JPH07176838A - Wiring substrate, its connecting structure and its method, and packaging structure of display panel - Google Patents

Abstract

PURPOSE:To provide a wiring substrate which has electrode terminals to be electrically and mechanically connected to opposite electrode terminals on a different wiring substrate on the surface of a substrate wherein a terminal disconnection during and after connecting step can be avoided, the terminals can be connected at a fine pitch within a short time with high positional precision, the acceptability of alignment and connecting state can be easily judged. CONSTITUTION:The wiring substrate is provided with electrode terminals 3 to be electrically and mechanically connected to the opposite electrode terminals on a different wiring substrate on the surface of a substrate 20. Slits 4, 4 passing through the substrate 20 are provided in the region including a part of the electrode terminals 3 in the substrate 20 or within the nearby region not exceeding 5mm.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board having a plurality of strip-shaped electrode terminals arranged in parallel and electrically and mechanically connected to the electrode terminals of another wiring board on the surface of the board. . In addition, according to the present invention, two substrates of different types or the same type (ceramic substrate, flexible substrate, printed circuit board, silicon substrate, etc.) are electrically and mechanically connected to each other via connecting members with electrode terminals corresponding to each other. The present invention relates to a wiring board connection structure and a connection method. The present invention also relates to a mounting structure of a display panel such as liquid crystal, plasma, and EL.

[0002]

2. Description of the Related Art FIG. 11 shows a conventional liquid crystal display device viewed obliquely from various display devices, and FIG.
7 shows a cross section taken along line BB ′ of FIG. As shown in FIG. 11, this liquid crystal display device includes a display panel 1'and a driving IC (integrated circuit) 6, 5 for driving the display panel 1'on a substrate surface made of a polyimide resin. A plurality of flexible wiring boards 502, 508, a circuit board 501 provided along the display panel 1 ′ for transmitting a control signal to each flexible wiring board 502, and a control board 602 for outputting the control signal. ing.

The display panel 1'is, as shown in FIG.
A liquid crystal 505 is enclosed between a pair of glass substrates 506 and 506 '(a region in which the liquid crystal 505 is enclosed displays an image). On the peripheral edge portion 2 of the one glass substrate 506 ', ITO (tin-added indium oxide), Ti, T
A large number of electrode terminals 504 made of a, Cr, Cu, Mo, Al, etc. are arranged. 511 is a base coat (insulating layer). Each flexible wiring board 502, 508 has an opaque base surface 520, as illustrated in FIG.
In addition, an output terminal 606 and an input terminal 507 made of Cu or the like and connected to the driving IC 6 are provided on opposite sides of each other. All input terminals 507 of the base material surface 520
A slit 510 penetrating the base material is provided in a region including the. As shown in FIG. 11, the circuit board 501 has an opaque bus line 60 extending in the longitudinal direction of the circuit board.
8 and electrode terminals 604 (FIG. 12) connected to the bus line 608 and corresponding to each flexible wiring board 502. The control board 602 has electronic components for generating the control signal, a bus line 608 'for transmitting the control signal, and electrode terminals 60 connected to the bus line 608' and corresponding to the flexible wiring boards 508.
3 and 3 are provided.

In the mounted state, the peripheral portion 2 of the display panel 1 '
Electrode terminals 504 and flexible wiring boards 502, 50
8 output terminals 606 are connected through an anisotropic conductive film 607. On the other hand, each flexible wiring board 502, 508
Input terminal 507 and the electrode terminal 60 of the circuit board 501.
4. The electrode terminals 603 of the control board 602 are connected to each other using solder 605 (FIG. 12).

More specifically, as shown in FIG. 12, first, solder 605 is supplied to the electrode terminals 604 of the circuit board 501. Next, the anisotropic conductive film 607 is supplied onto the electrode terminals 504 on the peripheral portion of the display panel 1 '. Next, each electrode terminal 504 and each flexible wiring board 50 of the display panel 1 '
The position of each of the output terminals 606 of 2,508 is aligned.

Here, the glass substrate 506 'is transparent, and the anisotropic conductive film 607 is a transparent resin in which conductive particles are dispersed.
The alignment marks (not shown) for alignment provided on both the flexible wiring board 502 and the flexible wiring board 502 can be seen from the direction A through the glass substrate 506 '. Therefore, the glass substrate 506 'and the flexible wiring board 50
Positioning with 2 is performed by finely adjusting each other's position while observing with the alignment mark. Next, the display panel 1 ′ and the flexible wiring boards 502 and 508 are thermocompression bonded to connect the electrode terminals 504 and the output terminals 606. At this time, the resin component of the anisotropic conductive film 607 is liquefied and flows by heating. Alternatively, the flexible wiring boards 502 and 508 may expand due to heating. Therefore, even if the alignment is once performed as described above, the glass substrate 50
6'and the flexible wiring board 502 are easily displaced from each other in the surface direction, and in particular, the displacement becomes large unless the pressing tool has parallelism or flatness. Therefore, after the connection, the glass substrate 506 'is again observed visually or automatically from the direction A. For example, as shown in FIG.
The deviation d between the output terminal 606 and the output terminal 606 is checked to determine whether the alignment is good or bad. At the same time, as shown in FIG. 16, the flow-out method 513 of the resin component of the anisotropic conductive film 607, the distribution of the conductive particles 514 and the distribution of the density, and the shape and amount of the bubbles 512 generated in the anisotropic conductive film 607. Based on the above, the quality of the connection state is determined.

Next, as shown in FIG. 11, the flexible wiring boards 502 and 508 are aligned with the circuit board 501 and the control board 602, and the respective input terminals 507 of the flexible wiring boards 502 and 508 and the circuit. Board 5
Each of the electrode terminals 601 and 602 is connected by using solder as a connecting material. The quality of alignment and the quality of the connection state are determined by observing through the slit 510. After that, the electrode terminals 603 of the control board 602 and the bus lines 608 of the circuit board 501 are connected by the connector 601. In addition, such mounting technology is described in the National Technical Report (NATIONAL TE
CHNICAL Rep. ) Vol.38 No.3 (199
2) pp.24-30 "Thin liquid crystal module using narrow frame LSI".

During operation of the liquid crystal display device, the circuit board 50 is connected from the control board 602 via the connector 601.
A control signal is supplied to the first bus line 608. This bus line 608, each flexible wiring board 502, 50
Each flexible wiring board 5 through the eight input terminals 507.
A control signal is input to the driving ICs 6 and 5 of 02 and 508. The signals output from the driving ICs 6 and 5 are output to the output terminal 6
06, each glass substrate 506 via the electrode terminal 504,
The voltage is applied to a display electrode (not shown) formed on the opposite surface of 506 '. As a result, the display panel 1'is driven and a display is performed.

[0009]

However, the above conventional liquid crystal display device has the following problems.

As shown in FIG. 14, since the slit 510 is provided in the region including all the input terminals 507 of the flexible wiring board 502, the relatively heavy liquid crystal panel 1'and the circuit board 501 are thin (thickness 10). ~ Tens of μm
It must be supported by a group of thin input terminals 507.
Therefore, the input terminal 507 may be affected by an impact when the liquid crystal display device is dropped, a vibration during movement by a car, a train, or the like.
There is a problem that is disconnected (causing so-called "terminal disconnection"). Actually, such a trouble has occurred during the manufacture of the liquid crystal display device or after it has been put on the market.

