JPH0697238A - Semiconductor mounting equipment - Google Patents

Abstract

(57) [Summary] [Construction] In the semiconductor mounting apparatus of the present invention, the pressing portion 11 provided on the thermocompression-bonding tool 2 is provided at the total center of gravity position 14 of the thermocompression-bonding portions 8a to 8i formed on the semiconductor. Is set so as to receive a 1-point concentrated pressurizing force, and when the pressurizing force is applied, the thermocompression-bonding tool 2 is attached to the surfaces of the thermocompression-bonding portions 8a to 8i and the circuit patterns 4a to 4i. It is designed to allow a certain free movement in the three-dimensional direction. According to the present invention, the thermocompression bonding work of the circuit patterns 4a to 4i and the thermocompression bonding portions 8a to 8i formed on the insulating tape 5 is applied to the thermocompression bonding tool 2. The pressure portion 11 concentrates and pressurizes the total gravity center position 14 of the thermocompression-bonding portions 8a to 8i at one point, so that the thermocompression-bonding work can be stably performed at a level of several microns.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mounting device for thermocompression bonding a plurality of thermocompression bonding parts formed on a semiconductor on a substrate or tape having a plurality of circuit patterns formed thereon.

[0002]

2. Description of the Related Art In the prior art, a thermocompression-bonding tool surface for thermocompression bonding a substrate or tape having a plurality of circuit patterns and a plurality of thermocompression bonding portions provided on a semiconductor. As shown in FIG. 5, the adjustment of the parallelism between the and is performed by adjusting parts 17 and 18 having a movable circumferential surface installed on the fixed part 1 through which the thermocompression-bonding tool 2 transmits a pressing force. The three-dimensional adjustment was performed by moving the screw 20 before the thermocompression bonding work, and it was fixed.

[0003]

However, in the above-mentioned conventional method, a substrate or tape having a plurality of circuit patterns and a plurality of thermocompression bonding portions formed on a semiconductor are bonded to each other by thermocompression bonding. -The parallelism at the several micron level between the plurality of circuit patterns and the plurality of thermocompression-bonding tool surfaces required for thermocompression bonding with a tool is caused by the variation in condition setting depending on the sense of the adjuster. , Not only quality defects such as insufficient thermo-compression bonding strength and mistakes in thermo-compression bonding, but also micro level 3 due to the passage of time.
There is a problem in that the tool pressure surface for thermocompression bonding is displaced in the dimensional direction.

Therefore, the present invention solves such a problem, and an object of the present invention is to solve the above problems by forming the plurality of circuit patterns on the substrate or tape and the plurality of semiconductors formed on the semiconductor. It is an object of the present invention to provide a semiconductor mounting device capable of stably and easily performing parallelism between a thermocompression bonding portion and the thermocompression-bonding tool surface by a familiar structure by one-point concentrated pressurization.

[0005]

According to a first aspect of the present invention, there is provided a semiconductor mounting apparatus in which the parallelism between a thermocompression-bonding tool surface and a plurality of thermocompression-bonding portions formed on a semiconductor is measured. It is characterized in that it is performed by a familiar structure formed on the loop side, and a plurality of circuit patterns and a plurality of thermocompression bonding portions formed on the semiconductor are thermocompression bonded.

According to a second aspect of the semiconductor mounting apparatus of the present invention, the parallelism between the thermocompression-bonded tool surface and the plurality of thermocompression-bonded portions formed on the semiconductor is measured by a one-point concentrated pressure method. It is characterized by performing a familiar structure.

According to a third aspect of the present invention, there is provided a semiconductor mounting apparatus in which a single point pressurizing force is applied for parallelization of a thermocompression-bonding tool surface and a plurality of thermocompression-bonding portions formed on a semiconductor. It is characterized in that the position is provided at the position of the total center of gravity of a plurality of thermocompression bonding portions formed on the semiconductor.

According to a fourth aspect of the present invention, there is provided a semiconductor mounting apparatus in which a pressure-applying portion for one-point concentrated pressurization provided at a total center of gravity of a plurality of thermocompression-bonding portions formed on a semiconductor is a thermocompression-bonding tool. It is characterized in that the tool is preset at the time of tool processing.

According to a fifth aspect of the semiconductor mounting apparatus of the present invention, the position of the one-point concentrated pressurizing portion provided at the total center of gravity of the plurality of thermocompression-bonding portions formed on the semiconductor is the thermocompression-bonding tool. It has a structure that can be finely adjusted in the plane direction with respect to the pressure surface of the.

