JPH07118692A - Cleaning agent composition - Google Patents

Abstract

PURPOSE:To obtain a cleaning agent composition having stably cleaning and removing power over solder flux residue of electronic parts, comprising a straight-chain type hexyl groupcontaining ethylene glycol compound or a straight-chain type alkyl group-containing propylene glycol. CONSTITUTION:30wt.% of a straight-chain type hexyl group-containing ethylene glycol compound of formula I ((k) is 1-4 integer) (e.g. diethylene glycol mono-n- hexyl ether) or a straight-chain type alkyl group-containing propylene glycol of formula I ((m) is 4-6 integer; (n) is l-4 integer) (e.g. propylene glycol mono-n- butyl ether) is mixed with 70wt.% of a 8-12C alkane such as octane, nonane, decane, undecane or dodecane and optionally additives such as a surfactant, a rust preventive, a mildew-proofing agent, a defoaming agent and an antioxidant. The resultant composition can simultaneously remove the ionic and resinous components in the solder flux residue of electronic parts.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning composition for removing flux residue of electronic parts after soldering.

[0002]

2. Description of the Related Art Conventionally, chlorine-based organic solvents represented by chlorine-fluorinated hydrocarbon compounds (hereinafter abbreviated as CFCs) and trichloroethane have been used to clean the flux of electronic parts after soldering.

From the viewpoint of recent global environmental problems, it is necessary to urgently refrain from using these chlorine-based organic solvents. For example, CFCs have a problem that the ozone layer may be destroyed and other chlorine-based organic solvents are also carcinogens and easily penetrate underground to cause groundwater pollution. . As a cleaning agent that replaces these chlorine-based organic solvents, use of non-aqueous cleaning agents such as hydrocarbon-based, alcohol-based, and terpene-based cleaning agents and cleaning with an aqueous solution containing a surfactant have been proposed.

[0004] Then, for electronic parts which are clearly affected by water, non-aqueous cleaning agents are generally used for cleaning. Among them, hydrocarbon-based cleaning agents are particularly costly,
It is most often used from the viewpoint of safety.

[0005]

However, in the cleaning of solder flux, a hydrocarbon single component cannot provide sufficient cleaning performance, and therefore, in general, a component capable of dissolving and removing solder flux, that is, cleaning for flux removal. There is a problem that it is necessary to add the agent composition.

Further, according to the research conducted by the present inventors, the cleaning composition containing the cleaning composition to be added and hydrocarbons such as alkanes is used in the case where the vicinity of the cleaning tank in which the cleaning agent is used is in a humid atmosphere. It has been clarified that when the water is brought in, the hydrocarbon and the detergent composition are separated from each other and the flux removability is significantly deteriorated. In order to solve the separation of the hydrocarbon and the detergent composition, polyoxyethylene alkylphenyl ether,
A method of suppressing layer separation by adding a nonionic surfactant such as polyoxyethylene alkyl ether or polyoxyethylene fatty acid ester, an anionic surfactant, or a cationic surfactant is conceivable. It has also been clarified that when the agent remains in the electronic component, there is a problem that the reliability is deteriorated.

The present invention solves the above-mentioned conventional problems, and provides a cleaning composition which has the ability to dissolve and remove solder flux residues and does not separate from hydrocarbons due to the presence of a small amount of water. With the goal.

[0008]

In order to achieve the above object, the detergent composition of the present invention is a detergent composition containing a glycol compound represented by the general formula (Formula 1) or (Formula 2). Is.

In the above structure, the general formula (Formula 1)
Alternatively, it preferably contains 30% by weight or more of the glycol compound represented by (Chemical Formula 2). Moreover, in the said structure, it is preferable to contain 30 weight% or more and 70 weight% or less alkane of the glycol compound shown by said General formula (Chemical formula 1) or (Chemical formula 2).

Further, in the above constitution, it is preferable that the glycol compound represented by the general formula (Formula 1) is an ethylene glycol compound having a linear hexyl group. In the above structure, the general formula (Formula 1)
It is preferable that the glycol compound shown in is a diethylene glycol mononormal hexyl ether.

Further, in the above constitution, it is preferable that the glycol compound represented by the general formula (Formula 2) is a propylene glycol compound having a linear alkyl group having 4 or more carbon atoms.