As shown in FIG. 12, since the input terminal 507 of the flexible wiring board 502 is connected to the electrode terminal 604 of the circuit board 501 by the solder 605, even if an attempt is made to connect at a fine pitch, at the development level. It cannot exceed the limit of about 300 μm, or about 600 μm at the practical mass production level. Therefore, there is a problem that the mounting area becomes large.

The output terminal 608 of the flexible wiring board 502 is connected to the electrode terminal 504 of the glass substrate 506 'by an anisotropic conductive film 607. That is, the connecting material is different between the input terminal 507 side and the output terminal 606 side of the flexible wiring board 502. For this reason, separate connecting devices and processes are required for the input terminal 507 side and the output terminal 606 side, and there is a problem that equipment investment and man-hours increase and cost increases.

Here, in order to solve the above-mentioned problems (1), for example, as shown in FIG. 13, no slit is provided in the region of the base material surface where the input terminal 507 exists,
A method has been proposed in which the anisotropic conductive film 530 is used instead of solder for the connection on the input terminal 507 side (so-called fine pitch connection). In this case, the practical level is 10
The pitch can be reduced to 0 μm, or around 50 μm at the development level.

However, this method has the following problems.

In the fine pitch connection, positioning accuracy between terminals is strictly required. However, in general, the base material 520 of the flexible wiring board 502 is opaque,
Since the circuit board 501 is also opaque, there is a problem that if the slit is not provided, the alignment mark cannot be observed through the base material or the substrate, and minute alignment cannot be performed.

Since the alignment mark cannot be observed through the base material or the substrate, the input terminal 50 can be connected after connection.
It is difficult to confirm the positional deviation between the electrode 7 and the electrode terminal 604.

Since the alignment mark cannot be observed through the base material or the substrate, it is difficult to judge whether the connection state is good or bad. It is for this reason that the connection method using solder has been conventionally used.

However, as shown in FIG. 18, when the connecting material is changed from solder to anisotropic conductive film 530 while the slit 510 is provided, the terminals in the slit 510 are the same as described above. The problem of disconnection cannot be resolved.
Further, at the time of connection, the heating tool 522 for connection is directly passed through the slit 510 as shown in FIG.
7, the anisotropic conductive film 5 has flowed out to the tip of the heating tool 522 as shown in FIG.
21 'sticks, the tool 522 is broken (broken), or locally worn, resulting in a short life. further,
The foreign matter 521 'adheres (forms a projection), so that the flatness of the tool 522 is lost, and as a result, the input terminal 50
7 Even pressure may not be applied to the entire product, which may result in defective products.

In addition, two opaque substrates 51 are generally used.
As a method for aligning 5,516, a method as shown in FIG. 17 is known. That is, the first substrate 515
The second substrate 516 and the second substrate 516 are held on another stage in a state of being displaced in the horizontal direction by a predetermined distance L in advance. The electrode terminal 517 or the alignment mark (not shown) of the first substrate is seen by the first camera 518 ', while the electrode terminal 519 or the alignment mark (not shown) of the second substrate 516 is seen by the second camera 518'.
View with camera 518. Then, the second substrate 516 is horizontally moved to the first substrate 515 side by the distance L by a transfer device (not shown), and then the second substrate 516 is lowered to make the first substrate 516.
Contact the substrate 515.

However, in this method, there is a problem that the alignment accuracy is not good because of the variation in the movement amount L due to the transfer device. Further, since the second substrate 516 is moved by the extra distance L, the operating time of the device is lengthened and the production amount is reduced. In addition, in the component part of the transfer device, for example, the stage, the joint part, the stopper, etc. for moving the second substrate 516 by L may be worn or loosened, and the amount of movement may suddenly change. If you continue automatic production without knowing it, there is a risk of producing a large number of defective products.

As a method for aligning the flexible wiring board 502 and the circuit board 501, a pair of positioning holes (about φ1 to φ3 mm) 521 are formed in the base material surface 520 of the flexible wiring board 502 as shown in FIG. 521
There is known a method of providing. In this case, the circuit board 501 shown in FIG. 11 and the like is also provided with a pair of holes (φ2 to φ5 mm), and pins (not shown) are provided in the holes of both 502 and 501.
Position through.

However, in this method, the positioning accuracy is deteriorated due to wear of the pin or the like. Therefore, it takes time and effort to replace the pins, which results in an increase in cost. Further, an area for providing a positioning hole is required, which increases the mounting area and the size of the flexible wiring board. Therefore, there is a problem that the cost increases or the product size increases.

Therefore, an object of the present invention is a wiring board having an electrode terminal to be electrically and mechanically connected to the surface of the board so as to face an electrode terminal of another wiring board. An object of the present invention is to provide a wiring board that can prevent terminal breakage during or after connection, can connect terminals with fine positioning in a short time with a fine pitch, and can easily determine the quality of alignment and connection state.

Another object of the present invention is to make the first and second wiring boards having a plurality of electrode terminals arranged on the surface of the board face each other, and to electrically and mechanically connect the electrode terminals to each other through a connecting material. It is a connection structure of the wiring board to be connected to, and it is possible to prevent terminal breakage during the connection process and after connection, and it is possible to connect the terminals at a fine pitch in a short time with high position accuracy, and easily judge the quality of the alignment and connection state. (EN) Provided is a wiring board connection structure and connection method.

Another object of the present invention is to connect the output terminals of the flexible wiring board to the electrode terminals on the peripheral portion of the display panel and to connect the input terminals of the flexible wiring board to the electrode terminals of the circuit board. With a mounting structure, it is possible to prevent terminal breakage during and after the connection process, connect terminals at a fine pitch in a short time with high positional accuracy, easily determine the quality of alignment and connection status, and also flexible wiring It is an object of the present invention to provide a display panel mounting structure in which the input terminal side and the output terminal side of a plate can be connected with the same connecting material, and therefore the number of connecting devices and steps can be reduced to reduce the cost.

[0026]

In order to achieve the above object, the wiring board according to claim 1 is electrically and mechanically disposed on the surface of the board while facing the electrode terminals of another wiring board. In a wiring board having a plurality of aligned electrode terminals to be connected to each other, a slit penetrating the board is provided within the area including a part of the plurality of the electrode terminals of the board or within 5 mm near the area. Is characterized by.

A wiring board according to a second aspect is the wiring board according to the first aspect, wherein the substrate is a flexible base material having a bendable flexibility.

According to a third aspect of the present invention, there is provided a wiring board connection structure in which a first wiring board having a plurality of first electrode terminals arranged on the surface of the board and a plurality of second electrodes arranged on the surface of the board. The second wiring board having terminals is opposed to each other, and the first wiring board
In the connection structure of the wiring board, which electrically and mechanically connects the electrode terminal and the second electrode terminal through a connecting material,
A slit penetrating the board is provided in a specific region of the first wiring board, and a portion of the second wiring board corresponding to the slit of the first wiring board is provided.
A mark having a shape corresponding to the shape of the slit, the shape of the first electrode terminal existing in the slit, or the shape of the slit and the first electrode terminal existing in the slit is provided. There is.