[0010]

According to the structure of the present invention, the thermocompression bonding work of the plurality of circuit patterns formed on the substrate or the tape and the plurality of thermocompression bonding portions formed on the semiconductor is performed. When the base of the triangular pyramid of force with the pressing portion formed at the top as the apex is in contact with a plurality of circuit patterns and a plurality of thermocompression bonding parts, a vertical axis from the total gravity center position of the plurality of thermocompression bonding parts The parallel structure at the level of several microns can be automatically achieved by the familiar structure in which the position of the pressing portion formed on the line for the thermocompression bonding tool is located. Further, the total gravity center position of the plurality of thermocompression-bonded portions in which the triangular pyramid-shaped vertices of the force are formed on the semiconductor and the thermocompression-bonding tool.
Since it corresponds to the pressurizing portion formed on the ring, the pressurizing force applied to the pressurizing portion can uniformly press all the thermocompression-bonding portions and the circuit pattern.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings.

FIG. 1 is a front view showing a structure of a head portion of a semiconductor mounting apparatus of the present invention before thermocompression bonding work. The head portion described here refers to a thermocompression-bonding tool 2 having a one-point concentrated pressurizing section and a pusher-1 for pressing the thermocompression-bonding tool 2 fixed to the machine body. . In the state before the thermocompression bonding work, the central shaft 9 of the thermocompression bonding tool 2 held by the pusher -1, which is held by the machine body and operates up and down.
b does not coincide with the vertical axis 9a of the semiconductor 7 held on the semiconductor platform 6. That is, there is no parallelism between the upper surfaces of the thermocompression bonding portions 8a to 8i formed on the semiconductor 7 and the pressing surface of the thermocompression bonding tool 2. FIG. 2 is a front view showing a head portion during the thermocompression bonding work of the semiconductor mounting device. The thermocompression-bonding tool 2 held by the pusher-1 by the vertical power of the machine body sandwiches the circuit patterns 4a-4i and presses the thermocompression bonding portions 8a-8i formed on the semiconductor. At this time, the tools for thermocompression bonding 2 that did not match before the work
The central axis 9b of the thermocompression-bonding tool 2 is provided on the thermocompression-bonding tool 2 by a pusher 1 after the pressing surface of the thermocompression-bonding tool 2 contacts the thermocompression-bonding portions 8a to 8i and the circuit patterns 8a to 8i. Pressure unit 11
The position where the pressing surface of the thermocompression-bonding tool 2 is in contact with the thermocompression-bonding portion is maintained by setting and pressing, and the pressing surface not yet in contact with the thermocompression-bonding portion has a force with the pressing portion 11 as the apex. The base of the triangular pyramid 13 is displaced by a familiar function until it forms a triangular pyramid of forces contacting all the thermocompression bonding parts, and the vertical axis 9a on the upper surface of the thermocompression bonding parts 8a to 8i formed on the semiconductor 7 is formed. Match and balance. After the equilibrium state, the triangular pyramid shape of force having the pressing portion 11 as the apex is formed on the circuit patterns 4a to 4i and the thermocompression bonding portions 8a to 8i and the set pressing force and thermocouple 1 are formed.
When the heat controlled by 0 is applied for a fixed time, a eutectic alloy is formed at the joints between the circuit patterns 4a to 4i and the thermocompression bonding portions 8a to 8i, and the thermocompression bonding tool 2 rises to generate heat. The crimping work is completed. In this way, the thermocompression-bonding tool 2 is provided with the one-point concentrated pressurizing portion 11, and the triangular pyramid shape of the force having the apex thereof is formed on the circuit patterns 4a to 4i and the semiconductor 7 in the thermocompression-bonding portion. According to the familiar structure formed on the upper surfaces of 8a to 8i for each thermocompression bonding operation, the substrate or tape having the circuit pattern formed as in the conventional method and the thermocompression bonding tool provided on the semiconductor are used.
The parallelism at the level of a few microns with the contact surface can be stably performed regardless of the sense of the adjuster, and stable thermocompression bonding quality can be obtained without causing defects such as thermocompression bonding strength and thermocompression bonding errors. Can be secured. FIG. 3 shows the thermocompression bonding portions 8a to 8i formed on the semiconductor 7 and the position 14 of the total center of gravity thereof.
FIG. As shown in FIG. 3, it is preferable that the position of the pressurizing unit 11 be aligned with the total gravity center position 14 of the thermocompression bonding units 8a to 8i. The reason is that the thermocompression bonding parts 8a to 8i provided on the semiconductor 7 have different numbers, arrangements, and pattern sizes depending on the models, and therefore all the thermocompression bonding parts 8a to 8i.
Also, by considering the circuit patterns 4a to 4i and applying the force uniformly to one point of the total center of gravity 14 to which the force can be uniformly applied, a uniform eutectic alloy is formed, and the thermocompression bonding strength and the thermocompression bonding are performed. It is possible to prevent the occurrence of quality defects such as mistakes. In this case, the total barycentric position 14 can be obtained by the following calculation formula. (Note that ma to mi represent the mass of the thermocompression bonding portions 8a to 8i formed on the semiconductor 7.)

