JPH0715032A - Opto-semiconductor module mounting structure - Google Patents

Abstract

(57) [Abstract] [Purpose] Regarding a mounting structure of a semiconductor module in which an optical semiconductor element and an optical fiber are optically coupled, miniaturization of an optical device is promoted, and attachment work and shield work are easy and low cost. The purpose is to [Structure] A stem 4 of an optical semiconductor module 30 in which an optical semiconductor element and an optical fiber 8 are optically coupled to each other in the shape of a box made of a metal plate which has a pair of left and right side plates 42 and a ceiling plate 41 and whose lower and front surfaces are opened. To the mounting portion 40 integrally fixed to the printed wiring board, a printed wiring board provided with a drive circuit or an amplifier circuit, a case for housing the printed wiring board 20, and the mounting portion 40 to be inserted and fixed in a hole of the printed wiring board. A plurality of pins 45 protruding from the lower end surface of the side plate 42 are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor module mounting structure in which an optical semiconductor element and an optical fiber are optically coupled.

[0002]

2. Description of the Related Art FIG. 5 is a sectional view of a conventional optical semiconductor module, FIG. 6 is a view showing a mounting structure of a conventional example, (A) is a partially cutaway plan view, and (B) is a partially broken side view. is there.

In the figure, 1 is an optical semiconductor element such as a semiconductor laser or a light receiving element, and 8 is an optical fiber optically coupled with the optical semiconductor element 1. Reference numeral 10 denotes an optical semiconductor module in which the optical semiconductor element 1 and the optical fiber 8 are optically coupled.

More specifically, the optical semiconductor module 10 is assembled so that the optical semiconductor assembly, the lens assembly and the optical fiber assembly are optically coupled, and is integrally fixed.

The optical semiconductor assembly is a stem member in which a substantially rectangular plate-shaped flange portion 5 is provided on the outer peripheral portion of a substantially disk-shaped stem 4 made of a metal material such as Fe-Ni-Co alloy (trade name: Kovar). The carrier 2 is fixed to the end surface of the stem 4, and the optical semiconductor element 1 is mounted on the carrier 2 by soldering.

Then, the lead 3 is hermetically sealed to penetrate the stem 4, and the lead 3 of the optical semiconductor element 1 is led out from the end face opposite to the optical fiber 8. The lens assembly includes a bottomed cylindrical lens holder 7 and a lens 6 inserted into a shaft center hole of a bottom end surface of the lens holder 7.

Numeral 9 is a cylindrical ferrule in which the end of the optical fiber 8 is inserted into the pore of the axial center and the outer periphery of the optical fiber 8 is fixed to the inner wall of the pore with an adhesive. 9A is
It is a cylindrical ferrule holder 9A having a flange with an outer diameter equal to the outer diameter dimension of the lens holder 7. An optical fiber assembly is constructed by inserting the ferrule 9 into the hollow hole of the ferrule holder 9A.

The optical fiber assembly protects the lead-out portion of the optical fiber 8 by covering the ferrule holder 9A with a rubber bush on the side opposite to the flange. The optical semiconductor module 10 described above is integrated by fixing the lens assembly to the optical semiconductor assembly and then fixing the optical fiber assembly to the lens assembly.

More specifically, the opening side of the lens holder 7 is inserted into the outer circumference of the circular projecting plate portion of the stem 4 so that the lens holder 7 is inserted.
The optical axis of the optical semiconductor element 1 and the optical axis of the lens 6 are made to coincide with each other by soldering the end face of the to the stem 4.

The lens 6 is moved and adjusted in the optical axis direction within the axial center hole of the lens holder 7 so that the optical coupling between the optical semiconductor element 1 and the lens 6 is maximized. Further, the end surface of the ferrule holder 9A and the end surface of the lens holder 7 on the lens 6 side are fixed by soldering.

In FIG. 6, reference numeral 20 denotes a drive circuit (in the case where the optical semiconductor element 1 is a semiconductor laser) mounting desired components.
Alternatively, it is a printed wiring board provided with an amplifier circuit (when the optical semiconductor element 1 is a light receiving element).

Reference numeral 21 is a shallow box-shaped case made of a metal material with an open upper part, and is a case in which the optical semiconductor module 10 is mounted on the side wall 21A thereof and the printed wiring board 20 is horizontally accommodated and held therein.

An input / output terminal 24 is provided which penetrates (insulates) the bottom plate of the case 21, and the upper end portion of the input / output terminal 24 is provided on the printed wiring board 20.
It is inserted into the through hole and soldered. On the other hand, in the optical semiconductor module 10, the flange portion 5 is provided on the side wall 21A of the case.
It is brought into contact with the outer side surface of and is fixed to the case 21 using screws.

