JPH0693170A - Phenolic resin molding material - Google Patents
Phenolic resin molding materialInfo
- Publication number
- JPH0693170A JPH0693170A JP24102892A JP24102892A JPH0693170A JP H0693170 A JPH0693170 A JP H0693170A JP 24102892 A JP24102892 A JP 24102892A JP 24102892 A JP24102892 A JP 24102892A JP H0693170 A JPH0693170 A JP H0693170A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- powder
- molding material
- resin
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012778 molding material Substances 0.000 title claims abstract description 21
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 16
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title abstract description 4
- 229920001568 phenolic resin Polymers 0.000 title abstract description 4
- 239000000843 powder Substances 0.000 claims abstract description 27
- 239000012766 organic filler Substances 0.000 claims abstract description 22
- 239000011256 inorganic filler Substances 0.000 claims abstract description 19
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims abstract description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 16
- 239000000945 filler Substances 0.000 claims abstract description 12
- 229910000019 calcium carbonate Inorganic materials 0.000 claims abstract description 8
- 239000004927 clay Substances 0.000 claims abstract description 7
- 229910052570 clay Inorganic materials 0.000 claims abstract description 6
- 239000000454 talc Substances 0.000 claims abstract description 5
- 229910052623 talc Inorganic materials 0.000 claims abstract description 5
- 238000005553 drilling Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 239000000654 additive Substances 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 abstract 1
- 230000008570 general process Effects 0.000 abstract 1
- 238000004898 kneading Methods 0.000 abstract 1
- 238000005453 pelletization Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 8
- 239000002023 wood Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- -1 iron and aluminum Chemical class 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はフェノール樹脂成形材料
に関し、充填材の一部として熱硬化性樹脂硬化物の粉末
を使用することにより、特にドリル加工等における摩耗
特性、及び機械的強度の向上を図るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenol resin molding material, and by using powder of a thermosetting resin cured material as a part of a filler, it is possible to improve wear characteristics and mechanical strength particularly in drilling. Is intended.
【0002】[0002]
【従来の技術】従来より、フェノール樹脂成形材料の充
填材として、有機質充填材においては、主として木粉が
使用され、その他、パルプ、有機繊維、布細片、熱可塑
性樹脂粉末などが用途に応じて使用されている。有機質
充填材の中で木粉など通常のものでは、機械的強度や電
気特性(特に煮沸後の特性)において十分とはいえず、
熱可塑性樹脂粉末や熱硬化性樹脂硬化物の粉末あるいは
無機質充填材を配合することにより上記特性の改良があ
る程度達成されている。しかしながら、熱可塑性樹脂粉
末では一般的には耐熱性が低下するので、その配合に限
界がある。更に、熱硬化性樹脂硬化物の粉末あるいはこ
れに木粉などを併用して成形収縮や電気特性を改良する
ことも試みられている(特開昭57−78444号公
報、特開昭59−105049号公報など)が、熱硬化
性樹脂硬化物の粉末では多量に使用すると、成形品が硬
く脆くなり、他の特性も余り向上しない。2. Description of the Related Art Conventionally, wood powder has been mainly used as an organic filler as a filler for a phenolic resin molding material, and in addition, pulp, organic fibers, cloth strips, thermoplastic resin powder, etc. are used depending on the application. Is being used. Among the organic fillers, ordinary ones such as wood powder are not sufficient in mechanical strength and electrical characteristics (especially characteristics after boiling),
The above properties have been improved to some extent by incorporating a thermoplastic resin powder, a thermosetting resin cured product powder, or an inorganic filler. However, thermoplastic resin powders generally have low heat resistance, and therefore their blending is limited. Further, it has been attempted to improve the molding shrinkage and the electrical properties by using powder of a thermosetting resin cured product or wood powder in combination with it (Japanese Patent Laid-Open No. 57-78444, Japanese Patent Laid-Open No. 59-105049). However, if a large amount of powder of a thermosetting resin cured product is used, the molded product becomes hard and brittle, and other properties are not improved so much.
