JPH07114213B2 - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPH07114213B2 JPH07114213B2 JP24564988A JP24564988A JPH07114213B2 JP H07114213 B2 JPH07114213 B2 JP H07114213B2 JP 24564988 A JP24564988 A JP 24564988A JP 24564988 A JP24564988 A JP 24564988A JP H07114213 B2 JPH07114213 B2 JP H07114213B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- lead frame
- semiconductor device
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 18
- 238000007789 sealing Methods 0.000 claims description 15
- 239000011347 resin Substances 0.000 description 22
- 229920005989 resin Polymers 0.000 description 22
- 230000017525 heat dissipation Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は主に放熱板付樹脂封止型半導体装置に利用する
ことのできるリードフレームに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame mainly applicable to a resin-sealed semiconductor device with a heat sink.
従来の技術 放熱板付樹脂封止型の半導体装置を樹脂封止成形する際
は、樹脂封止用金型の上型と下型によって、リードフレ
ームのリード部と放熱板部の一部封止されない部分をク
ランプすることによって樹脂成形されていた。2. Description of the Related Art When resin-molding a resin-sealed semiconductor device with a heat sink, the lead frame and heat sink are not partially sealed by the upper and lower molds of the resin mold. It was resin molded by clamping the part.
発明が解決しようとする課題 しかしながら上記従来の半導体装置の樹脂封止では樹脂
封止用金型の上型と下型で放熱板付リードフレームの上
面と下面を押えるため、前記放熱板の上面および下面へ
の封止樹脂のもれは少ないが、前記放熱板側面には、前
記金型との間に生じる隙間のために樹脂成形時樹脂が侵
入し、放熱板側面に樹脂バリが発生していた。そして、
このバリ取り工程で放熱板に傷をつけたりしていた。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the conventional resin encapsulation of a semiconductor device, since the upper and lower dies of a resin encapsulation mold press the upper and lower surfaces of a lead frame with a heat sink, the upper and lower surfaces of the heat sink are Although there was little leakage of the sealing resin to the side surface of the heat sink, the resin penetrated into the side surface of the heat sink during resin molding due to the gap formed between the die and the side surface of the heat sink. . And
The heat sink was scratched during this deburring process.
本発明は上記問題を解決するために樹脂バリがあまり発
生しない半導体装置用リードフレームを提供することを
目的とするものである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a lead frame for a semiconductor device in which resin burrs do not occur so much in order to solve the above problems.
課題を解決するための手段 上記問題を解決するために本発明は、半導体素子が接続
されるリード部に連結された外枠部と、この外枠部に連
結された放熱板とを有し、この放熱板の側面に、前記外
枠部および放熱板を樹脂封止用の金型に収容したときに
押しつぶされて前記金型と放熱板側面との間の隙間の一
部をうずめる突部を形成したものである。Means for Solving the Problems In order to solve the above problems, the present invention has an outer frame part connected to a lead part to which a semiconductor element is connected, and a heat dissipation plate connected to the outer frame part, On the side surface of the heat dissipation plate, there is provided a protrusion that is crushed when the outer frame portion and the heat dissipation plate are housed in a resin-sealing mold and dents a part of the gap between the mold and the side surface of the heat dissipation plate. It was formed.
作用 上記構成により、半導体装置の樹脂封止の際、樹脂封止
用金型によりリードフレームの上面と下面を押えたとき
に、放熱板側面の突部は金型により押しつぶされて、金
型と放熱板側面との間の隙間の一部をうずめるように密
着し、金型と放熱板側面との間の隙間への封止樹脂が侵
入が金型に密着した突部により阻止され、これにより侵
入樹脂による放熱板側面のバリの発生が防止される。With the above configuration, when the upper surface and the lower surface of the lead frame are pressed by the resin sealing mold during resin sealing of the semiconductor device, the protrusion on the side surface of the heat dissipation plate is crushed by the mold, A part of the gap between the heat sink and the heat sink is closely contacted so that the sealing resin is prevented from entering the gap between the die and the heat sink side by the protrusion that is in close contact with the mold. It is possible to prevent the occurrence of burrs on the side surface of the heat sink due to the invading resin.
