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JPH0716789A - Production of active silver brazing filler metal - Google Patents

Production of active silver brazing filler metal

Info

Publication number
JPH0716789A
JPH0716789A JP18748593A JP18748593A JPH0716789A JP H0716789 A JPH0716789 A JP H0716789A JP 18748593 A JP18748593 A JP 18748593A JP 18748593 A JP18748593 A JP 18748593A JP H0716789 A JPH0716789 A JP H0716789A
Authority
JP
Japan
Prior art keywords
brazing filler
filler metal
silver brazing
active silver
brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP18748593A
Other languages
Japanese (ja)
Inventor
Kiyoshi Takaku
潔 高久
Yasushi Moriwaka
靖 森若
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP18748593A priority Critical patent/JPH0716789A/en
Publication of JPH0716789A publication Critical patent/JPH0716789A/en
Withdrawn legal-status Critical Current

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Abstract

PURPOSE:To prevent the breakage of the active silver brazing filler metal even if this brazing filler metal is worked to an extremely slender band material or wire by dissolving raw materials for the active silver brazing filler metal contg. a specific ratio of Cu and subjecting the molten metal to rapid solidifying while heating and maintaining the raw materials to and at a specific temp. CONSTITUTION:The raw materials for the active silver brazing filler metal consisting of 25 to 30wt.% Cu, 0.5 to 4% one or >=22 kinds among Ti, Hf, Zn, Zr, Be and Li and the balance Ag and inevitable impurities are dissolved in a vacuum atmosphere, inert gaseous atmosphere or reducing gaseous atmosphere. While the molten metal is heated and held to and at 1350 deg.C, more preferably 1400 to 1800 deg.C, the molten metal is kept stirred just before tapping. The melt of the active silver brazing filler metal is rapidly solidified at >=100 deg.C/sec cooling rate. As a result, an active silver brazing filler metal ingot having the Cu-M intermetallic compd. of finer particle sizes is obtd.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、セラミックスとセラ
ミックス、セラミックスと金属、または金属と金属をろ
う付けするための活性銀ろう材の製造法に関するもので
あり、特に素地中に最大粒径が50μm以下、好ましく
は30μm以下のCu−M(ただし、Mは、Ti、H
f、Zn、Zr、Be、Liのうちの1種または2種以
上を示す)金属間化合物粒子が分散している組織を有す
る酸素含有量:100ppm 以下の活性銀ろう材の製造法
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an active silver brazing material for brazing ceramics to ceramics, ceramics to metal, or metal to metal, and particularly, the maximum grain size in the matrix is 50 μm. Or less, preferably Cu-M of 30 μm or less (where M is Ti, H
f, Zn, Zr, Be, and Li) (one or more of f, Zn, Zr, Be, and Li) having a structure in which intermetallic compound particles are dispersed. Oxygen content: 100 ppm or less is there.

【0002】[0002]

【従来の技術】一般に、Agを主成分とし、これにC
u:10〜40重量%、Ti:0.5〜10重量%を添
加した活性Agろう材は知られており、前記活性Agろ
う材は、Cu粉末、Ti粉末、およびAg粉末を原料粉
末とし、粉末冶金法により焼結し、最終的に帯状または
線状に加工することにより製品化されている。このよう
にして作製された活性Agろう材は、電子または電気部
品に使用されているセラミックス部分とセラミックス部
分、セラミックス部分と金属部分、または金属部分と金
属部分などのろう付けに広く使用されている(必要なら
ば、特開昭64−53795号公報、溶接学会論文集第
9巻(1991)第4号、P495〜501などを参
照)。
2. Description of the Related Art Generally, Ag is the main component, and C
An active Ag brazing material containing u: 10 to 40% by weight and Ti: 0.5 to 10% by weight is known, and the active Ag brazing material includes Cu powder, Ti powder, and Ag powder as raw material powders. Sintered by powder metallurgy, and finally processed into a strip or a wire to obtain a product. The active Ag brazing material thus produced is widely used for brazing ceramics and ceramics, ceramics and metal, or metal and metal used in electronic or electric parts. (If necessary, refer to JP-A-64-53795, Welding Society Papers Vol. 9 (1991) No. 4, P495-501, etc.).