【0003】一方、無機質充填材においては、炭酸カル
シウム、クレー、シリカ、アルミナ、水酸化アルミニウ
ム、ガラスなどの粉末、ガラス繊維などが使用されてい
る。無機質充填材はシリカ、アルミナ、ガラスなどの硬
質のもの、炭酸カルシウム、クレーなど比較的軟質のも
のがあり、用途や要求特性に応じて選択使用されている
が、一般的には、機械的強度、電気特性等において優れ
た性能を発揮する。無機質充填材は有機質充填材に比較
すれば硬く、ドリル加工や摺動時において、相手材(ド
リルや金属材料)を摩耗させることが問題となってい
る。On the other hand, as the inorganic filler, powders of calcium carbonate, clay, silica, alumina, aluminum hydroxide, glass and the like, glass fiber and the like are used. Inorganic fillers include hard ones such as silica, alumina and glass, and relatively soft ones such as calcium carbonate and clay, and they are selected and used according to the application and required characteristics, but generally mechanical strength Excellent performance in electrical characteristics. Inorganic fillers are harder than organic fillers, and there is a problem that the mating material (drill or metal material) is worn during drilling or sliding.
【0004】[0004]
【発明が解決しようとする課題】本発明者は、有機質充
填材及び無機質充填材を種々検討した結果、木粉などの
有機質充填材あるいは有機質充填材と無機質充填材とを
併用した場合に比較して、機械的強度が優れ、摩耗特
性、即ち成形品自体の摩耗が小さく、相手材を摩耗させ
ない成形材料を開発するに至ったものである。DISCLOSURE OF THE INVENTION As a result of various studies on organic fillers and inorganic fillers, the present inventor has compared them with organic fillers such as wood powder or a combination of organic fillers and inorganic fillers. As a result, a molding material which has excellent mechanical strength, wear characteristics, that is, the wear of the molded product itself is small and which does not wear the mating material, has been developed.
【0005】[0005]
【課題を解決するための手段】本発明は、有機質充填材
と無機質充填材とを充填材とするフェノール樹脂成形材
料であって、有機質充填材のうち、熱硬化性樹脂硬化物
の粉末10〜40重量%を含有することを特徴とするフ
ェノール樹脂成形材料に関するものである。本発明で用
いられるフェノール樹脂は、ノボラックでもレゾールで
もよく、あるいはこれらを変性したものでも使用するこ
とができる。また必要に応じて、これらの二種あるいは
二種以上の併用も可能である。The present invention relates to a phenol resin molding material containing an organic filler and an inorganic filler as fillers, wherein the thermosetting resin cured product powder 10 to 10 of the organic fillers is used. The present invention relates to a phenol resin molding material containing 40% by weight. The phenolic resin used in the present invention may be novolac or resol, or those modified with these may be used. If necessary, two or more of these may be used in combination.
【0006】次に充填材について説明する。ここで、有
機質充填材は、木粉の他、パルプ、有機繊維、布細片、
熱可塑性樹脂粉末などを用途に応じて使用することがで
きる。無機質充填材としては、炭酸カルシウム、タル
ク、クレー、シリカ、アルミナ、水酸化アルミニウム、
ガラスなどを使用することができるが、本発明において
は、摩耗特性を特に重視する観点から軟質の炭酸カルシ
ウム、タルク、クレーが好ましい。本発明の主たる特徴
は有機質充填材と無機質充填材とを併用し、有機質充填
材の一部として熱硬化性樹脂硬化物の粉末を使用するこ
とである。熱硬化性樹脂硬化物の粉末としては樹脂単独
の硬化物粉末は勿論、熱硬化性樹脂成形材料の硬化物、
熱硬化性樹脂積層板あるいは化粧板を粉砕したものも含
まれる。熱硬化性樹脂としては、フェノール樹脂、メラ
ミン樹脂、エポキシ樹脂、ウレタン樹脂、不飽和ポリエ
ステル樹脂などであるが、フェノール樹脂、メラミン樹
脂及びエポキシ樹脂が一般的である。Next, the filler will be described. Here, the organic filler, in addition to wood powder, pulp, organic fibers, cloth strips,
A thermoplastic resin powder or the like can be used depending on the application. As the inorganic filler, calcium carbonate, talc, clay, silica, alumina, aluminum hydroxide,
Although glass or the like can be used, in the present invention, soft calcium carbonate, talc, and clay are preferable from the viewpoint of particularly placing emphasis on wear characteristics. The main feature of the present invention is that an organic filler and an inorganic filler are used in combination, and a thermosetting resin cured product powder is used as a part of the organic filler. As the powder of the thermosetting resin cured product, not only the cured product powder of the resin alone but also the cured product of the thermosetting resin molding material,
It also includes a crushed thermosetting resin laminated plate or a decorative plate. Examples of the thermosetting resin include phenol resin, melamine resin, epoxy resin, urethane resin and unsaturated polyester resin, but phenol resin, melamine resin and epoxy resin are common.
