JPH0722569U - Electronic component connection device - Google Patents

Abstract

(57) [Abstract] [Purpose] When connecting an electronic component such as an external current limiting resistor to an external terminal of an electronic device such as an SSR, the number of work steps is small, and the connection can be performed easily and securely. . [Structure] A first sandwiching substrate 14 and a second sandwiching substrate 15 each having a conductor pattern on the upper surface and capable of being bent are used, and a current limiting resistor 24 is provided at each of the bent tips 18 and 20.
The electronic parts such as are sandwiched so that they can be fixed with solder. This facilitates external attachment to the plate-shaped external terminal 26. Further, since the electronic component has a solder fixing structure in which the tip portions 18 and 20 of the substrates 14 and 15 are sandwiched, a connection device that is strong against vibration and the like and highly reliable can be obtained.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic component connecting device capable of easily and reliably connecting an electronic component between an external terminal of an electronic device and an external connection conductor.

[0002]

[Prior art]

 As an electronic device, for example, there is a solid state relay (hereinafter abbreviated as S SR) shown in FIG. In the figure, a load 11 and an AC power supply 12 are connected between the output terminals 3 and 4 of the SSR 10, and a signal power supply ES is connected between the output terminals 1 and 2. To supply power to the load 11, a voltage is applied from the signal power source ES to the light emitting diode 13 of the photocoupler in the SSR 10 to cause the light emitting diode 13 to emit light. Then, the SSR 13 is turned on and power is supplied to the load 11. Here, the voltage of the signal power supply ES is generally 5V, 12V, and 24V. The current limiting resistors R1 and R2 that limit the current flowing through the light emitting diode 13 according to each voltage of the signal power source ES are built in the SSR 10. It is necessary to change the current limiting resistors R1 and R2 according to each of the signal power source voltages. Therefore, at present, a plurality of types of SSRs having different limiting resistance values are produced according to the type of power source voltage. It

However, increasing only the above-mentioned limiting resistance values and increasing the types of SSRs is disadvantageous in terms of manufacturing cost, management and storage, and the like. On the other hand, as shown in FIG. 5, the current limiting resistors R1 and R2 are not built in the SSR 10 but externally attached, so that the types of the SSR 10 itself can be reduced. In such a case, the current limiting resistors R1 and R2 must be externally attached by the user, so it is necessary to take care so that the number of working steps is as small as possible.

[0004]

[Problems to be Solved by the Invention] In the SSR having the structure in which the current limiting resistor is externally attached as described above, conventionally, a structure convenient for mounting has not been devised, so that the mounting work requires man-hours. It was Further, since the current limiting resistors R1 and R2 are of the axial lead type, there is a problem to be solved that the fixed portion is weak against vibration and lacks reliability.

[0005]

[The purpose of the device]

 The present invention has been made in order to solve the above problems, and when connecting an electronic component such as an external current limiting resistor to an external terminal of an electronic device such as an SSR, the number of working steps is small, It is an object of the present invention to provide an electronic component connecting device having a structure capable of easily and surely making electrical connection.

[0006]

[Means for solving problems]

 In the electronic component connecting device of the present invention, a conductor pattern is formed on one main surface, and a first sandwiching substrate whose front end portion is curved so as to follow the outer periphery of the electronic component, and a first sandwiching substrate facing the first sandwiching substrate. A second sandwiching base plate that is disposed, is curved so that its front end portion has a shape complementary to the front end portion of the first sandwiching substrate, and has a conductor pattern formed on one main surface; and the first sandwiching substrate. An electronic component sandwiched between the substrate and the tip of the second sandwiching substrate and fixed by soldering, the conductor pattern of the first sandwiching substrate is in contact with the external connection conductor, and the conductor of the other second sandwiching substrate. The pattern is characterized in that it makes contact with the plate-shaped external terminals led out from the electronic device and electrically connects electronic components between these external connection conductors and the plate-shaped external terminals to form a circuit configuration. It is what

[0007]

[Action]

 The electronic part connecting device of the present invention uses the first sandwiching substrate and the second sandwiching substrate which have a conductor pattern on the upper surface and which can be bent, and the bent tip has an electronic component such as a current limiting resistor. Since it can be sandwiched and fixed by soldering, it becomes easy to attach it externally to a plate-shaped external terminal of electronic equipment such as SSR. Further, since the electronic component is a solder fixing structure in which it is sandwiched between the front end portions of the substrate, a connection structure that is strong against vibrations and has high reliability can be obtained.

