JPH07161771A - Film carrier, electronic part and mold releasing paper peeling method - Google Patents

Abstract

PURPOSE:To provide an electronic part such that a sheet of mold releasing paper can be excellently peeled off from the anisotropic conductive film adhering to the leads. CONSTITUTION:The title film carrier 10 is provided with a base film 11, the device hole 12 made in the base film 11, a plurality of leads 13 on which inner leads 13a are protruding into a device hole 12 and outer leads 13b are extended in parallel with each other to the edge part of the base film 11, and dummy pads 14 which are provided on the outermost position of a plurality of outer leads 13b. An anisotropic conductive film 7, having a mold releasing paper 8 attached to a plurality of outer leads 13b and the dummy pads 14, is stuck to the edge part of a film carrier 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a release paper peeling method for peeling a release paper from an electronic component mounted on a peripheral portion of a liquid crystal cell and an adhesive tape piece attached to the electronic component. It is a thing.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a liquid crystal panel, a liquid crystal driving substrate is formed on a liquid crystal glass substrate constituting a liquid crystal cell.
There is a step of mounting C. Conventionally, a rubber connector or the like has been used to connect the liquid crystal glass substrate and the liquid crystal driving IC. However, in recent years, there has been a demand for smaller and lighter liquid crystal panels and a demand for mounting a backlight, so that the connection with the above-mentioned rubber connector has reached a limit.

Therefore, recently, as a liquid crystal driving IC,
A thin cine film with a circuit pattern formed on the surface
TAB (Tape Automated B) formed by lead bonding
onding) components are widely used.

The TAB component is a component as shown by 1 in FIG. 9, and includes a flexible base film 2 and a plurality of leads 3 wired on the base film 2. This Lee
The semiconductor element 4 is connected to the tip portion (inner lead 3a) of the battery 3. The other end of the lead 3 is extended to the edge of the base film 2 so that the outer lead
It is called a 3b.

As shown in FIG. 8, each TAB component 1 comprises a pair of first and second liquid crystal glass substrates 6 which constitute a liquid crystal cell 6.
It is mounted around a and 6b. Then, in order to connect the TAB component 1 to the wiring terminals formed on the first and second liquid crystal glass substrates 6a and 6b, an anisotropic conductive film piece (anisotropic conductive adhesive) 7 shown in FIG. Agent) is used.

The anisotropic conductive film piece 7 is a strip-shaped member manufactured by cutting a long tape-shaped anisotropic conductive film into pieces each having a predetermined length dimension. The anisotropic conductive film is made of an anisotropic conductive material in which conductive particles are mixed in a thermosetting or thermoplastic resin film.

The anisotropic conductive film piece 7 is sandwiched between the outer leads 3b of the TAB component 1 and the wiring terminals of the first or second glass substrate 6a, 6b to form the TAB component 1 described above.
And the first or second glass substrate 6a, 6b are pressed in a direction in which they face each other, the conductive particles in this anisotropic conductive film piece 7 are conductive only in the direction in which they are in contact with each other and sandwiched. The TABs that face each other because they have
Only the outer lead 5 of the component 1 and the wiring terminals of the first or second glass substrate 6a, 6b are electrically connected.

By the way, by using this anisotropic conductive film piece 7, the TAB component and the first and second liquid crystal glass substrates 6 are formed.
When connecting a and 6b, it is necessary to previously attach the anisotropic conductive film piece 7 to either the TAB component 1 or the liquid crystal glass substrates 6a and 6b.

Of these, as shown in FIG.
When the anisotropic conductive film piece 7 is attached to the component 1 side, the anisotropic conductive film piece 7 is spread over all the outer leads 3b ... Derived to the edge of the TAB component 1. Make sure to stick it.

In order to prevent dust and the like from adhering to the surface of the anisotropic conductive film piece 7 opposite to the surface adhered to the outer lead 3b, a release paper is formed. 8 is attached. Therefore, when mounting the TAB component 1 on the first or second liquid crystal glass substrate 6a, 6b, it is necessary to peel off the release paper 8 from the anisotropic conductive film piece 7.

[0011]

By the way, both lengthwise end portions of the anisotropic conductive film piece 7 are extended slightly outward from the outermost outer lead of the outer lead. There is. On the other hand, when the release paper 8 is peeled from the anisotropic conductive film piece 7, the release paper 8 is peeled from either one end side of the both ends of the anisotropic conductive film piece 7.

Therefore, as shown in FIG. 11, when the release paper 8 is pulled in a direction away from the TAB component 1 in order to remove the release paper 8, one end portion of the anisotropic conductive film piece 7 is pulled. Will also be pulled upward due to this.