In the above structure, it is preferable that the glycol compound represented by the general formula (Formula 2) is propylene glycol mono-n-butyl ether. Further, in the above structure, the alkane is preferably at least one alkane selected from octane, nonane, decane, undecane, and dodecane.

[0013]

According to the structure of the present invention, by containing the glycol compound represented by the general formula (Formula 1) or (Formula 2), the ability to dissolve and remove the solder flux residue used in electronic parts is improved. In addition, it is possible to achieve a cleaning agent that does not separate from mixed hydrocarbons due to the presence of water.

Further, the above general formula (Formula 1) or (Formula 2)
According to the preferable constitution of the present invention containing 30% by weight or more of the glycol compound shown in (3), a detergent having a higher detergency can be achieved.

Further, the above general formula (Formula 1) or (Formula 2)
According to the preferred constitution of the present invention in which the glycol compound represented by the formula (3) contains 30% by weight or more and 70% by weight or less of an alkane, a highly safe detergent can be achieved.

According to the preferred constitution of the present invention in which the glycol compound represented by the general formula (Formula 1) is an ethylene glycol compound having a linear hexyl group, a detergent having excellent detergency is achieved. it can.

Further, according to the preferred constitution of the present invention in which the glycol compound represented by the general formula (Formula 1) is diethylene glycol mononormal hexyl ether, a cleaning agent having a particularly high ability to dissolve and remove solder flux residue is achieved. it can.

Further, according to the preferable constitution of the present invention in which the glycol compound represented by the general formula (Formula 2) is a propylene glycol compound having a linear alkyl group having 4 or more carbon atoms, more excellent cleaning is achieved. A powerful cleaner can be achieved.

According to the preferred constitution of the present invention in which the glycol compound represented by the general formula (Formula 2) is propylene glycol mononormal butyl ether, a cleaning agent having a particularly high ability to dissolve and remove solder flux residue is achieved. it can.

Further, the alkane is at least one selected from octane, nonane, decane, undecane and dodecane.
According to the preferable constitution of the present invention which is a kind of alkane, it is possible to achieve a cleaning agent having high safety and more excellent cleaning power.

[0021]

EXAMPLES In the above general formula (Formula 1), the value of k is 1 to 4
A value outside this range is not preferable as an industrial cleaning agent because it causes a decrease in flux removability, a safety problem due to a decrease in the flash point, and is not cheap for industrial products. It becomes a composition.

Further, when the hexyl group of the ethylene glycol compound represented by the general formula (Formula 1) is a methyl, ethyl, propyl, butyl or pentyl group having a carbon number smaller than that of the hexyl group, it has hygroscopicity. On the other hand, when the number of carbon atoms is larger than that of the hexyl group, the industrial production amount is small and the melting point is high, which is not desirable as an industrial detergent. On the other hand, in the propylene glycol compound represented by the general formula (Formula 2), the hexyl group may be a butyl group or a pentyl group.

Specific examples of the glycol compound of the present invention include ethylene glycol mononormal hexyl ether, diethylene glycol mononormal hexyl ether, triethylene glycol mononormal hexyl ether, tetraethylene glycol mononormal hexyl ether, propylene glycol normal hexyl ether, Dipropylene glycol mono-normal hexyl ether, tripropylene glycol mono-normal hexyl ether, tetrapropylene glycol mono-normal hexyl ether, propylene glycol mono-normal butyl ether, propylene glycol mono-normal pentyl ether, propylene glycol mono-isopentyl ether, propylene glycol isohexyl ether, Zipropi Glycol monobutyl n-butyl ether, dipropylene glycol mono-n-pentyl ether, there is a glycol ether-based compounds such as dipropylene glycol iso-hexyl ether.

These glycol compounds can be blended alone or in combination of two or more, and can be mixed with an alkane at an arbitrary ratio. From the viewpoint of safety as alkanes and similar boiling points used in the present invention, octane having 8 to 12 carbon atoms,
Nonane, decane, undecane, dodecane are preferred,
It is desirable to select an alkane having a boiling point similar to that of the glycol compound used, because the compounding ratio does not change. The blending amount of the glycol compound of the present invention and the alkane is required to be 30% by weight or more of the glycol compound within a range not impairing flux removability.

