JPH07125198A - Inkjet recording head - Google Patents

Abstract

(57) [Summary] (Correction) [Purpose] Inkjet recording head with smooth ink flow. [Structure] When anisotropically etching a silicon single crystal substrate having a crystal orientation, through holes 5 and 6 for forming a pressure generating chamber and a reservoir are formed with one wall surface 5a and 6a on the same surface. Also, the through holes 5 and 6 that form the pressure generating chambers.
The wall surface in the vicinity of the nozzle opening 2 that defines the wall is formed by wall surfaces 5a, 5b, 5f, 5g, and 5h that are in contact with each other at an obtuse angle. As a result, the ink supply port 7, which is a bottleneck to the ink flow, and the pressure generating chamber are configured as a smooth flow path, and the wall surface near the nozzle opening 2 where ink is likely to stay is as close as possible to the nozzle opening 2. Are equidistant to.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention more specifically relates to an ink jet type recording head, in which a vibrating plate elastically deformed by expansion and contraction of a piezoelectric vibrator and a nozzle plate having nozzle openings for ejecting ink droplets are fixed. The present invention relates to an ink jet recording head in which a pressure generating chamber, a reservoir, and a spacer for forming an ink supply port for communicating these with each other are formed of a silicon single crystal substrate.

[0002]

2. Description of the Related Art Ink jet recording heads can print efficiently at a very high resolution by reducing the size of the ink droplets because the dots on the recording medium are composed of ink droplets. Therefore, it is necessary to increase the number of nozzle openings.In particular, in the case where the piezoelectric vibrator is used as an ink droplet ejection source, the pressure generation chamber should be expanded to use the energy of the piezoelectric vibrator efficiently. It is necessary to increase the size, which conflicts with the demand for miniaturization. In order to eliminate such contradictory problems, it is usually possible to make the walls that partition the adjacent pressure chambers as thin as possible and to increase the shape of the pressure generation chambers in the longitudinal direction to increase the volume. It is being appreciated.

Such pressure generating chambers and reservoirs are formed by forming through holes in spacers, which are members that maintain the distance between the vibrating plate and the nozzle plate at a predetermined value. Etching techniques are commonly used because of the need to form through holes that match the pressure generating chambers with small yet complex shapes. A photosensitive resin film is usually used as a material for forming such a spacer, but since it has low mechanical strength, crosstalk, bending, etc. occur, and print quality is reduced when trying to realize high resolution. There is a problem of decrease.

In order to solve such a problem, a silicon single crystal substrate having a crystal orientation (110) is cut into a thickness suitable for a spacer, and this is changed into a shape necessary for forming a pressure generating chamber or a reservoir. Performing isotropic etching is proposed in US Pat. No. 4312008. Since spacers made of such single crystal silicon have high mechanical synthesis, the deflection of the entire recording head due to deformation of the piezoelectric vibrator can be minimized, and the etched wall surface Since it is almost perpendicular to, it has a great advantage that the pressure generating chamber can be uniformly configured. However, since the etching depends on the crystal orientation, it is difficult to process it into an ideal shape as a pressure generating chamber of the ink jet recording head, and there is a disadvantage that the stagnation of ink and the stagnation of bubbles are easily caused in the pressure generating chamber. ing.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to process a silicon single crystal substrate having a smooth ink flow by anisotropic etching. Another object of the present invention is to provide an ink jet recording head including a pressure generating chamber, an ink supply port, and a reservoir.

[0006]

In order to solve such a problem, in the present invention, a nozzle plate in which nozzle openings are formed in rows, a pressure generating chamber, an ink supply port, and a reservoir are formed. A spacer having a through hole, a diaphragm that receives vibration of the piezoelectric vibrator, and a piezoelectric vibrator that expands and contracts in accordance with print data are provided, and the spacer is a silicon single crystal anisotropic etching having a crystal orientation (110). And the end portion near the nozzle opening of the through hole that forms the pressure generating chamber is formed by five wall surfaces that are in contact with each other at an obtuse angle.

[0007]

Since the vicinity of the nozzle opening where ink easily stagnates is formed by five wall surfaces that are in contact with each other at an obtuse angle, the shape becomes smooth, the flow of ink can be made smooth, and stagnant air bubbles near the nozzle opening can be prevented. it can.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the illustrated embodiments. FIG. 1 shows an embodiment of the present invention, in which reference numeral 1 is a nozzle plate having a predetermined pitch,
For example, the nozzle openings 2.2 and 2 are set to 180 DPI.
.. are formed to form opening rows 3, 3, ....

