JPH07183060A - Electric-circuit component, its manufacture, storage-device driving unit, ink-jet driving unit, and ink-jet recording device - Google Patents

Abstract

PURPOSE:To manufacture an electric-circuit component or the like that enables a highly reliable alternate connection of film-shaped electrically conducting and insulating members to each other even if electrodes to be connected are arranged at small intervals with high density. CONSTITUTION:A circuit component 21 comprises a plurality of film-shaped electrically conducting members l and a plurality of film-shaped electrically insulating members 2 stacked alternately, the conducting members 1 being insulated from one another. Adhesive layers 3 are interposed between the pairs of conducting and insulating members 1, 2. The electrically conducting members 1 can be formed from any material showing a desired electrical conductivity, and if a metal is used, gold is desirable because of its excellent workability and corrosion resistance, while other metals can also be used. The electrically insulating members 2 are formed from a material showing a desired electrical insulating property such as a thermosetting resin. The adhesive layers 3 are not always required. Even if electrodes to be connected are arranged at small intervals into high density, a connection of high reliability can be made.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric circuit component for electrically connecting electric components in which a plurality of electrodes are arranged at high density and a method for manufacturing the same. Furthermore, the present invention relates to a recording element drive unit, an inkjet drive unit, and an inkjet recording apparatus having such an electric circuit component.

[0002]

2. Description of the Related Art The following technique is known as a conventional method for electrically connecting electric parts to each other.

.. Wire Bonding Method FIG. 17 is a diagram showing a typical example of a semiconductor device connected and sealed by wire bonding, (a)
Is a schematic cross-sectional view, and (b) is a schematic plan view. In the wire bonding method shown in this figure, the semiconductor element 44 is fixedly supported on the element mounting portion 42 using, for example, a silver paste 43, and then the joint portion 45 of the semiconductor element 44 and the joint portion 46 of the lead frame 41 are connected. Extra fine metal wire such as gold 4
7 for electrical connection. After this connection, thermosetting resin (epoxy resin, etc.) by transfer molding etc.
The semiconductor element 44 and the lead frame 41 are sealed with a resin 48 such as, and thereafter, unnecessary portions of the lead frame 41 extending outward from the resin-sealed component are cut and bent into a desired shape to obtain a semiconductor device 49. .

.. TAB (Tape Automated Bonding) method (see Japanese Patent Laid-Open No. 59-139636). FIG. 18 is a schematic cross-sectional view showing a typical example of a semiconductor device which is connected and sealed by the TAB method. Also,
This method is an automatic bonding method using a tape carrier method. That is, in the TAB method shown in this figure, after the carrier film substrate 56 and the semiconductor element 44 are positioned, the inner lead portion 57 of the carrier film substrate 56 and the joint portion 45 of the semiconductor element 44 are thermocompression bonded to be connected. To do. After this connection, a semiconductor device 49 is obtained by sealing with a resin 58 and a resin 59 such as a thermosetting resin (epoxy resin or the like).

.. CCB (Controlled Collapse Bondin
g) method (Japanese Examined Patent Publication No. 42-2096, JP-A-60-5)
FIG. 19 is a schematic cross-sectional view showing a typical example of a semiconductor device connected and sealed by the CCB method. In addition,
This method is also called a flip chip bonding method. In the CCB method shown in this figure, the semiconductor element 44
Solder bumps 61 are provided in advance on the joint portions 45 of the semiconductor chip 44, the semiconductor element 44 provided with the solder bumps 61 is positioned and mounted on the circuit board 62, and the circuit board 62 and the semiconductor element 44 are separated by heating and melting the solder. The semiconductor device 49 is obtained by connecting at the joint portion 63, and cleaning after flux and sealing.

[0006] Method Using Thermocompression Bonding FIG. 20 is a schematic sectional view showing a conventional method utilizing thermocompression bonding. In this conventional method, first, as shown in FIG. 20A, an insulating film 71 made of polyimide or the like is formed on a portion other than the joint portion 45 of the first semiconductor element 44, and the joint portion 45 is formed.
Is provided with a metal material 70 made of Au or the like, and then the exposed surface 72 of the insulating film and the exposed surface 73 of the metal material are flattened.
Similarly, for the second semiconductor element 44 ′, the insulating film 71 ′ is formed on the portion other than the joint portion 45 ′, and the joint portion 4 ′ is formed.
A metal material 70 'is provided on 5', and exposed surfaces 72 'and 73' are made flat. After that, as shown in FIG. 20B, the first semiconductor element 44 and the second semiconductor element 44 'are positioned and thermocompression-bonded to each other, thereby joining the joint portion 45 and the joint portion 45 via the metal materials 70 and 70'. 45 'is electrically connected.

[0007]. Method Using Anisotropic Conductive Film FIG. 21 is a schematic sectional view showing a conventional method using an anisotropic conductive film. In the conventional method shown in this figure, an insulating material 7 is formed between the first circuit board 75 and the second circuit board 75 '.
After the first circuit board 75 and the second circuit board 75 'are positioned by interposing the anisotropic conductive film 78 in which the conductive particles 79 are dispersed in 7, the first circuit board 75 and the second circuit board 75' are pressurized or pressurized to heat the first circuit board 75 and the second circuit board 75 '. The joint portion 76 of the circuit board and the joint portion 76 'of the second circuit board are electrically connected.

[0008]

The conventional techniques listed above have the following problems.