The substance to be mixed with the glycol compound is not limited to alkanes, as long as it is a lipophilic component and the glycol compound of the present invention is soluble, and for example, cycloparaffin hydrocarbons and the like. You may use.

If desired, the detergent composition of the present invention may contain additives such as a surfactant, a rust preventive, a fungicide, a defoaming agent and an antioxidant. As shown in the subject, it is desirable to add in a range that does not affect the reliability of electronic components.

As the cleaning method using the cleaning composition of the present invention, there are methods using dipping, shaking, ultrasonic cleaning, spraying, etc., and the effect is obtained by using these methods alone or in combination. Cleaning can be performed.

The cleaning composition of the present invention can be used not only for removing solder flux but also for dissolving and removing wax, and also for removing processing oil which is difficult to be dissolved and removed only by hydrocarbon such as alkane.

Examples of the present invention will be specifically described below, but the present invention is not limited thereto. (Example 1) A capacitor was mounted and solder flux treatment was performed using rosin-based solder flux (solder flux: AGF-200-J3, manufactured by Asahi Chemical Co., Ltd.),
Printed circuit board with soldering treatment (board surface area 5 cm
² ) was used as the test piece. The test piece was washed with the detergent prepared using the detergent composition of the present invention. The cleaning agent was adjusted by applying a mixture of diethylene glycol mononormal hexyl ether and decane as a cleaning solution. The mixing ratio of diethylene glycol mononormal hexyl ether, which is the composition of this example, and decane is shown in (Table 1). The cleaning process used in this example is shown in (Table 2).

[0030]

[Table 1]

[0031]

[Table 2]

The cleanability of the test piece after the cleaning step shown in Table 2 was evaluated by measuring the amount of ions remaining in the test piece. The device used for measuring the amount of ions is an omega meter (Model 600SC manufactured by Alpha Metals Co., Ltd.). For comparison, the same test piece was washed by a conventional washing method using a detergent containing Freon 113 as a main component (trade name: Daiflon S3, manufactured by Daikin Industries, Ltd.), and the same evaluation method was used. The ion flux removability of the solder flux was evaluated by the method. The results are shown in (Table 3).

[0033]

[Table 3]

As shown in (Table 3), when the detergent composition of this example contains 30% by weight or more of diethylene glycol mono-normal hexyl ether, it is equivalent to or different from other detergents conventionally used. It showed the same or higher scavenging property of ions. Therefore, in order for the cleaning agent of this example to have the ability to remove the ion components in the solder flux, 30% by weight of diethylene glycol mono-normal hexyl ether, which is the cleaning agent composition of this example, should be used.
It has been found that it is desirable to contain more than the above, and it is preferable to contain more when especially cleaning property is required.

Example 2 The removability of the resin component in the solder flux was evaluated. The compounding amounts of the test piece and the cleaning agent of this example are the same as in Example 1.

The test piece was dipped in the cleaning agent of this example and irradiated with ultrasonic waves. The test piece was taken out at regular intervals, and the time until the residual resin content could not be visually confirmed using a stereoscopic microscope was measured. The liquid temperature of the cleaning agent was room temperature and 60 ° C. The results are shown in (Table 4). For comparison, in the same manner as in (Example 1), Freon 113 (trade name: Daiflon S3, manufactured by Daikin Industries, Ltd.) was used to evaluate the removability of the resin component in the solder flux by the same method. The results are also shown in (Table 4).

[0037]

[Table 4]

In the usual cleaning process, the cleaning time is usually less than 10 minutes. Therefore, in order for the cleaning composition of this example to have the ability to remove the resin component in the solder flux, (Table 4 ), It is found that it is desirable to contain diethylene glycol mononormal hexyl ether in an amount of 30% by weight or more.

As shown in the results of (Example 1) and (Example 2), in order to show the simultaneous removal property of the ion component and the resin component in the solder flux, one of the cleaning composition of the present invention is used. It has been found that it is desirable to contain 30% by weight or more of diethylene glycol mononormal hexyl ether, which is one of the two.

(Example 3) Propylene glycol mononormal butyl ether was used in place of the diethylene glycol mononormal hexyl ether used in (Example 1) and (Example 2). I found it desirable.