Numeral 4 is a spacer which is sandwiched between a vibrating plate 10 and a nozzle plate 1 which will be described later. As shown in FIG. , 5, 6, 5, 6, 7, 6, 7, 7, 7, 7, ..., 8, through holes for forming ink supply ports, flow paths for distributing ink from the ink tank to each reservoir, and the like.
8 are formed.

Reference numeral 10 denotes a vibrating plate, which forms a pressure generating chamber facing the nozzle plate 1 through a spacer 4.
As shown in FIG. 3, the piezoelectric vibrator unit 2 described later
1, 21, 21 ... Abutting against the tips of the piezoelectric vibrators 30 and 30, the island portion 11 having rigidity so as to transmit the displacement of the piezoelectric vibrators 30 and 30 to the largest possible area and the peripheral area thereof. The thin portion 12 is formed. With such a configuration, the piezoelectric vibrators 30, 30 ...
In response to the expansion and contraction of 0 and 30, the pressure generating chamber can be efficiently reduced and expanded.

These piezoelectric vibrator units 21, 21, 2
1, ... Are piezoelectric vibrators 30, 30, as shown in FIG.
One half of 30 is fixed to a fixed substrate 31 at a constant pitch, and the other half is arranged so that vibration in a longitudinal vibration mode is possible. As shown in FIG. 5, each vibrator 30 is formed by alternately stacking piezoelectric vibration material 32, drive electrodes 33, and common electrode 34 in a sandwich shape. And drive electrode 3
3, 33, 33, ... Are exposed from the end face on the rear end side of the piezoelectric vibrator 30 and are connected in parallel by a driving external electrode 35 formed by vapor deposition or the like, and are also common electrodes 34, 34 ,.
34 are exposed at the free end side of the piezoelectric vibrator 30 and are extended to the side, and are connected in parallel by a common external electrode 36.

The driving external electrode 35 of each piezoelectric vibrator 30 is
The end surfaces are positioned so as to be substantially flush with the fixed substrate 31, and the common external electrodes 36 of the piezoelectric vibrators 30, 30, 30 ...
Dummy oscillators 39 located on both sides of 0, 30, 30 ...
It is connected to the electrode 40 on the rear end face so as to have a conductive relationship. The drive external electrode 3 is formed on the rear end surface of the dummy oscillator 39.
The electrode 40 is configured in the same manner as 5 and can be connected to the connection circuit board.

Referring back to FIG. 1, reference numeral 42 is a base for accommodating the vibrator units 21, 21, 21 ... In such a manner that the free ends of the piezoelectric vibrators 30, 30, 30 ... Are exposed. , And the ink supply port 44 for supplying ink from the ink tank to the reservoir are provided, and the vibration plate 10, the spacer 4, and the nozzle plate 1 are positioned on the surface. It is fixed by a frame 45 that also functions as an electrostatic shield, and is assembled as a recording head main body. Reference numeral 46 in the figure denotes an ink inlet from the ink tank. As a result, as shown in FIG. 6, the openings of the through holes 5 and 5 of the spacer are closed by the nozzle plate 1 and the vibration plate 10 to form a pressure generating chamber. When the pressure generating chamber 48 contracts due to the deformation of the thin portion 12 of the vibration plate 10 that receives the expansion and contraction of the piezoelectric vibrator 30 by the island portion 11, the ink existing therein is compressed to form an ink droplet from the nozzle opening 2. Will fly.

FIG. 7 shows an enlarged view of the vicinity of the through holes 5, 5, 5, ... Forming the pressure generating chamber in one embodiment of the spacer 4 described above. A silicon single crystal substrate having a crystal orientation (110) of 220 μm is provided with a through hole 5 serving as a pressure generating chamber 48, a through hole 6 serving as a reservoir, and a through hole 7 serving as an ink supply port connecting these. .