[0009]. Wire Bonding Method (a) In order to avoid contact between adjacent ultrafine metal wires 47 and the like, a pitch dimension of the joint portion 45 must be set to some extent. Therefore, it is not suitable for connecting joints that are spatially arranged at high density. (B) The wire bonding work takes time. Particularly, if the number of connection points is large, the bonding time becomes long and the production efficiency is reduced. (C) If the transfer mold condition range is exceeded for some reason, the ultrafine metal wire 47 is deformed or, in the worst case, is cut. (D) When a defect occurs in one of the bonded substrates, it is difficult to replace only one substrate.

[0010]. TAB method (a) The pitch dimension of the joint portion 45 is 0.09 to 0.15 m
Since it is necessary to take about m, like the wire bonding method, it is not suitable for connecting the joint portions which are spatially arranged at high density. (B) Since the thermal expansion coefficient of the connecting member (for example, the semiconductor element 44) is different from the thermal expansion coefficient of the resins 58 and 59, the reliability of the device deteriorates when the temperature changes in the system. In particular, the larger the size of the connecting member, the more likely this problem will occur. (C) When one of the bonded substrates has a defect, it is difficult to replace only one substrate.

[0011]. CCB method (a) Since it is necessary to form the solder bump 61 on the joint portion 45, the cost becomes high. (B) When the amount of solder in the bump is large, a bridge is formed between the adjacent solder bumps, and conversely, when the amount of solder in the bump is small, electrical continuity is lost and the reliability of connection is lowered. Further, the solder shape of the connection also affects the reliability of the connection. Therefore, strict control of the amount of solder bumps 61 is required. (C) If the solder bumps 61 are present inside the semiconductor element 44, for example, it becomes difficult to perform a visual inspection as to whether or not the connections are made well. (D) When a defect occurs in one of the bonded substrates, it is difficult to replace only one substrate.

[0012]. Method Using Thermocompression Bonding When one of the bonded substrates is defective, it is difficult to replace only one of the substrates.

.. Method Using Anisotropic Conductive Film (a) Due to the arrangement of the conductive particles 79 in the anisotropic conductive film 78, the resistance value varies greatly and the reliability of connection is poor. Further, it is not suitable when a large amount of current is desired to flow.
(B) When the pitch of the adjacent joints 76 and 76 'is narrowed, the resistance value between the adjacent joints becomes small, which is not suitable for high-density connection. (C) Since the resistance value changes due to the variation in the protrusion amount h ₁ of the joint portions 76 and 76 ′, it is necessary to accurately suppress the variation amount in h ₁ .
(D) When one of the circuit boards 75 and 75 'becomes defective, it is difficult to replace only that circuit board.

The present invention has been made to solve the problems of the prior art as described above, and an electric circuit which enables simple and highly reliable connection between electrodes arranged at high density. It is to provide parts.

[0015]

The above object can be achieved by the present invention described below.

The electric circuit component of the present invention is an electric circuit component for electrically connecting a plurality of arrayed electrodes and a plurality of other arrayed electrodes, and comprises a film-shaped electrically conductive member and a film-shaped electrically conductive member. The electrical circuit component is characterized by being alternately laminated with the electrical insulating member of.

The method for producing an electric circuit component of the present invention is the same as the method for producing an electric circuit component of the present invention, which is a multilayer film formed by laminating a film-like electrically conductive member and a film-like electrically insulating member. A step of laminating by winding an adhesive on the winding body, or by winding a single layer film of an electrically conductive member and a single layer film of an electrically insulating member on the winding body via an adhesive. It is a method of manufacturing an electric circuit component, which has a step of alternately laminating.

The recording element drive unit of the present invention is a recording element drive unit having a plurality of recording elements and a plurality of drive elements for driving the plurality of recording elements, each of the plurality of recording elements A plurality of electrodes arranged in communication with
A recording element drive unit is characterized in that a plurality of electrodes arranged in communication with each of the plurality of drive elements are electrically connected via the electric circuit component of the present invention.

The ink jet drive unit of the present invention comprises:
Inkjet drive having a plurality of recording elements having at least an electrothermal converter, an ink flow path and an ink ejection port formed on the electrothermal converter, and a plurality of driving elements for driving the plurality of recording elements In the unit, a plurality of electrodes arranged in communication with each of the electrothermal converters and a plurality of electrodes arranged in communication with each of the plurality of drive elements are connected via the electric circuit component of the present invention. The inkjet drive unit is characterized by being electrically connected.

An ink jet recording apparatus of the present invention is an ink jet recording apparatus having the above ink jet driving unit of the present invention.

[0021]

By using the electric circuit component of the present invention, the electrodes of one electric component arranged at high density on one part (joint part) of this electric circuit component and the other part (joint part) of the other electric part. Good electrical connection can be achieved only by connecting the electrodes arranged in high density in the parts. Such an electric circuit component for connection is completely different from the conventional various connection techniques, and can be connected very easily as compared with those, and a highly reliable connection can be obtained.

[0022]

EXAMPLES The present invention will be described in more detail below with reference to examples.

<Example A1> FIG. 1A is a schematic view showing a first example of an electric circuit component of the present invention. In the electric circuit component 21 of this embodiment, the conductive members 1 are insulated from each other by the structure in which the plurality of film-shaped electrically conductive members 1 and the plurality of film-shaped electrically insulating members 2 are alternately laminated. ing. Further, the adhesive layer 3 is provided for each pair of the conductive member 1 and the insulating member 2.