A wiring board connection structure according to a fourth aspect is the wiring board connection structure according to the third aspect.
The connecting material is an anisotropic conductive film.

According to a fifth aspect of the present invention, there is provided a display panel mounting structure, wherein a first connecting member is provided to the electrode terminal of a display panel having a plurality of electrode terminals arranged along a peripheral portion of one surface. Connecting a plurality of output terminals of a flexible wiring board on which a driving IC for driving the display panel is mounted on the surface of the base material, and along the display panel, the driving IC on the surface of the substrate. A display panel mounting in which a circuit board having a plurality of electrode terminals for supplying signals to the circuit board is provided, and a plurality of input terminals of the flexible wiring board are connected to the electrode terminals of the circuit board via a second connecting material. In the structure, a slit penetrating the base material surface is provided in a specific region of the base material surface of the flexible wiring board, and a portion of the circuit board corresponding to the slit of the flexible wiring board. A mark having a shape corresponding to the shape of the slit, the shape of the input terminal or the output terminal existing in the slit, or the shape of the slit and the input terminal or the output terminal existing in the slit. I am trying.

The display panel mounting structure according to claim 6 is the display panel mounting structure according to claim 5, wherein the second connecting material is an anisotropic conductive film. .

The display panel mounting structure according to claim 7 is the display panel mounting structure according to claim 5 or 6, wherein the first connecting material and the second connecting material are made of the same material. It is characterized by that.

The display panel mounting structure according to claim 8 is the same as the display panel mounting structure according to claim 7, wherein the first connecting material and the second connecting material are the flexible wiring board. The output terminal and the input terminal are commonly provided.

According to a ninth aspect of the present invention, there is provided a wiring board connecting method, wherein a first wiring board having a plurality of first electrode terminals arranged on the surface of the board and a second electrode arranged on the surface of the board. The second wiring board having terminals is opposed to each other, and the first wiring board
In the method for connecting a wiring board, wherein the electrode terminal and the second electrode terminal are connected via a connecting material, a slit penetrating the board is provided in a specific region of the first wiring board, and The shape of the slit, the shape of the first electrode terminal existing in the slit, at a position corresponding to the slit of the first wiring board in the second wiring board,
Or the first existing in the slit and the slit
A mark having a shape corresponding to the shape of the electrode terminal of
The first wiring board and the second wiring board are aligned by using the slit and the mark, and then the first electrode terminal and the second electrode terminal are connected.

A wiring board connecting method according to a tenth aspect of the present invention is the wiring board connecting method according to the ninth aspect, wherein the first wiring board and the second wiring board are formed by using the slits and the marks. After aligning the wiring board and connecting the first electrode terminal and the second electrode terminal, the quality of the positional deviation between the first wiring board and the second wiring board is observed through the slit. It is characterized by making a judgment.

According to the wiring board connecting method of the eleventh aspect, a first wiring board having a plurality of first electrode terminals arranged on the surface of the board and a plurality of second electrodes arranged on the surface of the board. A wiring board connecting method in which a second wiring board having terminals is opposed to each other and the first electrode terminal and the second electrode terminal are connected via a connecting material, A slit penetrating the substrate is provided in a specific region, and after connecting the first electrode terminal and the second electrode terminal, the connection state between the first electrode terminal and the second electrode terminal is checked. It is characterized by observing through the slit and making a determination.

A wiring board connecting method according to a twelfth aspect of the present invention is the wiring board connecting method according to the eleventh aspect, wherein the connection state between the first electrode terminal and the second electrode terminal is good or bad. It is characterized in that the determination is made based on the amount of the portion of the connecting material that has flowed out of the connecting portion through the slit.

Further, a wiring board connecting method according to a thirteenth aspect is the same as the wiring board connecting method according to the eleventh or the twelfth aspect, wherein the slit of the first wiring board among the second wiring boards is provided. A mark having a shape corresponding to the shape of the slit, the shape of the first electrode terminal existing in the slit, or the shape of the slit and the first electrode terminal existing in the slit is provided at a position corresponding to After aligning the first wiring board and the second wiring board using the slits and the marks, the first wiring board is aligned with the first wiring board.
The quality of the connection state between the electrode terminal and the second electrode terminal is determined by observing through the same slit.

A wiring board connecting method according to a fourteenth aspect is the wiring board connecting method according to any one of the ninth to thirteenth aspects, wherein the connecting material is cooled by heating or after heating and melting. And a connecting tool that pressurizes the first wiring board, and a release sheet having a releasing property with respect to the connecting material is interposed between the first wiring board and the connecting tool that pressurizes the first wiring board. It is characterized in that the connecting material is pressurized and heated.

[0040]

In the wiring board according to the first aspect, the slit includes only a part of the plurality of electrode terminals or exists only within the vicinity of 5 mm, and the remaining electrode terminals are lined and protected by the board surface. . Therefore, the disconnection of the terminals of the first wiring board is prevented during or after the step of connecting the electrode terminals of the wiring board (first wiring board) and the electrode terminals of another wiring board (second wiring board). To be done. Further, in the second wiring board, the shape of the slit, the shape of the electrode terminal existing in the slit, or the slit and the electrode existing in the slit are provided at locations corresponding to the slits of the first wiring board. By providing the mark having a shape corresponding to the shape of the terminal, the alignment can be performed accurately. That is, the slit of the first wiring board,
If there is, the electrode terminal inside and the mark on the second wiring board are passed from the outside through the slit,
It is observed visually or by an automatic recognition device. Therefore, by using these as alignment marks, the first wiring board and the second wiring board are accurately aligned. Further, since the alignment accuracy is improved in this way, a so-called fine pitch connecting material such as an anisotropic conductive film can be used as a connecting material for connecting the terminals,
The connection pitch is reduced, and the area required for connection is reduced. Further, after the connection, the quality of alignment and the quality of the connection state can be easily determined by externally observing through the slit. In particular, if the connecting material is an anisotropic conductive film, the quality of the connected state can be easily determined by the degree of resin flow-out, the distribution of conductive particles, the shape of bubbles, and the like. Alternatively, the amount of protrusion that flows out through the slit may be checked. Further, since the slit is provided only in the area including a part of the plurality of electrode terminals of the substrate, the connecting material sticks to the tip of the connecting tool and the tool is damaged (chipped), or locally worn. The risk of short life is reduced. Moreover, since the first wiring board or the second wiring board is not moved significantly,
The alignment is performed in a shorter time than when the substrates are aligned by the method shown in FIG. Therefore, the connection is completed in a short time. In addition, the risk of making a large number of defective products due to misalignment is reduced. In addition, the area of the substrate can be reduced because the holes are not provided, as compared with the method in which the pins are aligned through the holes provided in the substrate. Also, it does not take time to replace the pins.