The through hole 7 serving as an ink supply port is formed so that one of the wall surfaces 7a and 7b defining the through hole 7 is aligned with one wall 5a of the through hole 5 forming the pressure generating chamber, and the other wall surface. 7b are formed at intervals so that a flow path resistance suitable for the ink supply port can be realized. When the vibration plate 10 and the nozzle plate 1 are adhered to each other by an adhesive agent, the adhesive absorption recesses 50, 50, 50, ... It is formed by reactive etching. These recesses 50, 5
0, 50, ... Are sized so as to have a minimum depth with a volume that can accommodate the excess adhesive. If no adhesive is required as in eutectic bonding, these adhesive absorbing holes are not necessary.

FIG. 8 shows the angle formed by the through hole forming the pressure generating chamber and the wall surface forming the through hole forming the ink supply port. The through hole 5 forming the pressure generating chamber is shown in FIG. ,
In detail, it is composed of eight wall surfaces 5a to 5h, and the surfaces 5b, 5f, 5g, 5 which the nozzle openings 2 face each other.
h and 5a are in contact with each other at angles θ ₃ , θ ₄ , θ ₅ , and θ ₆ , respectively, and these angles θ ₃ , θ ₄ , θ ₅ , and θ ₆ are approximately 1 respectively.
The obtuse angles are 52 degrees, 154 degrees, 125 degrees, and 110 degrees. Further, wall surfaces 5c, 5d, 5e are formed on the side communicating with the through hole 7 serving as an ink supply port, and are formed so as to spread the ink supply port and the pressure generation chamber toward the pressure generation chamber side.

Further, one wall surface 7a of the through hole 7 forming the ink supply port is formed to be the same wall surface as the one wall surface 5a of the through hole 5 forming the pressure generating chamber, and the other wall surface 7b is formed. The ink supply ports are formed in parallel with the wall surface 7a with a space enough to provide a necessary and sufficient fluid resistance. The wall surface 7a extending straight from the pressure generating chamber to the ink supply port is connected to the wall surface 6a of the through hole 6 forming the reservoir and the expansion portion formed by the two surfaces 6b and 6c. The angle indicated by θ1 in the figure is around 30 degrees, and the angle indicated by θ2 is a value around 70 degrees.

FIG. 9 shows a wall surface 5g facing the nozzle opening 2.
And the angle θ with the surface, respectively.
7 = Slopes 5g ₁ and 5g ₂ forming about 35 degrees are formed. The slopes 5g ₁ and 5g ₂ make the flow in the vicinity of the nozzle opening 2 in the pressure generating chamber caused by the non-symmetrical shape caused by the anisotropic etching as uniform as possible, and prevent stagnation of bubbles and the like. Contribute to doing.

An adhesive is applied to the spacer 4 thus constructed, and the nozzle plate 1 and the vibration plate 10 are aligned and pressure-bonded. The excess adhesive due to this pressure bonding flows into the minute recesses 50, 50, 50, ... Formed so as to surround the pressure generating chamber, the ink supply port, and the through holes 5, 7, 6 serving as reservoirs. . Therefore, the volumes of the pressure generating chamber, the ink supply port, and the reservoir are prevented from changing due to the inflow of the adhesive. When the joining is completed, as shown in FIG. 7B, the nozzle opening 2 of the nozzle plate is provided in the vicinity of the tip of the center line of the through hole 5 forming the pressure generating chamber, and the vibrating plate 4 is extended so as to cover almost the entire area. The island part 11 will be located. In this state, the piezoelectric vibrator 3
When 0 is driven, the displacement extends through the island portion 11 to the entire pressure generating chamber, so that the displacement of the piezoelectric vibrator 30 can be converted into a volume change of the pressure generating chamber with high efficiency.

FIG. 10 shows a manufacturing process of the above-mentioned spacer. In the figure, reference numeral 60 is a silicon single crystal substrate having a crystal orientation (110) having a thickness necessary to function as a spacer, for example, 220 μm. The surface of the silicon dioxide film 6 having a thickness that can function as a protective film for anisotropic etching, for example, about 1 μm, is formed on the surface of the silicon dioxide film 6 by thermal oxidation.
1 is formed (FIG. 10A).

A hydrogen fluoride protective film having the above-mentioned through holes 5, 6, 7 on the front surface and the back surface of the substrate 60 on which the silicon dioxide film 61 is formed, and the windows 63, 64 corresponding to the recesses 50 if necessary. 62 is formed by photolithography (FIG. 10B). When etching is performed with hydrogen fluoride in this state, the silicon dioxide film 61 is removed in conformity with the through holes 5, 6, 7 and the windows 63, 64 in the regions where the recesses 50 are to be formed (FIG. 9C. )). The patterns 61a and 61b of the silicon dioxide film formed on the front surface and the back surface are formed.
Means that the pattern 61a on one surface is the pattern 6 on the other surface.
It is formed to have a slightly different size so as to surround 1b.