【0003】[0003]

【発明が解決しようとする課題】しかし、前記粉末冶金
法により作製された活性Agろう材は、酸素、水素など
のガス成分を多量に含み、これを電子または電気部品の
構成部分のろう付けに使用すると、活性Agろう材中の
ガスが放出し、ろう付け部の強度にバラツキが生じ、信
頼性が要求される製品には適用できないなどの課題があ
った。
However, the active Ag brazing filler metal produced by the powder metallurgy method contains a large amount of gas components such as oxygen and hydrogen, and is used for brazing of components of electronic or electric parts. When it is used, the gas in the active Ag brazing material is released, the strength of the brazing part varies, and there is a problem that it cannot be applied to products requiring reliability.

【0004】そのために、Cu:10〜40重量%、T
i:0.5〜10重量%、残り:Agからなる活性Ag
ろう材原料を、真空雰囲気中、不活性ガス雰囲気中また
は還元性ガス雰囲気中で溶解鋳造してインゴットを作製
し、このインゴットを圧延して活性Agろう材を薄い帯
材または細い線材に加工することにより活性Agろう材
を製造することもあるが、前記鋳造して得られたインゴ
ットの素地中には、50μmを越えるCu−Ti金属間
化合物の粗大粒子が生成されるために、薄い帯材または
細い線材に加工する際に毎々切断することがあり、50
μm以下の厚さの帯材または細線に加工することは難し
く、出来たとしても50μmを越えるCu−Ti金属間
化合物の粗大粒子が素地中に含まれるために、帯材また
は細線がリールから供給される途中で毎々切断すること
があり、近年の電子または電気部品の小型化に対応でき
る一層薄い帯状の活性Agろう材または細い線状の活性
Agろう材を供給することはできなかった。
Therefore, Cu: 10 to 40% by weight, T
i: 0.5 to 10% by weight, balance: active Ag consisting of Ag
A brazing material is melt-cast in a vacuum atmosphere, an inert gas atmosphere or a reducing gas atmosphere to produce an ingot, and the ingot is rolled to process the active Ag brazing material into a thin strip or a thin wire. Although an active Ag brazing filler metal may be produced by this method, since a coarse particle of Cu—Ti intermetallic compound exceeding 50 μm is generated in the base material of the ingot obtained by the casting, a thin strip material is produced. Or it may be cut each time when processing into a thin wire.
It is difficult to process into a strip material or fine wire with a thickness of less than μm, and even if it is possible, since coarse particles of Cu-Ti intermetallic compound exceeding 50 μm are contained in the base material, the strip material or fine wire is supplied from the reel. Since it may be cut during the process, it is impossible to supply a thinner strip-shaped active Ag brazing material or a thin linear active Ag brazing material that can cope with the recent miniaturization of electronic or electric parts.

【0005】[0005]

【課題を解決するための手段】そこで、本発明者等は、
かかる観点から活性Agろう材インゴットを薄い帯材ま
たは細い線材に加工しても切断することがなく、しかも
得られた薄い帯材または細い線材形状の活性Agろう材
を用いてセラミックスとセラミックス、セラミックスと
金属、または金属と金属をろう付けした場合に優れたろ
う付け性能を示す活性Agろう材を得るべく研究を行っ
た結果、(1) Cu:10〜40重量%、Ti、H
f、Zn、Zr、Be、Liのうちの1種または2種以
上(以下、Mと記す):0.5〜4重量%を含有する活
性Agろう材に含まれる酸素濃度を100ppm 以下に下
げるには、真空雰囲気中、不活性ガス雰囲気中または還
元性ガス雰囲気中で溶解する必要がある、(2)かかる
雰囲気中で溶解し、得られた溶湯を温度:1350℃以
上(好ましくは、1400〜1800℃)に加熱保持し
ながら出湯直前まで攪拌し、ついで、この活性銀ろう材
溶湯を100℃/sec.以上の冷却速度で急冷凝固さ
せると、Cu−M金属間化合物の粒子径が微細化した活
性Agろう材インゴットがえられ、この活性Agろう材
インゴットを薄く細い帯材または線材に加工しても切断
することがなく、より薄く細い活性Agろう材を得るこ
とができる、という知見を得たのである。
Therefore, the present inventors have
From this point of view, the activated Ag brazing filler metal ingot is not cut even if it is processed into a thin strip or a thin wire, and the obtained thin strip or thin wire-shaped active Ag brazing filler is used for ceramics, ceramics, and ceramics. As a result of conducting research to obtain an active Ag brazing material that exhibits excellent brazing performance when brazing metal and metal or metal and metal, (1) Cu: 10 to 40 wt%, Ti, H
One or more of f, Zn, Zr, Be and Li (hereinafter referred to as M): The oxygen concentration contained in the active Ag brazing material containing 0.5 to 4% by weight is reduced to 100 ppm or less. For this, it is necessary to dissolve in a vacuum atmosphere, an inert gas atmosphere or a reducing gas atmosphere. (2) Melt in such an atmosphere, and obtain the molten metal at a temperature of 1350 ° C. or higher (preferably 1400 ° C. or higher). While maintaining the temperature at about 1800 ° C.), the mixture is stirred until just before tapping, and then this activated silver brazing filler metal is heated at 100 ° C./sec. When rapidly solidified at the above cooling rate, an active Ag brazing filler metal ingot in which the particle diameter of the Cu-M intermetallic compound is made fine is obtained, and even if this active Ag brazing filler metal ingot is processed into a thin thin strip or wire rod. It was found that a thinner and thinner active Ag brazing material can be obtained without cutting.

