JPH07210824A - Magnetic head and its production - Google Patents

Abstract

PURPOSE:To produce a magnetic head with high productivity. CONSTITUTION:Recesses 10, 30 are formed in glass layers 4, 34 on base bodies 1, 31, respectively. Insulating protective films 21, 51 are formed on the bottoms of recesses 10, 30, on which base films 20, 50 and coil patterns 19, 49 comprising copper thin films 19, 49 are formed. The base bodies 1, 31 are joined so that the coil patterns 19, 49 are electrically connected to form a coil. Since the insulating protective films 21, 51 cover and protect the glass layers 4, 34, respectively, corrosion of the glass layers can be prevented when the coil patterns are formed (more particularly, when the base films 20, 50 are patterned) and unnecessary part of the copper which constitutes the coil patterns is to be removed by etching. Thereby, the coil pattern can be formed at high accuracy without influence of corrosion of glass. Not only high quality is assured but no severe controlling of patterning or etching rate is required.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head and a method of manufacturing the same, for example, a magnetic head suitable for a video tape recorder and a magnetic disk device and a method of manufacturing the same.

[0002]

2. Description of the Related Art For example, a video tape recorder (VTR)
In such magnetic recording / reproducing devices, digital recording for digitizing and recording signals is being advanced in order to improve image quality and the like, and correspondingly, high density recording and high frequency recording have been performed. There is.

As the density and frequency of magnetic recording have increased, magnetic heads used for recording and reproduction are required to have high output at high frequencies and low noise. For example, in a so-called composite type metal-in-gap head in which a metal magnetic film is formed on a ferrite material that is often used as a magnetic head for a VTR and winding is performed, the inductance is large and the output per inductance is reduced. The output is low in the high frequency region, and it is difficult to sufficiently deal with digital image recording that requires high frequency and high density.

Under these circumstances, a so-called thin film magnetic head which is manufactured by a thin film forming process has been considered as a high frequency compatible magnetic head.

In a thin film magnetic head, a spiral coil is formed on each of a pair of ceramic substrates by a thin film forming method such as photolithography, and a pair of bases are joined to form a magnetic head. At the time of this joining, the tips of the spiral thin film coils are electrically connected to each other to form one coil.

However, when the thin film coil is formed by patterning the conductive film on the substrate, the substrate is also corroded by the etching solution, resulting in a problem that the property of the thin film coil, for example, the dimensional accuracy is deteriorated. In order to prevent this, the etching rate during patterning must be carefully controlled, which is very inconvenient from the viewpoint of productivity.

[0007]

The present invention has been made in view of the above circumstances, and there is no fear of eroding the substrate during patterning of the thin film coil formation. Therefore, patterning is performed to prevent substrate erosion. Another object of the present invention is to provide a magnetic head which can easily form a thin-film coil without requiring any severe management in the process, and a manufacturing method thereof.

[0008]

The present invention has a pair of bases facing each other, and a thin film coil is formed on at least one of the bases, and the thin film coil is insulated and protected on the base on which the thin film coil is formed. The present invention relates to a magnetic head formed via a film.

In the case of a substrate having a surface layer (for example, a surface layer made of glass), the above-mentioned substrate means a substrate including this surface layer.

In the present invention, the insulating protective film has a thickness of 1 to 500 n.
It is preferably formed with a thickness of m 3.

Further, in the present invention, it is preferable that the insulating protective film is made of a chemically stable oxide.

The insulating protective film made of the above oxide is Al ₂
It can be composed of O ₃ , SiO ₂ or Ta ₂ O ₅ .

Further, in the present invention, the insulating protective film is preferably made of a chemically stable nitride.

The insulating protective film made of the nitride can be made of silicon nitride.

In the present invention, the insulating protective film is preferably made of a chemically stable organic material.

The insulation protection made of the above organic material can be made of a photoresist material.

Further, in the present invention, it is preferable that the thin film coil is formed in a recess provided in the base body in order to prevent short circuit of the thin film coil.

Further, in the present invention, it is preferable that the thin film coils are formed on both of the pair of bases, and the thin film coils are electrically connected to each other to form one coil.

