JPH07176658A - Method for tightly assembling heat sink and semiconductor - Google Patents

Abstract

PURPOSE:To allow independent mounting of a heat sink and a semiconductor onto a PCB board by allowing simple integration through vertical operation. CONSTITUTION:One dowel member 3 having trapezoidal axial cross-section is employed along with the other dowel member 5 having an inclining face 5a of same angle as the inclining face 3a of the dowel member 3. A screw 7 is driven into an elongated hole 6 made at a part 5' protruding from the dowel member 5 toward the dowel member 3. One dowel member 3 is secured in parallel with the base 2 of a heat sink 1 and the other dowel member 5 is shifted to the base 2 side of heat sink 1 thus pressing a semiconductor. The screw 7 is tightened under that state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of closely attaching a heat sink and a semiconductor.

[0002]

2. Description of the Related Art Conventionally, assembling of a heat sink and a semiconductor has employed a method in which a screw A is used and a semiconductor C is fixedly integrated with a base B'of a heat sink B as shown in FIG. Also, when mounting this on a PCB board, if the heat sink and the semiconductor are separately mounted and then integrated, the screw driver must be laid horizontally and screwed. It is practically impossible when the parts are mounted.
For this reason, the heat sink and the semiconductor had to be integrated before mounting.

However, in the case of such pre-integration, the pins of the heat sink and the pins of the semiconductor must be simultaneously inserted into the pin insertion holes provided in the PCB substrate when they are mounted on the PCB substrate. Since the distance between the heat sink pin and the semiconductor pin does not always match the position of the pin insertion hole on the PCB board, the heat sink and the semiconductor pin must be manually inserted, which is very troublesome. It took. Further, since the mounting work is performed in a state where other components are mounted, the work is difficult and extra time is required.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and is made so as to be easily integrated by an operation in the vertical direction. Therefore, the heat sink and the semiconductor are separately provided on the PCB. An object of the present invention is to provide a method of closely attaching a heat sink and a semiconductor, which can be mounted on a substrate, to each other.

[0005]

In order to achieve the above object, the present invention is constructed as follows. (1) One piece member having a trapezoidal axial cross section and having an internal thread engraved on its upper surface, and a sloped surface having the same angle as the sloped surface of the pieced member, the upper end surface of which is projected onto the pieced member and the projection. A pair of piece members, each of which is provided with a long hole in a direction perpendicular to the axis of the one piece member, and the other member having a screw threaded into the female thread inserted through the long hole, Fix one trapezoidal piece member parallel to the base of the heat sink,
A heat sink and a semiconductor, characterized in that the other piece member is displaced toward the base side of the heat sink and the semiconductor inserted between the piece member and the base is crimped to the base of the heat sink and screwed in this state. Adhesive assembling method.

(2) One of the vertical walls has a box-shaped axial cross section having a notch for slidably fitting a pressing projection of the other piece member, which will be described later, and a female screw is engraved on the top wall of the vertical wall. One piece member in which a female screw is screwed, and a pressing projection on one vertical surface, and a concave portion that becomes shallower from the upper part to the lower part are provided on the upper surface of the surface opposite to the pressing projection. A pair of piece members, which are loosely fitted in one piece member, and the other piece member are used. One piece member having the box-shaped axial cross section is parallel to the base with the cutout portion being the base side of the heat sink. Fixed to the base plate of the heat sink by rotating the other piece member by turning a screw, and crimping the semiconductor inserted between the pressing protrusion of the piece member and the base of the heat sink to the base of the heat sink. Characterized by heat Adhesion assembly method of the ink and the semiconductor.

(3) A support rod is provided in parallel with the base of the heat sink, and a disc-shaped cam provided with a screw insertion hole at an eccentric portion and a knob on the head is screwed to the support rod. Further, a circular hole having a diameter slightly larger than that of the disc-shaped cam is provided, and a flat plate-shaped pressing body in which the disc-shaped cam is loosely fitted is slidably arranged on the support rod to form the disc-shaped cam. The cam of the plate is rotated to displace the flat plate-shaped pressing body toward the base side of the heat sink, so that the semiconductor inserted between the flat plate-shaped pressing body and the base of the heat sink is crimped to the base of the heat sink. A characteristic method of assembling a heat sink and a semiconductor in close contact.

(4) A support rod is provided in parallel with the base of the heat sink, and a disc-shaped pressing body provided with a screw insertion hole at an eccentric portion is screwed to the support rod to screw the disc-shaped pressing body. A method for closely assembling a heat sink and a semiconductor, wherein the semiconductor inserted between the heat sink and the base of the heat sink is pressure-bonded to the base of the heat sink by rotating.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. First, an embodiment of the invention described in (1) above will be described with reference to FIGS. 1 and 2. 1 in the figure
Is a heat sink, and 2 is a base of the heat sink 1.
Reference numeral 3 is one piece member having a trapezoidal axial cross section, and a female screw 4 is engraved on the upper surface.