As the electrically conductive member 1, a material having electrically desired conductivity can be used without limitation. Among metal materials, gold is excellent in workability and corrosion resistance, but metals or alloys other than gold may be used. Specifically, A
g, Be, Ca, Mg, Mo, Ni, W, Fe, Ti,
Alloys such as Ta, In, Zn, Cu, Al, Sn, and Pb-Sn can also be used. As the electrically insulating member 2, a material (organic material or inorganic material) that exhibits an electrically desired insulation property.
Can be used without restrictions. Examples of the organic material include thermosetting resins and thermoplastic resins, with cellulose acetate, polyethylene terephthalate, and polyimide being particularly preferable. The adhesive layer 3 is a layer that exists as a result of manufacturing the electric circuit component of this embodiment using an adhesive, and is not necessarily a layer necessary for the electric circuit component of the present invention. In addition,
The manufacturing method and the adhesive will be described in detail later.

In the electric circuit component 21 shown in FIG. 1 (a), the surface excluding the portion (joint portion) for joining to the electrode is sealed with a sealing material 5 made of an electrical insulator, and is used for connection or connection. It is also possible to prevent a short circuit between adjacent electrically conductive members 1 due to contact with another electrically conductive material later. Figure 1
(B) is a schematic diagram showing an example of sealing with the sealing material 5 in this way. In the example shown in this figure, the lower surface is insulated by the sealing material 5 and the upper surface is exposed to be used as a joint.

FIGS. 2A and 2B show an electric circuit in the case of electrically connecting a plurality of arranged electrodes and a plurality of arranged electrodes by using the electric circuit component of this embodiment. FIG. 6 is a schematic cross-sectional view illustrating a state in which a component and an electrode are connected.

In FIG. 2A, the electrode 27 is the substrate 31.
It is assumed that a large number of them are densely arranged on the top with a fine pitch. In the present invention, an electrode connected by an electric circuit component means all conductive portions that require electrical connection, and the shape, material, function, etc. are not particularly limited. Further, the arrangement form of the electrodes 27 is not particularly limited, but the electric circuit component of the present invention is particularly useful when connecting electrodes arranged at high density with a constant pitch.

Next, as shown in FIG. 2B, this electrode 2
The conductive member 1 and the electrode 27 are electrically connected by bringing the surface on the 7 side into contact with the electric circuit component 21. Then, in the longitudinal direction of the conductive member 1 to which the electrode 27 is connected, the other substrates are aligned so that the desired electrodes are connected to each other and connected in the same manner. This can be easily achieved via the electric circuit component 21. In the example shown in this figure, the arrangement pitch of the conductive members 1 of the electric circuit component 21 (P ₁ in FIG. 2A) is sufficiently narrower than the arrangement pitch of the electrodes 27 (the same P ₂ ). . With such a configuration, it is not necessary to perform precise alignment at the time of connection.

3 (a) and 3 (b) are schematic cross-sectional views showing another example of a state in which the electric circuit parts and the electrodes of this embodiment are connected. In the example shown in this figure, the arrangement pitch of the conductive members 1 of the electric circuit component 21 is the same as the arrangement pitch of the electrodes 27.

In the present invention, the thickness and arrangement pitch of the conductive member 1 and the insulating member 2 of the electric circuit component 21 are determined by the electrode 27.
The size is not particularly limited as long as it can be connected as desired. However, from the viewpoint of eliminating the need for precise alignment during connection as much as possible, the distance between the conductive members 1 of the electric circuit component (the same d) is larger than the width of the electrode 27 (W ₂ in FIG. 3A).
₁ , total thickness of insulating member 2 and adhesive layer 3 in this example)
It is desirable that the thickness of the conductive member 1 of the electric circuit component (the same W ₁ ) be smaller than the distance between the electrodes 27 (the same d ₂ ). This can be expressed by the following inequality.

D ₁ <W ₂ and W ₁ <d ₂ Specific dimensions may be appropriately determined according to the above points and applications, but the thickness (W ₁ ) of the conductive member 1 is 5 μm to 70 μm.
m is desirable, and more preferably about 10 μm to 40 μm. The thickness may be 20 μm or less, but it is necessary to accurately form the thin film. The distance (d ₁ ) between the conductive members 1 is preferably about 5 μm to 70 μm, more preferably about 10 μm to 40 μm. The arrangement pitch (P ₁ ) of the conductive members 1 is 15 μm to 13 μm.
The thickness is preferably about 0 μm, more preferably about 20 μm to 80 μm.

In the present invention, the specific means for connecting the electric circuit component 21 and the electrode 27 is not particularly limited. For example, there are the following three methods. ． A connection method other than a method of metalizing and / or alloying the joint (for example, connection by pressure welding) ,. A method by metallization and / or alloying of the joint ,. A method of connecting some joints by metallization and / or alloying and connecting some other joints by other methods. These connection methods will be described in detail later.

<Embodiment A2> FIG. 4A is a perspective view showing a second embodiment of the electric circuit component of the present invention. The electric circuit component 21 of the present embodiment has a conductive member 1 on one surface.
Is different from Example A1 in that it projects more than the insulating member 2. Also in the present embodiment, by sealing the surface excluding the joint portion with the sealing material 5 as in the embodiment A1, it is possible to prevent a short circuit between the adjacent conductive members 1. Figure 4 (b) shows
It is a schematic diagram which shows the example which sealed the surface except the joining part in this way with the sealing material 5.