実施例 以下、本発明の一実施例を図面に基づき説明する。第１
図は本発明の一実施例を示す放熱板付きの半導体装置用
リードフレームの樹脂封止後の平面図、第２図は同半導
体装置用リードフレームの樹脂封止前の要部斜視図、第
３図（ａ）および（ｂ）はそれぞれ同半導体装置用リー
ドフレームを金型内に収容した際の要部平面図および要
部側面断面図、第４図（ａ）および（ｂ）はそれぞれ同
半導体装置用リードフレームを金型内に収容して金型に
より上下より押圧した後の要部平面図および要部側面断
面図である。第１図において、１はリードフレームで、
半導体素子（図示せず）が接続されるリード部２と、こ
のリード部に連結された外枠部３と、この外枠部３に連
結された放熱板４とを有し、第２図に拡大して示すよう
に、放熱板４の側面には側方へ突出する突部4aが形成さ
れている。また、4bは放熱板規制孔、５は封止樹脂であ
る。第３図（ａ）および（ｂ）において、６および７は
半導体素子を樹脂封止するための上金型および下金型
で、上金型６における放熱板４の突部4aに対応する箇所
には下方に突出する凸部6aが設けられている。Embodiment An embodiment of the present invention will be described below with reference to the drawings. First
FIG. 1 is a plan view of a lead frame for a semiconductor device with a heat dissipation plate after resin sealing, showing an embodiment of the present invention. FIG. 2 is a perspective view of a main part of the lead frame for a semiconductor device before resin sealing. 3 (a) and 3 (b) are a plan view and a side sectional view of a main part when the same lead frame for a semiconductor device is housed in a mold, and FIGS. 4 (a) and 4 (b) are the same, respectively. FIG. 4 is a plan view of a main part and a side sectional view of the main part after the semiconductor device lead frame is housed in the mold and pressed from above and below by the mold. In FIG. 1, 1 is a lead frame,
2 has a lead portion 2 to which a semiconductor element (not shown) is connected, an outer frame portion 3 connected to the lead portion, and a heat dissipation plate 4 connected to the outer frame portion 3. As shown in an enlarged view, the side surface of the heat dissipation plate 4 is formed with a protrusion 4a protruding laterally. Further, 4b is a heat dissipation plate restriction hole, and 5 is a sealing resin. In FIGS. 3 (a) and 3 (b), 6 and 7 are upper and lower molds for resin-sealing the semiconductor element, which correspond to the protrusions 4a of the heat sink 4 in the upper mold 6. Is provided with a convex portion 6a protruding downward.
上記構成により、樹脂封止成形の際に、上金型６と下金
型７により外枠部３および放熱板４をクランプすると、
第４図（ａ）および（ｂ）に示すように、上金型６の凸
部6aにより放熱板４の突部4aは押しつぶされて、下金型
７と放熱板４の側面との間の隙間がこの位置でうずめら
れる。したがって封止樹脂の矢印で示すような流れが突
部4aにより遮断され、金型と放熱板側面の間の残りの隙
間８への樹脂の廻り込みは阻止され、放熱板４のこの部
分の側面にバリが発生することが防止される。なお、こ
の突部4aの幅は1.5mm〜4.0mmで、厚さ0.2mm〜2.0mmの範
囲に設定することが好適である。また、このままの状態
では、電子部品としては突部4aがつぶれているため製品
にはならないので、この突部4aは製品加工時に切り離さ
れ、これにより製品として使用される。With the above configuration, when the outer frame portion 3 and the heat dissipation plate 4 are clamped by the upper mold 6 and the lower mold 7 during resin sealing molding,
As shown in FIGS. 4 (a) and 4 (b), the protrusion 6 a of the upper die 6 crushes the protrusion 4 a of the heat radiating plate 4, and the protrusion 4 a between the lower die 7 and the side surface of the heat radiating plate 4 is crushed. The gap is filled at this position. Therefore, the flow of the sealing resin as shown by the arrow is blocked by the protrusion 4a, and the resin is prevented from flowing into the remaining gap 8 between the mold and the side surface of the heat sink, and the side surface of this portion of the heat sink 4 is blocked. Burrs are prevented from occurring. The width of the protrusion 4a is preferably 1.5 mm to 4.0 mm and the thickness is preferably set to 0.2 mm to 2.0 mm. Further, in this state, since the protrusion 4a is crushed as an electronic component and does not serve as a product, the protrusion 4a is cut off at the time of processing the product and used as a product.