The present invention also includes a step of forming an insulating protective film on the substrate and a step of forming a thin film coil through patterning of the conductive film formed on the insulating protective film when manufacturing the magnetic head. The present invention relates to a method of manufacturing a magnetic head.

In the present invention, the first conductive film is formed on the insulating protective film, the second conductive film is formed on the first conductive film in a predetermined pattern by electroplating or the like, and then the first conductive film is formed. Patterning the first conductive film into a predetermined pattern using the second conductive film as a mask forms a thin film coil.
It is preferable for facilitating patterning.

In the present invention, the insulating protective film has a thickness of 1 to 500 nm.
Is preferably formed to a thickness of.

In the present invention, it is preferable to use a chemically stable oxide as the material of the insulating protective film.

Al ₂ O ₃ , SiO ₂ or Ta ₂ O ₅ can be used as the material of the insulating protective film made of the above oxide.

In the present invention, it is preferable to use a chemically stable nitride as the material of the insulating protective film.

Silicon nitride can be used as a material for the insulating protective film made of the above nitride.

In the present invention, it is preferable to use a chemically stable organic material as the material of the insulating protective film.

A photoresist material can be used as a material for the insulating protective film made of the above organic material.

Further, in the present invention, it is preferable to provide a recess in the substrate and form an insulating protective film in the recess in order to prevent short circuit of the thin film coil on the insulating protective film.

Further, in the present invention, it is preferable that a thin film coil is formed on both of the pair of bases, the pair of bases is joined, and the thin film coils are electrically connected to each other to form one coil.

[0030]

EXAMPLES Examples of the present invention will be described below.

The magnetic head according to this example is constructed by bonding a pair of head halves each having a spiral coil pattern formed by a thin film forming method to each of a pair of substrates. 2 is an enlarged plan view of these head halves, FIG.
2A is _a sectional view taken along the line Ia- _Ia of FIG. 2, and FIG.
It is I _b -I _b line cross-sectional view of. As indicated by the arrow, the other head half body 39 having substantially the same shape is attached to one head half body 9 to form a magnetic head.

The head half body 9 is constructed as follows. Dimples 10 on the surface of the glass 4 on the ceramic substrate 1
And the coil pattern 11 is formed on the bottom surface of the depression 10 by a thin film forming method. In the vicinity of the inner tip portion 11a of the coil pattern 11, there is a recessed portion, and a portion which will be the back gap 3b of the metal magnetic film 3 is exposed on the glass 4 in this portion. The metal magnetic film 3 is
The back gap 3b is embedded in the glass 4 from one end face side of the substrate to the one end face side, and this end face side of the base body becomes the front gap 3a.

The substrate 1 is provided on the outer tip of the coil pattern 11.
One terminal portion 12 extending to the other end surface side of the other is provided, and the other terminal portion 13 separated from the coil pattern 11 is provided in parallel with the terminal portion 12. The metal magnetic film 3 is formed on the inclined surface of the groove provided on the substrate described later.

A gold film 14 is formed on the outer glass of the recess 10 and a gold film 15 is formed on the back gap portion 3b of the metal magnetic film 3.
However, a gold film 16 is formed on the inner end 11a of the coil pattern 11.
However, a gold film 17 is deposited on the connection portion of the coil pattern 11 with the terminal portion 12, and a gold film 18 is deposited on the inner end portion of the terminal portion 13. Then, in the depression 10, the coil pattern 11
The gap 23 is filled with the insulating material 23.

The head half 39 is the terminal portion 1 of the head half 9.
In place of 2, 13, connecting portions 42, 43 (shorter than the terminal portions 12, 13) for connecting to the terminal portions 12, 13 are provided,
It is shorter than the head half 9. The other structure of the head half body 39 is the same as that of the head half body 9. It should be noted that the respective parts constituting the head half body 39 are represented by adding reference numerals of "30" to the reference numerals of the parts of the head half body 9 corresponding thereto.

As can be seen from FIGS. 1 and 2, when the head halves 9 and 39 are bonded together, the metal magnetic films 3 and 33 form a closed magnetic circuit, and the gold films 14 and 44 cause the front gap to be A back gap is formed by the films 15 and 45, respectively.
Then, the coil patterns 11 and 41 are connected through the gold films 16 and 46 to form one coil.