The electric circuit component of this embodiment is also the embodiment A.
It can be connected to the electrode in the same manner as 1. FIGS. 5A and 5B and FIGS. 6A and 6B are schematic cross-sectional views illustrating a state in which the electric circuit component 21 and the electrode 27 of this embodiment are connected in this way.

In particular, in this embodiment, since the conductive member 1 is configured to project from the surface more than the insulating member 2,
There is an advantage that an electric connection with higher reliability than that of the embodiment A1 can be realized.

<Embodiment A3> FIG. 7A is a perspective view showing a third embodiment of the electric circuit component of the present invention. The electric circuit component 21 of the present embodiment is different from that of the embodiment A1 in that the conductive member 1 projects more than the insulating member 2 on both upper and lower surfaces. Also in the present embodiment, by sealing the surface excluding the joint portion with the sealing material 5 as in the embodiment A1, it is possible to prevent a short circuit between the adjacent conductive members 1. Figure 7 (b)
FIG. 6 is a schematic view showing an example in which the surface excluding the joint portion is sealed with the sealing material 5 in this way. The example shown in this figure is an example in which the lower surface of one side of the conductive member 1 in the longitudinal direction and the upper surface of the other side are insulated by the sealing material 5. That is, one side uses the upper surface thereof and the other one side uses the lower surface thereof as a joint portion. Also, the electric circuit component of this embodiment can be connected to the electrodes in the same manner as in Embodiment A1.

Particularly in this embodiment, the electric circuit component 2
One of the advantages is that more reliable electrical connection can be made on a plurality of surfaces (upper and lower surfaces) of one and the usage mode (Example C3) as shown in FIG. .

<Embodiment B1> FIGS. 8A and 8B are schematic views showing a first embodiment of the method for manufacturing an electric circuit component of the present invention.

In this embodiment, first, a multi-layer film is produced by laminating a film-shaped electrically conductive member and a film-shaped electrically insulating member. The method for producing this multilayer film is not particularly limited. For example, there are a method of forming a conductive layer on the surface of an insulating film, a method of coating a resin layer on the surface of a conductive film, a method of attaching a conductive film and an insulating film, and the like. As a specific method for forming the conductive layer on the surface of the insulating film, for example, a method of depositing or sputtering a metal film on the insulating film, MOD (Meta
llo-organic deposition) or the like is used to attach a metal film. In addition, since the film thickness of the multilayer film directly affects the dimensions of the layers (W ₁ , d ₁ ) and the array pitch (P ₁ ) of each layer of the conductive member 1, the desired pitch can be obtained. Therefore, it is formed accurately. Specifically, for example, when a multilayer film prepared by forming a metal film by MOD on a polyethylene terephthalate film having a film thickness of 20 μm is used and prepared according to the steps described below, P ₁ = 25 to 3
An electric circuit component of about 5 μm can be obtained. This pitch is
It is sufficiently finer than the arrangement pitch of the recording elements of the inkjet recording apparatus of 360 DPI, 70.5 μm,
It is an electric circuit component suitable for use in an inkjet recording apparatus.

Then, as shown in FIG. 8 (a), the multilayer film 4 previously wound on the material supply roll 12 is
The surface is coated with an adhesive and wound on a rectangular column-shaped winding body 11. After this adhesive has set, see Figure 8.
It is cut as shown by the dotted line in (b) to obtain a block in which multilayer films are laminated with an adhesive as shown in FIG.
If this block is cut into thin pieces if desired,
The electric circuit component (Example A1) shown in (a) is completed. The adhesive used here may be one that can bond a conductive film (metal film or the like) and an insulating film (resin or the like), and it depends on the type of resin or the like. Adhesives such as rubber, polyurethane, and neoprene can be used. Since the adhesiveness of this adhesive affects whether or not the block shown in FIG. 9 can be thinly cut, it is desirable to use an adhesive having high adhesiveness.

In order to obtain the electric circuit parts (Examples A2 and A3) having the shapes shown in FIGS. 4 and 7, the insulating member 2 and the adhesive layer 3 are removed by using, for example, oxygen ashing or a solvent. Good. When performing oxygen ashing, the insulating member 2
An organic resin may be used for the adhesive layer 3. When scraping with a solvent or the like, a soluble material may be used for the insulating member 2 and the adhesive layer 3.

According to the manufacturing method of the present invention in which desired lamination is carried out through such an adhesive, the electric circuit component can be obtained by arbitrarily setting the film thickness of the multilayer film (or single layer film) to be used. The thickness and pitch of each layer can be formed accurately and in a simple process. Therefore, the manufacturing method of the present invention is particularly useful for manufacturing an electric circuit component having a fine pitch. Further, in particular, in this embodiment, since the winding body 11 has a prismatic shape, there is an advantage that a block having a shape as shown in FIG. 9 can be easily obtained.

<Example B2> FIGS. 10 (a) and 10 (b) are schematic views showing a second example of the method for manufacturing an electric circuit component of the present invention. The manufacturing method of the present embodiment is different from that of the embodiment B1 in that the winding body 11 has a cylindrical shape. Also in this embodiment, the multilayer film 4 is wound on the winding body 11 while coating the surface thereof with the adhesive as in the case of the embodiment B1. Then, as shown in FIG. 10 (b), the wound multilayer film 4 is cut, expanded and stretched, and then heat-cured.

In particular, in this embodiment, the winding body 11
Since the column is a column, there is an advantage that the winding process can be performed easily and smoothly.