【0007】木粉など通常の有機質充填材の使用のみで
は成形品の硬度が十分でなく、寸法精度が良くなく、強
度、摩耗の点で満足なものが得られにくい。そこで、有
機質充填材の一部として熱硬化性樹脂硬化物の粉末を一
定量配合することによりこれらの欠点を大幅に改良する
ことができる。熱硬化性樹脂硬化物の粉末は他の有機質
充填材に比較して硬いが、鉄、アルミニウムなどの金属
よりは軟質であるので、ドリル加工や摺動時に相手材で
あるドリルや金属を摩耗させることがない。熱硬化性樹
脂硬化物の粉末の配合割合は、有機質充填材中10〜4
0重量%である。10重量%未満ではその配合の効果が
小さく、40重量%を越えると成形品が硬く脆くなり好
ましくない。The hardness of the molded product is not sufficient, the dimensional accuracy is not good, and it is difficult to obtain a satisfactory product in terms of strength and wear only by using an ordinary organic filler such as wood powder. Therefore, these defects can be remarkably improved by blending a certain amount of the thermosetting resin cured product powder as a part of the organic filler. The powder of cured thermosetting resin is harder than other organic fillers, but it is softer than metals such as iron and aluminum, so it wears the counterpart drill or metal during drilling or sliding. Never. The mixing ratio of the powder of the thermosetting resin cured product is 10 to 4 in the organic filler.
It is 0% by weight. If it is less than 10% by weight, the compounding effect is small, and if it exceeds 40% by weight, the molded product becomes hard and brittle, which is not preferable.
【0008】次に、上記のような有機質充填材とともに
無機質充填材を併用する。無機質充填材を併用すること
により強度、寸法精度、電気特性などが向上するが、そ
の使用量が多いと、成形品が硬くなり、ドリル加工や摺
動時に相手材であるドリルや金属を摩耗させる傾向があ
る。このため、無機質充填材としては前述のように炭酸
カルシウム、タルク、クレーが好ましく、その配合量も
充填材全体に対して20〜40重量%が好ましい。成形
材料化の方法は、樹脂、充填材、添加剤等のブレンド物
をロール、コニーダ、押出し機等を利用して、加熱溶融
混練した後、ペレット化あるいは冷却粉砕して材料化す
る方法が一般的である。上記の如く得たフェノール樹脂
成形材料は、射出成形など通常の成形方法で加熱、加圧
し硬化させることにより優れた強度、摩耗特性を有し、
良好な電気特性、寸法精度をもつ成形品を得ることがで
きる。Next, an inorganic filler is used together with the above organic filler. Strength, dimensional accuracy, electrical characteristics, etc. are improved by using an inorganic filler together, but if used in a large amount, the molded product becomes hard and wears the counterpart drill or metal during drilling or sliding. Tend. Therefore, as the inorganic filler, as described above, calcium carbonate, talc, and clay are preferable, and the compounding amount thereof is also preferably 20 to 40% by weight based on the whole filler. The method of forming a molding material is generally a method in which a blend of a resin, a filler, an additive, etc. is melt-kneaded by heating using a roll, a co-kneader, an extruder, etc., and then pelletized or cooled and ground to be a material. Target. The phenol resin molding material obtained as described above has excellent strength and wear characteristics by being heated, pressurized and cured by a usual molding method such as injection molding,
A molded product having good electrical characteristics and dimensional accuracy can be obtained.