Each lead 3 of the optical semiconductor module 10 is soldered and connected to a corresponding pad provided on the surface of the printed wiring board 20. Note that the case 21 has its opening closed with a lid after the optical semiconductor module 10 and the printed wiring board 20 are assembled.

The case 21 incorporating the optical semiconductor module 10 and the printed wiring board 20 in this manner is a mother board 25.
Are mounted on the motherboard 25 by inserting and soldering the lower ends of the respective input / output terminals 24 into the corresponding through holes of the motherboard 25.

When the optical semiconductor element is a light receiving element,
Printed wiring board from lead 3 of optical semiconductor module
By attaching the shield cover 29 to the inside of the case 21 up to the preamplifier part mounted on 20, the minute current flowing through the leads and the like is shielded.

[0017]

By the way, the conventional optical semiconductor module provided with the stem member in which the flange portion which is long in the left-right direction and the disc-shaped stem are integrated as described above has a flange portion and a case side wall. The optical semiconductor module is fixed to the case by screwing and.

Due to the attachment of the stem member, a case much larger than the printed wiring board is required, and there is a problem that it hinders downsizing of the optical device. Also,
After mounting the optical semiconductor module on the case, the leads are drawn around the upper surface of the printed wiring board housed and fixed in the case and soldered to the pads on the upper surface of the printed wiring board. Therefore, it is necessary to increase the distance B between the case side wall and the front edge of the printed wiring board, which is also an obstacle to downsizing of the optical device.

Further, there is a problem that it is difficult to attach the shield cover. The present invention has been made in view of the above circumstances, and an object thereof is to provide a mounting structure of an optical semiconductor module, which promotes miniaturization of an optical device, facilitates attachment work and shield work, and is low cost. I am trying.

[0020]

In order to achieve the above object, the present invention provides a pair of left and right side plates as illustrated in FIG.
A box-shaped box made of a metal plate having a bottom plate 42 and a ceiling plate 41 and opening at the lower and front sides, which is integrally fixed to a stem 4 of an optical semiconductor module 30 in which an optical semiconductor element and an optical fiber 8 are optically coupled. Attachment part 40, a printed wiring board provided with a drive circuit or an amplification circuit, a case for accommodating printed wiring board 20, and a lower end surface of side plate 42 of attachment part 40 for insertion and fixation in a hole of the printed wiring board. The plurality of pins 45 provided are provided.

Further, as illustrated in FIG. 3, the light emitting element and the optical fiber 8 are optically coupled, and the optical semiconductor module 30-1 having the stem 4A on the end face, the light receiving element and the other optical fiber 8 are optical. It is connected and has a stem 4B on its end face, and has another optical semiconductor module 30-2 mounted in parallel with the optical semiconductor module 30-1, and a pair of left and right side plates 42A, a partition plate 42B and a ceiling plate 41A. A box-shaped box made of a metal plate with an open bottom and front, and an attachment part 40A integrally fixed by connecting the stems 4A and 4B, a printed wiring board provided with a drive circuit and an amplifier circuit, and a printed wiring. A case to house the board,
Side plate of attachment section 40A to be inserted and fixed in the hole of the printed wiring board
A plurality of pins 45A protruding from the lower end surface of 42A are provided.

Alternatively, as illustrated in FIG. 4, the optical semiconductor element and the optical fiber 8 are in the form of a box made of a metal plate having a pair of left and right side plates 52 and a ceiling plate 51, the lower and front faces of which are open.
Stem 4 of optical semiconductor module 30 in which and are optically coupled
The mounting portion 50 integrally fixed to the optical fiber module and the desired circuit are formed and closely attached to the lower surface of the ceiling plate 51.
Small printed wiring board 60 connected to 30 leads 3
And an input / output terminal 61 attached to a small printed wiring board 60 to insert and connect the tip part to the through hole of the printed wiring board 20.
And a plurality of pins 56 projecting from the lower end surface of the side plate 52 of the attachment portion 50 so as to be inserted and fixed in the holes of the printed wiring board 20.

[0023]

The attachment portion according to the present invention can easily be formed in a box shape slightly larger than the outer dimension of the stem. Therefore, the width of the case can be made smaller than that of the conventional one including the stem member including the stem and the flange portions protruding to the left and right of the stem. That is, the optical device becomes smaller.

After the leads of the optical semiconductor module are connected to the pads of the printed wiring board and the pins of the attachment portion are inserted into the holes of the printed wiring board and soldered, the optical semiconductor module and the printed wiring board are fixed together. Since the printed wiring board can be housed in the case, it is easy to reduce the distance between the front edge of the printed wiring board and the stem, and the optical device can be downsized also in this respect.