<Embodiment B3> FIG. 11 is a schematic view showing a third embodiment of the method for manufacturing an electric circuit component of the present invention.
In the manufacturing method of this embodiment, a single layer film 15 of an electrically conductive member and a single layer film 16 of an electrically insulating member, which are wound in advance on the material supply rolls 13 and 14 respectively, do not use a multilayer film.
This is different from Example B1 in that the film is wound around the winding body 11 while being adhered to each other. That is, as shown in FIG. 11, the single-layer film 1 and the single-layer film 16 are wound together on the winding body 11 while being coated with an adhesive, so that the single-layer film 1
A block in which Nos. 5 and 16 are alternately laminated via an adhesive is produced, and thereafter, the electric circuit component of the present invention can be completed in the same manner as in Example B1.

In particular, this embodiment does not require the step of manufacturing the multilayer film 4 in advance, and has an advantage that the manufacturing process can be continuous and simplified.

<Embodiment C1> FIG. 12 is a view showing a first embodiment of the recording element drive unit of the present invention, (a).
FIG. 3B is a view of the recording element drive unit as seen from above the reference plane, and FIG.

The printing element drive unit of the present embodiment has a plurality of printing elements arranged at a fixed pitch on the printing element substrate 22, and an element for driving the printing elements, which is fixed on the driving element substrate 23. A plurality of drive elements 2 arranged at a pitch
4 and. The recording element substrate 22 is fixed on a recording element substrate base 25, and the driving element substrate 23 is fixed on a driving element substrate base 26. Here, the printing element is composed of an electrothermal converter (consisting of a heating element and wiring) arranged on the printing element substrate 22 at a constant pitch. By utilizing the thermal energy generated from this electrothermal converter according to the electric signal, desired recording such as ink jet recording can be performed. When this is used as an inkjet drive unit, an ink flow path and an ink ejection port are formed at least on the electrothermal converter. These may be configured so that bubbles are formed in the ink in the ink flow path by the thermal energy generated from the electrothermal converter, and the ink can be ejected from the ejection port.

In this embodiment, the electrodes and the driving elements 24, which are in communication with each of the electrothermal converters and are arranged on the recording element substrate 22 at a constant pitch, are in communication with each other and are arranged on the driving element substrate 23 at a constant pitch. The electrodes are electrically connected to each other via an electric circuit component 21 (using the one of Example A2). This connection is specifically shown in FIG. 6 described above.
Connection was made in the manner shown in (b). That is, the arrangement pitch of the conductive members 1 of the electric circuit component 21 is the same as the arrangement pitch of the electrodes arranged at the ends on the recording element substrate 22 and the electrodes arranged at the ends on the driving element substrate 23. Further, the distance (d ₁ ) between the conductive members 1 of the electric circuit component is made smaller than the width (W ₂ ) of the electrode 27, and the distance (d ₁ ) between the electrodes 27 (d
₂ ) the thickness of the conductive member 1 of the electric circuit component (the same W ₁ )
Has been made smaller. By the electrical connection through the electric circuit component 21, the image information sent from each drive element 24 passes through the electric circuit component 21 and the recording element substrate 22.
The recording is carried out by being sent to each corresponding recording element above.

For connecting the electrodes on the recording element side and the electrodes on the driving element side to the electric circuit component 21, a connecting method other than the method of metalizing and / or alloying the joint is adopted, and Specifically, the connection is made by a detachable pressure contact member 28. The pressure contact member 28 is fixed to the recording element substrate base 25 or the drive element substrate base 26 by screws at both ends in the longitudinal direction. Due to this pressure, the electric circuit component 21, the recording element substrate 22, and the driving element substrate 23 are pressed against each other. Further, between the electric circuit component 21 and the pressure contact member 28, a pressure contact assisting member 29 made of a flexible member such as rubber is inserted to electrically connect the electric circuit component 21 to the recording element substrate 22 and the drive element substrate 23. Reliability of dynamic connections is improved.

As described above, the recording element drive unit of the present invention is connected easily and satisfactorily even if the electrodes to be connected have a narrow array pitch and are arranged at a high density. . Further, in this embodiment, since the removable pressure contact member 28 is used, only the recording element substrate 22 can be easily replaced even when the recording element substrate 22 is defective, and the recording element drive unit can be easily replaced. There is an advantage that manufacturing can be facilitated.

In the present embodiment, the detachable press-contact member 28 is used as the connecting method between the electrodes and the electric circuit component by a connecting method other than the method of metalizing and / or alloying the joint. Other than this, for example, a method using an adhesive can be used without limitation.

<Embodiment C2> FIG. 13 is a view showing a second embodiment of the recording element drive unit of the present invention, (a).
FIG. 3B is a view of the recording element drive unit as seen from above the reference plane, and FIG. The recording element drive unit according to the present embodiment includes an electrode on the drive element substrate 23 side and an electric circuit component 2.
The connection with No. 1 differs from that of Example C1 in that the connection was made by metallizing and / or alloying the joint.

In the present embodiment, the connection by metallization and / or alloying is such that if the conductive member 1 and the electrode to be connected are made of the same kind of pure metal, the connection interface formed by metallization is a conductive member. 1 or a crystal structure different from that of the electrode. As a method of this metallization, for example, the end of the conductive member 1 and the electrode at the position corresponding to the end may be brought into contact with each other and then heated at an appropriate temperature. This heating causes diffusion of atoms in the vicinity of the contact portion, and the diffusion portion becomes a metallized state to form a metal layer.