Thus, the current input from the terminal portion 12 is applied to the coil pattern 11, the gold films 16 and 46, the coil pattern.
41 and the gold film 47 of the connecting portion 42 in order and flow to the terminal portion 13. Also, it flows in the opposite direction. The gold films 17 and 48 are not necessary for the electrical connection of the coil pattern, but they help prevent rattling when the head halves 9 and 39 are bonded together.

By providing the depressions 10 and 40 and forming the coil patterns 11 and 41 on the bottom surfaces thereof, the area of the coil pattern other than the connecting portions 11a and 41a is equal to the size of the magnetic gap formed by the gold film. They do not come into contact with each other apart and no short circuit occurs. Further, this short circuit is easily prevented.

In this example, it should be noted that the insulating protective films 21 and 51 are formed on the bottom surfaces of the depressions 10 and 40 and the coil patterns 11 and 41 are formed thereon before the coil patterns are formed. It is that you are. The insulating protective films 21 and 51 prevent erosion of the surfaces of the glass layers 4 and 34 when patterning for forming a coil pattern, which will be described later, or a conductive unnecessary portion forming the coil pattern is removed by chemical etching. It plays a role of preventing deterioration of properties such as pattern dimensional accuracy.

Next, the manufacturing process of the magnetic head according to this example will be described.

First, as shown in FIG. 3, a flat plate-shaped substrate 1
To prepare. The substrate 1 may be made of a magnetic material such as ferrite. For example, potassium titanate or the like is used in order to prevent crosstalk when a multichannel structure is used and to reduce the impedance of the magnetic head. It is preferable that the non-magnetic material of

Of course, not only the above-mentioned potassium titanate but also various non-magnetic materials can be used. For example, calcium titanate, barium titanate, zirconium oxide (zirconia), alumina, alumina titanium carbide, SiO _{2 can be used.} , MnO-NiO mixed sintered material, Zn ferrite, crystallized glass, high hardness glass and the like.

Next, as shown in FIG. 4, the main surface 1 of the substrate 1 is
The first groove processing is performed on a. This groove processing is provided such that a metal magnetic film formed in a later step is formed obliquely with respect to the main surface 1a which is the magnetic gap forming surface of the substrate 1. Therefore, each first groove 2 is formed parallel to the depth direction with a predetermined inclined surface 2a.

After performing the above-described groove processing, as shown in FIG. 5, a metal magnetic film 3 is formed on the entire main surface 1a of the substrate 1 including the inside of the groove 2 (particularly on the inclined surface 2a). . The method for forming the metal magnetic film 3 includes vacuum deposition, sputtering, and the like.
Various thin film forming processes can be adopted.

The metal magnetic film 3 may be made of any material as long as it has a high saturation magnetic flux density and good soft magnetic characteristics, for example, Fe-Al.
-Si based alloy (especially sendust), Fe-Al based alloy,
Fe-Si-Co based alloy, Fe-Ga-Si based alloy, F
e-Ga-Si-Ru alloy, Fe-Al-Ga alloy, Fe-Ga-Ge alloy, Fe-Si-Ge alloy, Fe-Co-Si-Al alloy, Fe-Ni alloy, etc. And the crystalline alloys thereof.

Alternatively, an alloy composed of one or more elements of Fe, Co, and Ni and one or more elements of P, C, B, or Si, or containing Al, Ge, Be, or
Sn, In, Mo, W, Ti, Mn, Cr, Zr, H
Amorphous alloys such as metal-metalloid amorphous alloys represented by alloys containing f, Nb, etc., and metal-metal amorphous alloys containing transition metals such as Co, Hf, Zr and rare earth elements as main components. Can also be used.

Next, as shown in FIG. 6, the glass 4 is filled in the first groove 2 formed in the substrate 1 to flatten the surface, and then the first groove 2 is formed as shown in FIG. The second groove 5 and the third groove 6 are provided by cutting in a direction orthogonal to.