【0006】この発明は、かかる知見にもとづいてなさ
れたものであって、Cu:25〜30重量%、M:0.
5〜4重量%を含有し、残りがAgおよび不可避不純物
からなる組成を有する活性銀ろう材原料を、真空雰囲気
中、不活性ガス雰囲気中または還元性ガス雰囲気中で溶
解し、得られた溶湯を温度:1350℃以上(好ましく
は、1400〜1800℃)に加熱保持しながら出湯直
前まで攪拌し、ついで、この活性銀ろう材溶湯を100
℃/sec.以上の冷却速度で急冷凝固させる、Cu:
25〜30重量%、M:0.5〜4重量%、O2 :10
0ppm 以下を含有し、残りがAgおよび不可避不純物か
らなる組成を有し、その素地中に最大粒径が50μm以
下(好ましくは、30μm以下)のCu−M金属間化合
物粒子が分散している組織を有する活性銀ろう材の製造
法に特徴を有するものである。
The present invention has been made on the basis of such findings, and Cu: 25 to 30% by weight, M: 0.
A molten metal obtained by melting an active silver brazing material having a composition of 5 to 4% by weight and the balance of Ag and unavoidable impurities in a vacuum atmosphere, an inert gas atmosphere or a reducing gas atmosphere. While maintaining the temperature at 1350 ° C. or higher (preferably 1400 to 1800 ° C.) until just before tapping, and then adding 100 parts of this activated silver brazing filler metal melt.
° C / sec. Cu which is rapidly solidified at the above cooling rate:
25 to 30% by weight, M: 0.5 to 4% by weight, O 2 : 10
A structure that contains 0 ppm or less and the balance is Ag and inevitable impurities, and Cu-M intermetallic compound particles having a maximum particle size of 50 μm or less (preferably 30 μm or less) are dispersed in the base material. It is characterized by a method for producing an active silver brazing material having

【0007】つぎに、この発明の活性Agろう材の製造
法を前記の如く限定した理由を説明する。
Next, the reason why the method for producing the active Ag brazing material of the present invention is limited as described above will be explained.

【0008】(1) Cu この発明の活性Agろう材はAg−Cu合金の共晶組成
であるAg−27.5重量%Cuを標準とするものであ
り、共晶組成よりも多少Cu成分がずれても融点への影
響があまりなく、したがって、ろう付け温度にも影響を
及ぼさないが、Cuが25重量%未満あるいは30重量
%を越えるとろう付け温度が上昇し好ましくないのでC
u含有量を25〜30重量%に定めた。
(1) Cu The active Ag brazing material of the present invention uses Ag-27.5% by weight Cu, which is a eutectic composition of an Ag-Cu alloy, as a standard, and the Cu component is slightly larger than the eutectic composition. Even if it is deviated, it has little effect on the melting point and therefore does not affect the brazing temperature, but if Cu is less than 25% by weight or exceeds 30% by weight, the brazing temperature rises, which is not preferable.
The u content was set to 25-30% by weight.