In the wiring board of the second aspect, since the board is a flexible base material having a bendable flexibility, a flexible wiring board is formed as the wiring board. A manufacturing process for manufacturing such a flexible wiring board usually includes a step of forming a through hole in a flexible base material. For example, it is a hole for providing a driving IC in the substantially central portion of the base material. Therefore, the slit as in claim 1 can be provided on the base material at the same time. In addition, it is easy to make a compact product by taking advantage of the flexibility of the flexible wiring board.

In the connection structure of the wiring board according to claim 3,
A slit penetrating the board is provided in a specific area of the wiring board, and the shape of the slit is provided in a portion of the second wiring board corresponding to the slit of the first wiring board, A mark having a shape of the existing first electrode terminal, or a shape corresponding to the shape of the slit and the shape of the first electrode terminal existing in the slit is provided. When the slit is provided in a region including a part of the plurality of first electrode terminals or in the vicinity of 5 mm or less,
The remaining first electrode terminals outside the slit are lined and protected by the first wiring board. Therefore, terminal disconnection of the first wiring board is prevented during or after the step of connecting the first electrode terminal of the first wiring board and the second electrode terminal of the second wiring board. Further, the slits of the first wiring board, the first electrode terminals existing inside the slits, if any, and the marks of the second wiring board are passed from the outside through the slits by visual or automatic recognition devices. To be observed. Therefore, by using these as alignment marks, the first wiring board and the second wiring board are accurately aligned. In addition, since the alignment accuracy is improved in this way, so-called fine pitch connecting material such as anisotropic conductive film can be used as the connecting material for connecting the terminals, and the connecting pitch is miniaturized, and the area required for connection is reduced. To do. Further, after the connection, the quality of alignment and the quality of the connection state can be easily determined by externally observing through the slit. In particular, if the connecting material is an anisotropic conductive film, the quality of the connected state can be easily determined by the degree of resin flow-out, the distribution of conductive particles, the shape of bubbles, and the like. Alternatively, the amount of protrusion that flows out through the slit may be checked. Further, when the slit is provided only in a region including a part of the plurality of electrode terminals of the substrate, the connecting material sticks to the tip of the connecting tool and the tool is damaged (chipped), or locally worn. The risk of short life is reduced. Further, since the first wiring board or the second wiring board is not moved largely, the positioning can be performed in a shorter time than the case where the boards are aligned by the method shown in FIG. Therefore, the connection is completed in a short time. In addition, the risk of making a large number of defective products due to misalignment is reduced. In addition, the area of the substrate can be reduced because the holes are not provided, as compared with the method in which the pins are aligned through the holes provided in the substrate. Also, it does not take time to replace the pins.

In the connection structure of the wiring board according to the fourth aspect, since the connection material is the anisotropic conductive film, the quality of the connection state can be easily determined by the degree of resin flow-out, the distribution distribution of conductive particles, the shape of bubbles, and the like. You can judge. Alternatively, the amount of protrusion that flows out through the slit may be checked. Since anisotropic conductive films are the mainstream of the current high-density connecting materials, the labor required for development and research is much higher than when new materials are used.
(Time and money) is saved. In addition, existing equipment and manufacturing know-how are also used.

According to a fifth aspect of the present invention, there is provided a display panel mounting structure, wherein a slit penetrating the base material surface is provided in a specific region of the base material surface of the flexible wiring board. At a position corresponding to the slit, a mark having a shape corresponding to the shape of the slit, the shape of the input terminal or the output terminal existing in the slit, or the shape of the slit and the input terminal or the output terminal existing in the slit. Since it is provided, the same operation as in claim 3 is performed. That is, for example, when the slit is provided in a region including a part of the plurality of input terminals of the flexible wiring board, the remaining input terminals outside the slit are lined and protected by the substrate surface. Therefore, disconnection of the terminals of the flexible wiring board is prevented during or after the process of connecting the input terminals of the flexible wiring board and the electrode terminals of the circuit board. Further, the slits of the flexible wiring board, the input terminals existing therein, if any, and the marks of the circuit board are observed from the outside through the slits visually or by an automatic recognition device or the like. Therefore, by using these as alignment marks, the flexible wiring board and the circuit board can be accurately aligned. Further, since the alignment accuracy is improved in this way, a so-called fine pitch connecting material such as an anisotropic conductive film can be used as the second connecting material for connecting the terminals to each other, and the connection pitch is reduced, which is required for connection. The area is reduced. Further, after the connection, the quality of alignment and the quality of the connection state can be easily determined by externally observing through the slit. In particular, if the second connecting material is an anisotropic conductive film, the quality of the connected state can be easily determined by the degree of resin flow-out, the distribution of conductive particles, the shape of bubbles, and the like. Alternatively, the amount of protrusion that flows out through the slit may be checked. Further, when the slit is provided only in the area including a part of the plurality of input terminals on the base material surface of the flexible wiring board, the connecting material sticks to the tip of the connecting tool and the tool is damaged (chipped). , The risk of local wear and short life is reduced. Further, since the flexible wiring board or the circuit board is not moved significantly, the board can be aligned in a short time as compared with the case where the board is aligned by the method shown in FIG. Therefore, the connection is completed in a short time. In addition, the risk of making a large number of defective products due to misalignment is reduced. In addition, the mounting area can be reduced because the holes are not provided, as compared with the method in which the pins are aligned through the holes provided in the board. Also, it does not take time to replace the pins. Therefore, a low-cost, compact, highly reliable display device is constructed. Even when the slit is provided on the output terminal side of the flexible wiring board, the same operation as when the slit is provided on the input terminal side occurs.

Further, in the display panel mounting structure according to the sixth aspect, since the second connecting material is the anisotropic conductive film, the quality of the connected state depends on the degree of resin outflow, the distribution distribution of the conductive particles, and the shape of the bubbles. It can be easily determined by Alternatively, the amount of protrusion that flows out through the slit may be checked. Since the anisotropic conductive film is the mainstream of the current high-density connection material, the labor (time and money) for development and research is reduced compared to the case where a new material is used. In addition, existing equipment and manufacturing know-how are also used.

Further, in the display panel mounting structure according to claim 7, the first connecting material on the output terminal side of the flexible wiring board and the second connecting material on the input terminal side of the flexible wiring board are made of the same material. Therefore, it is not necessary to provide different types or separate connecting devices and processes. Therefore, capital investment and man-hours are reduced, resulting in cost reduction.

In the mounting structure of the display panel according to claim 8, the first connecting material and the second connecting material are provided in common for the output terminal and the input terminal of the flexible wiring board. It is not necessary to provide a separate connecting device or process. Therefore, capital investment and man-hours are reduced, resulting in cost reduction.