The second groove 5 corresponds to, so to speak, a winding groove of a normal bulk type magnetic head, and defines the front depth and the back depth of the metal magnetic film 3 previously formed. The magnetic path formed by the magnetic film 3 is formed so as to form a closed loop. On the other hand, the third groove 6
Is provided in order to remove the metal magnetic film 3 which becomes unnecessary when the magnetic head is finally assembled.

Next, as shown in FIG. 8, the second groove 5 and the third groove 6 are filled with the glass 4 again, and the main surface 1a is flattened.

Next, as shown in FIG. 9, a fourth groove 7 and a fifth groove 8 are provided in parallel with the first groove 2 by cutting. Here, the fourth groove 7 is formed so as to be in contact with one end edge of the metal magnetic film 3 formed on the groove inclined surface 2a, and regulates the abutting width of the metal magnetic film 3, that is, the track width.
Further, the fifth groove 8 is provided for removing the unnecessary metal magnetic film 3 existing on the bottom surface of the groove 2 of the metal magnetic thin film 3 in the first groove 2.

Next, as shown in FIG. 10, the glass 4 is filled in the fourth groove 7 and the fifth groove 8 again to flatten the surface.

Through the above steps, the magnetic path portion is formed by the metal magnetic film 3. FIG. 11 shows a portion (portion XI shown by a virtual line) corresponding to each magnetic head in FIG. 10 taken out and enlarged (the direction is changed). Less than,
A method of forming the coil in the area shown in FIG. 11 will be described.

Similar to FIG. 11, FIG. 12 is a partially enlarged view of the substrate 1 corresponding to each magnetic head.
12 (a) is a plan view further enlarging a rectangular area of XII indicated by an imaginary line in FIG. 11, and FIG. 12 (b) is a sectional view taken along the imaginary line position in FIG. Also in the drawing).

As shown in FIG. 12A, the metal magnetic film 3 faces the magnetic gap forming surface in a divided form.
The portion located at the center is the back gap portion 3b, and the portion divided from the back gap portion by the groove 5 is the front gap portion 3a. Both parts are shown in Figure 12.
As shown in (b), the film is obliquely formed on the substrate 1. Further, the glass 4 filled in each groove is exposed around the back gap portion 3b.

Therefore, first, as shown in FIG. 13, a resist layer 61 is formed by a photolithographic technique so as to roughly correspond to the outer shape of the coil.

After that, as shown in FIG. 14, etching is selectively performed by a method of ion milling to form a recess 10 corresponding to the outer shape of the coil, and then a photoresist is used.
Wash away 61.

Here, since the glass to be etched by the ion milling is the glass 4, the recesses 10 are accurately formed as shown in the table below.

[0058]

From the above table, it is understood that glass is preferably used in order to form the recess 10 in the coil portion deeply and accurately.

As a method of forming the depression 10, besides the above-mentioned ion milling, a chemical etching method, a reactive ion etching, a powder beam etching and the like can be mentioned. These methods physically remove the atoms in the etched area,
It is chemically peeled off, and when the etched part is polycrystalline, the peeling speed differs due to the difference in crystal grains,
Although it is difficult to form the flat depressions 10, if the material is amorphous such as glass, the flat depressions 10 can be formed. It is difficult to form a space (recess) only in a necessary portion by mechanical processing.

Next, as shown in FIG. 15, an alumina film (insulating protection film) 21 is sputtered on the glass layer 4.
A film having a thickness of 0.2 μm is formed on the entire surface, and then a base film 20 serving as a base of the copper plating layer forming the coil pattern is formed on the entire surface by sputtering. The base film 20 is formed by stacking a chromium film (0.01 μm thick) and a copper film (0.2 μm thick) in this order from the bottom, but these layer configurations are not shown.

Next, photoresist is applied and patterned according to the coil pattern to be formed as shown in FIG. In the figure, 62 is a patterned photoresist.

Next, copper plating is performed using the photoresist 62 as a mask to form a copper plating layer 19 having a thickness of about 3.5 μm as shown in FIG. 17, and then the photoresist 62 is washed as shown in FIG. Remove.