【0009】(2) M(Ti、Hf、Zn、Zr、B
e、Liのうちの1種または2種以上) Mは、ろう付け時にセラミックスと反応し、拡散層を形
成し、これにより相手の金属またはセラミックスと接合
する作用があるので必須元素として添加されるが、その
含有量が0.5重量%未満であるとろう付け強度が不足
し、一方、4重量%を越えると、ろう材中のCu−M金
属間化合物粒子が粗大化しかつその量も増加しすぎて、
ろう付け時にMの拡散が遅くなり、ろう付け後にろう付
け面においてCu−M金属間化合物粒子が残留し、この
ため、ろう付け強度が低下すると共にろう付け強度のば
らつきも大きくなるので好ましくない。したがってM含
有量は0.5〜4重量%に定めた。
(2) M (Ti, Hf, Zn, Zr, B
e, one or more of Li) M is added as an essential element because it reacts with ceramics during brazing to form a diffusion layer and thereby joins with the other metal or ceramics. However, if its content is less than 0.5% by weight, the brazing strength becomes insufficient, while if it exceeds 4% by weight, the Cu-M intermetallic compound particles in the brazing material become coarse and their amount also increases. Too much,
The diffusion of M is slowed during brazing, and Cu-M intermetallic compound particles remain on the brazing surface after brazing, which lowers the brazing strength and increases variations in the brazing strength, which is not preferable. Therefore, the M content is set to 0.5 to 4% by weight.

【0010】(3) 溶解雰囲気 O2 がこの発明の活性Agろう材に100ppm を越えて
含まれると、ろう付け中にO2 ガスが放出し、ろう付け
部に微細な気孔を生成せしめ、ろう付け強度を低下させ
ると共にろう付け強度のばらつきを増大せしめるので好
ましくない。したがって、活性Agろう材に含まれるO
2 含有量は100ppm 以下にしなければならないが、O
2 含有量を100ppm 以下にするためには原料金属また
は合金を真空雰囲気中、不活性ガス雰囲気中または還元
性ガス雰囲気中で溶解することが必要である。
(3) If the melting atmosphere O 2 is contained in the active Ag brazing filler metal of the present invention in an amount exceeding 100 ppm, O 2 gas is released during brazing, and fine pores are generated in the brazing portion. It is not preferable because it lowers the brazing strength and increases the variation in brazing strength. Therefore, O contained in the active Ag brazing filler metal
2 Content must be 100ppm or less, but O
2 In order to reduce the content to 100 ppm or less, it is necessary to dissolve the raw material metal or alloy in a vacuum atmosphere, an inert gas atmosphere or a reducing gas atmosphere.

【0011】(4) 溶解温度および攪拌 Mは、ろう材素地中にほとんどCu−M金属間化合物粒
子として分散しているが、溶解温度が1350℃未満で
は、Cu−M金属間化合物の最大粒子径が50μmを越
えて粗大化するようになるので溶解温度を1350℃以
上と定めた。また、溶解時に攪拌がないとやはりCu−
M金属間化合物の最大粒子径が50μmを越えて粗大化
するようになるので好ましくない。したがって、ろう材
原料の溶解には攪拌を伴う溶解炉、例えば、真空炉、不
活性ガス雰囲気炉、還元ガス炉などを使用して溶解する
ことが好ましい。しかし、この発明の活性Agろう材の
製造法において、攪拌を伴う溶解時の温度は1400〜
1800℃の範囲内にあることが最も好ましい。
(4) Melting temperature and agitation M is almost dispersed as Cu-M intermetallic compound particles in the brazing filler metal base, but when the melting temperature is less than 1350 ° C., the maximum particles of Cu-M intermetallic compound are present. The melting temperature was set to 1350 ° C. or higher because the diameter exceeds 50 μm and coarsens. Also, if there is no stirring during dissolution, Cu-
The maximum particle size of the M intermetallic compound exceeds 50 μm and becomes coarse, which is not preferable. Therefore, it is preferable to use a melting furnace accompanied by stirring, such as a vacuum furnace, an inert gas atmosphere furnace, or a reducing gas furnace, for melting the brazing material. However, in the method for producing an active Ag brazing filler metal according to the present invention, the temperature during melting with stirring is 1400 to
Most preferably, it is within the range of 1800 ° C.