When the pattern formation of silicon dioxide is completed in this way, etching is performed using an aqueous solution of potassium hydroxide having a concentration of about 17% and kept at a constant temperature, for example, 80 ° C. Pattern 61
With a and 61b as protective films, only the windows 63 and 64 are
Etching proceeds at a speed of about 2 μm per minute from both surfaces to a surface of about 35 degrees with respect to the surface, that is, perpendicular to the crystal orientation (111) surface.

By the way, as described above, the patterns 61a and 61b formed on the front surface and the back surface of the substrate 60, respectively.
Since one of them is set to be large so as to surround the other, at the stage when etching is completed, the through hole 65 having a size corresponding to the pattern 61b having a large window size is formed.
Are formed (FIG. 10D). As a result, even if the front and back patterns are slightly misaligned, at least the edge of the pattern located on the outer side becomes the etching surface, so that the etching position can be managed.

That is, when the patterns 70 and 71 having the same size are formed on the front and back of the substrate 72 as shown in FIG. 11, if these patterns are deviated, the through holes to be formed in the patterns facing each other on the front and back. The wall surfaces 72a, 7 are aligned with the boundaries of the patterns 70a, 71a located outside 73.
Since 2b is formed, a through hole 73 having a size different from the size defined by the patterns 70 and 71 is formed, which makes it impossible to control the size of the through hole and the position of the etching surface. Become.

When the through hole 65 is formed in this way, the silicon dioxide films 61a and 61b used as masks are formed.
Are removed by hydrogen fluoride, and then thermal oxidation is performed again to form silicon dioxide 66 having a sufficient thickness as a protective film, for example, about 1 μm, on the exposed surface and the entire surface to form a protective film for the ink (FIG. 10 (e)). )).

By the way, such a crystal orientation (110)
When anisotropic etching is performed on the single crystal silicon substrate of, in the process of reaching the target pattern, as shown in FIG. 12, an angle of about 35 degrees with respect to the crystal orientation (110),
That is, etching proceeds in conformity with the plane of crystal orientation (111).

In order to positively utilize such a property,
As shown in FIG. 13 (a), in a region of about 1/2 of the side of the through hole 5 that serves as a pressure generating chamber facing the nozzle opening, the boundary line 80a of the etching pattern 80 defining the wall surface is formed on the other wall surface. It is formed by shifting it to the side of 5a. Further, among the wall surfaces forming the through hole 7 serving as the ink supply port, the wall surface 7b on the side opposite to the wall surface 5a of the through hole 5 serving as the pressure generating chamber is located next to the wall surface 7a. And the sword-shaped etching protection patterns 82, 83 corresponding to the respective wall surfaces 7a, 7b that also form the ink supply port 7 in the through hole 6 serving as a reservoir. Is formed.

When anisotropic etching is performed using the etching pattern formed as described above, since the pattern 80 has the edge portion 80b when forming the through hole 5, the etching of the edge portion 80b is performed on the wall surface 5b. With respect to a predetermined angle θ of about 35 degrees. Therefore, when the etching progresses to the area facing the nozzle opening,
A wall surface 5f that is in contact with the wall surface 5h at the tip at an obtuse angle is formed. As a result, the distances between the nozzle openings 2 and the wall surfaces 5a, 5b, 5f, 5g, 5h facing the nozzle openings 2 are as uniform as possible. In addition, the progress of etching at the connection point between the ink supply port and the pressure generating chamber and the connection point between the ink supply port and the reservoir is a bottleneck to the ink flow, and the ink flow stagnates at the ink supply port inlet and outlet. It is possible to secure an appropriate fluid resistance as an ink supply port by stopping the ink supply to the extent that it can be prevented.

