive material, and the heat radiation efficiency can be further improved. According to the tenth aspect of the invention, by filling the heat conductive material without contacting the printed circuit board, the adhesion between the printed circuit board and the filler can be improved, and the heat dissipation efficiency can be further improved.

In the eleventh aspect of the present invention, two printed circuit boards for individually mounting a heat-generating component and other components are vertically installed and housed in a box-shaped case having an open upper surface, and the open surface of the case is In an electric device covered with a lid, a resin having a relatively small hardness is filled between the printed circuit board on which the heat-generating component is mounted and the inner surface of the case with a substantially spherical insulating thermal conductive material having high thermal conductivity. Is filled as a filling material, and by filling the heat conductive material between the printed circuit board on which the heat generating component is mounted and the inner surface of the case, the heat generated by the heat generating component is radiated to the case via the heat conductive material. By mounting the heat generating component and the other component on separate printed circuit boards, the heat of the heat generating component can be prevented from being transmitted to the other components, and efficient and good heat dissipation can be performed. . Moreover, since the heat-conducting material is substantially spherical, the heat-dissipating area can be increased with a smaller amount than when the heat-conducting material is sand-like, and the heat-dissipating efficiency is good,
It can be relatively lightweight. Furthermore, by filling a resin having a relatively low hardness as a filler, solder stress can be reduced.

In a twelfth aspect of the present invention, a box-shaped case having an open top is provided with a printed circuit board on which heat-generating components are mounted on the bottom and other components are mounted on the top. In electrical equipment that covers with
Between the lower part of the printed circuit board on which the heat-generating components are mounted and the inner surface of the case, a substantially spherical insulating thermal conductive material having a high thermal conductivity is filled, and a resin having a relatively low hardness is filled as a filler. The heat generated by the heat-generating component is generated by filling a substantially spherical insulating conductive material with high thermal conductivity between the bottom of the printed circuit board on which the heat-generating component is mounted and the inner surface of the case. It is possible to dissipate heat to the case via the conductive material, and by mounting the heat-generating component and other components separately on the upper and lower sides of the printed circuit board, it is possible to make it difficult to transfer the heat of the heat-generating component to other components, and improve efficiency. Heat can be radiated efficiently and satisfactorily. Moreover, since the heat-conducting material has a substantially spherical shape, the heat-dissipating area can be increased with a smaller amount than when the heat-conducting material has a sandy shape, and the heat-dissipating efficiency is good, but the weight is relatively light. can do. Furthermore, by filling a resin having a relatively low hardness as a filler, solder stress can be reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a first embodiment of the present invention.

FIG. 2 is a sectional view of a second embodiment.

FIG. 3 is a sectional view of a third embodiment.

FIG. 4 is a sectional view of a fourth embodiment.

FIG. 5 is a sectional view of a fifth embodiment.

FIG. 6 is a plan view when a heat-generating component is used instead of a partition plate.

FIG. 7 is a plan view when a heat-generating component is used instead of a partition plate.

FIG. 8 is a sectional view of a sixth embodiment.

FIG. 9 is a sectional view of a seventh embodiment.

FIG. 10 is a sectional view of an eighth embodiment.

FIG. 11 is a sectional view of a ninth embodiment.

FIG. 12 is a cross-sectional view showing a conventional filling structure of a filler.

FIG. 13 is a cross-sectional view showing a filling structure of a filling material with improved heat dissipation effect.

FIG. 14 is a cross-sectional view showing the structure of another electric device.

FIG. 15 is a cross-sectional view showing a method of radiating heat in the above.

[Explanation of symbols]

 1 Case 2 Lid 3 Printed Circuit Board 4 Heating Component 7 Filling Material 8 Ceramic Ball 9 Partition Plate 10 Heat Sink

Claims (12)

[Claims] 1. A box-shaped case having an open top surface, a printed circuit board having electrical components mounted on the top surface and having a size substantially the same as the internal shape of the case, and an opening surface of the case being covered with a lid. In a device, in order to improve the humidity resistance and vibration resistance of the electric components housed, the case is filled with a filler, and the inside surface of the case and the print are placed between the printed circuit board and the bottom surface of the case. The diameter is larger than the gap between the board and the diameter of the spherical shape is smaller than the distance between the printed board and the bottom surface of the case, and it is filled with an insulating heat conductive material having high thermal conductivity, and at least the printed board and the case A filling structure of a filling material, characterized in that a resin having a relatively small hardness is filled between the bottom surface and the bottom surface as a filling material. 2. The filling structure according to claim 1, wherein the heat conductive material is filled on the component mounting surface side of the printed circuit board. 3. The filling material filling structure according to claim 1, wherein the heat conductive material is filled both between the printed circuit board and the bottom surface of the case and on the component mounting surface side of the printed circuit board. 4. The filling material filling structure according to claim 1, wherein the heat conducting material is filled only in the vicinity of the heat generating component. 5. The filling material according to claim 4, further comprising a partition member for partitioning the heat-generating component from other components in order to fill the heat-conducting material only in the vicinity of the heat-generating component. Filling structure. 6. The filling structure according to claim 5, wherein the partition member is a heat-generating component itself. 7. The filling structure according to claim 5, wherein a heat dissipation plate is used as the partition member. 8. The filling structure of the filling material according to claim 5, wherein a spacer is used as a partition member arranged at least between the pattern of the printed circuit board and the case. 9. A mixed filler made of a mixture of a sand-like heat conductive material having a high thermal conductivity and the filler is filled on the component mounting surface side of the printed circuit board. The filling structure of the filling material described. 10. The filling material filling structure according to claim 1, wherein the heat conducting material is filled without contacting a printed circuit board. 11. An electric device in which two printed circuit boards for individually mounting a heat-generating component and other components are installed upright in a box-shaped case having an open top surface, and the open surface of the case is covered with a lid. In the equipment, between the printed circuit board on which the heat-generating components are mounted and the inner surface of the case, a substantially spherical insulating conductive material with high thermal conductivity is filled, and a resin with relatively low hardness is filled as the filling material. A filling structure of a filling material, characterized in that 12. A box-shaped case having an open upper surface, a printed circuit board having heat-generating components mounted on the lower portion and other components mounted on the upper portion is erected and housed, and the opening surface of the case is covered with a lid. In electrical equipment, between the lower part of the printed circuit board on which the heat-generating components are mounted and the inner surface of the case, a substantially spherical insulating thermal conductive material with high thermal conductivity is filled, and resin with relatively low hardness is filled. A filling structure of a filling material characterized by being filled as a material.