[0013]

[Equation 1]

Further, by setting the pressurizing portion 11 at the total center of gravity position 14 obtained by the above-mentioned calculation formula in the process of manufacturing the thermocompression-bonding tool 2, the condition of the machine can be adjusted. Eliminates the need to set conditions when changing models or exchanging thermocompression bonding tools. FIG. 4 shows a method in which the position of the one-point concentrated pressurizing portion 11 provided at the total gravity center position 14 of the thermocompression bonding portions 8a to 8i formed on the semiconductor 7 can be finely adjusted in the plane direction with respect to the semiconductor upper surface. It is the front view and the top view which showed the example. In the familiar structure in which one point concentrated pressure is applied to the pressurizing portion 11 to form a triangular pyramid shape of force having the apex of the pressurizing portion 11 on the circuit patterns 4a to 4i and the thermocompression bonding portions 8a to 8i. From the pressing surface of the thermocompression-bonding tool 2 to the pressing portion 11
If the height is too high, the external resistance force due to the rigidity of the heater-3 and the wiring of the thermocouple 10 will affect the parallel position at the level of several microns due to the familiar structure. There may be a phenomenon that does not match 14.
In such a case, if the pressurizing portion 11 is positioned and adjusted to a position at which the fitting is most surely performed without depending on the total center-of-gravity position 14, the external force due to the rigidity of the wiring of the heater-3 and the thermocouple 10 The position of the pressurizing unit 11 may be finely adjusted to an optimum position in consideration of the resistance force.

[0015]

As described above, according to the present invention, the thermocompression bonding work of the circuit patterns 4a to 4i and the thermocompression bonding portions 8a to 8i formed on the insulating tape 5 is performed by the thermocompression bonding tool. When the base of the triangular pyramid of force with the pressing portion 11 formed on the rule 2 as the apex contacts all the thermocompression bonding portions 8a to 8i and the circuit patterns 4a to 4i, the thermocompression bonding portions 8a to 8i With the familiar structure in which the pressing portion 11 is positioned on the vertical axis of the total center of gravity position 14, parallelism can be automatically obtained at the level of several microns. Further, the apex of the triangular pyramid shape of the force coincides with the total gravity center point 14 of the thermocompression bonding parts 8a to 8i and the pressing part 11 formed on the thermocompression bonding tool 2, so that the pressing part 1 is formed.
The pressing force applied to 1 has an effect that all the thermocompression bonding parts 8a to 8i and the circuit patterns 4a to 4i can be uniformly pressed and stable semiconductor mounting work can be performed.

[Brief description of drawings]

FIG. 1 is a front view showing a head portion of a semiconductor mounting device before work.

FIG. 2 is a front view showing a head portion of the semiconductor mounting device during work.

FIG. 3 is an enlarged plan view of correlation positions of a thermocompression bonding portion formed on a semiconductor.

4A and 4B are a front view and a plan view showing an embodiment in the case where the pressure unit 11 is provided on the pusher side.

FIG. 5 is a front view and a side view of an embodiment showing a conventional method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pusher 2 Thermocompression bonding tool 4a-4i Circuit pattern 5 Insulation tape 6 Semiconductor mounting stand 7 Semiconductor 8a-8i Thermocompression bonding part 9a Center of gravity axis 10 Thermocouple 11 Pressurizing part 14 Total center of gravity position 15a to 15d Screw 16 Adjustment plate

Claims (5)

[Claims] 1. A semiconductor mounting device for thermocompression bonding a semiconductor to a substrate or tape on which a plurality of circuit patterns are formed. The tool surface for thermocompression bonding and a plurality of thermocompression bonding parts formed on the semiconductor. By providing a familiar structure for providing parallelism on the side of the thermocompression bonding tool, the plurality of circuit patterns and the plurality of thermocompression bonding portions on the semiconductor are thermocompression bonded. Semiconductor mounting equipment. 2. The parallelization of the thermocompression-bonding tool surface and a plurality of thermocompression-bonding portions formed on the semiconductor is performed by a familiar structure using a one-point concentrated pressurizing method of pressing force. Semiconductor mounting device. 3. The pressing position of the one-point concentrated pressurizing force for performing parallelization between the thermocompression-bonding tool surface and a plurality of thermocompression-bonding portions formed on the semiconductor is on the semiconductor. A semiconductor mounting device, wherein the semiconductor mounting device is provided at a position of a total center of gravity of a plurality of thermocompression-bonded portions formed on the. 4. A pressure-applying portion for the one-point concentrated pressurizing force, which is provided at the position of the total center of gravity of a plurality of thermocompression-bonding portions formed on the semiconductor, is pre-tooled on the thermocompression-bonding tool. A semiconductor mounting device characterized by being set at times. 5. The position of the one-point concentrated pressurizing portion provided at the total center of gravity of a plurality of thermocompression-bonding portions formed on the semiconductor is fine in the plane direction with respect to the thermocompression-bonding tool surface. A semiconductor mounting device having an adjustable structure.