[0008]

【Example】

 Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. First, the substrate for holding the electronic component used in the present invention has the following configuration. That is, an aluminum plate having a thickness of about 1 mm is used as a base material, and an aluminum printed wiring board having a copper layer of about 35 μm formed on one side of the aluminum plate through an epoxy insulating layer of about 80 μm is used. To do. Using this aluminum printed wiring board, a first sandwiching substrate 14 and a second sandwiching substrate 15 which are processed to sandwich the electronic component are formed at one end thereof. As shown in FIG. 2, the first holding substrate 14 has a flat portion 16 that is not bent and is arranged so that the conductor pattern 17 is on the upper side. On the other hand, on the side of the tip portion 18 for sandwiching the electronic component and soldering the electronic component, a strip shape is formed in a narrow width shape as shown in FIG. It is bent in an arc shape.

The flat portion 19 of the second holding substrate 15 is formed in substantially the same shape as the flat portion 16 of the first holding substrate 15. On the other hand, the distal end portion 20 of the second sandwiching substrate facing the distal end portion 18 of the first sandwiching substrate 15 is arranged line-symmetrically with respect to the center line L-L and is curved so as to be concave downward. There is. In addition, the conductor pattern 17 is formed in series on the upper surface of the second holding substrate 15 including the curved portion. The flat portions 16 and 19 of the first sandwiching substrate 14 and the second sandwiching substrate 15 are provided with stopper holes 21 and 22, respectively. In addition, the conductor pattern 17 is removed from the ring-shaped portion 23 on the outer periphery of the stop holes 21 and 22 in a certain range, and the range of about 0.5 to 1.0 mm is also insulated from the end faces of the substrates 14 and 15. The conductor pattern 17 is removed to secure the creepage distance.

Next, as shown in FIG. 3, an electronic component, a current limiting resistor 24 in this embodiment, is sandwiched between the tips 18 and 20 of the first sandwiching substrate 14 and the second sandwiching substrate 15, and soldered by the solder 25. Fix it. As a result, the current limiting resistor 24 is interposed between the conductor pattern 17 of the first sandwiching substrate 14 and the conductor pattern 17 of the second sandwiching substrate 15 so as to form an electric circuit.

Next, FIG. 1 shows a state in which the first sandwiching substrate 14 and the second sandwiching substrate 15 to which the current limiting resistor 24 is fixed are attached to the plate-shaped external terminals 26 of the body of the SSR 10. In FIG. 1, the plate-shaped external terminal 26 of the SSR 10 has a shape that rises from the upper surface of the SSR 10 and is bent into a substantially L shape. Further, a terminal 29 having a screw hole 28 is provided so as to project from the upper surface of the SSR 10 so as to cover the flat portion 27 of the plate-shaped external terminal 26. The flat portion 27 of the plate-shaped external terminal 26 is provided with a through hole 30 substantially equal to the inner diameter of the stop holes 21 and 22 provided in the flat portions 16 and 19 of the first sandwiching substrate 15 and the second sandwiching base plate 16. Has been. Next, a case of assembling the device using the above members will be described. First, the flat portion 27 of the plate-shaped external terminal 26 is sandwiched between the first sandwiching substrate 15 and the second sandwiching substrate 16.

Next, the external connection conductor 31 is arranged on the conductor pattern 17 of the first sandwich substrate 14. Next, the insulating spacer 32 is inserted into the through hole 33 of the external connection conductor 31, the stop hole 21 of the first sandwiching substrate 14, the through hole 30 of the plate-shaped external terminal 26, and the stop hole 22 of the second sandwiching substrate 15. Then, the set screw 34 is screwed into the screw hole 28 of the terminal 29 to fix the whole.