According to a ninth aspect of the present invention, there is provided a wiring board connecting method, wherein a slit penetrating the board is provided in a specific region of the first wiring board, and the first wiring of the second wiring board is provided. The shape of the slit at a location corresponding to the slit of the substrate, and the first slit existing in the slit.
A mark having a shape corresponding to the shape of the electrode terminal or the shape of the slit and the first electrode terminal existing in the slit is provided, and the slit and the mark are used to form the first wiring board and the second wiring board. The first electrode terminal and the second electrode terminal are connected to each other after aligning with the wiring board. When the slit is provided in a region including a part of the plurality of first electrode terminals, the remaining first outside of the slit
The electrode terminals of are protected by being lined with the first wiring board. Therefore, terminal disconnection of the first wiring board is prevented during or after the step of connecting the first electrode terminal of the first wiring board and the second electrode terminal of the second wiring board. In addition, the slits of the first wiring board, the first electrode terminals, if any, existing therein, and the marks of the second wiring board are observed from the outside through the slits, visually or by an automatic recognition device or the like. To be done. Therefore, by using these as alignment marks, the first wiring board and the second wiring board are accurately aligned. In addition, since the alignment accuracy is improved in this way, so-called fine pitch connecting material such as anisotropic conductive film can be used as the connecting material for connecting the terminals, and the connecting pitch is miniaturized, and the area required for connection is reduced. To do. Further, after the connection, the quality of alignment and the quality of the connection state can be easily determined by externally observing through the slit. In particular, if the connecting material is an anisotropic conductive film, the quality of the connected state can be easily determined by the degree of resin flow-out, the distribution of conductive particles, the shape of bubbles, and the like. Alternatively, the amount of protrusion that flows out through the slit may be checked. Further, when the slit is provided only in a region including a part of the plurality of electrode terminals of the substrate, the connecting material sticks to the tip of the connecting tool and the tool is damaged (chipped), or locally worn. The risk of short life is reduced. Further, since the first wiring board or the second wiring board is not moved largely, the positioning can be performed in a shorter time than the case where the boards are aligned by the method shown in FIG. Therefore, the connection is completed in a short time.
In addition, the risk of making a large number of defective products due to misalignment is reduced. In addition, the area of the substrate can be reduced because the holes are not provided, as compared with the method in which the pins are aligned through the holes provided in the substrate. Also, it does not take time to replace the pins.

Further, in the wiring board connecting method of the tenth aspect, the first wiring board and the second wiring board are aligned with each other by using the slit and the mark, and the first electrode terminal and the first electrode terminal are connected. After connecting the second electrode terminal, the quality of the positional deviation between the first wiring board and the second wiring board is determined by observing through the slits. Therefore, the first wiring board and the second wiring It is possible to judge the quality of the positional accuracy after the connection with the substrate. As a result, for example, abnormalities such as uneven contact of the pressure seal can be detected early, and a large number of defective products can be eliminated.

According to the wiring board connection method of the eleventh aspect, after the first electrode terminal and the second electrode terminal are connected, the connection state of the first electrode terminal and the second electrode terminal is established. Since the quality of is judged by observing through the slit,
The connection state between the first electrode terminal and the second electrode terminal can be easily determined.

Further, by providing the above slit,
The connection state may change between the area provided with the slit and the area not provided with the slit. In such a case, the size of the slit is reduced in order to reduce the influence of the slit. As in the wiring board connecting method according to claim 12, the quality of the connection state between the first electrode terminal and the second electrode terminal is determined by the amount of the portion of the connecting material that has flowed out from the connecting portion through the slit. It may be determined based on.
As a result, even if the slit size is very small,
The quality of the connecting material can be reliably determined.

Further, in the wiring board connecting method of the thirteenth aspect, whether the connection state between the first electrode terminal and the second electrode terminal is good or bad is determined by the first wiring board and the second wiring board. Since the judgment is made by observing through the same slit as that used for alignment, the substrate area is reduced by that amount as compared with the case where slits are provided separately. Therefore, high-density mounting becomes possible.

Further, in the wiring board connecting method of the fourteenth aspect, the connecting material is made of a material which is solidified by heating or cooling after heating and melting, and the first wiring board and the first wiring board are connected.
Since the connecting material is pressed and heated through a release sheet having a releasability with respect to the connecting material between the wiring board and the connecting tool for pressing the connecting board, the connecting material temporarily flows out from the slit. However, adhesion to the pressure tool is prevented.
Therefore, the connecting material that has flowed out to the tip of the connecting tool does not stick and the tool is not damaged (broken), and the tool does not locally wear to shorten the service life. Since the release sheet is generally thin, it does not cause a great change in the pressing force or the pressing temperature, but rather makes the pressing force uniform for a plurality of electrode terminals.

[0054]

The wiring board, the wiring board connection structure and connection method, and the display panel mounting structure of the present invention will be described in detail below with reference to embodiments.

FIG. 1 illustrates a flexible wiring board 2 as a wiring board (first wiring board). In this flexible wiring board 2, a driving IC 6 is mounted at a substantially center of a substantially rectangular base material 20. The base material 20 is made of polyimide or the like and has bendable flexibility. A plurality of output terminals 5 connected to the driving IC 6 are provided along one side of the base material 20, and a plurality of inputs as first electrode terminals connected to the driving IC 6 along a side opposite to the side. A terminal 3 is provided. Drive IC6
Is the same as the driving IC 506 shown in FIG. 11, and can output a signal for driving the display panel 1 '. Both the output terminal 6 and the input terminal 3 are arranged at a fine pitch (for example, 120 μm). In this example, the base material 2 is provided in an area including a part of the plurality of input terminals 3 ,.
A pair of rectangular slits 4 penetrating 0 are provided. Notches 20a are provided at the corners of the base material 20 on the input terminal 3 side to reduce the area. The holes (not shown) for providing the driving IC 6, the slits 4, 4 and the notches 20a, 20a can be simultaneously formed in the manufacturing process for manufacturing the flexible wiring board.

In FIG. 3, the input terminal 3 of the flexible wiring board 2 and the second electrode terminal 7 (shown in FIG. 2) of the circuit board 9 as the second wiring board are made to face each other, and a connecting material is provided. 2 shows a cross-sectional structure when connected via the anisotropic conductive film 10 as described above. Like the circuit board 501 shown in FIG. 11, the circuit board 9 is for supplying signals to the driving IC 6 of the flexible wiring board 2. In this example, the electrode terminal 7 itself of the circuit board 9 shown in FIG. 2 is a positioning mark corresponding to the shape of the input terminal 3 of the flexible wiring board 2.

When connecting, the flexible wiring board 2 and the circuit board 9 are connected by using the input terminals 3 existing in the slits 4 of the flexible wiring board 2 and the electrode terminals 7 of the circuit board 9.
Align and. At this time, the flexible wiring board 2
The input terminal 3 and the electrode terminal 7 of the circuit board 9 can be observed from the outside through the slit 4 by visual observation or an automatic recognition device. In this example, the input terminal 3 and the electrode terminal 9
It can be seen that there is a gap d between and. Therefore,
By using these as alignment marks, the flexible wiring board 2 and the circuit board 9 can be accurately aligned.

After alignment, the input terminal 3 and the electrode terminal 9 are connected via the anisotropic conductive film 10. Connection is shown in Figure 18.
Pressing and heating are performed using the tool 522 as shown in (a). Here, since the slit 4 is provided only in the region of the base material surface 20 that includes a part of the plurality of input terminals 3, the anisotropic conductive film 10 is provided at the tip of the connecting tool as compared with the conventional case. It is less likely that the tool will stick and break (chip), or that it will locally wear and shorten its life.

