JPH07161778A - Manufacturing method of tape carrier for TAB - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] To provide a method for manufacturing a TAB tape carrier that can eliminate coating defects in the backing process and reduce the cost of the backing process. [Structure] A base tape processing step of forming an opening 2 in a resin tape 1 and attaching a copper foil to the opening 2 and a pattern forming step of applying resist, exposing, developing, backing and etching the copper foil. In the method of manufacturing a tape carrier for TAB, the backing treatment in the pattern forming step is characterized in that the film-shaped resist 8 is attached only to a necessary portion of the back surface of the resin tape 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to TAB (Tape A
The present invention relates to a method of manufacturing an automated bonding tape carrier and relates to a backing process in a pattern forming step of the method of manufacturing a TAB tape carrier.

[0002]

2. Description of the Related Art A conventional method for manufacturing a TAB tape carrier will be described with reference to FIGS.

FIG. 3 is a plan view of the conventional TAB tape carrier manufacturing method, and FIG.
FIG. 4 is a sectional view of the TAB tape carrier of FIG. 3.

In the conventional method of manufacturing a tape carrier for TAB, a conductive layer is formed on a resin tape as a base material with an adhesive,
For example, there are a three-layer tape to which a copper foil is attached and a two-layer tape that does not use an adhesive. Since the three-layer tape is currently the center of the TAB tape, the three-layer tape will be described.

In FIGS. 3 and 4, 1 is an insulating film, 2
Is a device hole, 3 is a copper foil, 4 is an adhesive, 5 is a perforation hole, 6 is a photoresist, and 7 is a backing resist.

Generally, the TAB tape carrier is an insulating film 1 such as a resin tape having a thickness of 50 to 125 μm and a width of 35 mm (or a width of 48 or 70 mm) coated with an adhesive, such as a polyimide tape or a glass epoxy tape.
Then, the device hole 2 and the perforation hole 5 are formed by punching.

The insulating film 1 has a thickness of 18 to 35 μm.
The rolled copper foil or electrolytic copper foil of 1 is pasted with an adhesive 4 and laminated.

Next, a photoresist 6 is applied to the copper foil to form patterns and leads, and the patterns and leads are exposed and developed.

Next, a backing resist 7 is applied to protect the back surface of the copper foil 3 in the device hole 5 exposed by the punching process from etching.

After that, the copper foil 3 is subjected to an etching process to form patterns and leads. After etching, the unnecessary photoresist 6 and backing resist 7 are dissolved and removed with an alkaline solution, and solder resist printing is performed to protect and insulate the copper wiring pattern other than the joint portion, and the copper wiring pattern is bonded. In order to improve the performance, solder plating is performed by an electroplating method, and the process is completed in a power supply lead cutting step for electrically separating each lead.

By the way, the backing resist 7 is coated by using a roll coater with a width over the entire back surface of the insulating film 1.

[0012]

In the backing process of the conventional method for manufacturing a tape carrier for TAB, a roll coater is used to apply the resist over the entire back surface of the insulating film. Misalignment,
The coating of the roll coater is eccentric and the coating is coated at an unnecessary position.
For example, there is a problem that the copper foil goes around to the front side of the copper foil through the perforation hole.

Further, if the above-mentioned resist is applied to the entire back surface of the insulating film with a certain width, there is a problem that the cost of the backing process becomes high.

The present invention has been made to solve the above-mentioned problems of the prior art, and provides a method of manufacturing a TAB tape carrier which can eliminate coating defects in the backing process and reduce the cost of the backing process. Its purpose is to provide.

[0015]

In order to achieve the above object, the structure of the present invention relating to a method of manufacturing a tape carrier for TAB has a base tape in which an opening is provided in a resin tape and a copper foil is attached to the opening. Processing step, resist coating on the copper foil,
In a method of manufacturing a TAB tape carrier including a pattern forming process of exposing, backing, and etching, the backing process of the pattern forming process is to protect only a necessary portion of the back surface of the resin tape with a resist. Characterize.

The protection with a resist is characterized in that a film-shaped resist is attached only to a necessary portion on the back surface of the resin tape.

[0017]

The function of each of the above technical means is as follows.

According to the structure of the present invention, the protection by the resist is performed by backing the film-shaped resist to the minimum necessary area, so that the wraparound to the front side of the copper foil and the backing resist caused by the backing treatment are caused. Bleeding can be eliminated, coating defects can be eliminated, and backing position accuracy can be improved.

[0019]

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a plan view of a TAB tape carrier in a method of manufacturing a TAB tape carrier according to an embodiment of the present invention, and FIG. 2 is a sectional view of the TAB tape carrier of FIG.

In FIGS. 1 and 2, the same reference numerals as those in FIGS. 3 and 4 denote the same parts, and thus detailed description thereof will be omitted. Only new codes will be described. Reference numeral 8 is a film-like resist. In a method of manufacturing a tape carrier for TAB according to an embodiment of the present invention, a resin tape having a thickness of 75 μm and a width of 35 mm, for example, an insulating film 1 of an organic polyimide film is used.
Punching is performed to form device holes 2 and perforation holes 5 corresponding to IC elements.

The insulating film 1 is laminated with a rolled copper foil or electrolytic copper foil having a thickness of 35 μm bonded together via an adhesive 4.

Next, a photoresist 6 is applied to the copper foil to form a pattern and leads, and the pattern is exposed and developed.

Next, in order to protect the back surface of the copper foil 3 in the device hole 5 exposed by the punching process from etching, a film-shaped resist 8 is attached only to the necessary portion from the insulating film 1 side. A so-called backing process is performed.

The subsequent etching process, solder resist printing, electroplating method, and power supply lead cutting process are the same as those in the prior art, and therefore detailed description thereof will be omitted.

As described above, according to the method for manufacturing the TAB tape carrier according to the above-described embodiment, the wraparound to the front side of the copper foil and the backing resist which occur in the backing process in the conventional method for manufacturing the TAB tape carrier are described. Bleeding can be prevented.

It is needless to say that the above embodiments are merely specific examples and can be applied to various other systems.

For example, the three-layer tape in which the insulating film 1 is bonded to the copper foil via the adhesive 4 has been described, but it goes without saying that the present invention can be applied to a two-layer tape that does not use an adhesive.

[0029]

As described in detail above, according to the present invention, it is possible to provide a method of manufacturing a TAB tape carrier which can eliminate coating defects in the backing process and can reduce the cost of the backing process. it can.

[Brief description of drawings]

FIG. 1 is a plan view of a TAB tape carrier in a method of manufacturing a TAB tape carrier according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the TAB tape carrier of FIG.

FIG. 3 is a plan view of the tape carrier in a conventional method for manufacturing a TAB tape carrier.

4 is a cross-sectional view of the TAB tape carrier of FIG.

[Explanation of symbols]

 1 Insulating film 2 Device hole 3 Copper foil 4 Adhesive 5 Perforation hole 6 Photoresist 7 Backing resist 8 Film resist

Claims (2)

[Claims] 1. A base tape processing step in which an opening is provided in a resin tape and a copper foil is attached to the opening, and a pattern forming step in which resist coating, exposure, development, backing and etching are performed on the copper foil. In the method for producing a TAB tape carrier, including the TAB tape carrier, the backing treatment in the pattern forming step protects only necessary portions of the back surface of the resin tape with a resist. 2. The method for producing a TAB tape carrier according to claim 1, wherein the protection with a resist is performed by attaching a film-shaped resist only to a necessary portion on the back surface of the resin tape.