When the optical semiconductor element is a light receiving element,
By attaching a flat shield cover to the opening on the front of the attachment part, you can shield from the lead part of the optical semiconductor module to the preamplifier part mounted on the printed wiring board with a simple structure. Can be shielded at low cost.

On the other hand, according to the second aspect of the present invention, the light emitting side optical semiconductor module and the light receiving side optical semiconductor module are closely fixed to each other by the attaching portion which connects the respective stems and integrally fixes them. ing.

Therefore, the size of the case is promoted by applying it to the optical device for transmission and reception. According to the invention of claim 3, a small printed wiring board in which a preamplifier portion and the like are formed,
The input / output terminals are directly connected to the through holes of the printed wiring board by closely adhering to the lower surface of the ceiling plate of the attachment part.

Therefore, the shield of the preamplifier section and the like is strengthened.

[0029]

The present invention will be described in detail with reference to the drawings. The same reference numerals denote the same objects throughout the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a side view showing the mounting structure of the present invention, FIG. 3 is a view of another embodiment of the present invention, (A) is a plan view, 4B is a side view, FIG. 4 is a view of still another embodiment of the present invention, FIG. 4A is a perspective view, and FIG. 4B is a side view showing a mounting structure.

In FIGS. 1 and 2, reference numeral 30 denotes an optical semiconductor module in which an optical semiconductor element (light emitting element or light receiving element) and an optical fiber 8 are optically coupled via a lens. In the optical semiconductor module 30, the optical fiber 8 is drawn out from one tapered end face of the package, the substantially disk-shaped stem 4 is attached to the other end face, and the carrier is attached to the inside of this stem 4. The optical semiconductor element is mounted by, for example, soldering the optical semiconductor element to the carrier.

The leads 3 of the optical semiconductor element are led out to the outside of the optical semiconductor module 30 by penetrating the stem 4 by hermetically sealing the leads 3. Reference numeral 40 is a box-shaped attachment part which has a pair of left and right side plates 42 and a ceiling plate 41 and is made of a metal plate whose lower and front surfaces are opened.

The stem 4 of the optical semiconductor module 30 is fitted into the hole on the rear face plate 43 side of the mounting portion 40, and the optical semiconductor module 30 and the mounting portion 40 are integrally fixed by laser welding or the like. There is.

A plurality of reference numerals 45 are provided vertically downward from the lower end surface of each side plate 42 (in each figure, two side plates are provided.
This is a pin that is provided so as to project. This pin 45 is designed so that its tip end is inserted into a hole of the printed wiring board 20 provided with a drive circuit, an amplifier circuit or the like and soldered.

Reference numeral 46 denotes a motherboard pin which is provided vertically downward from the lower end surface of the rear surface plate 43 of the mounting portion 40 and is provided with a plurality of protrusions. The motherboard pins 46 are inserted into the holes of the motherboard 25 and soldered.

Reference numeral 70 is a case composed of a bottom plate 71 and a shallow box-shaped cover 72 that is attached to the bottom plate 71 and has a downward opening. The side wall 73 of the cover 72 is provided with a notch having an opening in the lower side, which is slightly larger than the outer diameter of the stem 4.

To mount the optical semiconductor module 30 as described above on the mother board 25, first, the leads 3 and the pads provided on the back surface and the mounting surface of the printed wiring board 20 are connected by soldering, and then the mounting portion 40. The lower end surface of the side plate 42 of the above is brought into contact with the mounting surface of the printed wiring board 20, the pin 45 is inserted into the corresponding hole of the printed wiring board 20, and the optical semiconductor module 30 and the printed wiring board 20 are fixed by soldering. To do.

Next, the printed wiring board 20 is attached to the bottom plate of the case 70.
Stick to 71. At this time, the input / output terminals that penetrate the bottom plate 71 through insulation
The upper tip of 24 is inserted into the through hole of the printed wiring board 20 and soldered.

After that, the inner surface of the side wall 73 of the cover 72 is brought into close contact with the outer surface of the rear plate 43 of the attachment portion 40, and the cover 72 is fixed to the bottom plate.
The bottom plate 71 and the cover 72 are fixed to each other by being attached to 71. As a result, the attachment portion 40 is housed in the case 70, and the optical semiconductor module 30 is pulled out from the hole of the side wall 73 to the case.
Stick to 70.

Next, the case 70 is placed on the motherboard 25, and the lower end portions of the input / output terminals 24 are attached to the motherboard.
Insert it into the corresponding through hole of 25 and solder it, and attach the pin 46 for motherboard of the attachment part 40 to the motherboard 25.
Insert into the hole and solder.

