JPH0710527B2 - Hole punching machine for green sheets for multilayer boards - Google Patents

Description

Detailed Description of the Invention

[0001]

The present invention relates are those relating <br/> fine through-hole hole disconnect processing apparatus of the green sheet for a ceramic multilayer substrate.

[0002]

2. Description of the Related Art FIG. 1 shows an example of a ceramic multilayer substrate for 25 chips. This multilayer substrate is usually composed of the following three types of layers. The ones shown in FIGS. 1 to 5 are called surface layers. This surface layer is usually a number, but each layer has, for example, A1 to A25, D1 to D
In the areas indicated by 25, An in FIG. 2 and FIG.
A hole having a pattern as shown by Dn is punched. This pattern is different for each layer. 6 to 17 in FIG.
What is shown in FIG. 4 is called an intermediate layer, and the hole patterns of these ten or more sheets are the same, and the holes are evenly formed on the surface at equal pitches in the vertical and horizontal directions. Reference numeral 18 in FIG. 1 denotes a terminal connection layer, which is different from the hole pattern intermediate layer and has a wide pitch.

As described above, a multilayer substrate requires a large number of through-hole holes having various patterns. This drilling should be done in the state of the green sheet before firing the ceramics, but as the processing method, there are three possible methods: cutting using a conventional drill, electron beam processing, and punching using a punch and die. Has been.

[0004]

However, the cutting work by the first drill has problems that the working speed is slow and the tool life is short.

Further, electron beam processing has a drawback that the apparatus is extremely expensive. As a punching method using a punch and a die, first, a die in which a punch and a die having the pattern shown in Fig. 1 are combined and punched in one step is considered, but a die with a different pattern is produced for each surface layer. However, there is a drawback in that it is difficult to manufacture the mold when it is difficult to cover the holes.

Another punching method using punches and dies is that one set of punches and dies can be moved vertically and horizontally.
Although a method of processing all the patterns shown in (1) can be considered, there is a problem that the processing speed is slow.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a punching device for a ceramic green sheet for a multilayer substrate, which is inexpensive and has good productivity, without the above-mentioned drawbacks of the prior art.

That is, according to the present invention, the LS in which the hole pattern of the multilayer substrate is mounted on the upper surface of the substrate of the surface layer, particularly for the surface layer.
Paying attention to the repeated pattern for each I chip, L
A feature is that a die having a structure in which one set of punch and die is assigned to one SI chip is adopted.

[0009]

With the above structure, since a large number of holes are punched simultaneously, it becomes possible to process holes in all layers with a high efficiency by a few types of dies.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to an embodiment shown in FIGS. FIG. 4 is an overall view of the processing apparatus, FIG. 5 is a schematic view of the lower mold, FIG. 6 is a schematic view of the upper mold, and FIG. 7 is a schematic view showing a state of holding and feeding the green sheet.

[0011] 19 in FIGS. 3 to 7 are die piece, the number of die holes 20 is equal to the number of chips mounted on the substrate and repeating the pattern pitch of the pitch surface layer (P _L in FIG. 1) Equal to.

Further, as shown in FIGS. 6 (a) and 6 (b), 21
Is a punch, and is arranged in the same number and the same pitch as the die holes 20 formed in the die piece 19. 33 is an upper die set plate, 34 is a stripper plate, 36 is a sub-guide post for guiding the stripper plate 34, 37
Is a punch plate that supports the punch 21 together with the backing plate 38, 39 is a guide hole into which the guide post 35 of the die set is inserted, and 40 is a spring that presses the stripper plate 34.

As shown in FIGS. 7A and 7B, the green sheet 22 is fixed to a frame-shaped holder 23 with an adhesive or the like, and the holder 23 is fixed to the arm 2 by a pin 24.
It is positioned at 5. The arm 25 is connected to an XY drive device 26 and can be positioned at a position instructed by an NC tape or the like.