Next, as shown in FIG. 19, the underlying film 20 where the copper plating layer 19 is not present is removed by ion milling to form the coil pattern 11. At this time, the copper plating layer 19 serves as a mask, and the insulating protective film 21 protects the glass layer 4 to prevent its corrosion.

Next, as shown in FIG.
Apply 63 and pattern it to leave unetched areas.

Next, it is immersed in a ferric chloride solution, and unnecessary copper is removed by chemical etching, as shown in FIG. 21, to leave the coil pattern 11 consisting of the copper plating layer 19 and the base film 20. The unnecessary parts of copper are removed by chemical etching,
Ion milling, reactive ion etching, powder beam etching or the like can also be used. In this step, the insulating protective film 21 protects the glass layer 4 and prevents corrosion by the etching solution.

Next, an insulating material is applied, and as shown in FIG. 22, the insulating material 23 is patterned so as to leave the insulating material in the depressions 10 to protect the coil pattern 11. As the insulating material, photoresist is used in this example.
It is heated to 00 to 400 ° C. and cured, and this is used as the insulating material 23.

Next, a polishing finish for surface flattening is applied, and
As shown in 23, the copper plating layer 19 of the coil pattern 11 is exposed.

Next, as shown in FIG. 24, a nonmagnetic film 74 for forming a magnetic gap is formed by sputtering so as to have a thickness half the gap length. The non-magnetic film 74 is formed in the order of titanium and gold to a total thickness of 0.1 μm.

Next, a photoresist is applied on the non-magnetic film 74, and as shown in FIG. 25, the inner tip portion of the coil pattern is formed.
11a, the back gap 3b of the magnetic film 3 and the recess 10
Patterning so that the photoresist 65 is left in the outer region (region for forming the front gap).

Next, ion milling is performed using the photoresist 65 as a mask to remove unnecessary portions of the gold film (nonmagnetic film). Thus, as shown in FIG. 26, the gold film 14 is formed in the region outside the depression 10 (including the front gap forming region).
However, the gold film 15 is formed on the back gap forming portion, the gold film 16 is formed on the inner tip portion 11a of the coil pattern 11, the gold film 17 is formed on part of the terminal portion 12, and the gold film 17 is formed on part of the terminal portion 13. Each gold film 18 remains.

Next, as shown in FIG. 27, the head halves 9 manufactured as described above and the head halves 39 manufactured through the same process are taken along the lines AA and BB, respectively. And cut at the positions indicated by lines C-C and D-D. At the time of this cutting, as described above with reference to FIG.
The connecting portions 42 and 43 are cut so as to be shorter than the terminal portions 12 and 13 of the head half body 9.

Next, the head halves 9 and 39 cut into a predetermined size in FIG. 27 are bonded as shown in FIG. 28 to obtain the magnetic head material shown in FIG. FIG. 29 (a) is a perspective view of the magnetic head material, and FIG. 29 (b) is a sectional view passing through the inner end of the coil pattern. The above-mentioned bonding is performed by thermocompression bonding at 200 to 400 ° C., as described above.

Next, unnecessary side edges of the magnetic head material are cut and removed to obtain the magnetic head shown in FIG.

In the description with reference to FIGS. 12 to 29, one head half is explained, but in reality, a plate-shaped material as an assembly of many head halves as shown in FIG. The above-mentioned processing is performed, and finally, individual head half materials are collected by cutting.

As described above, in the magnetic head according to this example, since the insulating protective film is formed on the glass layer and the coil pattern is formed thereon as described above, patterning of the coil pattern and the coil pattern are performed. When the unnecessary portion of the conductive material forming the pattern is removed by etching, the glass layer of the substrate is prevented from being corroded. As a result, the coil pattern is assured of high dimensional accuracy, and the etching rate in the above case is not required to be strictly controlled, so that high productivity and high reliability are assured.

Further, in this magnetic head, a recess having a shape corresponding to the shape of the coil pattern is formed around the back gap, and the coil pattern is formed in this recess, so that the sliding surface on the magnetic recording medium is formed. No unnecessary openings (holes) are formed and there is no need to fill the glass. Therefore, the disconnection or short circuit of the thin film coil pattern due to the filling of glass is eliminated.