When the conductive member 1 and the electrode to be connected are made of different pure metals, the connection interface is an alloy layer of both metals. As an alloying method, for example, the end of the conductive member 1 and the electrode at a position corresponding to the end may be brought into contact with each other and then heated at an appropriate temperature. This heating causes diffusion of atoms and the like in the vicinity of the contact portion to form an alloy layer made of a solid solution or an intermetallic compound. For example,
When Au is used for the electrodes and Al is used for the conductive member 1, the heating temperature is preferably about 200 to 350 ° C. When one of the conductive member 1 and the electrode to be connected is made of a pure metal and the other is made of an alloy, or when both are made of the same kind or different kinds of alloys, the connection interface becomes an alloy layer.

The heating method for connection by such metallization and / or alloying is not particularly limited as long as it is a method capable of directly or indirectly heating and connecting the joint portion. Specifically, in addition to a method such as thermocompression bonding, an ultrasonic heating method, a high frequency induction heating method, a high frequency dielectric heating method, a microwave heating method may be used, or the above heating methods may be used in combination.

Also, electrical connection by soldering is possible.

In particular, in this embodiment, since the connection between the electrode on the drive element side and the electric circuit component 21 was made by metalizing and / or alloying the joint portion, it is practically unnecessary to attach and detach the drive element. There is an advantage in that the pressure contact member 28 and the like on the substrate 23 side are unnecessary.

<Embodiment C3> FIG. 14 is a view showing a third embodiment of the recording element drive unit of the present invention, (a).
FIG. 3B is a view of the recording element drive unit as seen from above the reference plane, and FIG. The recording element drive unit of the present embodiment is different from the embodiment C1 in that the electric circuit component 21 of the embodiment A3 is used and the reference planes of the recording element substrate 22 and the drive element substrate 23 are reversed. In particular, this embodiment has an advantage that the degree of freedom in design is expanded.

<Embodiment C4> FIG. 15 is a view showing a fourth embodiment of the recording element drive unit of the present invention, (a).
FIG. 3B is a view of the recording element drive unit as seen from above the reference plane, and FIG. In the printing element drive unit of the present embodiment, the printing element substrate 22 and the driving element substrate 23 are provided on the same plane of one base 30, and the electrodes on the printing element substrate 22 side and the electrodes on the driving element substrate 23 side and the electric circuit. It differs from Example C1 in that the component 21 and the component 21 are pressed against each other by one pressing member 28. Particularly, in the present embodiment, there is an advantage that the structure of the unit itself can be simplified and its manufacture can be facilitated.

The present invention is particularly effective in the ink jet recording type recording head and recording apparatus for recording by forming flying droplets by utilizing thermal energy among the ink jet recording methods. Is.

Regarding its typical structure and principle, see, for example, US Pat. Nos. 4,723,129 and 4740.
No. 796, the present invention is preferably carried out using these basic principles. This recording method is applicable to both the so-called on-demand type and the continuous type.

To briefly explain this recording method, an electrothermal converter is arranged corresponding to a sheet or flow path holding a liquid (ink), and a liquid (ink) corresponding to recording information. Thermal energy is generated by applying at least one drive signal for giving a rapid temperature rise that causes the film boiling phenomenon beyond the nucleate boiling phenomenon, and causes the film boiling on the heat acting surface of the recording head. . In this way, bubbles can be formed in one-to-one correspondence with the drive signal applied from the liquid (ink) to the electrothermal converter, which is particularly effective for the on-demand recording method. By the growth and contraction of the bubbles, liquid (ink) is ejected through the ejection port,
Form at least one drop. It is more preferable to make the driving signal into a pulse shape because bubbles can be grown and contracted immediately and appropriately, and thus a liquid (ink) with excellent responsiveness can be ejected. As the pulse-shaped drive signal, U.S. Pat. Nos. 4,463,359 and 4,345 are used.
Those as described in the '262 patent are suitable. If the conditions described in US Pat. No. 4,313,124, which is an invention relating to the rate of temperature rise on the heat acting surface, are adopted, more excellent recording can be performed.

The structure of the recording head is a combination of a discharge port, a liquid flow path, and an electrothermal converter as disclosed in the above-mentioned specifications (straight liquid flow path or right-angled liquid flow path).
In addition, as disclosed in U.S. Pat. No. 4,558,333 and U.S. Pat. No. 4,459,600, the present invention includes those having a configuration in which a heat acting portion is arranged in a bending region.

In addition, Japanese Laid-Open Patent Publication No. 123670/1984, which discloses a structure in which a common slit is used as a discharge port of the electrothermal converter for a plurality of electrothermal converters, and a pressure wave of thermal energy is absorbed. The present invention is also effective in a structure based on Japanese Patent Laid-Open No. 138461/1984, which discloses a structure in which the corresponding opening corresponds to the discharge portion.

Further, as a recording head in which the present invention is effectively used, there is a full line type recording head having a length corresponding to the maximum width of the recording medium which can be recorded by the recording apparatus.
The full line head may be a full line configuration formed by combining a plurality of print heads as disclosed in the above specification, or may be a single full line print head integrally formed.

In addition, by being attached to the apparatus main body, it can be electrically connected to the apparatus main body and can be supplied with ink from the apparatus main body by a replaceable chip type recording head or the recording head itself. The present invention is also effective when a cartridge-type recording head that is specially provided is used.

Further, it is preferable to add recovery means for the recording head, preliminary auxiliary means, etc. to the recording apparatus of the present invention because the recording apparatus of the present invention can be made more stable. Specifically, the recording head is preheated by a capping means, a cleaning means, a pressure or suction means, an electrothermal converter or a heating element other than this, or a combination thereof. It is also effective to perform stable recording by adding a means for performing a preliminary ejection mode for performing ejection different from the means and recording.