Reference numeral 5 denotes the other piece member, which has an inclined surface 5a at the same angle as the inclined surface 3a of the above-mentioned piece member 3 and whose upper end surface projects above the piece member 3. Further, a long hole 6 in a direction orthogonal to the axis of the piece member 3 is provided in the projecting portion 5 ', and a screw 7 screwed into the female screw 4 of the piece member 3 is inserted into the long hole 6.
In addition, 8 is a semiconductor.

According to the present invention, therefore, one piece member 3 is fixed in parallel with the base 2 of the heat sink 1, and the other piece member 5 of the heat sink 1 is provided with the pair of piece members. The semiconductor 8 inserted between the piece member 5 and the base 2 while being displaced is pressure-bonded to the base 2 of the heat sink, and in this state, it is held and fixed by the screw 7.

Next, an embodiment of the invention described in (2) above will be described with reference to FIGS. In the figure, 9 is one piece member. The piece member 9 is one of the vertical walls 9a.
Is formed into a box-shaped axial cross section having a notch 10 into which a pressing projection of the other piece member is slidably fitted, and a female screw 11 is engraved on its top wall 9b. Screw 12
Is screwed.

Numeral 13 is the other piece member which is loosely fitted in the one piece member 9. The piece member 13 has a pressing protrusion 14 on one vertical surface, and a concave portion 1 is formed on an upper portion of a surface opposite to the pressing protrusion 14 and becomes shallower from an upper portion to a lower portion.
5 is provided.

Thus, the present invention uses the above-mentioned pair of piece members, and one piece member 9 is provided with the notch 10 in the heat sink 1.
Is fixed in parallel with the base 2 as the side of the base 2, and the other piece member 13 is displaced to the side of the base 2 of the heat sink 1 by turning a screw 12, so that the pressing projection 14 of the piece member 13 and the heat sink 1 The semiconductor inserted between the base 2 and the base 2 is pressure-bonded to the base 2 of the heat sink 1.

Next, an embodiment of the invention described in (3) above will be described with reference to FIGS. 6 and 7. 1 in the figure
Reference numeral 6 is a support rod provided in parallel with the base 2 of the heat sink 1. In addition, the support rod 16 is provided with a female screw 17 into which a screw described later is screwed. Reference numeral 18 is a disk-shaped cam having a screw insertion hole 19 at an eccentric portion and a knob 18a on the head. Reference numeral 20 denotes a screw which is inserted into the screw insertion hole 19 of the disk-shaped cam 18 and whose tip is screwed into the female screw 17 of the support rod 16.

Reference numeral 21 is a flat plate-shaped pressing body in which a circular hole 22 having a diameter slightly larger than that of the disc-shaped cam 18 is provided, and the disc-shaped cam 18 is loosely fitted in the circular hole 22. The flat plate-shaped pressing body 21 is slidably mounted on the support rod 16.

Thus, according to the present invention, the disk-shaped cam 18 is screwed into the screw 2 by pinching the knob 18a and rotating it horizontally.
Rotate with 0 as the fulcrum, and this disk-shaped cam 18
The flat pressing body 21 is displaced toward the base 2 side of the heat sink 1 by rotating, and the semiconductor 8 inserted between the flat pressing body 21 and the base 2 of the heat sink 1 is mounted on the base of the heat sink 1. It is to be crimped onto the table 2. And, finally, the screw 20 is turned and fixed.

Next, an embodiment of the invention described in (4) above will be described with reference to FIGS. 8 and 9. 2 in the figure
Reference numeral 3 is a support rod provided in parallel with the base 2 of the heat sink 1. Further, the support rod 23 is engraved with a female screw (not shown) into which a screw described later is screwed. Reference numeral 24 is a disk-shaped pressing body having a screw insertion hole (not shown) at an eccentric portion. Reference numeral 24a denotes a push-out protrusion provided on the outer peripheral surface of the disk-shaped pressing body 24. 25 is the disc-shaped pressing body 2
4 is a screw which is inserted into a screw insertion hole (not shown) of No. 4 and whose tip is screwed into a female screw (not shown) of the support rod 23.

Thus, according to the present invention, the disk-shaped pressing body 24 is rotated about the screw 25 as a fulcrum, and the semiconductor is pressed against the base side of the heat sink by the outer peripheral surface thereof. And, finally, the screw 25 is turned and fixed.