At this time, when the outermost outer lead 3b and the anisotropic conductive film piece 7 are firmly attached to each other, the release paper 8 is the anisotropic conductive film piece. 7
The anisotropic conductive film piece starts to peel from the anisotropic conductive film piece due to the cutting process of the anisotropic conductive film piece 7 in the previous step or the chemical change over time. If the adhesive strength of 7 is reduced, the release paper 8
In some cases, stable peeling cannot be performed.

In such a case, the anisotropic conductive film piece 7 is also peeled off from the TAB component 1 together with the release paper 8 and the TAB component 1 cannot be mounted. there were.

Particularly when the above-mentioned liquid crystal panel manufacturing apparatus is an automatic apparatus, when the above-mentioned trouble occurs,
Since it is necessary to stop the device one by one, continuous operation of the device may be hindered and it may not be possible to improve the mobility.

The present invention has been made in view of the above circumstances, and provides an electronic component and a release paper peeling method capable of favorably peeling a release paper from an anisotropic conductive film attached. That is the purpose.

[0017]

A first means of the present invention is a base, a plurality of leads juxtaposed on the base at a predetermined pitch, and the base described above. Provided on the
An electronic component comprising: a pad formed on the outer side of the outermost lead among the plurality of leads arranged in parallel.

A second means is the electronic component of the first means, characterized in that the pad is formed with a predetermined distance from the outermost lead. .

A third means is an electronic component according to the first means, wherein the pad is formed integrally with the outermost lead.

According to a fourth means, in the electronic component according to the first means, an adhesive tape piece having at least one end attached to the pad is attached to the lead and the pad. It is an electronic component characterized in that.

A fifth means is the electronic component according to the fourth means, in which release paper is attached to the surface of the adhesive tape piece opposite to the surface attached to the lead and the pad. It is an electronic component characterized in that

A sixth means is a release paper peeling method for peeling a release paper of an adhesive tape piece adhered to a plurality of leads juxtaposed on a base of an electronic component. Release paper
The release paper peeling is characterized in that the adhesive tape piece is peeled from one end attached to a pad formed on the outer side of the outermost lead among the plurality of leads. Is the way.

A seventh means is that a base film, an element mounting position formed on the base film, and one end of the base film are juxtaposed on the base film so as to project to the element mounting position. And a pad formed on the outer side of the outermost lead of the plurality of leads.

[0024]

By such means, the release paper can be favorably peeled off from the adhesive tape piece attached to the lead.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. Shown in the figure is a part of a long cine-film-shaped film carrier 10 (electronic component of the present invention). The film carrier 10 includes a flexible base film 11, a plurality of device holes 12 (element mounting positions) formed at predetermined intervals along the longitudinal direction of the base film 11, and a tip. A plurality of leads 13 in which a part (inner lead 13a) is extended to the device hole 12 and the other end (outer lead 13b) is extended to the edge of the base film 11. It consists of and.

The other end of the lead 13 is called an outer lead 13b (lead of the present invention), and the outer lead 13b is arranged on the base film 11 in two directions. The base film 11 is led out to the edge portion along the width direction.

The outer leads that are routed in two directions are on the signal input side (indicated by A in the figure) and the signal output side (indicated by B in the figure). And these signal input side A
Outer lead 13b and signal output side B outer lead 1
3b are arranged in parallel at a predetermined pitch.

Further, as shown in the enlarged view of the figure, the plurality of outer leads 13 arranged on the signal output side are arranged on the signal output side.
A dummy pad 14 (pad) formed in parallel with the outer lead 13b is formed on the outer side of the outer lead 13b located on the outermost side.

These leads 13 and dummy pads 14
Are made of the same material, for example copper, and
It is formed by depositing a copper foil over substantially the entire surface of the film 11 and then melting and removing unnecessary copper foil by an etching technique.

Next, a process of manufacturing a TAB component (electronic component) using this film carrier 10 will be described. The film carrier 10 is wound and housed in a film carrier supply reel (not shown), and is pulled out intermittently by a predetermined dimension from the film carrier supply reel and stretched in a direction indicated by an arrow in the figure. Be driven to. The film carrier 10 sequentially stops the portions provided with the device holes 12 at predetermined bonding positions.

At this bonding position, as shown in FIG. 3B, the semiconductor element 15 is supplied from the back surface side of the film carrier 10 into the device hole 12 and is formed on the upper surface of the semiconductor element 14. The formed electrode portion (not shown) is positioned and held in contact with the lower surface of the tip portion of the inner lead 13a protruding into the device hole 12.