【0012】(5) 冷却速度 前記攪拌しながら溶解時の温度を1350℃以上に保持
しても、鋳込み時の冷却速度が遅いと、モールド中での
凝固途中で、粒径の大きなCu−M金属間化合物が析出
してしまい、また、引け巣などの鋳造欠陥が発生すると
ころから、冷却速度を100℃/sec.以上に定め
た。
(5) Cooling rate Even if the temperature at the time of melting is maintained at 1350 ° C. or higher while stirring, if the cooling rate at the time of casting is slow, Cu-M having a large particle size is generated during solidification in the mold. Since the intermetallic compound is precipitated and casting defects such as shrinkage cavities occur, the cooling rate is 100 ° C./sec. Determined above.

【0013】前記条件で得られた活性Agろう材のイン
ゴットの組織を調べたところ、鋳造素地中に脆弱なCu
−M金属間化合物粒子が析出分散しており、その最大粒
子径は50μm以下であった。このように前記条件で得
られた活性Agろう材インゴットは、Cu−Ti金属間
化合物粒子が析出分散していてもその最大粒子径は50
μm以下であるから、50μm以下の薄い帯材または細
い線材に加工しても切断することはない。前記Cu−T
i金属間化合物粒子の最大粒子径は微細な程よく、最大
粒子径:30μm以下であることが一層好ましい。その
場合に粒子径:20〜30μmの粒子が50個/mm2
越えてAgろう材鋳造素地中に分散していることのない
ようにするのが一層好ましい。
When the structure of the ingot of the active Ag brazing material obtained under the above conditions was examined, it was found that Cu, which was fragile in the casting base, was found.
-M intermetallic compound particles were precipitated and dispersed, and the maximum particle size was 50 µm or less. In this way, the activated Ag brazing filler metal ingot obtained under the above conditions has a maximum particle size of 50 even if Cu-Ti intermetallic compound particles are precipitated and dispersed.
Since it is less than μm, it is not cut even if it is processed into a thin strip material or a thin wire material of less than 50 μm. The Cu-T
The finer the maximum particle diameter of the i intermetallic compound particles, the better, and it is more preferable that the maximum particle diameter is 30 μm or less. In this case, it is more preferable that particles having a particle diameter of 20 to 30 μm do not exceed 50 particles / mm 2 and are not dispersed in the Ag brazing material casting base material.

【0014】[0014]

【実施例】つぎに、この発明を実施例にもとづいて具体
的に説明する。原料として純Cu、純Ti、純Agを用
意し、これら原料金属を表1〜表4に示される配合量と
なるように秤量したのち溶解炉に装入し、表1〜表4に
示される雰囲気中および温度で加熱溶解し、この温度に
加熱された溶湯を出湯直前まで攪拌し続け、攪拌後ただ
ちに内側が縦:5〜50mm、幅:100mm、長さ:20
0mmの寸法を有する深さの異なる複数の鋳型に鋳造し、
表1〜表4に示される種々なる冷却速度にて凝固させ、
鋳造インゴットを得た。前記冷却速度の調整は、鋳造イ
ンゴットの肉厚、鋳型材質、離型剤の厚さ、水冷の給水
量等を変えることにより行った。
EXAMPLES Next, the present invention will be specifically described based on Examples. Pure Cu, pure Ti, and pure Ag were prepared as raw materials, and these raw material metals were weighed so as to have the compounding amounts shown in Tables 1 to 4, then charged into a melting furnace, and shown in Tables 1 to 4. It is heated and melted in the atmosphere and at the temperature, and the molten metal heated to this temperature is continuously stirred until just before tapping. Immediately after stirring, the inner side is vertical: 5 to 50 mm, width: 100 mm, length: 20
Cast in multiple molds of different depth having a dimension of 0 mm,
Solidified at various cooling rates shown in Tables 1 to 4,
I got a casting ingot. The cooling rate was adjusted by changing the wall thickness of the cast ingot, the material of the mold, the thickness of the release agent, the water supply amount of water cooling, and the like.