Further, as shown in FIGS. 5A and 5B, the die piece 19 is fitted in the die plate 27,
When the thickness of the frame of the holder 23 is t _P and the thickness of the arm 25 is t _A on the die surface 30 and the die plate surface 29, t
There is a step difference of _P + t _A , and when the arm 25 slides on the die plate surface 29, the green sheet 22 moves to the die surface 29.
The upper part can be moved smoothly. Die plate 27
Are positioned and fastened to the lower die set plate 28.

The lower die set plate 28 is fixed to the bolster 31 of the press, and the upper die set plate 33.
Is fixed to the ram 32.

In the above structure, the green sheet 22
Is moved by the XY driving device 26 via the frame 23 and the arm 25, and the pattern A1 of the surface layer 1 of FIG. 1 is processed using, for example, the punch 21-1 and the hole 20-1 of the die. The pattern A8 can also be processed by the -8 die hole 20-8. With respect to the other surface layers, the same pattern Bn to E can be obtained by just positioning the green sheet so that the patterns B1 to E1 can be processed using the punch 21-1 and the die hole 20-1 of the same type.
n can be processed.

The intermediate layer can be processed by the same method using the same die because the pitch P _L of the punch / die pair is usually an integral multiple of the hole pitch P _H (not shown) of the intermediate layer.

The conditions for the terminal connection layer are the same as those for the intermediate layer.

The hole diameter of the ceramic multilayer substrate is not limited to one type, but the core portions of pattern A and patterns B to E (di in FIG. 3) of the surface layer and the outer peripheral portions of patterns B to E (in FIG. 3). do), the intermediate layer, and the terminal connecting layer are at most 2 to 3 types. Therefore, it is possible to efficiently perform the drilling of the multi-layer substrate having such various patterns by preparing as many molds as the types of hole diameters.

[0020]

As described above, according to the present invention, it is possible to accommodate a large number of punched parts (holes formed by punches and dies) in a mold according to the number of chips, so that the press The number of holes to be machined per stroke is large, making it possible to make a large number of holes without making the number of strokes per minute of the press so high, and to correspond one punch and die hole to one chip. By doing so, there is a margin in the pitch between punches and between the dies, the die manufacturing is easy, and it is possible to deal with different hole patterns depending on the substrate layers by XY driving of the green sheet. The effect of greatly improving the processing efficiency and simplifying the equipment is achieved.

[Brief description of drawings]

FIG. 1 is a schematic view of a product processed by the present invention.

FIG. 2 is an enlarged view of each part shown in FIG.

FIG. 3 is an enlarged view of each part shown in FIG.

[Figure 4] hole抜加Engineering of the green sheet for the multi-layer substrate present invention
Schematic block diagram showing one embodiment of the equipment.

5A is a plan view of the lower mold shown in FIG. FIG. 5B is a side view of FIG.

FIG. 6A is a plan view of the upper mold shown in FIG. FIG. 6B is a side view of FIG.

7A is a plan view showing the green sheet holding device shown in FIG. 4. FIG. FIG. 7B is a side view of FIG.

[Explanation of symbols]

 1-18. Ceramic substrate 19. Die 21. Punch 22. Green sheet 23. Holder 25. Arm 26. XY drive

Claims (1)

[Claims] 1. A hole disconnect processing apparatus of the green sheet for a multilayer board the unit patterns of the multiple arranged in rows and columns parallel relationship that have a same piercing pattern, single position corresponding to the plurality of unit patterns each an upper mold having a punch of multiple as in the pattern located at the same position throughout the unit pattern, and in correspondence with the punch of the upper mold lower die having a plurality of die holes, the upper mold and A holder arranged between the lower die and the green sheet for fixing the green sheet , and moving the holder.
An XY drive device , comprising: the punch and the duck.
B) Drilling at the same time for all unit patterns by using holes
Continue until the hole pattern is obtained,
XY drive that moves the holder according to the removal pattern
An apparatus for punching a green sheet for a multilayer substrate, which comprises a device .