Then, at this position, a bonding tool (not shown) is activated to operate the inner lead 13a.
Are pressed against the electrodes of the semiconductor element 14. As a result, the inner lead 13a is connected to the semiconductor element 14 by the inner lead 13a.
It is mechanically and electrically connected to the electrode of.

In such an operation, the film carrier 10 is intermittently driven and driven, and the device hall 12 is driven.
Is carried out each time it is stopped at the bonding position, and the semiconductor elements 15 are sequentially mounted in the device holes 12.

When the semiconductor element 15 is mounted in this manner, the outer lead 13b of the film carrier is formed.
As shown in FIG. 1 (b), a strip-shaped anisotropic conductive film piece 7 having a predetermined length dimension is attached. This anisotropic conductive film piece is the same as that shown in the conventional example, and a long tape-shaped anisotropic conductive film is attached to one adhesive surface of this anisotropic conductive film. It is formed by cutting together with the pattern paper into a strip having a predetermined length.

Next, a process of attaching the anisotropic conductive film piece 7 to the film carrier 10 and a process of manufacturing the TAB component 17 from the film carrier 11 will be described.

The elongated tape-shaped anisotropic conductive film is housed in an anisotropic conductive film supply reel (not shown), and is sequentially fed from the anisotropic conductive film supply reel. The anisotropic conductive film that has been fed is cut by the cutting mechanism together with the release paper 8 into anisotropic conductive film pieces 7 having a predetermined length, and the anisotropic conductive film pieces 7 are attached to the release paper 8. The surface is suction-held by a suction nozzle (not shown).

While the anisotropic conductive film piece 7 is held by the suction nozzle, the adhesive surface (the surface on which the release paper 8 is not attached) is formed on the film carrier 10 on the signal output side. The outer leads 13b ... Are positioned so as to face each other.

Then, the anisotropic conductive film piece 7 is attached to the plurality of outer leads 13b as shown in FIG. The anisotropic conductive film piece 7 is manufactured so as to have a length reaching the dummy pad 14, and both ends of the anisotropic conductive film piece 7 are respectively formed on the dummy pad 1.
Attached to 4.

Next, the semiconductor element mounted on the film carrier 10 is potted (resin-sealed) (not shown) and punched along the alternate long and short dash line shown in FIG. Complete.

Next, the release paper 8 is peeled off from the anisotropic conductive film piece 7 attached to the TAB component 17, and the TAB component 17 is attached to the first and second liquid crystal glass substrates 6a and 6b (see FIG. 8).

2 (a) and 2 (b) show this TAB part 1
7 is an enlarged view of a portion (output side B) to which the anisotropic conductive film piece 7 of 7 is attached. As described above, the both ends of the anisotropic conductive film piece 7 have the dummy pad 14,
14 is attached to each.

To release the release paper 8 attached to the anisotropic conductive film piece 7, a peeling tape 18 shown in FIG. 2 is used. The stripping tape 18 is stretched substantially horizontally with the adhesive surface facing downward and facing the release paper 8.

The peeling tape 1 stretched in this way
8 is driven downward as shown by an arrow in the figure in a state where it is stretched horizontally as described above, and the adhesive surface thereof is applied to the release paper 8
The entire surface is adhered to the upper surface of the.

As shown by the arrow in FIG. 3, the stripping tape 18 is arranged in order from the portion corresponding to one end of the anisotropic conductive film piece 7 to the portion corresponding to the other end. It is driven in the upward direction (the direction away from the TAB component).

As a result, the release paper 8 is driven upward together with the peeling tape 18 in a state of being adhered to the peeling tape 18, and the anisotropic conductive film piece. Peeled from 7. At this time, unlike the conventional example, one end of the anisotropic conductive film piece 7 is adhered and held by the dummy pad 14, so that it does not come off from the TAB component 17.

When the peeling tape 18 is completely separated from the TAB component 17 as shown by a dashed line in the figure, the peeling of the release paper 8 is completed. The release paper 8 thus peeled off is taken up by the take-up reel (not shown) together with the release tape 18, and the TAB component 17 for peeling the release paper 8 next has the above release tape. -The new adhesive surface of the boop 18 will be opposed.

On the other hand, TAB after the release paper is peeled off
The part is a part of the first or second liquid crystal glass substrate 6a, 6b shown with reference to FIG. 8 showing the part where the outer lead is provided (the part where the anisotropic conductive film piece 7 is adhered). The wiring terminals led to the edges are made to face each other, and these are heated by a bonding tool (not shown) and pressed in the directions facing each other.

As a result, the epoxy resin forming the anisotropic conductive film piece 7 is softened, and the conductive particles mixed in the epoxy resin are brought into contact with each other, so that the outer leads 13b and the liquid crystal which face each other are opposed to each other. Glass substrates 6a, 6
The wiring terminals of b are joined electrically and mechanically.