After the connection, the quality of alignment and the quality of the connection state can be easily determined by externally observing through the slit 4. In particular, in this example, since the connecting material is the anisotropic conductive film 10, the quality of the connected state can be easily determined by the degree of resin flow-out, the dispersed distribution of conductive particles, the shape of bubbles, and the like. Here, since observation is performed through the same slit 4 used for alignment, it is possible to prevent an increase in area of the flexible wiring board 2 as compared with the case where separate slits are used for alignment and connection state confirmation. it can.

During and after the connection process, the remaining input terminals 3 of the plurality of input terminals 3 of the flexible wiring board 2 which are not present in the slits 4 are lined and protected by the base material 20, so that the flexible wiring board is protected. It is possible to prevent the input terminal 3 of 2 from being disconnected (causing terminal disconnection).

Further, since the alignment accuracy is improved as described above, by using a so-called fine pitch connecting material such as the anisotropic conductive film 10 the connection pitch can be made fine and the area required for connection can be reduced. be able to. The fine pitch connecting material can be used as the connecting material because the alignment accuracy is good as described above. As the connecting material, a photocurable resin or a pressure contact type clip may be used.

Further, since the flexible wiring board 2 or the circuit board 9 is not largely moved, the positioning can be performed in a shorter time than the case where the boards are aligned by the method shown in FIG. Therefore, the connection is completed in a short time. In addition, the risk of making a large number of defective products due to misalignment is reduced. Further, as compared with the method in which the pins are aligned through the holes provided in the substrate, the area of the substrate can be reduced because the holes are not provided, and the pin replacement is not required.

Now, FIG. 3 shows an example in which the thickness of the connecting material 10 is smaller than the thickness t of the input terminal 3 of the flexible wiring board 2. In this case, if a pressurizing tool having a high rigidity is used for connection, the base surface 2 of the flexible wiring board 2
Since 0 is evenly pressed, the state of the connecting material 10a in the area where the slits 4 are provided and the connecting material 10b in the remaining area are
Finished without much difference from the state.

However, as shown in FIG. 4, the connecting material 1 is thicker than the thickness of the input terminal 3'of the flexible wiring board 2 '.
When the thickness of 0'before connection is large, or when the pressure tool is soft like rubber, the state of the connecting material 10a 'in the area where the slits 4'are provided and the connecting material 10 in the remaining space area 10'.
There is a difference from the state of b '.

In such a case, as shown in FIG. 5, the flexible wiring board 2'is provided with a slit 4 "which is smaller than the width of the input terminal 3, and the connected state is flown out from this slit 4". The determination may be made based on the amount of the connecting material 10c ″ (for example, diameter D). When the pressure, the pressurizing time, and the like are constant as connection conditions, the connection temperature is between the connection temperature T and the connecting material outflow amount (diameter D). 6 is known to have a correlation as shown in Fig. 6. For each item of the connection condition, such a correlation can be set in advance to determine a quality criterion for the connection condition, for example, α <D <. If β, it may be determined as good, and automated inspection is easy.

In this case, in order to prevent the connecting material 10c "flowing out from the slit 4" from adhering to the pressing tool, a position (within 5 mm is preferable) out of the area where the pressing tool presses. ) May be provided with a slit 4 ″. Alternatively, as shown in FIG. 10, a release sheet having a release property with respect to the connecting material 10 between the flexible wiring board 2 ″ and the tip of the pressure tool. It suffices to insert 10 "for connection. For example, as the release sheet 10", silicone rubber or Teflon sheet having a thickness of 0.1 to 0.5 mm can be used.

7 to 9 show various alignments (including displacement inspection) in regions of the circuit board corresponding to the slits 4a, 4b and 4c of the flexible wiring board 2, respectively.
An example in which a mark for use is provided is shown. In the example of FIG. 7, a square mark 13 is provided on the circuit board corresponding to the square slit 4a. In the example of FIG. 8, when the cross wiring 14 is present in the square slit 4b, the cross wiring 1
Marks 13a, 13b, 13c and 13d corresponding to No. 4 are provided on the circuit board. In the example of FIG. 9, when the input terminal 3 and the wiring end portions 14a and 14b are inside the rectangular slit 4c, the corners of the slit 4c, the side portions of the input terminal 3, and the wiring end portions 14a and 14b correspond to each other. Mark 13
e is provided on the circuit board. In either case, the flexible wiring board 2 and the circuit board can be accurately aligned.

The electrode terminals arranged on the peripheral portion 2 of the liquid crystal display panel 1'shown in FIG. 11 and the output terminals 5 of the flexible wiring board 2 shown in FIG.
Of the flexible wiring board 2 and the electrode terminal 7 of the circuit board 9 shown in FIG. 3 as the second connecting material by the above method. A liquid crystal display device can be configured by connecting through the anisotropic conductive film 10. Since the anisotropic conductive film is the mainstream of the current high density connecting material, the labor (time and money) of the development research can be saved as compared with the case of using a new material. In addition, existing equipment and manufacturing know-how can be used. Since the output terminal 5 side and the input terminal 3 side of the flexible wiring board 2 are connected by the same anisotropic conductive film, it is not necessary to provide separate connecting devices or steps.
Therefore, it is possible to reduce equipment investment and man-hours and reduce costs. Further, when one anisotropic conductive film is provided commonly to the output terminal 5 side of the flexible wiring board 2 and the input terminal 3, it is possible to further reduce capital investment and man-hours.

In this embodiment, the flexible wiring board is described as the wiring board (first wiring board), but the invention is not limited to this. The present invention can be widely applied to general wiring boards having no flexibility.

Although an example in which a liquid crystal display panel is mounted has been described, the present invention can be applied to a case where another display panel such as plasma or EL is mounted.

[0071]

As is apparent from the above, in the wiring board of the present invention, the slit includes only a part of the plurality of electrode terminals, and the remaining electrode terminals are lined and protected by the board surface. It is possible to prevent terminal breakage of the first wiring board during or after the step of connecting the electrode terminal of the wiring board (first wiring board) and the electrode terminal of another wiring board (second wiring board). The first wiring board of the second wiring board
In the location corresponding to the slit of the wiring board, the shape of the slit, the shape of the electrode terminal present in the slit,
Alternatively, by providing a mark having a shape corresponding to the shape of the slit and the electrode terminal existing in the slit, the alignment can be performed accurately. Further, since the alignment accuracy is improved in this way, a so-called fine pitch connecting material such as an anisotropic conductive film can be used as a connecting material for connecting the terminals, and the connecting pitch can be made smaller,
The area required for connection can be reduced. Further, after the connection, the quality of alignment and the quality of the connection state can be easily determined by externally observing through the slit. In particular, if the connecting material is an anisotropic conductive film, the quality of the connected state can be easily determined by the degree of resin flow-out, the distribution of conductive particles, the shape of bubbles, and the like. It is also possible to judge by looking at the amount of protrusion that flows out through the slit. Further, since the slit is provided only in a region including a part of the plurality of electrode terminals of the substrate, the connecting material sticks to the tip of the connecting tool and the tool is damaged (chipped).
It is also possible to reduce the risk of local wear and short life due to local wear. Further, since the first wiring board or the second wiring board is not moved significantly, the positioning can be performed in a shorter time than the case where the boards are aligned by the method shown in FIG. Therefore, the connection can be completed in a short time. In addition, it is possible to reduce the possibility that a large number of defective products will be produced due to misalignment. Further, as compared with a method in which the pins are aligned through holes provided in the substrate, the area of the substrate can be reduced because the holes are not provided, and pin replacement is not required.