When the preamplifier section is shielded, the optical semiconductor module 30 and the printed wiring board 20 are fixed to each other, and then the flat shield plate 29A is applied to the front side of the attaching section 40 by soldering or the like. , Shield plate 29A and ceiling plate 41
To fix and.

As described above, since the attachment portion 40 has a box shape slightly larger than the outer dimensions of the stem 4, the width of the case 70 can be reduced. In addition, before fixing to the case 70, the leads 3 of the optical semiconductor module 30 are connected to the printed wiring board.
Since it can be connected to 20, the connection work is easy, and the distance between the front edge of the printed wiring board 20 and the stem 4 can be reduced.

On the other hand, by inserting and fixing the mother board pins 46 into the mother board 25, the case 70 is prevented from shaking and the input / output terminals 24 are not damaged.

In FIG. 3, reference numeral 30-1 denotes an optical semiconductor module in which a light emitting element and an optical fiber 8 are optically coupled to each other, and the optical semiconductor module 30-1 has a circular end surface opposite to the optical fiber 8. It has a plate-shaped stem 4A.

The lead 3A is hermetically sealed, penetrates the stem 4A, and is led to the outside of the optical semiconductor module 30-1. Reference numeral 30-2 is an optical semiconductor module in which the light receiving element and the optical fiber 8 are optically coupled, and has a disc-shaped stem 4B on the end surface of the optical semiconductor module 30-2 opposite to the optical fiber 8. .

The lead 3B is hermetically sealed and extends through the stem 4B to the outside of the optical semiconductor module 30-2. 40A is a metal plate having a pair of left and right side plates 42A, a partition plate 42B that divides a space formed by the pair of side plates 42A into approximately two equal parts, a ceiling plate 41A and a rear plate, and a lower and front open plate. It is a box-shaped attachment part.

On the rear face plate side of this attachment portion 40A, holes for inserting the stem 4A and the stem 4B are provided. 45A
Are pins provided vertically (downwardly, two on each side plate) protruding downward from the lower end surface of each side plate 42A. The pin 45A is designed to be inserted into the hole of a printed wiring board described later and soldered at its tip.

Reference numeral 46A is a motherboard pin provided vertically downwardly from the lower end surface of the rear plate of the attachment portion 40A. This mother board pin 46A is inserted into the hole of the mother board and soldered, and the stem 4A of the optical semiconductor module 30-1 is inserted into one hole of the attachment part 40A and laser welded to form an optical semiconductor. Module 30-1
And the attachment portion 40A are integrally fixed.

Further, the stem 4B of the other optical semiconductor module 30-2 is inserted into the other hole and laser-welded, etc., so that the optical semiconductor module 30-2 is converted into the optical semiconductor module 30-1.
Is fixed to the mounting portion 40A integrally and in parallel with and close to.

A printed wiring board (not shown) similar to the printed wiring board 20 of FIG. 2 provided with a drive circuit and an amplifier circuit is provided. Although not shown in the figure, it has a case similar to the case 70 of FIG. 2, which includes a bottom plate and a shallow box-shaped cover that is attached to the bottom plate and has an opening at the bottom.

Optical semiconductor module 30-1, 30-as described above
Connecting 2 to the printed wiring board, housing and fixing the printed wiring board in the case, and mounting the printed wiring board on the motherboard is almost the same as described in FIG.

The mounting structure of the optical semiconductor module described above is
The present invention has an effect of being applied to an optical device for transmission / reception to promote miniaturization of the case. In FIG. 4, reference numeral 50 denotes a box-shaped attachment part made of a metal plate having a pair of left and right side plates 52, a ceiling plate 51, and a rear face plate, the lower and front faces of which are open.

Holes for fitting the stems 4 are provided on the rear plate side of the mounting portion 50 so that the optical semiconductor module 30 and the mounting portion 50 are integrally fixed. Mounting part 50
The lower end surface of the side plate 52 is brought into contact with the mounting surface of the printed wiring board 20.

Further, there is provided a pin 56 protruding vertically downward from the lower end surface of the side plate 52 of the attachment portion 50 and inserted into a hole of the printed wiring board for soldering. Further, on the lower end surface of the rear plate of the attachment part 50, there is provided a motherboard pin 46 which vertically protrudes downward and is inserted into a hole of the motherboard 25 and soldered.

Reference numeral 60 is a small printed wiring board on which a desired circuit (for example, a circuit such as a preamplifier section) is formed. The small printed wiring board 60 is in close contact with the lower surface of the ceiling plate 51 of the mounting portion 50 and fixed to the mounting portion 50, and the leads 3 of the semiconductor module 30 are connected to the small printed wiring board 60.