When the whole is fixed as described above, the current path from the signal power supply ES of FIG. 5 is as follows. That is, the signal power source ES → the external connection conductor 31 → the conductor pattern 17 of the first sandwiching substrate 14 → the current limiting resistor 24 → the conductor pattern 17 of the second sandwiching substrate 15 → the plate-shaped external terminal 26 of the SSR10 → the internal electronic circuit of the SSR10. The current flows. A connecting device similar to the above is also configured on the other side of the pair of signal input terminals. As a result, two current limiting resistors 24 are arranged on the signal input side. Further, when the current limiting resistor is provided in only one of the signal input terminals, it is needless to say that one connection device is prepared.

Further, in the above-described embodiment, the example in which the current limiting resistor is provided on the signal input side of the SSR 10 has been described, but the electronic device is not limited to the SSR and may be another electronic device. Further, the member sandwiched between the end portions 18 and 20 of the substrates 14 and 15 is not limited to the current limiting resistance, but may be another electronic component. Furthermore, in the above-mentioned embodiment, an example in which an aluminum printed circuit board is used as the substrates 14 and 15 has been described, but the present invention is not limited to this, and an insulating plate having a conductor pattern formed on one main surface thereof. But good. What is essential is that the electronic parts have a structure in which they are connected so as to form an electric circuit between the substrates 14 and 15. In addition, although the insulating spacer 32 is interposed in the structure of FIG. 1, a structure that does not cause an electrical short circuit when the setscrew 34 is inserted between the external connection conductor 31 and the plate-shaped external terminal 26 is used. If so, it is not always necessary to interpose the insulating spacer 32.

[0015]

[Effect of device]

 According to the present invention, a bendable first sandwiching substrate and a second sandwiching substrate having a conductor pattern on the upper surface are used, and an electronic component such as a current limiting resistor is sandwiched between the folded tip ends of the soldering substrate. Since it is fixed, it can be easily attached to the external terminal of electronic equipment such as SSR by external attachment. Further, since the electronic component is a solder fixing structure in which it is sandwiched between the front end portions of the substrate, a connection structure that is strong against vibration and the like and highly reliable can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional view showing an electronic component connecting device according to an embodiment of the present invention.

FIG. 2 is a front view of a state in which an electronic component is interposed between a first sandwiching substrate and a second sandwiching substrate used in the electronic component connecting device.

FIG. 3 is a plan view showing a state in which an electronic component is interposed between a first sandwiching substrate and a second sandwiching substrate used in the electronic component connecting device.

FIG. 4 is an explanatory diagram showing a state in which a current limiting resistor is connected to an input signal terminal inside the main body of the SSR.

FIG. 5 is an explanatory diagram showing a state in which a current limiting resistor is externally attached to the input signal terminal of the SSR.

[Explanation of symbols]

 10 SSR 11 load 12 AC power supply 13 light emitting diode 14 first sandwiching substrate 15 second sandwiching substrate 16 flat portion 17 conductor pattern 18 tip portion 19 flat portion 20 tip portion 21 and 22 stopper hole 23 annular portion 24 current limiting resistance 25 solder 26 Plate-shaped external terminal 27 Flat portion 28 Screw hole 29 Terminal 30 Through hole 31 External connection conductor 32 Insulating spacer 33 Through hole 34 Set screw

Claims (1)

[Scope of utility model registration request] 1. A conductor pattern is formed on one main surface,
A first sandwiching substrate whose tip portion is curved so as to follow the outer periphery of the electronic component, and is arranged to face the first sandwiching substrate, and the tip portion has a complementary shape with the tip portion of the first sandwiching substrate. A second sandwiching substrate that is curved and formed with a conductor pattern on one main surface; the first sandwiching substrate and the second sandwiching substrate;
An electronic component sandwiched between the front end portions of the sandwiching substrates and fixed by soldering, the conductor pattern of the first sandwiching substrate is in contact with the external connection conductor, and the conductor pattern of the other second sandwiching substrate is electronic. An electronic component connecting device characterized in that a circuit configuration is made by contacting a plate-shaped external terminal led out from a device and electrically connecting an electronic component between the external connection conductor and the plate-shaped external terminal. .