Example 4 Separability with water was evaluated using a mixture of the glycol compound of the present invention and an alkane. Hexyl group-containing ethylene glycol compounds listed in (Table 5), or butyl glycol or hexyl group-containing propylene glycol compound 100 cc and decane 1
A liquid mixed with 00 cc was put in a vial, 1 cc of water was added, and the liquid and water were shaken vigorously to stir the liquid and water, and then allowed to stand to visually evaluate the layer separation of the glycol compound and decane. The results are shown in (Table 5). For comparison, the same experiment was performed and evaluated for ether compounds having a methyl group, an ethyl group, a propyl group, and a butyl group. The results are also shown in (Table 5). As shown in (Table 5), it can be seen that the cleaning composition of this example does not cause layer separation even if water is mixed.

[0042]

[Table 5]

(Embodiment 5) In order to understand the effect of the layer separation on the flux removability in Example 4, the removability of the ion component and the flux resin component when washed with a cleaning device was evaluated. . The printed circuit board used in Examples 1 and 2 was used as the test piece. Liquid 2 in which diethylene glycol mono-normal hexyl ether, which is one of the glycol compounds of the present invention, and decane were mixed in a ratio of 1: 1.
A liquid obtained by adding 1 cc of water to 00 cc was used as a cleaning agent. The cleaning method was the same as that shown in (Table 2), and the above cleaning agent was used as the cleaning agent in (Table 2) a.

FIG. 1 shows a conceptual diagram of the test piece position at the time of cleaning using the cleaning agent used in this embodiment. Since the cleaning liquid used in this example is mixed at a ratio of 1: 1, it is necessary to clean the beaker at a height higher than half. For comparison, 200 cc of a liquid prepared by mixing dipropylene glycol monomethyl ether and decane at a ratio of 1: 1 with water 1 cc.
FIG. 2 shows a conceptual diagram of the cleaning solution and the position of the test piece when the solution containing cc is used as the cleaning agent.

The results of evaluation using the residual stereoscopic microscope of the amount of ionic residues and the flux resin content are shown in (Table 6).

[0046]

[Table 6]

As shown in Table 6, the cleaning composition of this example is excellent in removing ion components and flux resin components, but the cleaning composition used as a comparative example has ion components and flux resin components. The removability of the components was very poor. The reason will be described in detail with reference to (FIG. 1) and (FIG. 2).

As shown in FIG. 1, the glycol compound 4 does not undergo layer separation from decane, and therefore has good washability.
On the other hand, in the washing with the ether compound in the comparative example, as shown in (FIG. 2), since the decane layer 5 and the dipropylene glycol monomethyl ether layer 6 were separated into two layers, the test piece was formed only by the upper layer. In the case of cleaning, only decane having a low specific gravity is used for cleaning, and the cleaning property of flux is extremely poor. Therefore, the glycol compound in the present invention was effective as a detergent composition for mixing with hydrocarbons.

Example 6 The effect of the cleaning composition of the present invention was evaluated when the cleaning agent remained on the substrate.
A substrate for insulation resistance test evaluation as shown in (FIG. 3) was used. The insulation resistance test evaluation substrate used in this example is JI
It complies with S-Z-3197. Table 7 shows an outline of the insulation resistance test evaluation substrate used in this example.

[0050]

[Table 7]

Diethylene glycol mononormal hexyl ether or propylene glycol mononormal butyl ether 500, which is one of the detergent compositions of the present invention.
μl was applied to the above-mentioned evaluation substrate and left in a constant temperature bath at 100 ° C. for 30 minutes. After that, the manufactured evaluation substrate was placed in a constant temperature and humidity chamber at 60 ° C. and 95% RH, and a DC voltage of 50 V was applied to the positive and negative conductors. The insulation resistance value between the positive and negative conductors was measured at regular intervals. The measurement of the insulation resistance value in this example was carried out in a constant temperature and constant humidity chamber at 60 ° C. and 95% RH. The results are shown in (Fig. 4). For comparison, a commercially available hydrocarbon-based detergent, polyethylene glycol-based surfactant (hereinafter abbreviated as PEG), and polyoxyethylene polyoxypropylene alkyl ether (hereinafter abbreviated as POE) were also evaluated in the same manner. It was The results are also shown in (FIG. 4).