Further, in the manufacturing process of this magnetic head, since the abutting surface (that is, the magnetic gap forming surface) is flattened after forming the coil pattern in the recess previously formed by ion milling, the gap accuracy is sufficient. Secured in.

As the insulating material, in addition to photoresist,
Stable insulating materials such as glass, oxides such as alumina and silica, or nitrides such as silicon nitride can be used. In these cases, a film having a thickness of 6 to 8 μm is formed by sputtering, and then the surface is flattened.

As the material of the insulating protective film 21 in the above example, SiO ₂ , Ta ₂ O ₅ , Si ₃ N were used instead of alumina.
_{4. When} the same thermosetting photoresist material as the insulating material 23 (each of which is a chemically stable oxide, nitride or organic material) was used, the same effect as in the above example was obtained.

For comparison, the following experiment was conducted without providing the insulating protective film 21. That is, the substrate (the substrate shown in FIG. 14) in which the glass layer 4 has the depression 10 is applied to the ferric chloride solution by about 10 times.
After immersion for a minute, it was examined whether or not the glass layer 4 was eroded.

After the lapse of the above time, the substrate was taken out from the ferric chloride solution, washed with water, and observed under a microscope with special attention paid to the vicinity of the magnetic film 3. As a result, the glass layer 4 was partially eroded. Immediately after immersing the substrate in the ferric chloride solution, it was observed that the surface of the glass portion became cloudy. This is because the glass reacted with ferric chloride and was altered.

On the other hand, in the substrate according to the above-mentioned embodiment provided with the insulating protective film 21, no change was observed even after soaking in the ferric chloride solution for about 10 hours. From the above results,
It is clear that the insulating protective film is not etched and functions as an etching stop layer.

In the above-mentioned embodiment, the coil pattern made of the thin film is formed on both of the pair of substrates, but the coil pattern can be provided only on one substrate and the wiring can be provided on the other substrate. That is, the inner tip portion of the coil pattern and the terminal portion provided on the base body (the terminal portion on the base body that is not connected to the coil pattern) are electrically connected by the wiring provided on the other base body.

FIG. 31 is a plan view similar to FIG. 2 showing the head half thus constructed, and FIG. 32 is an enlarged sectional view taken along the line EE of FIG. 31 after the two head halves are bonded together. .

In this example, one head half is the head half 9 used in the above embodiment, and the other head half is the head half indicated by reference numeral "101".

In the head half 101, the recess 10 of the glass layer 102 is formed.
An L-shaped copper wiring 104 is provided by electroplating on the insulating protective film 121 in 3 and is connected to the gold films 16 and 18 of the head half body 9 by the gold films 105 and 106, and a coil is formed through the copper wiring 104. The inner tip portion 11 a of the pattern 11 is connected to the terminal portion 13. In the figure, 107 is a gold film that forms a magnetic gap together with the gold film 14, 108 is an insulating material, 120 is a base film of the copper wiring 104, and 121 is an insulating protective film.

The examples of FIGS. 31 and 32 have the advantage that the structure of one of the head halves is simplified when the number of turns of the thin film coil is small.

Although the embodiments of the present invention have been described above, various modifications can be added to the embodiments based on the technical idea of the present invention.

For example, the coil pattern may be formed by patterning both the conductive underlayer film formed in a planar shape and the copper plating layer thereon, and may be formed of a single layer of copper formed by sputtering or the like. It is also possible to form the layer by patterning. Further, a photoresist is applied on the underlayer film 20 and patterned, and then the underlayer film 20 is patterned by, for example, chemical etching using a ferric chloride solution to remove the remaining portion of the underlayer film 20. It is also possible to form the copper plating layer 19 thereon by electroplating.

In any of the above methods, the glass layer 4 of the substrate is
Since is covered with the insulating protective film 21, it is not corroded. As described above, these methods are the same in the subsequent removal of unnecessary portions of the copper plating layer (step of FIG. 21), and therefore the effect of providing the insulating protective film 21 is remarkable.

The glass layer and the depression provided in the glass layer are desirable because they have the above-mentioned merits, but these are not essential to the present invention and can be omitted.

