JPH07111897B2 - Method of connecting electrode formed on conductive film and lead wire - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting a power source lead wire to a conductive film used as a surface heating element or the like.

[0002]

2. Description of the Related Art On one surface of a substrate made of a synthetic resin sheet or a synthetic resin film, a conductive film having a heat-generating layer of metal or the like having a low electric resistance formed by vapor deposition or other means is integrally attached and formed. It is generally known to construct a heating element.

In order for the surface heating element having such a structure to function specifically, it is necessary to connect a power source wire to a part of the surface heating element to supply electric power. A conductive paint is applied to the portion to form an electrode, and a power supply wire (lead wire) is fixed to the electrode by means of soldering or the like.

[0004]

However, since the heat-resistant temperature of the conductive film used as a heating element is lower than the melting temperature of the solder used to fix the electric wire, the electrode portion formed on the conductive film is If soldering work is performed, holes will be created in the conductive film or the synthetic resin substrate that will be the substrate due to the heat of fusion, or these will be adversely affected by expansion, contraction, deformation, etc., and an appropriate heating element cannot be constructed. It had a drawback.

As a means for coping with these problems, as illustrated in FIG. 5, electrodes c formed by a conductive paint are attached across both ends of a conductive film a and a substrate b, and the substrate is attached. A structure in which a power source wire d is connected to a portion of the electrode c located on b, or, as illustrated in FIG. 6, an electrode e made of a conductive paint is formed on a conductive film a and then the electrode is formed. A structure has been proposed in which an electric wire d made of a metal tape or the like is adhered onto e, and a coating film f of a conductive paint is further formed so as to cover the entire electric wire d. However, in the case of the structure illustrated in FIG. Is a conductive film a and an electrode c
When the synthetic resin substrate is deformed due to a small contact area with the conductive film a and the electrode c, the conductive film a and the electrode c are separated from each other, which causes a defect of conduction. Further, in the case of the structure illustrated in FIG. In addition, since the conductive paint forming the electrode c and the electric wire d have different expansion coefficients, the durability and reliability are poor, and the cost of the conductive paint is applied to the bottom surface and the covering surface of the electric wire d. However, there is a drawback that the manufacturing cost is increased and the productivity is low, and the mass productivity is poor.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances and intends to cope with it. It is an object of the present invention to provide a method of connecting a power supply wire which has a simple structure and is extremely reliable. .

[0007]

The present invention has heat resistance and flexibility,
On the upper surface of a substrate made of synthetic resin film with electrical insulation properties, a metal film with low electrical resistance is formed by means such as vapor deposition.
While wearing bonded conductive film formed of, in said conductive by forming a by Ri electrode conductive paint onto the film surface heating element, the electrode was separately formed and this homogeneous
It consists of electrically conductive paint, and, by <br/> bonded with the pre-power electric wire on the upper surface soldered auxiliary electrode homogeneous conductive paint, conductive by heat during soldering Fi
The main point of the invention is a method for connecting an electrode formed on a conductive film and a lead wire, which is characterized by preventing troubles such as deformation, shrinkage, and melting in a rum.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

A symbol A is a known surface heating element, which is a synthetic resin film or a synthetic resin sheet having heat resistance and flexibility and electrical insulation, and a conductive film 2 is formed on the upper surface of the substrate 1. Is integrally attached.

A conductive film 2 attached to the upper surface of the substrate 1.
Is a structure in which a metal film having a low electric resistance is adhered to the upper surface of an electrically insulating synthetic resin sheet by means such as vapor deposition.

Reference numerals 3 and 3 denote electrodes formed on the conductive film 2, which are formed into a thin film by applying a conductive coating material in a predetermined width and then drying it.

Reference numeral 31 denotes an auxiliary electrode for adhering the power supply wire 4 on the conductive film 2, which is made of the same conductive paint as the electrode 3 applied and formed on the conductive film 2.

Reference numeral 5 is a fitting portion of an auxiliary electrode formed on the electrode 3 as required, and a part of the electrode 3 is peeled to the size of the auxiliary electrode 31 or when the electrode 3 is formed in advance. It is formed by omitting the application of the conductive paint to this portion.

Further, the means for forming the auxiliary electrode 31 is that the conductive paint is applied in a strip shape on the upper surface of the substrate 11 having heat resistance and then dried, and the dried strip is cut into a desired size. The power supply wire 4 is previously soldered to the auxiliary electrode 31 formed in each size.

The auxiliary electrode 31 to which the tip of the power supply wire 4 is previously soldered is adhered to a predetermined position of the electrode 3 using liquid conductive paint as an adhesive to complete the installation of the wire 4.

[0016]

The effects of the present invention configured as described above are as follows.

(1) It is not preferable to directly solder the power supply wire 4 to the electrode 3 formed on the conductive film 2 because the conductive film 2 is affected by the melting heat of the solder, but in the present invention, the auxiliary formed separately. After the electric wire 4 is soldered to the electrode 31, the auxiliary electrode 31 is adhered onto the electrode 3, so that the conductive film 2 is directly soldered to cause a damage such as a perforation phenomenon due to the melting heat of the solder. Never.

(2) The electrode 3 and the auxiliary electrode 31 are made of a conductive paint having the same properties, and the auxiliary electrode 31 is made of the same conductive paint solution as that used to form the electrodes 3 and 31. Since the electrodes 3 are adhered, the electrodes 3 after adhering are completely the same, and a constant current can always flow without causing conduction failure in the connection portion.

(3) Since the auxiliary electrode 31 made of the same material is bonded onto the electrode 3 made of a conductive paint, the bonding between the two is extremely strong, and there is an advantage that stability can be maintained for a long time.

(4) When the fitting portion for fitting and inserting the auxiliary electrode 31 into the electrode 3 formed on the conductive film 2 is recessed, the entire electrode 3 after the auxiliary electrode 31 is fitted and inserted. Has an advantage that a uniform surface can be formed.

[Brief description of drawings]

FIG. 1 is a plan view of a surface heating element to which the present invention is applied.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a partially cutaway perspective view showing a manufacturing example of an auxiliary electrode.

FIG. 4 is a plan view showing a structure in which an auxiliary electrode fitting portion is formed on an electrode.

FIG. 5 is a cross-sectional view of a heating plate showing a conventional electric wire connecting portion.

FIG. 6 is a cross-sectional view of a heating plate showing a conventional electric wire connection portion different from that of FIG.

[Explanation of symbols]

 A-side heating element 1 substrate 11 substrate 2 conductive film 3 electrode 31 auxiliary electrode 4 power supply wire 5 auxiliary electrode fitting part

Claims (2)

[Claims] 1. A vapor deposition or the like is formed on the upper surface of a synthetic resin film substrate having heat resistance, flexibility, and electrical insulation properties.
While wearing bonded electrically <br/> conductive film coating was formed of small metal electric resistance by means, in said conductive film on by forming a by Ri electrode to the conductive coating on the surface heating element, the electrode, which as made of homogeneous conductive coating formed separately, and by attaching the pre-supply wires on the upper surface soldered auxiliary electrode using homogeneous conductive coating, soldering Deformed into a conductive film by the heat of
A method for connecting an electrode formed on a conductive film and a lead wire, which prevents problems such as shrinkage and melting . 2. The method for connecting an electrode formed on a conductive film and a lead wire according to claim 1, wherein the auxiliary electrode is fitted and integrated with a fitting portion formed on the electrode.