Further, the recording mode of the recording apparatus is not limited to the mode in which only the mainstream color such as black is recorded, and either the recording head may be integrally formed or a combination of plural recording heads may be used. However, the present invention is extremely effective for an apparatus provided with at least one of a multicolor of different colors or a full color by color mixing.

In the embodiments of the present invention described above, the liquid ink is used for the description. However, in the present invention, either an ink which is solid at room temperature or an ink which is in a softened state at room temperature is used. Can be used. In the above-mentioned inkjet device, the temperature of the ink itself is generally adjusted within the range of 30 ° C. or higher and 70 ° C. or lower to control the temperature of the ink so that the viscosity of the ink is within the stable ejection range. Any liquid may be used as long as the ink is liquid.

In addition, the excessive temperature rise of the head or ink due to thermal energy is positively prevented by using it as the energy of the state change of the ink from the solid state to the liquid state, or the evaporation of the ink is prevented. It is also possible to use an ink that solidifies when left as it is. In any case, liquefaction occurs only when heat energy is applied, such as when the ink is liquefied by applying heat energy according to the recording signal and ejected as an ink liquid, or when it begins to solidify when it reaches the recording medium. The use of an ink having such a property is also applicable to the present invention.

Such an ink is disclosed in JP-A-54-568.
No. 47 or Japanese Patent Laid-Open No. 60-71260 so that it faces the electrothermal converter in the state of being held as a liquid or solid in the recesses or through holes of the porous sheet. It may be in any form.

In the present invention, the most effective one for each of the above-mentioned inks is one that executes the above-mentioned film boiling method.

FIG. 16 is an inkjet head cartridge (IJC) having an inkjet drive unit of the present invention.
FIG. 3 is an external perspective view showing an example of an inkjet recording device (IJRA) mounted with.

In the figure, reference numeral 120 denotes an ink jet head cartridge provided with a group of nozzles for ejecting ink so as to face the recording surface of the recording paper fed onto the platen 124.
(IJC). 116 is a carriage H that holds the IJC 120
C, which is connected to a part of the drive belt 118 that transmits the driving force of the drive motor 117 and is slidable with the two guide shafts 119A and 119B arranged in parallel with each other, so that the IJC 120 It is possible to move back and forth over the entire width of the recording paper.

Reference numeral 126 is a head recovery device, which is arranged at one end of the movement path of the IJC 120, for example, at a position facing the home position. The drive force of the motor 122 via the transmission mechanism 123 causes the head recovery device 126 to operate, and the IJC 12
Perform a cap of 0. In association with the capping of the IJC 120 by the cap portion 126A of the head recovery device 126, ink suction by an appropriate suction means provided in the head recovery device 126 or appropriate pressure means provided in an ink supply path to the IJC 120 Ink ejection is performed by forcibly ejecting the ink from the ejection port to remove the thickened ink in the nozzle and perform the ejection recovery process. In addition, IJC can be added by capping at the end of recording.
Is protected.

Reference numeral 130 is a blade as a wiping member which is arranged on the side surface of the head recovery device 126 and is made of silicon rubber. The blade 130 is a blade holding member 13
Head recovery device 126, held in cantilever form at 0A
Similarly, the motor 122 and the transmission mechanism 123 operate to enable engagement with the ejection surface of the IJC 120. With this, at the appropriate timing in the recording operation of IJC 120,
Alternatively, after the ejection recovery process using the head recovery device 126, the blade 130 is projected into the movement path of the IJC 120,
It removes dew condensation, wetting, or dust on the ejection surface of the IJC 120 as it moves.

[0078]

As described above, according to the electric circuit component of the present invention, good connection with high reliability can be achieved even if the electrodes to be connected have a narrow array pitch and are arranged at high density. It is possible. Moreover, the connection work does not take time and can be easily connected.

Further, according to the method for manufacturing an electric circuit component of the present invention, the thickness and pitch of each layer of the electric circuit component can be accurately adjusted by arbitrarily setting the film thickness of the multilayer film or the single layer film to be used. It can be formed by a simple process.

Further, in the recording element drive unit, the ink jet drive unit and the ink jet recording apparatus of the present invention, even if the arrangement pitch of the electrodes to be connected is narrow and arranged in high density, the electric circuit of the present invention is used. It is well connected by. In particular, if the electrode and the electric circuit component are connected by a detachable pressure contact member, when one of the electric components is defective, only one of them can be easily replaced.

[Brief description of drawings]

FIG. 1 is a schematic view showing a first embodiment of an electric circuit component of the present invention.

FIG. 2 is a schematic cross-sectional view illustrating a state in which a plurality of electrodes on a substrate are connected to an electric circuit component of the present invention.

FIG. 3 is a schematic cross-sectional view illustrating a state in which a plurality of electrodes on a substrate are connected to an electric circuit component of the present invention.

FIG. 4 is a schematic view showing a second embodiment of the electric circuit component of the present invention.

FIG. 5 is a schematic cross-sectional view illustrating a state in which a plurality of electrodes on a substrate are connected to the electric circuit component of the present invention.

FIG. 6 is a schematic cross-sectional view illustrating a state in which a plurality of electrodes on a substrate are connected to an electric circuit component of the present invention.

FIG. 7 is a schematic view showing a third embodiment of the electric circuit component of the present invention.