Further, the small printed wiring board 60 is provided with input / output terminals 61 for inserting and connecting the front end portions thereof into the through holes of the printed wiring board 20. Attaching part 50 to printed wiring board
Placed on the mounting surface of 20 and inserting each input / output terminal 61 into the corresponding through hole of the printed wiring board 20 and soldering it, and inserting each pin 56 into the corresponding hole of the printed wiring board 20. Soldering.

A flat shield plate 59 is fixed to the front opening of the mounting portion 50 to shield the small printed wiring board 60 and the like.

[0058]

As described above, according to the present invention, the case for accommodating the printed wiring board can be reduced to a small shape substantially equal to the plan view shape of the printed wiring board having the preamplifier section, the amplification circuit or the drive circuit. This has the effect of promoting miniaturization of the optical device.

Further, the connection work between the optical semiconductor module and the printed wiring board becomes easy. Furthermore, when the optical semiconductor element is a light receiving element, there is an effect that the preamplifier section and the like can be shielded easily and at low cost.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention.

FIG. 2 is a side view showing a mounting structure of the present invention.

FIG. 3 is a view of another embodiment of the present invention (A) is a plan view (B) is a side view

FIG. 4 is a perspective view of a further embodiment of the present invention, and FIG. 4B is a side view showing a mounting structure.

FIG. 5 is a sectional view of a conventional optical semiconductor module.

FIG. 6 is a view showing a mounting structure of a conventional example, (A) is a partially cutaway plan view, and (B) is a partially cutaway side view.

[Explanation of symbols]

1 Optical semiconductor element 2 Carrier 3 Lead 4 Stem 5 Flange part 6 Lens 7 Lens holder 8 Optical fiber 20 Printed wiring board 21 Case 24 Input / output terminal 25 Motherboard 29 Shield cover 40,40A, 50
Mounting part 41,41A, 51 Ceiling plate 42,42A, 52
Side plate 42B Partition plate 43 Rear plate 45,45A Pin 46,46A Motherboard pin 29A, 59 Shield plate 56 Pin 60 Small printed wiring board 61 I / O terminal 70 Case 71 Bottom plate 72 Cover 73 Side wall 10,30,30-1,30 -2 Opto-semiconductor module

Claims (3)

[Claims] 1. A box-shaped box made of a metal plate having a pair of left and right side plates (42) and a ceiling plate (41) with openings at the lower and front sides, in which an optical semiconductor element and an optical fiber (8) are optically coupled. A mounting part (40) integrally fixed to the stem (4) of the optical semiconductor module (30), a printed wiring board provided with a drive circuit or an amplification circuit, a case for accommodating the printed wiring board, The attachment part (40) is inserted and fixed in the hole of the printed wiring board.
And a plurality of pins (45) protruding from the lower end surface of the side plate (42) of the optical semiconductor module mounting structure. 2. An optical semiconductor module (30- comprising a light emitting element and an optical fiber (8) optically coupled to each other and having a stem (4A) at an end face.
1), a light receiving element and another optical fiber (8) are optically coupled to each other and have a stem (4B) at the end face, and another optical semiconductor mounted in parallel with the optical semiconductor module (30-1) Module (30-2), pair of left and right side plates (42A), partition plate (42B) and ceiling plate (41A)
A box shape made of a metal plate having an opening on the lower side and the front side,
An attachment portion (40A) integrally connecting and fixing each of the stems (4A, 4B), a printed wiring board provided with a drive circuit and an amplifier circuit, a case for accommodating the printed wiring board, In order to insert and fix it in the hole of the printed wiring board,
Pins (45A) protruding from the lower end of the side plate (42A) of (A)
A mounting structure for an optical semiconductor module, comprising: 3. A box shape comprising a metal plate having a pair of left and right side plates (52) and a ceiling plate (51) with openings at the lower and front sides, wherein an optical semiconductor element and an optical fiber (8) are optically coupled. The optical semiconductor module (30) comprises a mounting portion (50) integrally fixed to the stem (4) of the optical semiconductor module (30), and a desired circuit formed on the ceiling plate (51). A small printed wiring board (60) connected to the leads (3) of the (30) and a small printed wiring board (60) for inserting and connecting the tip part to the through hole of the printed wiring board (20). Input / output terminals
(61) and the attachment part for insertion and fixation in the hole of the printed wiring board (20).
A mounting structure of an optical semiconductor module, comprising: a plurality of pins (56) projecting from a lower end surface of a side plate (52) of the (50).