As shown in FIG. 4, the cleaning composition of this example, diethylene glycol mono-normal hexyl ether and propylene glycol mono-n-butyl ether, has excellent insulating properties for 500 hours. Even if the cleaning composition of No. 1 remained in the electronic component, it did not affect the insulating property. Note that (Fig. 4)
The result of the cleaning composition of this example shown in FIG. 6 has the same insulation resistance value as that of the CFC cleaning product and the substrate to which the cleaning agent is not applied.

The following are points to be noted for the detergent composition of this example: 1) Since layer separation due to moisture does not occur, stable detergency is always obtained. 2) It is particularly effective for cleaning electronic parts that are sensitive to the presence of water.

3) Remaining does not affect reliability.

[0055]

As described above, the cleaning composition of the present invention contains the glycol compound represented by the general formula (Chemical formula 1) or (Chemical formula 2) and is therefore excellent in solder flux residue. Since it exhibits removability, clears global environmental problems, and has high safety, it can be effectively used as a solder flux residue of electronic parts.

Further, the above general formula (Formula 1) or (Formula 2)
By containing 30% by weight or more of the glycol compound shown in (3), a detergent having particularly high detergency can be achieved. Further, by containing the glycol compound represented by the general formula (Formula 1) or (Formula 2) in an amount of 30% by weight or more and 70% by weight or less of an alkane, a highly safe detergent can be achieved.

When the glycol compound represented by the general formula (Formula 1) is an ethylene glycol compound having a linear hexyl group, a detergent having excellent detergency can be achieved.

When the glycol compound represented by the general formula (Formula 1) is diethylene glycol mononormal hexyl ether, a cleaning agent having a particularly high ability to dissolve and remove the solder flux residue can be achieved.

Further, since the glycol compound represented by the general formula (Formula 2) is a propylene glycol compound having a linear alkyl group having 4 or more carbon atoms, a detergent having a particularly excellent detergency is achieved. it can.

When the glycol compound represented by the general formula (Formula 2) is propylene glycol mono-n-butyl ether, a cleaning agent having a particularly high ability to dissolve and remove the solder flux residue can be achieved.

Further, the alkane is at least one selected from octane, nonane, decane, undecane and dodecane.
By being a kind of alkane, it is possible to achieve a cleaning agent having high safety and superior cleaning power.

[Brief description of drawings]

FIG. 1 is a conceptual diagram of a test piece position at the time of cleaning with a cleaning agent according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram of a cleaning solution using a cleaning agent and a test piece position in a comparative example of the present invention.

FIG. 3 is a diagram of an insulation resistance test evaluation substrate used in one example of the present invention.

FIG. 4 is a diagram showing a change with time of an insulation resistance value in one example of the present invention.

[Explanation of symbols]

 1. Beaker 2. Test piece 3. Jig supporting the test piece 4. Cleaning composition 5. Decane layer 6. Layer of dipropylene glycol monomethyl ether

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshikazu Yamagata 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (8)

[Claims] 1. A detergent composition containing a glycol compound represented by the general formula (Formula 1) or (Formula 2). [Chemical 1] [Chemical 2] 2. The cleaning composition according to claim 1, which contains 30% by weight or more of the glycol compound represented by the general formula (Formula 1) or (Formula 2). 3. The cleaning composition according to claim 1, containing 30% by weight or more of the glycol compound represented by the general formula (Formula 1) or (Formula 2) and 70% by weight or less of an alkane. 4. The detergent composition according to claim 1, wherein the glycol compound represented by the general formula (Formula 1) is an ethylene glycol compound having a linear hexyl group. 5. The cleaning composition according to claim 1, wherein the glycol compound represented by the general formula (Formula 1) is diethylene glycol mononormal hexyl ether. 6. The detergent composition according to claim 1, wherein the glycol compound represented by the general formula (Formula 2) is a propylene glycol compound having a linear alkyl group having 4 or more carbon atoms. . 7. The cleaning composition according to claim 1, wherein the glycol compound represented by the general formula (Formula 2) is propylene glycol mononormal butyl ether. 8. The alkane is octane, nonane, decane,
The cleaning composition according to claim 3, which is at least one alkane selected from undecane and dodecane.