On the other hand, at the time of etching the through hole 7 serving as the ink supply port, the regions of the sword-shaped etching protection patterns 81, 82 and 83 formed by extending the ends from the wall surface are subjected to etching (FIG. 13). (B)), the final stage,
In other words, through holes are formed by etching from both sides,
At the stage where the etching has further proceeded to the target shape, as shown in FIG. 8, on the pressure generating chamber side of the through hole 7 serving as the ink supply port, the angle θ1 = the wall surface 5c and the wall surface 7b.
Wall surfaces 5d and 5e having an angle of about 30 degrees are formed, and the angle θ1 = 3 with respect to the wall surfaces 6a and 7a on the reservoir side.
The wall surfaces 6b and 6c having an angle of about 0 degree are formed. As a result, expanded openings are formed at the inflow port and the outflow port of the ink supply port, so that the ink can smoothly flow from the reservoir into the pressure generating chamber, and the stagnant bubbles can be prevented.

FIG. 14 is an enlarged view of a pattern on the side of the through hole 6 which serves as a reservoir when ink is supplied to the pressure generating chambers of two rows by one reservoir. The nozzles arranged in each row are shown. ., And 7 ', 7', 7 '..., which are the ink supply ports of the pressure generating chambers in each row. Sword-shaped patterns 82, 82, 82 ..., 83,
83, 83 ... And 82 ', 82', 82 '..., 8
3 ', 83', 83 ', ... Can be formed with almost no wrapping.

FIG. 15A shows another embodiment of the anisotropic etching pattern. In this embodiment, a through hole 7 serving as an ink supply port and a through hole 6 serving as a reservoir are formed. Is formed as a continuous portion 85 having a thin pattern, and one sword-shaped etching protection pattern 86 is extended from here to extend in the axial direction of the through hole 7 serving as an ink supply port. According to the etching pattern of this embodiment, the ink supply port 7 and the through hole 6 serving as a reservoir are formed.
Since the connection point with and is blocked by the continuous portion 85, it is possible to prevent the progress of unnecessary etching by the single sword-shaped portion 86.

According to this embodiment, when the ink is supplied to the two rows of pressure generating chambers by one reservoir as described above, the ink supply formed on the side of the through hole 6 serving as the reservoir as shown in FIG. Through-holes 7, 7, 7, ...
And 7 ', 7', 7 '... Form continuous etching protection patterns 85, 85, 85, ... And 85', 85 ', 85'. ... through holes 7, 7, 7, ... And 7 ', 7',
7 '... One sword-shaped etching protection pattern 86, 86, 86 ..., 86', 8
6 ′, 86 ′, ..., For this reason, when the nozzles of each nozzle row are displaced, the sword-shaped etching protection patterns 86, 86, 86 ,.
The 6'86 'can be deployed and arranged in a plane without wrapping.

FIG. 17 shows a second embodiment of the ink jet recording head of the present invention in the shape near the connection region between the pressure generating chamber formed in the spacer and the ink supply port, and reference numeral 90 in the figure. In this embodiment, the through holes 92 that form the pressure generating chambers and that form the ink supply ports that are connected to the through holes 91 that form the reservoirs are provided with the wall surfaces 90a, 90b in the longitudinal direction that define the pressure generating chambers. Wall surfaces 90c and 90d extending obliquely from are formed and are connected to each other substantially on the center line of the pressure generating chamber. According to this embodiment, the wall surface 90c that spreads the ink from the reservoir at the center of the end of the pressure generating chamber, and the wall surface 90e that spontaneously occurs along the crystal axis formed in the etching process and 90d,
Since it can be supplied from 90f, the flow of ink can be made smoother and stagnation can be eliminated.

[0034]

As described above, according to the present invention, the nozzle plate having the nozzle openings formed in a row,
A spacer having a pressure generating chamber, an ink supply port, and a through hole that forms a reservoir, a vibration plate that receives the vibration of the piezoelectric vibrator, and a piezoelectric vibrator that expands and contracts in accordance with print data are formed. The ends of the through holes, which are formed by anisotropic etching of the silicon single crystal of the orientation (110) and which form the pressure generating chamber, are in contact with each other at an obtuse angle 5
Since it is formed so as to have one wall surface, the vicinity of the nozzle opening where ink easily stagnates is formed by five wall surfaces that are in contact with each other at an obtuse angle, resulting in a smooth shape and smooth ink flow, and bubbles near the nozzle opening Can be prevented from stagnation.

[Brief description of drawings]

FIG. 1 is an assembly diagram showing an embodiment of an ink jet recording head of the present invention.

FIG. 2 is a plan view showing an embodiment of a spacer used in the same apparatus.

FIG. 3 is a diagram showing an example of a diaphragm used in the same apparatus.