【0015】このようにして得られたインゴットを温
度:700℃にて熱間圧延し、厚さ:2mmの熱間圧延板
を作製し、ついで前記熱間圧延板を温度:700℃にて
焼鈍し、面削後、厚さ:50μmとなるまで冷間圧延と
焼鈍を繰り返し行い、本発明ろう材製造法(以下、本発
明法という)1〜23、比較ろう材製造法(以下、比較
法という)1〜8、および従来ろう材製造法(以下、従
来法という)1を実施した。
The ingot thus obtained is hot-rolled at a temperature of 700 ° C. to produce a hot-rolled plate having a thickness of 2 mm, and then the hot-rolled plate is annealed at a temperature of 700 ° C. Then, after the surface cutting, cold rolling and annealing are repeatedly performed until the thickness becomes 50 μm, and the present invention brazing material manufacturing methods (hereinafter, referred to as the present invention method) 1 to 23, comparative brazing material manufacturing method (hereinafter, comparative method) 1 to 8 and a conventional brazing material manufacturing method (hereinafter, referred to as a conventional method) 1.

【0016】さらに比較のために、平均粒径:30μm
のTi粉末およびAg−Cu粉末を用意し、これら粉末
をCu:27.5重量%、Ti:1.5重量%、残りA
gとなるように十分混練し、厚さ:15mm、幅:150
mm、長さ:300mmの寸法を有する成形体を作製し、こ
の成形体を温度:700℃にて焼結し、厚さ:50μm
となるまで冷間圧延と焼鈍を繰り返し行い、従来法2を
実施した。
For comparison, the average particle size is 30 μm.
The Ti powder and the Ag-Cu powder are prepared, and these powders are Cu: 27.5 wt%, Ti: 1.5 wt%, and the rest A
kneaded sufficiently to obtain g, thickness: 15 mm, width: 150
mm, length: 300 mm, a compact having a size of 50 μm was produced by sintering the compact at a temperature of 700 ° C.
The conventional method 2 was implemented by repeatedly performing cold rolling and annealing until it became.

【0017】これら本発明法1〜23、比較法1〜8お
よび従来法1〜2により得られたろう材の各マトリック
ス中に分散しているCu−Ti金属間化合物の最大粒子
径および酸素含有量を測定し、その測定結果を表1〜表
4に示した。
The maximum particle size and oxygen content of the Cu--Ti intermetallic compound dispersed in each matrix of the brazing filler metals obtained by the present invention methods 1 to 23, comparative methods 1 to 8 and conventional methods 1 and 2. Was measured, and the measurement results are shown in Tables 1 to 4.

【0018】[0018]

【表1】 [Table 1]

【0019】[0019]

【表2】 [Table 2]

【0020】[0020]

【表3】 [Table 3]

【0021】[0021]

【表4】 [Table 4]

【0022】[0022]

【発明の効果】表1〜表4に示される結果から、本発明
法1〜23により得られたろう材は、従来法1により得
られたろう材に比べて、ろう材素地中に分散するCu−
Ti金属間化合物の最大粒径も極めて微細であることが
分かる。さらに本発明法1〜23により得られたろう材
は、粉末冶金法による従来法2で製造されたろう材に比
べて、ろう材素地中に分散するCu−Ti金属間化合物
の最大粒径はほぼ等しいが、酸素含有量は格段に少ない
ことがわかる。
From the results shown in Tables 1 to 4, the brazing filler metals obtained by the methods 1 to 23 of the present invention are more dispersed in the brazing filler metal base than the brazing filler metal obtained by the conventional method 1.
It can be seen that the maximum particle size of the Ti intermetallic compound is also extremely fine. Further, the brazing materials obtained by the methods 1 to 23 of the present invention have substantially the same maximum particle size of the Cu-Ti intermetallic compound dispersed in the brazing material base as compared with the brazing material manufactured by the conventional method 2 by the powder metallurgy method. However, it can be seen that the oxygen content is remarkably low.

【0023】また、この発明の条件から外れた条件の比
較法1〜8により得られたろう材は、Cu−Ti金属間
化合物の最大粒径が粗大であったり、酸素含有量が粉末
冶金法により得られたろう材とほぼ同程度であったり、
または線状に加工するに際して切断するものがあったり
して、好ましくない特性が少くとも1つ表われているこ
とがわかる。
Further, the brazing filler metals obtained by the comparative methods 1 to 8 under the conditions deviating from the conditions of the present invention have a coarse maximum grain size of the Cu--Ti intermetallic compound and an oxygen content by the powder metallurgy method. It is almost the same as the obtained brazing material,
It is also understood that at least one unfavorable characteristic appears, because some may be cut when being processed into a linear shape.