Further, the material and shape of each part constituting the magnetic head may be an appropriate material and shape other than the above. The present invention can be applied to other magnetic heads for audio as well as VTR magnetic heads.

[0094]

According to the present invention, since the thin film coil is formed on at least one of the pair of bases facing each other through the insulating protective film, the process of forming the thin film coil and the unnecessary portion of the thin film coil constituent material are eliminated. In the removing step, the insulating protective film protects the substrate and prevents the substrate from being corroded.

As a result, the thin-film coil is not affected by the erosion of the substrate, is formed with high accuracy and guarantees high quality, and the speed of processing (for example, dry etching or wet etching) in the above process is not limited. The magnetic head can be manufactured with high productivity without the need to manage it.

[Brief description of drawings]

1 shows a cross-sectional structure of a pair of head halves according to an embodiment, FIG. 1 (a) is _a cross-sectional view taken along line Ia- _{Ia of} FIG.
(B) is I _b -I _b line cross-sectional view of FIG.

FIG. 2 is a plan view of the same pair of head halves.

FIG. 3 is a perspective view of a substrate in the same head half manufacturing process.

FIG. 4 is a schematic perspective view showing a first groove processing step on the same substrate.

FIG. 5 is a schematic perspective view showing a film forming process of the metal magnetic film.

FIG. 6 is a schematic perspective view showing the glass filling step.

FIG. 7 is a schematic perspective view showing second and third groove processing steps on the same substrate.

FIG. 8 is a schematic perspective view showing the glass filling step.

FIG. 9 is a schematic perspective view showing fourth and fifth groove processing steps on the same substrate.

FIG. 10 is a schematic perspective view showing the glass filling and flattening step.

FIG. 11 is an enlarged view of a portion XI (head half body material) in FIG.

FIG. 12 is a plan view (FIG. 12A) and a cross-sectional view (FIG. 11B) of the head half body material of FIG.

13A and 13B are a plan view (the same figure (a)) and a cross-sectional view (the same figure (b)) of a head half material in which a photoresist is provided on the glass layer.

14A and 14B are a plan view (the same figure (a)) and a cross-sectional view (the same figure (b)) of the head half material in which the glass layer is provided with a depression.

15A and 15B are a plan view (the same figure (a)) and a cross-sectional view (the same figure (b)) of the head half body material provided with the same insulating protective film and the copper plating base film.

16A and 16B are a plan view (the same figure (a)) and a cross-sectional view (the same figure (b)) of a head half material in which a photoresist is provided on the underlying film.

FIG. 17 is a plan view (FIG. (A)) and a cross-sectional view (FIG. (B)) of the head half body material provided with the copper plating layer.

FIG. 18 is a plan view (FIG. (A)) and a cross-sectional view (FIG. (B)) of the head half material from which the photoresist has been removed.

FIG. 19 is a plan view (FIG. (A)) and a cross-sectional view (FIG. (B)) of a head half body material in which a coil pattern is formed by removing a base film in a portion without the copper plating layer.

FIG. 20 is a plan view (FIG. (A)) and a cross-sectional view (FIG. (B)) of a head half material in which a photoresist is provided on the copper plating layer.

FIG. 21 is a plan view (FIG. (A)) and a sectional view (FIG. (B)) of the head half body material from which unnecessary portions of the copper plating layer are removed.
Is.

FIG. 22 is a plan view (FIG. (A)) and a cross-sectional view (FIG. (B)) of the head half body material in which the recess is filled with an insulating material.

FIG. 23 is a plan view (FIG. (A)) and a cross-sectional view (FIG. (B)) of the head half body material whose surface is flattened.

FIG. 24 is a plan view (FIG. (A)) and a cross-sectional view (FIG. (B)) of a head half body material having a gold film formed on the same surface.

FIG. 25 is a plan view (FIG. (A)) and a cross-sectional view (FIG. (B)) of a head half material in which a photoresist is provided on the gold film.

FIG. 26 is a plan view (FIG. (A)) and a cross-sectional view (FIG. (B)) of the head half body material in which the gold film is patterned.

FIG. 27 is a perspective view showing cutting positions of the same pair of half head materials.