[0020]

According to the present invention, the heat sink and the semiconductor can be separately mounted on the PCB substrate because they can be easily integrated by operating from the vertical direction. Thus, both of them can be separately mounted regardless of the distance between the pin insertion hole of the PCB substrate and the heat sink and the pin of the semiconductor. Therefore, the mounting work can be performed by the robot or the like, and the work efficiency can be further improved. Further, since they are integrated by the operation in the vertical direction, this can be performed without any trouble even when other components are already mounted.

[Brief description of drawings]

FIG. 1 is a partially cutaway plan view of an embodiment of the invention according to claim 1;

FIG. 2 is a cross-sectional view of a bridge member in the embodiment of the invention described in claim 1.

FIG. 3 is a perspective view of an embodiment of the invention described in claim 2.

FIG. 4 is a perspective view of an embodiment of the invention according to claim 2 in an exploded state.

FIG. 5 is a side view of a central longitudinal section of an embodiment of the invention according to claim 2;

FIG. 6 is a plan view of an embodiment of the invention described in claim 3;

7 is a cross-sectional view taken along the line I-I in FIG.

FIG. 8 is a plan view of an embodiment of the invention described in claim 4;

FIG. 9 is a plan view of an embodiment of the invention according to claim 4 in a crimped state.

FIG. 10 is an explanatory diagram of a conventional method.

[Explanation of symbols]

 1 heat sink 2 base of heat sink 3 one piece member 3a slope 4 female screw 5 other piece member 5'projection 5a slope 6 long hole 7 screw 8 semiconductor 9 one piece member 10 notch 11 female screw 12 screw 13 other Piece member 14 Pressing protrusion 15 Recess 16 Supporting rod 17 Female screw 18 Disc-shaped cam 19 Screw insertion hole 20 Screw 21 Flat plate pressing body 22 Circular hole 23 Supporting rod 24 Disc-shaped pressing body 25 Screw

Claims (4)

[Claims] 1. A one-piece piece member having a trapezoidal axial cross section and having a female screw engraved on the upper surface, and a sloped surface having the same angle as the sloped surface of the pieced member, the upper end surface of which protrudes above the pieced member. A pair of piece members is provided in which a long hole in a direction orthogonal to the axis of the one piece member is provided in the projecting portion, and the other member having a screw threaded into the female screw inserted into the long hole is used. A semiconductor in which one piece member having an axial trapezoidal shape is fixed in parallel with the base of the heat sink and the other piece member is displaced toward the base side of the heat sink and is inserted between the piece member and the base is a base of the heat sink. A method for closely assembling a heat sink and a semiconductor, which is characterized in that the heat sink and the semiconductor are tightly bonded to each other and screwed in this state. 2. A vertical wall is formed into a box shape having an axial cross section having a notch for slidably fitting a pressing projection of the other piece member, which will be described later, and a female screw is engraved on the top wall of the vertical wall. One piece member in which a screw is screwed on a screw, and a pressing projection on one vertical surface and a concave portion that becomes shallower from the upper portion to the lower portion are provided on an upper portion of a surface opposite to the pressing protrusion. Using a pair of piece members consisting of the other piece member which is loosely fitted in the piece member, one piece member having the box-shaped axial cross section is arranged in parallel with the base with the notch portion being the base side of the heat sink. After fixing, the other piece member is displaced to the base side of the heat sink by turning a screw, and thus the semiconductor inserted between the pressing protrusion of the piece member and the base of the heat sink is crimped to the base of the heat sink. Characteristic heat sink Adhesion and assembly method between semiconductor and semiconductor. 3. A disc-shaped cam provided with a support rod in parallel with the base of the heat sink and having a screw insertion hole at an eccentric portion and a knob on the head is screwed to the support rod. A circular hole having a diameter slightly larger than that of the disc-shaped cam is provided, and a flat plate-shaped pressing body in which the disc-shaped cam is loosely fitted is slidably arranged on the support rod. The cam is rotated to displace the flat plate-shaped pressing body toward the base of the heat sink, and the semiconductor inserted between the flat plate-shaped pressing body and the base of the heat sink is crimped to the base of the heat sink. Adhesive assembly method of heat sink and semiconductor. 4. A disc-shaped pressing body provided with a support rod parallel to the base of the heat sink and provided with a screw insertion hole at an eccentric portion of the support rod is screwed, and the disc-shaped pressing body is rotated. A method of closely assembling a heat sink and a semiconductor, wherein the semiconductor inserted between the heat sink and the base of the heat sink is pressure-bonded to the base of the heat sink.