In the wiring board of the second aspect, since the board is a flexible base material having a bendable flexibility, a flexible wiring board can be constructed as the wiring board. It is possible to make compact products by taking advantage of the flexibility of flexible wiring boards.

In the wiring board connection structure according to claim 3,
A slit penetrating the board is provided in a specific area of the wiring board, and the shape of the slit is provided in a portion of the second wiring board corresponding to the slit of the first wiring board, A mark having a shape of the existing first electrode terminal, or a shape corresponding to the shape of the slit and the shape of the first electrode terminal existing in the slit is provided. When the slit is provided in a region including a part of the plurality of first electrode terminals, the remaining first electrode terminals outside the slit are lined with and protected by the first wiring board, so that the first wiring During or after the step of connecting the first electrode terminal of the board and the second electrode terminal of the second wiring board,
It is possible to prevent disconnection of terminals on the wiring board. In addition, the slits of the first wiring board, the first electrode terminals, if any, existing therein, and the marks of the second wiring board are observed from the outside through the slits, visually or by an automatic recognition device or the like. it can. Therefore, by using these as alignment marks, the first wiring board and the second wiring board can be accurately aligned. Further, since the alignment accuracy is improved in this way, a so-called fine pitch connecting material such as an anisotropic conductive film can be used as a connecting material for connecting the terminals to each other, so that the connection pitch can be made smaller and the area required for connection can be reduced. it can. Further, after the connection, the quality of alignment and the quality of the connection state can be easily determined by externally observing through the slit. Further, when the slit is provided only in a region including a part of the plurality of electrode terminals of the substrate, the connecting material sticks to the tip of the connecting tool and the tool is damaged (chipped), or locally worn. It is possible to reduce the risk of short life. Further, since the first wiring board or the second wiring board is not moved significantly, the positioning can be performed in a shorter time than the case where the boards are aligned by the method shown in FIG. Therefore, the connection can be completed in a short time.
In addition, it is possible to reduce the possibility that a large number of defective products will be produced due to misalignment. Further, as compared with a method in which the pins are aligned through holes provided in the substrate, the area of the substrate can be reduced because the holes are not provided, and pin replacement is not required.

In the connection structure of the wiring board according to the fourth aspect, since the connection material is the anisotropic conductive film, the quality of the connection state can be easily determined by the degree of resin outflow, the distribution distribution of conductive particles, the shape of bubbles, and the like. You can judge. It is also possible to judge by looking at the amount of protrusion that flows out through the slit.

According to a fifth aspect of the present invention, in the display panel mounting structure, a slit penetrating the base material surface is provided in a specific region of the base material surface of the flexible wiring board, and the slit of the flexible wiring board of the circuit board is provided. At a position corresponding to the slit, a mark having a shape corresponding to the shape of the slit, the shape of the input terminal or the output terminal existing in the slit, or the shape of the slit and the input terminal or the output terminal existing in the slit. Since it is provided, the same effect as the third aspect can be obtained.

Further, in the display panel mounting structure according to the sixth aspect, since the second connecting material is the anisotropic conductive film, the quality of the connected state depends on the degree of resin flow out, the dispersion distribution of the conductive particles, and the shape of the bubbles. It can be easily determined by It is also possible to judge by looking at the amount of protrusion that flows out through the slit.

Further, in the display panel mounting structure according to claim 7, the first connecting material on the output terminal side of the flexible wiring board and the second connecting material on the input terminal side of the flexible wiring board are made of the same material. Therefore, it is not necessary to provide different types or separate connecting devices and processes. Therefore, it is possible to reduce capital investment and man-hours and reduce costs.

In the display panel mounting structure according to the eighth aspect, the first connecting material and the second connecting material are provided commonly to the output terminal and the input terminal of the flexible wiring board. It is not necessary to provide a separate connecting device or process. Therefore, it is possible to reduce capital investment and man-hours and reduce costs.

According to a ninth aspect of the present invention, there is provided a wiring board connecting method, wherein a slit penetrating the board is provided in a specific region of the first wiring board, and the first wiring of the second wiring board is provided. The shape of the slit at a location corresponding to the slit of the substrate, and the first slit existing in the slit.
A mark having a shape corresponding to the shape of the electrode terminal or the shape of the slit and the first electrode terminal existing in the slit is provided, and the slit and the mark are used to form the first wiring board and the second wiring board. The first electrode terminal and the second electrode terminal are connected to each other after aligning with the wiring board. Therefore, the same effect as that of the third aspect can be obtained.

Further, in the method of connecting a wiring board according to a tenth aspect, the first wiring board and the second wiring board are aligned with each other by using the slit and the mark, and the first electrode terminal and the first electrode terminal are connected to each other. After connecting the second electrode terminal, the quality of the positional deviation between the first wiring board and the second wiring board is determined by observing through the slits. Therefore, the first wiring board and the second wiring The quality of the position accuracy after connection with the board can be determined, and the yield rate is improved.

According to the wiring board connection method of the eleventh aspect, after the first electrode terminal and the second electrode terminal are connected, the connection state of the first electrode terminal and the second electrode terminal is established. Since the quality of is judged by observing through the slit,
The connection state between the first electrode terminal and the second electrode terminal can be easily determined.

According to the wiring board connecting method of the twelfth aspect, the quality of the connection state between the first electrode terminal and the second electrode terminal is discharged from the connection portion through the slit in the connection material. If the determination is made based on the amount of the portion, it is possible to reliably determine the quality of the connecting material even if the slit has a small dimension.

According to the wiring board connecting method of the thirteenth aspect, whether the connection state between the first electrode terminal and the second electrode terminal is good or bad is determined by the first wiring board and the second wiring board. Since the determination is made by observing through the same slit for alignment, the substrate area can be reduced by that amount as compared with the case where slits are provided separately. Therefore, high-density mounting can be performed.

Further, in the wiring board connecting method of the fourteenth aspect, the connecting material is made of a material which is solidified by heating or cooling after heating and melting, and the first wiring board and the first wiring board are connected.
Since the connecting material is pressed and heated through a release sheet having a releasability with respect to the connecting material between the wiring board and the connecting tool for pressing the connecting board, the connecting material temporarily flows out from the slit. However, the adhesion to the pressure tool can be prevented.
Therefore, the connecting material that has flowed out to the tip of the connecting tool does not stick and the tool is not damaged (broken), and the tool does not locally wear to shorten the service life. The release sheet can make the pressure applied to the plurality of electrode terminals uniform.

[Brief description of drawings]

FIG. 1 is a diagram showing a flexible wiring board according to an embodiment of the present invention.