発明の効果 以上、本発明によれば、リードフレームの放熱板側面
に、金型に押しつぶされて放熱板側面と金型との間の隙
間の一部をうずめる突部を形成したので、前記隙間から
の樹脂の侵入が阻止されて放熱板側面のバリの発生は防
止され、バリ取り工程が不要となり、したがって、この
バリ取り工程で放熱板に傷をつけることがなくなり、品
質向上にも有益である。As described above, according to the present invention, the side surface of the heat dissipation plate of the lead frame is provided with the protrusion that is crushed by the mold and dents a part of the space between the side surface of the heat dissipation plate and the mold. The resin is prevented from entering through and the burrs on the sides of the heat sink are prevented, and the deburring process is not required. Therefore, the heat sink is not scratched during this deburring process, which is also useful for quality improvement. is there.
第１図は本発明の一実施例を示す半導体装置用リードフ
レームの樹脂封止後の平面図、第２図は同半導体装置用
リードフレームの樹脂封止前の要部斜視図、第３図
（ａ），（ｂ）および第４図（ａ），（ｂ）は同半導体
装置用リードフレームを金型内に収容した際および金型
により上下より押した後の要部平面図と要部側面断面図
である。 １…リードフレーム、２…リード部、３…外枠部、４…
放熱板、4a…突部、５…封止樹脂、６…上金型、6a…凸
部、７…下金型。FIG. 1 is a plan view of a lead frame for a semiconductor device after resin sealing showing an embodiment of the present invention, FIG. 2 is a perspective view of a main part of the lead frame for a semiconductor device before resin sealing, and FIG. (A), (b) and FIG. 4 (a), (b) are a plan view and a main part of a main part when the lead frame for a semiconductor device is housed in a mold and after being pushed up and down by the mold. It is a side sectional view. 1 ... Lead frame, 2 ... Lead part, 3 ... Outer frame part, 4 ...
Heat sink, 4a ... Projection, 5 ... Sealing resin, 6 ... Upper mold, 6a ... Projection, 7 ... Lower mold.
Claims (1)
れた外枠部と、この外枠部に連結された放熱板とを有
し、この放熱板の側面に、前記外枠部および放熱板を樹
脂封止用の金型に収容したときに押しつぶされて前記金
型と放熱板側面との間の隙間の一部をうずめる突部を形
成した半導体装置用リードフレーム。1. An outer frame part connected to a lead part to which a semiconductor element is connected, and a heat radiating plate connected to the outer frame part. The outer frame part and the heat radiating member are provided on a side surface of the heat radiating plate. A lead frame for a semiconductor device, wherein a projection is formed when the plate is housed in a resin-sealing mold and is crushed to fill a part of a gap between the mold and a side surface of a heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24564988A JPH07114213B2 (en) | 1988-09-29 | 1988-09-29 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24564988A JPH07114213B2 (en) | 1988-09-29 | 1988-09-29 | Lead frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0294461A JPH0294461A (en) | 1990-04-05 |
| JPH07114213B2 true JPH07114213B2 (en) | 1995-12-06 |
Family
ID=17136781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24564988A Expired - Lifetime JPH07114213B2 (en) | 1988-09-29 | 1988-09-29 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07114213B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2741191B1 (en) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | PROCESS FOR MANUFACTURING A MICROMODULE, PARTICULARLY FOR CHIP CARDS |
| WO2015083263A1 (en) * | 2013-12-05 | 2015-06-11 | 新電元工業株式会社 | Lead frame, molding die, and method for manufacturing mounting component-attached lead frame |
-
1988
- 1988-09-29 JP JP24564988A patent/JPH07114213B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0294461A (en) | 1990-04-05 |
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