In this way, the TAB components 17 are continuously manufactured, and these TAB components 17 are sequentially mounted on the X and Y sides of the first and second liquid crystal glass substrates 6a and 6b. . With this, the liquid crystal panel is completed.

According to this structure, the following effects can be obtained. As described above, both ends of the anisotropic conductive film piece 7 are adhered and held by the dummy pad 14 provided on the base film. Therefore, even when the release paper 8 starts to be peeled from one end of the anisotropic conductive film, the one end does not move upward together with the release paper 8.

Therefore, the release paper 8 can be favorably peeled off from the anisotropic conductive film piece 7, and the anisotropic conductive film piece 7 itself is peeled from the TAB part 17 or displaced. This TA which is a post process without
There is an effect that the B component 17 can be mounted well.

Further, according to this structure, the release paper 8 can be peeled off with high reliability, so that the operation rate of the device is not lowered even when the release paper 8 is peeled off by an automatic device. Therefore, there is an effect that the productivity of the liquid crystal panel can be improved.

Next, a second embodiment of the present invention will be described. The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted. Second of this invention
On the film carrier 10 'of this embodiment, the outer leads 13b, which are located on the outermost side of the plurality of outer leads 13b arranged side by side, are connected to the outer leads 13b.
Two dummy leads 19 extending toward the outside of the
19 (pads) are formed. The two dummy leads 19 and 19 are provided in parallel with each other with a distance corresponding to the width of the anisotropic conductive film piece 7 from each other.

The anisotropic conductive film piece 7 is made up of the dummy reel.
The outer leads 13b and the dummy leads 19 are formed to have a length that reaches the tips of the leads 19, 19.
It is affixed on 19. Then, the release paper 8 is peeled off from the anisotropic conductive film piece 7 by the same method as in the first embodiment.

With this structure, both ends of the anisotropic conductive film piece 7 are adhered and held by the dummy leads 19 and 19 as in the first embodiment. Therefore, the release paper 8 can be satisfactorily peeled off without moving upward together with the release paper 8 and has substantially the same effect as that of the first embodiment.

Next, a third embodiment will be described. The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted. The outer lead 13 provided on the film carrier 10 'of the third embodiment.
The outer lead 13b located at the outermost side of b is formed so that its width is wide in the outer direction of the outer lead, and serves as a pad portion 13c as a pad of the present invention.

Then, the anisotropic conductive film piece 7 attached to the film carrier 10 'is the outer lead 13b.
Is formed so as to extend over the pad portion 13c provided on the outer lead 13b and is attached to the outer leads 13b.

When the release paper 8 is peeled from the anisotropic conductive film piece 7, the anisotropic conductive film piece 7 is sequentially removed from one end side by the same method as in the first embodiment. Try to peel it off.

With this structure, one end of the anisotropic conductive film piece 7 is attached and held by the pad portion 13c provided on the outer lead 13b, so that the release paper 8 and the release paper 8 are joined together. It does not move upward, and can be favorably peeled from this anisotropic conductive film piece 7. Therefore, it is possible to obtain substantially the same effect as that of the first embodiment.

The present invention is not limited to the above-mentioned first to third embodiments, but can be variously modified without changing the gist of the invention. For example, in the above-mentioned first to third embodiments, the plurality of outer leads 13 arranged in parallel are arranged.
Outermost two outer leads 13 of a
b and 13b are provided on the outside of the dummy pad 14, respectively.
Although the lead 19 and the pad portion 13b are provided, the present invention is not limited to this. One outer lead 13b corresponding to one end portion of the anisotropic conductive film piece 7 for starting to release the release paper 8 is provided. It may be provided only outside the.

With this structure, the release paper 8 is also
Can be peeled off satisfactorily, and the same effects as those of the first to third embodiments can be obtained. Further, in the above-described embodiment, the electronic component to which the anisotropic conductive film piece 7 is attached is a TAB component 17 as a liquid crystal driving IC.
However, the present invention is not limited to this, and other electronic components may be used.

The mechanism for peeling off the release paper 8 is not limited to the mechanism using the peeling tape 18 as shown in the first embodiment, but may be another mechanism. good.

Further, in the above-described embodiment, the anisotropic conductive film piece 7 is manufactured by cutting the release paper 8 together with the anisotropic conductive film to a predetermined length, but the invention is not limited to this. Alternatively, the anisotropic conductive film piece 7 may be manufactured by cutting only the anisotropic conductive film while leaving the release paper 8.