FIG. 2 is a diagram showing a state of slits when the flexible wiring board and a circuit board are connected to each other.

FIG. 3 is a cross-sectional view showing a state in which the flexible wiring board and a circuit board are connected to each other.

FIG. 4 is a diagram illustrating a state of the connecting material when the connecting material is thicker than the thickness of the input terminal of the flexible wiring board.

FIG. 5 is a diagram showing a connection state when minute slits are provided on a base material surface of a flexible wiring board.

FIG. 6 is a diagram showing a correlation between connection temperature and connection material outflow amount.

FIG. 7 is a diagram exemplifying slits and alignment marks.

FIG. 8 is a diagram exemplifying slits and alignment marks.

FIG. 9 is a diagram illustrating a slit and a mark for alignment.

FIG. 10 is a view showing a state in which a release sheet is inserted between a flexible wiring board and a connection tool to be connected.

FIG. 11 is a diagram showing a conventional general liquid crystal display device.

FIG. 12 is a diagram showing a connection structure of a peripheral portion of the liquid crystal display device.

FIG. 13 is a diagram showing a modified example of FIG.

FIG. 14 is a diagram showing a conventional flexible wiring board.

FIG. 15 is a diagram for explaining the positional deviation between the electrode terminals of the display panel and the output terminals of the flexible wiring board.

FIG. 16 is a diagram showing a state of the connecting material after connecting the electrode terminals of the display panel and the output terminals of the flexible wiring board.

FIG. 17 is a diagram illustrating a positioning method using a transfer device.

FIG. 18 is a diagram showing a state in which an input terminal of a flexible wiring board and an electrode terminal of a circuit board are pressed by a connecting tool using a connecting material, and a state in which the connecting material sticks to the tip of the connecting tool.

[Explanation of reference numerals] 1'display panel 2, 2 ', 2 "flexible wiring board 3, 3', 3" input terminal 4, 4 ', 4 "slit 5 output terminal 7 electrode terminal 9 circuit board

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location // G02F 1/1345

Claims (14)

[Claims] 1. A wiring board having a plurality of aligned electrode terminals, which are to be electrically and mechanically connected to each other on the surface of the board while facing the electrode terminals of another wiring board, wherein A wiring board, wherein a slit penetrating the board is provided in an area including a part of the electrode terminal or within 5 mm near the area. 2. The wiring board according to claim 1, wherein the board is a flexible base material having bendable flexibility. 3. A first wiring board having a plurality of first electrode terminals arranged on the surface of the substrate and a second wiring board having a plurality of second electrode terminals arranged on the surface of the substrate are opposed to each other. ,
In a connection structure of a wiring board for electrically and mechanically connecting the first electrode terminal and the second electrode terminal via a connecting material, the board is provided in a specific region of the first wiring board. A slit penetrating therethrough is provided, and the shape of the slit, the shape of the first electrode terminal existing in the slit, or the portion of the second wiring board corresponding to the slit of the first wiring board is provided. A connection structure for a wiring board, wherein a mark having a shape corresponding to the shape of the slit and the first electrode terminal existing in the slit is provided. 4. The wiring board connection structure according to claim 3, wherein the connection material is an anisotropic conductive film. 5. The display panel is driven on the surface of the base material via the first connecting material to the electrode terminal of the display panel having a plurality of electrode terminals arranged along the peripheral edge of one surface. For connecting a plurality of output terminals of a flexible wiring board on which a driving IC is mounted, and a plurality of electrode terminals for supplying a signal to the driving IC on the surface of the substrate along the display panel. In a display panel mounting structure in which a circuit board is provided and a plurality of input terminals of the flexible wiring board are connected to the electrode terminals of the circuit board via a second connecting material, In a specific area,
A slit penetrating the base material surface is provided, and at the location corresponding to the slit of the flexible wiring board in the circuit board, the shape of the slit, the shape of the input terminal or the output terminal existing in the slit, or the above A mounting structure of a display panel, wherein a mark having a shape corresponding to the shape of the slit and the input terminal or the output terminal existing in the slit is provided. 6. The display panel mounting structure according to claim 5, wherein the second connecting material is an anisotropic conductive film. 7. The mounting structure for a display panel according to claim 5, wherein the first connecting material and the second connecting material are made of the same material. 8. The display panel mounting structure according to claim 7, wherein the first connecting material and the second connecting material are provided commonly to the output terminal and the input terminal of the flexible wiring board. The mounting structure of the display panel, which is characterized in that 9. A first wiring board having a plurality of first electrode terminals arranged on the surface of the substrate and a second wiring board having a plurality of second electrode terminals arranged on the surface of the substrate are opposed to each other. ,
In the method for connecting a wiring board, which connects the first electrode terminal and the second electrode terminal via a connecting material, a slit penetrating the board is provided in a specific region of the first wiring board. , The shape of the slit, the shape of the first electrode terminal existing in the slit, or the slit and the slit in the second wiring board at a position corresponding to the slit of the first wiring board. A mark having a shape corresponding to the existing shape of the first electrode terminal is provided, and after aligning the first wiring board and the second wiring board using the slit and the mark, the first wiring board is aligned with the first wiring board. A method for connecting a wiring board, comprising connecting the electrode terminal and the second electrode terminal. 10. The wiring board connecting method according to claim 9, wherein the first wiring board and the second wiring board are aligned using the slit and the mark, and the first electrode is formed. After connecting the terminal and the second electrode terminal, whether the positional deviation between the first wiring board and the second wiring board is good or bad is determined by observing through the slit. . 11. A first wiring board having a plurality of first electrode terminals lined up on the surface of the substrate, and a second wiring board lined up on the surface of the substrate.
A wiring board connecting method in which the first wiring board and the second wiring board having electrode terminals are opposed to each other, and the first electrode terminal and the second electrode terminal are connected via a connecting material. After providing a slit penetrating the substrate in a specific region of the first electrode terminal and connecting the first electrode terminal and the second electrode terminal, the connection state of the first electrode terminal and the second electrode terminal A method of connecting a wiring board, characterized in that the quality is judged by observing through the slit. 12. The method for connecting a wiring board according to claim 11, wherein the quality of the connection state between the first electrode terminal and the second electrode terminal is discharged from the connection portion through the slit in the connection material. A method of connecting wiring boards, characterized in that the determination is made based on the amount of the formed portion. 13. The method of connecting a wiring board according to claim 11, wherein the shape of the slit and the slit are provided in a portion of the second wiring board corresponding to the slit of the first wiring board. A mark having a shape corresponding to the shape of the first electrode terminal existing inside or the shape of the slit and the shape of the first electrode terminal existing inside the slit is provided, and the first wiring is formed using the slit and the mark. After aligning the substrate and the second wiring board, the quality of the connection state between the first electrode terminal and the second electrode terminal is determined by observing through the same slit. Connection method. 14. The wiring board connecting method according to claim 9, wherein the connecting material is made of a material which is solidified by heating or by cooling after heating and melting, and the first wiring board. And a connection tool that pressurizes the first wiring board, and pressurizes and heats the connecting material via a release sheet having releasability with respect to the connecting material. Wiring board connection method.