【0024】上述のように、この発明の活性銀ろう材の
製造法によると、従来よりも優れたろう材を提供するこ
とができ、産業の発展に大いに貢献しうるものである。
As described above, according to the method for producing an active silver brazing filler metal of the present invention, a brazing filler metal superior to the conventional one can be provided, which can greatly contribute to the industrial development.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 Cu:25〜30重量%、Ti、Hf、
Zn、Zr、Be、Liのうちの1種または2種以上:
0.5〜4重量%を含有し、残りがAgおよび不可避不
純物からなる組成を有する活性銀ろう材原料を真空雰囲
気中、不活性ガス雰囲気中または還元性ガス雰囲気中で
溶解し、得られた溶湯を温度:1350℃以上に加熱保
持しながら出湯直前まで攪拌し、ついで、この活性銀ろ
う材溶湯を100℃/sec.以上の冷却速度で急冷凝
固させることを特徴とする活性銀ろう材の製造法。
1. Cu: 25 to 30% by weight, Ti, Hf,
One or more of Zn, Zr, Be and Li:
An active silver brazing material having a composition of 0.5 to 4% by weight and the balance of Ag and inevitable impurities was dissolved in a vacuum atmosphere, an inert gas atmosphere or a reducing gas atmosphere to obtain While the molten metal was heated and held at a temperature of 1350 ° C. or higher, the molten metal was stirred until just before tapping, and then this activated silver brazing filler metal was heated at 100 ° C./sec. A method for producing an active silver brazing material, which comprises rapidly solidifying at the above cooling rate.
【請求項2】 前記銀ろう材溶湯を温度:1400〜1
800℃の範囲内の所定の温度に加熱保持しながら出湯
直前まで攪拌し、ついで、この温度に加熱された活性銀
ろう材溶湯を100℃/sec.以上の冷却速度で急冷
凝固させることを特徴とする、請求項1記載の活性銀ろ
う材の製造法。
2. The molten silver brazing filler metal is heated to a temperature of 1400 to 1
While maintaining the temperature at a predetermined temperature within the range of 800 ° C., stirring was carried out until just before tapping, and then the activated silver brazing filler metal melt heated at this temperature was heated at 100 ° C./sec. The method for producing an active silver brazing filler metal according to claim 1, wherein the rapid solidification is performed at the above cooling rate.
JP18748593A 1993-06-30 1993-06-30 Production of active silver brazing filler metal Withdrawn JPH0716789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18748593A JPH0716789A (en) 1993-06-30 1993-06-30 Production of active silver brazing filler metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18748593A JPH0716789A (en) 1993-06-30 1993-06-30 Production of active silver brazing filler metal

Publications (1)

Publication Number Publication Date
JPH0716789A true JPH0716789A (en) 1995-01-20

Family

ID=16206896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18748593A Withdrawn JPH0716789A (en) 1993-06-30 1993-06-30 Production of active silver brazing filler metal

Country Status (1)

Country Link
JP (1) JPH0716789A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012161148A1 (en) 2011-05-24 2012-11-29 田中貴金属工業株式会社 Active metal brazing material
WO2016013651A1 (en) * 2014-07-24 2016-01-28 電気化学工業株式会社 Brazing filler metal, and ceramic substrate employing same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012161148A1 (en) 2011-05-24 2012-11-29 田中貴金属工業株式会社 Active metal brazing material
EP2716402A1 (en) * 2011-05-24 2014-04-09 Tanaka Kikinzoku Kogyo K.K. Active metal brazing material
CN103732351A (en) * 2011-05-24 2014-04-16 田中贵金属工业株式会社 Active metal brazing material
EP2716402A4 (en) * 2011-05-24 2015-04-29 Tanaka Precious Metal Ind Active metal brazing material
CN103732351B (en) * 2011-05-24 2016-01-20 田中贵金属工业株式会社 Active metal solder
US9375811B2 (en) 2011-05-24 2016-06-28 Tanaka Kikinzoku Kogyo K.K. Active metal brazing material
WO2016013651A1 (en) * 2014-07-24 2016-01-28 電気化学工業株式会社 Brazing filler metal, and ceramic substrate employing same
JPWO2016013651A1 (en) * 2014-07-24 2017-06-15 デンカ株式会社 Brazing material and ceramic substrate using the same

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