FIG. 4 is a perspective view showing an example of a piezoelectric vibrator unit used in the same apparatus.

FIG. 5 is a diagram showing an electrode structure of the same piezoelectric vibrator.

FIG. 6 is an enlarged sectional view showing a pressure generating chamber according to an embodiment of the recording head of the present invention.

7 (a) and 7 (b) are enlarged views showing the vicinity of the pressure generating chamber of the same spacer, respectively, the nozzle plate, the vibration plate, the nozzle opening when the vibrator is fixed, the island portion, FIG. 3 is a diagram showing a positional relationship between a piezoelectric vibrator and a piezoelectric vibrator. .

FIG. 8 is a diagram showing an angle formed by each wall surface forming a through hole.

FIG. 9 is a view showing a cross-sectional shape in the vicinity of a nozzle opening of a through hole which constitutes a pressure generating chamber.

FIG. 10 is an explanatory view showing a step of manufacturing a spacer by anisotropically etching a silicon single crystal substrate having a crystal orientation (110).

FIG. 11 is an explanatory diagram showing an etching state due to positional deviation of etching patterns formed on both front and back surfaces used when anisotropically etching the crystal orientation (110).

FIG. 12 is a diagram showing a progress process of anisotropic etching of a silicon single crystal substrate having a crystal orientation (110).

13A and 13B are diagrams showing an example of a pattern in the case of forming a spacer by anisotropic etching of a silicon single crystal substrate and a state just before the end of etching, respectively.

FIG. 14 is an enlarged view showing an embodiment of the etching pattern on the reservoir side when ink is supplied to the pressure generating chambers in two rows by one reservoir.

15A and 15B are diagrams showing another embodiment of a pattern used for anisotropic etching and a state just before the end of etching, respectively.

FIG. 16 is an enlarged view showing another embodiment of the etching pattern on the reservoir side when the ink is supplied to the two pressure generation chambers by one reservoir.

FIG. 17 is a view showing another embodiment of the present invention in the shape of a through hole.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Nozzle plate 2 Nozzle opening 3 Nozzle opening row 4 Vibration plate 5 Pressure generating chamber forming through hole 5a to 5h Wall surface defining through hole forming a pressure generating chamber 6 Reservoir forming through hole 6a to 6c Reservoir forming through hole Walls defining the holes 7 Ink supply port forming through holes 7a, 7b Wall surface 10 Vibration plate 11 Island portion 21 Piezoelectric vibrator unit 30 Piezoelectric vibrator

Claims (6)

[Claims] 1. A nozzle plate having nozzle openings formed in a row, a spacer having a through hole forming a pressure generating chamber, an ink supply port, and a reservoir, and a vibration plate that receives vibration of a piezoelectric vibrator. And a piezoelectric vibrator that expands and contracts in accordance with print data, wherein the spacer is formed by anisotropic etching of a silicon single crystal having a crystal orientation (110), and is provided in the vicinity of a nozzle opening of a through hole that forms the pressure generating chamber. An ink jet recording head having five wall surfaces whose ends are in contact with each other at an obtuse angle. 2. The ink jet recording head according to claim 1, wherein one of the wall surfaces that defines the through hole that forms the pressure generating chamber and the wall surface that defines the through hole that forms the ink supply port are formed as the same wall surface. . 3. The ink jet recording head according to claim 1, wherein a plurality of rectangular concave portions having a volume capable of accommodating a surplus adhesive are arranged around the through hole. 4. A nozzle plate having nozzle openings formed in rows, a spacer having a through hole that forms a pressure generating chamber, an ink supply port, and a reservoir, and a vibration plate that receives vibration of a piezoelectric vibrator. And a piezoelectric vibrator that expands and contracts in accordance with print data, the spacer is formed by anisotropic etching of a silicon single crystal having a crystal orientation (110), and is connected to a reservoir of a through hole that forms the ink supply port. An ink jet recording head in which an end surface and one wall surface of an end portion connected to the pressure generating chamber are formed in an expanded state by two wall surfaces. 5. The ink jet recording according to claim 4, wherein one of the wall surfaces defining the through hole forming the pressure generating chamber and the wall surface defining the through hole forming the ink supply port are formed as the same wall surface. head. 6. The ink jet recording head according to claim 4, wherein a plurality of rectangular concave portions having a volume capable of accommodating an excessive adhesive agent are arranged around the through hole.