FIG. 28 is a perspective view showing how to bond the same pair of head halves together.

29A and 29B show a pair of head halves that are bonded together, FIG. 29A being a perspective view and FIG. 29B being a sectional view.

FIG. 30 is a perspective view of a magnetic head obtained by cutting and removing the unnecessary portion.

FIG. 31 is a plan view of a pair of head halves according to another embodiment.

FIG. 32 is a diagram of a pair of head halves that are attached to each other.
It is an expanded sectional view which follows the EE line of 31.

[Explanation of symbols]

 1, 31 ... Substrate 3, 33 ... Metal magnetic film 4, 34 ... Glass layer 4a, 34a ... Protrusions 4b, 34b ... Inclined surface 9, 39 ... Head half body 10, 40 ... Dimple 10a, 40a ... Bottom face of dimple 11, 41 ... Coil pattern 11a, 41a ... Inner end of coil pattern 12, 13 ... Terminal portion 14, 15, 16, 17, 18, 44, 45, 46, 47, 48 ... Gold film 19, 49 ... Copper plating layer 20, 50, 120 ... Copper plating base film 21, 51 ... Insulating protection film 23, 53, 121 ・ ・ ・ Insulating material 42, 43 ・ ・ ・ Connection part with terminal part 62, 63, 64, 65 ・ ・ ・ Photoresist

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Koji Shoko 6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation

Claims (21)

[Claims] 1. A pair of bases facing each other, a thin film coil is formed on at least one of the bases, and the thin film coil is formed on the base on the thin film coil formation side via an insulating protective film. Magnetic head. 2. The magnetic head according to claim 1, wherein the insulating protective film is formed with a thickness of 1 to 500 nm. 3. The magnetic head according to claim 1, wherein the insulating protective film is made of a chemically stable oxide. 4. The magnetic head according to claim ₃ , wherein the insulating protective film is made of Al ₂ O ₃ , SiO ₂ or Ta ₂ O ₅ . 5. The magnetic head according to claim 1, wherein the insulating protective film is made of a chemically stable nitride. 6. The magnetic head according to claim 5, wherein the insulating protective film is made of silicon nitride. 7. The magnetic head according to claim 1, wherein the insulating protective film is made of a chemically stable organic material. 8. The magnetic head according to claim 7, wherein the insulating protective film is made of a photoresist material. 9. The magnetic head according to claim 1, wherein the thin-film coil is formed in a recess provided in the base body. 10. The thin film coil according to claim 1, wherein the thin film coil is formed on both of the pair of bases, and the thin film coils are electrically connected to each other to form one coil. Magnetic head. 11. When manufacturing the magnetic head according to claim 1, a thin film coil is formed through a step of forming an insulating protective film on a substrate and patterning of a conductive film formed on this insulating protective film. A method of manufacturing a magnetic head, comprising: 12. A first conductive film is formed on the insulating protective film,
A second conductive film is formed in a predetermined pattern on the first conductive film, and then the first conductive film is patterned using the second conductive film as a mask to form a thin film coil,
The method according to claim 11. 13. The method according to claim 11, wherein the insulating protective film is formed to a thickness of 1 to 500 nm. 14. The method according to claim 11, 12 or 13, wherein a chemically stable oxide is used as a material of the insulating protective film. 15. The material of the insulating protective film is Al ₂ O ₃ ,
The method according to claim 14, wherein SiO ₂ or Ta ₂ O ₅ is used. 16. The method according to claim 11, 12 or 13, wherein a chemically stable nitride is used as a material of the insulating protective film. 17. The manufacturing method according to claim 16, wherein silicon nitride is used as a material of the insulating protective film. 18. The method according to claim 11, 12 or 13, wherein a chemically stable organic substance is used as a material of the insulating protective film. 19. The magnetic head according to claim 18, wherein a photoresist material is used as a material of the insulating protective film. 20. The method according to claim 11, wherein the substrate is provided with a recess and an insulating protective film is formed in the recess. 21. A thin-film coil is formed on both of a pair of bases, the pair of bases is joined, and the thin-film coils are electrically connected to each other to form one coil.
20. The method according to any one of 20 to 20.