FIG. 8 is a schematic view showing a first embodiment of the method for manufacturing an electric circuit component of the present invention.

FIG. 9 is a schematic view showing a block obtained in the first example of the method for manufacturing an electric circuit component of the present invention.

FIG. 10 is a schematic view showing a second embodiment of the method for manufacturing an electric circuit component of the present invention.

FIG. 11 is a schematic view showing a third embodiment of the method for manufacturing an electric circuit component of the present invention.

FIG. 12 is a diagram showing a first embodiment of a recording element drive unit of the present invention.

FIG. 13 is a diagram showing a second embodiment of the recording element drive unit of the present invention.

FIG. 14 is a diagram showing a third embodiment of the recording element drive unit of the present invention.

FIG. 15 is a diagram showing a fourth embodiment of the recording element drive unit of the present invention.

FIG. 16 is a diagram showing an example of an inkjet recording apparatus of the present invention.

FIG. 17 is a diagram showing a wire bonding method as a conventional example.

FIG. 18 is a schematic cross-sectional view showing a TAB method as a conventional example.

FIG. 19 is a schematic sectional view showing a CCB method as a conventional example.

FIG. 20 is a schematic cross-sectional view showing a method of utilizing thermocompression bonding as a conventional example.

FIG. 21 is a schematic cross-sectional view showing a method of using an anisotropic conductive film as a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electrically conductive member 2 Electrically insulating member 3 Adhesive layer 4 Multilayer film 5 Encapsulating material 11 Winding body 12, 13, 14 Material supply roll 15 Single layer film of conductive member 16 Single layer film of insulating member 21 Electric circuit Parts 22 Recording element substrate 23 Driving element substrate 24 Driving element 25 Recording element substrate base 26 Driving element substrate base 27 Electrode 28 Pressure contact member 29 Pressure contact auxiliary member 30 Base 31 Board 41 Lead frame 42 Element mounting part 43 Silver paste 44 Semiconductor Element 45 Joint part of semiconductor element 46 Joint part of lead frame 47 Ultrafine metal wire 48 Resin 49 Semiconductor device 56 Carrier film substrate 57 Carrier film substrate inner lead part 58 Resin 59 Resin 61 Solder bump 62 Circuit board 63 Joint part 70, 70 'Metal material 71, 71' Insulating film 72, 72 'Insulating film dew Surface 73, 73 'Exposed surface of metal material 75, 75' Circuit board 76, 76 'Joint part of circuit board 77 Insulating material 78 Anisotropic conductive film 79 Conductive particles 116 Carriage 117 Drive motor 118 Drive belt 119A, 119B Guide shaft 120 inkjet head cartridge 122 cleaning motor 123 transmission mechanism 124 platen 126 head recovery device 130 blade 130A blade holding member

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location B41J 2/16 H01L 21/60 B41J 3/04 103 H

Claims (10)

[Claims] 1. An electric circuit component for electrically connecting a plurality of arranged electrodes and another plurality of arranged electrodes, comprising a film-shaped electrically conductive member and a film-shaped electrically insulating member. An electric circuit component characterized by being alternately laminated. 2. The electric circuit component according to claim 1, wherein the electrically conductive member projects from the surface more than the electrically insulating member. 3. The thickness (W ₁ ) of the conductive members, the spacing (d ₁ ) between the conductive members, the width (W ₂ ) of the electrodes to be connected, and the spacing between the electrodes to be connected. The electric circuit component according to claim 1 or 2, wherein (d ₂ ) has the relationship of the following formulas d ₁ <W ₂ and W ₁ <d ₂ . 4. The method for manufacturing an electric circuit component according to claim 1, wherein a multilayer film formed by laminating a film-shaped electrically conductive member and a film-shaped electrically insulating member is wound with an adhesive. A method of manufacturing an electric circuit component, comprising a step of laminating by winding around a body. 5. The method for manufacturing an electric circuit component according to claim 1, wherein the single-layer film of the electrically conductive member and the single-layer film of the electrically insulating member are wound around a winding body via an adhesive. A method for manufacturing an electric circuit component, the method including the steps of alternately stacking by. 6. A printing element drive unit having a plurality of printing elements and a plurality of driving elements for driving the plurality of printing elements, the plurality of printing elements being arranged in communication with each of the plurality of printing elements. 2. A recording element drive unit, wherein an electrode and a plurality of electrodes that are arranged so as to communicate with each of the plurality of drive elements are electrically connected via the electric circuit component according to claim 1. 7. A plurality of electrodes arranged to communicate with each of the plurality of recording elements and / or a plurality of electrodes arranged to communicate with each of the plurality of driving elements, and the electric circuit component. 7. The recording element drive unit according to claim 6, wherein the recording element drive units are connected by a removable pressure contact member. 8. A plurality of electrodes arranged in communication with each of the plurality of recording elements and / or a plurality of electrodes arranged in communication with each of the plurality of driving elements, and the electric circuit component are metalized and 7. The recording element drive unit according to claim 6, wherein the recording element drive units are connected by alloying. 9. A plurality of recording elements having at least an electrothermal converter, an ink flow path and an ink discharge port formed on the electrothermal converter, and a plurality of driving elements for driving the plurality of recording elements. 2. An inkjet drive unit having a plurality of electrodes arranged in communication with each of the electrothermal converters, and a plurality of electrodes arranged in communication with each of the plurality of drive elements. An inkjet drive unit, which is electrically connected via an electric circuit component. 10. An ink jet recording apparatus comprising the ink jet drive unit according to claim 9.