In this way, the peeling tape 18 is formed.
Even without using, the release paper 8 itself can be peeled off from the anisotropic conductive film 7 by pulling the release paper 8 itself upward.

Furthermore, in the first to third embodiments, the anisotropic conductive film piece 7 is attached only to the outer lead 13b on the output side, but the present invention is not limited to this. Alternatively, it may be attached to the outer lead 13b on the input side. The outer lead 13b on the input side of the TAB component may be used to connect to a circuit pattern formed on a printed board (not shown).

[0066]

As described above, according to the first structure of the present invention, a base, a plurality of leads arranged in parallel on the base at a predetermined pitch, and the above-mentioned base are also provided. -An electronic component provided with a pad formed on the outer side of the lead located on the outermost side of the plurality of leads arranged side by side.

The second structure is the electronic component of the first structure, in which the pad is formed with a predetermined distance from the outermost lead. A third configuration is the electronic component of the first configuration, wherein the pad is
The electronic component is formed integrally with the outermost lead.

According to a fourth structure, in the electronic component of the first structure, an adhesive tape piece is attached to the lead and the pad, at least one end of which is attached to the pad. Is.

In a fifth configuration, in the electronic component of the fourth configuration, release paper is attached to the surface of the adhesive tape piece opposite to the surface attached to the leads and pads. It is characterized by that.

The sixth structure is the release paper peeling method for peeling the release paper of the adhesive tape pieces adhered to a plurality of leads juxtaposed to the base of the electronic component. Release paper
The adhesive tape piece is peeled off from one end portion attached to a pad formed on the outer side of the outermost lead among the plurality of leads.

In a seventh structure, a base film, an element mounting position formed on the base film, and one end of the base film are juxtaposed on the base film so as to project to the element mounting position. And a pad formed on the outer side of the outermost lead of the plurality of leads.

According to this structure, the release paper can be satisfactorily peeled off from the anisotropic conductive piece attached to the lead, so that the electronic component can be mounted well and the product It has the effect of improving productivity.

[Brief description of drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention.

FIG. 2A is a partial plan view showing an operation of enlarging and showing a main part, and FIG. 2B is a vertical sectional view thereof.

FIG. 3 is a longitudinal sectional view showing a release paper peeling step.

FIG. 4 is a plan view showing a second embodiment of the present invention.

FIG. 5 is a partial plan view showing a main part in an enlarged manner and a vertical sectional view thereof.

FIG. 6 is a plan view showing a third embodiment of the present invention.

FIG. 7 is a partial plan view and a vertical cross-sectional view showing an enlarged main part of the same.

FIG. 8 is a perspective view showing a general liquid crystal panel.

FIG. 9 is a perspective view showing a general TAB component.

FIG. 10 is a vertical cross-sectional view showing a conventional example.

FIG. 11 is a vertical cross-sectional view showing the step of peeling the release paper.

[Explanation of symbols]

7 ... Anisotropic conductive film piece (adhesive tape piece), 8 ... Release paper,
10 ... Film carrier (electronic component), 11 ... Base film (base), 12 ... Device hole (element mounting position), 13 ... Lead, 13b ... Outer lead (Lead)
Pad), 14 ... Pad (dummy pad), 17 ... TAB component (electronic component), 19 ... Dummy lead (pad), 13
c ... Pad part (pad).

Claims (7)

[Claims] 1. A base and a plurality of reels arranged in parallel on the base at a predetermined pitch.
And a pad formed on the outer side of the outermost lead among the plurality of leads arranged in parallel, which are also provided on the base. Electronic components to do. 2. The electronic component according to claim 1, wherein the pad is formed with a predetermined distance from the outermost lead. 3. The electronic component according to claim 1, wherein the pad is formed integrally with the outermost lead. 4. The electronic component according to claim 1, wherein an adhesive tape piece having at least one end attached to the pad is attached to the lead and the pad. Electronic components. 5. The electronic component according to claim 4, wherein a release paper is attached to the surface of the adhesive tape piece opposite to the surface attached to the lead and the pad. Characteristic electronic parts. 6. A release paper peeling method for peeling a release paper of adhesive tape pieces adhered to a plurality of leads juxtaposed to a base of an electronic component, wherein the release paper is The plurality of reels of the adhesive tape piece
A release paper peeling method, characterized in that the release paper is peeled off from one end portion attached to a pad formed on the outer side of the outermost lead. 7. A base film, an element mounting position formed on the base film, and the base so that one end of the base film is projected to the element mounting position.
A plurality of leads juxtaposed on the film, and a pad formed on the outer side of the outermost lead among the other ends of the plurality of leads led out in parallel; A film carrier comprising: