JPH0712034B2 - Jet type liquid treatment device - Google Patents

Description

The present invention relates to a jet type liquid processing apparatus used in various liquid processing steps necessary for manufacturing a semiconductor device or the like.

[Conventional technology]

2. Description of the Related Art When manufacturing a semiconductor device, various liquid treatments such as an etching process, a photolithography developing process, and a water washing process are performed. FIG. 4 is a perspective view showing a jet cut portion of a conventional jet type liquid processing apparatus. FIG. 5 is a diagram showing the flow of a processing liquid in a conventional jet type liquid processing apparatus. When etching a semiconductor wafer using this jet cup (1), as shown in the figure, the semiconductor wafer (4) is held by vacuum suction on the vacuum chuck (3) (a vacuum pump and the like are not shown). ) Next, the semiconductor wafer (4) is held on the upper part of the jet cup (1) with an appropriate interval D. Then, when the etching liquid (5) is made to flow into the cut from below the jet cup (1) by a pump or the like (not shown), the etching liquid (5) is discharged from the jet cup (1) as shown by the arrow in the figure. ) Gush out. As a result, the etching liquid (5) contacts the semiconductor wafer (4) and etches the surface of the semiconductor wafer (4), and then flows from the center of the semiconductor wafer (4) toward the outer peripheral direction to the upper part of the jet cup (1). And passes through a space D between the semiconductor wafer and the semiconductor wafer and is discharged to the outside. here,
Generally, the etching liquid (5) is kept at a constant temperature by an external temperature controller or the like (not shown) in order to keep the etching speed for the semiconductor wafer (4) constant.

[Problems to be Solved by the Invention]

The conventional jet type liquid processing device is configured as described above,
The semiconductor wafer (4) is etched by the etching liquid (5) ejected from the jet cup (1). In the conventional jet type liquid processing apparatus as described above, the etching liquid (5) does not have a uniform flow velocity at the time of contact with the semiconductor wafer (4), and the etching that rises from below in the central portion of the jet cup (1). Since the liquid (5) directly contacts the semiconductor wafer, the flow velocity at the time of contact becomes faster than the peripheral portion, and the etching speed for the semiconductor wafer (4) has a distribution as shown in FIG. As a result, the tenth
As shown in the figure, variations occur depending on the etching amount in the plane of the semiconductor wafer (4). Since the etching liquid (5) flows only in the outer peripheral direction from the center of the semiconductor wafer (4), when the semiconductor wafer (4) is etched in a concave shape, for example, the etching liquid (5) flows in the concave portion. Is shown in Fig. 9. That is, there was a problem that the etching liquid (5) was not sufficiently circulated and the shape was distorted as shown in the figure to cause etching. Further, as a conventional technique for solving these problems, a method of revolving the vacuum chuck (3) around the central axis of the jet cup (1) while rotating the vacuum chuck (3) as shown in FIG. 6 has been devised. , Etching liquid with this technology (5)
However, there have been problems such that the wafer goes around to the back surface of the semiconductor wafer (4) to etch the back surface, and the etching liquid (5) is sucked into the vacuum chuck (3).

The present invention has been made in order to solve the above-mentioned conventional problems, and an object of the present invention is to obtain a jet type liquid processing apparatus which has a small variation in etching amount on the same surface of a substrate to be processed and has high surface accuracy.

[Means for solving the problem]

The jet type liquid treatment apparatus according to the present invention is characterized in that at least two drainage ports are provided on the circumference of the jet cup having a common central axis and different radii from the central axis.

[Action]

The jet type liquid treatment apparatus according to the present invention complicates the flow of the treatment liquid by providing two or more drainage ports on the circumference having a common central axis in the jet cup and different radii from the central axis. It is possible to eliminate variations in the etching amount within the wafer surface when processing such as etching is performed. As a result, the surface accuracy of the semiconductor wafer can be improved.

Example of Invention

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the present invention. FIG. 2 is a top view of the one shown in FIG.
(1) is characterized in that at least two drainage ports (6) are provided on the circumference having a common central axis and different radii from the central axis.

FIG. 3 is a sectional view of the jet cup showing the flow of the etching liquid when the apparatus of the above-mentioned embodiment is used. For example, when etching the semiconductor wafer (4), the semiconductor wafer (4) is held on the vacuum chuck (3) by vacuum suction (vacuum pump etc. is not shown), and in this case, it is placed on the jet cup (1). The semiconductor wafer is held at an appropriate distance D. Then, by rotating the vacuum chuck (3), the semiconductor wafer (4)
When the etching liquid (5) is made to flow from below the jet cup (1) into the cup by a pump (not shown) while rotating the jet, the etching liquid (5) is shown in the same figure as the arrow mark.
It flows to the upper part of (1) and touches the semiconductor wafer (4) to etch the surface of the semiconductor wafer (4). Here, in the conventional jet cup (1) shown in FIG. 5, the etching liquid (5) flows laterally from the center toward the semiconductor wafer (4) in the outer peripheral direction and the jet cup (1) and the semiconductor wafer (4). Although it is discharged to the outside after passing through the interval D of (4), in the jet cup (1) according to the present invention, the central axis in the jet cup (1) is common and the radius from the central axis is different on the circumference. Since the drainage port (6) is provided, the etching liquid (5) is the same as the conventional one with the jet cup (1) and the semiconductor wafer.
It passes through the interval D of (4) and is discharged to the outside, and also flows into the drain port (6) and is discharged to the outside through the discharge port (7). Therefore, the flow of the etching liquid (5) in the portion in contact with the semiconductor wafer (4) does not flow only in the outer peripheral direction from the central portion of the semiconductor wafer (4) as in the conventional case, but as shown in FIG. It becomes a complicated flow. Furthermore, since the semiconductor wafer (4) itself is also rotating, the flow of the etching liquid (5) on the surface of the semiconductor wafer (4) becomes more complicated.

As a result, the etching speed becomes constant at any place on the semiconductor wafer (4) as shown in FIG. According to an experiment conducted by the inventor, when a GaAs wafer having a diameter of 2 inches is etched by 1 μm, the variation in the etching amount on the wafer is ± 20.
Etching results with very good surface accuracy of 0Å were obtained.

Further, as shown in FIG. 9, no distortion of the shape caused when the conventional recess (8) was etched was generated. This is considered to be because the etching liquid flow is complicated and the etching liquid is sufficiently circulated as compared with the conventional device.

Here, the diameter of the jet cup (1), the position of the drain port (6), etc. may be determined according to the diameter of the semiconductor wafer (4) on which various liquid treatments such as etching are performed.
The distance D between the (1) and the semiconductor wafer (4), the flow velocity of the etching liquid (5), the temperature, etc. may be selected appropriately.

Although the etching of the semiconductor wafer has been described in the embodiment, it can be used in various cleaning steps such as development and water washing in the photoengraving step. Further, it goes without saying that it can be applied to other than the manufacture of semiconductor devices.

〔The invention's effect〕

As described above, the jet type liquid treatment apparatus according to the present invention has at least two drainage ports on the circumference where the central axes in the jet cups are common and the radii from the central axes are different, thereby complicating the liquid flow. Since the etching speed is made uniform, it is possible to perform various liquid treatments with good surface accuracy and little variation in etching amount.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment according to the present invention, FIG. 2 is a top view thereof, and FIG. 3 is a sectional view of a jet type liquid processing apparatus showing the flow of a processing liquid according to an embodiment of the present invention. Figure 4 shows
FIG. 5 is a perspective view showing a conventional jet type liquid treatment apparatus, FIG. 5 is a sectional view of the jet type liquid treatment apparatus showing the flow of the treatment liquid of the conventional jet type liquid treatment apparatus, and FIG. 6 is another conventional jet type liquid treatment apparatus. FIG. 7 is a sectional view showing a processing apparatus, FIG. 7 is a distribution diagram showing a distribution of etching speed of a conventional jet type liquid processing apparatus in a wafer surface, and FIG. 8 is an etching speed of a jet type liquid processing apparatus according to an embodiment of the present invention. FIG. 9 is a distribution diagram showing the distribution in the plane of the wafer, FIG. 9 is a sectional view showing the cross-sectional shape of the wafer when etching is performed by the conventional jet type liquid processing apparatus, and FIG. FIG. 11 is a sectional view schematically showing the variation in the etching amount of the processed semiconductor wafer, and FIG. 11 schematically shows the variation in the etching amount of the semiconductor wafer processed by the jet liquid processing apparatus according to the present invention. FIG. In the figure, (1) is a jet cup, (2) is an opening of the jet cup, (3) is a vacuum chuck, (4) is a semiconductor wafer, (5) is an etching liquid, (6) is a drain, (7) ) Is an outlet. The same reference numerals in the drawings indicate the same or corresponding parts.

Claims (1)

[Claims] 1. A liquid jet having a jet cup for jetting a treatment liquid from an upper opening, and a thin plate or the like to be treated is brought into contact with the treatment liquid jetting from the opening of the jet cup to perform the liquid treatment. In the jet type liquid treatment device to perform, the jet type liquid treatment device is characterized in that at least two drainage ports are provided on a circumference having a common central axis in the jet cup and different radii from the central axis.