【0009】[0009]
【実施例】次に本発明を実施例及び比較例に基づいて説
明する。ここで、「部」は「重量部」を示す。表1に示
す材料及び配合にて、加熱ロールにより加熱混練してフ
ェノール樹脂成形材料を製造した。比較例1は、充填材
として木粉と炭酸カルシウムを使用し、実施例と同様に
硬化促進剤である酸化マグネシウムを除いたものであ
る。比較例2は、比較例1において通常どおり酸化マグ
ネシウムを配合した場合である。各実施例及び比較例で
得られた成形材料について、耐摩耗性(ドリル摩耗指数)
及び曲げ強さを測定した。その結果を表1に示す。EXAMPLES Next, the present invention will be explained based on Examples and Comparative Examples. Here, "part" means "part by weight". The materials and formulations shown in Table 1 were kneaded by heating with a heating roll to produce a phenol resin molding material. In Comparative Example 1, wood powder and calcium carbonate were used as the filler, and magnesium oxide, which is a curing accelerator, was removed as in the case of the example. Comparative Example 2 is a case where magnesium oxide was blended as usual in Comparative Example 1. For the molding materials obtained in each Example and Comparative Example, wear resistance (drill wear index)
And the bending strength was measured. The results are shown in Table 1.
【0010】[0010]
【表1】 [Table 1]
【0011】[測定方法] (1) ドリル摩耗指数:ドリル刃回転数を 500rpm 、ドリ
ル刃下降速度を1mm/分とし、2mm厚のアルミニウム板
の穴あけ時におけるドリル刃の応力波形(A)を測定し、
このドリル刃を用いて同じ条件で3mm厚の実施例で得ら
れた成形材料からの試験片に10回穴をあける。再び2
mm厚のアルミニウム板に穴をあけ、この時のドリル刃の
応力波形(B)を測定する。ドリル摩耗指数は、ドリル刃
の応力波形(A)と(B)の比(A/B)で求めた。 (2) 曲げ強さ:JIS K 6911による 実施例1〜2で得られた成形材料については、高い曲げ
強度を保持しながら、非常に優れた摩耗特性を有する成
形品が得られる。比較例1は、曲げ強さが弱く、摩耗特
性も良くない。比較例2は、比較例1において酸化マグ
ネシウムを加えているので、曲げ強さは良好であるが、
摩耗特性が劣る。[Measurement method] (1) Drill wear index: The drill blade rotation speed is 500 rpm, the drill blade descending speed is 1 mm / min, and the stress waveform (A) of the drill blade at the time of drilling a 2 mm thick aluminum plate is measured. Then
Using this drill blade, a test piece from the molding material obtained in the example having a thickness of 3 mm was punched 10 times under the same conditions. Again 2
A hole is made in an aluminum plate having a thickness of mm, and the stress waveform (B) of the drill blade at this time is measured. The drill wear index was determined by the ratio (A / B) of the stress waveforms (A) and (B) of the drill blade. (2) Bending strength: According to JIS K 6911 With respect to the molding materials obtained in Examples 1 and 2, molded articles having extremely excellent wear characteristics can be obtained while maintaining high bending strength. In Comparative Example 1, the bending strength is weak and the wear characteristics are not good. In Comparative Example 2, since magnesium oxide is added in Comparative Example 1, the bending strength is good,
Inferior wear characteristics.
【0012】[0012]
【発明の効果】以上の実施例からも明らかなように、本
発明のフェノール樹脂成形材料は、良好な曲げ強さを保
持しながら、摩耗特性の優れた成形品を得ることができ
る。従って、ドリル加工性が良好であり、摺動時におけ
る摩耗特性、成形時の金型摩耗などにおいても優れた性
能を発揮する。更に、電気特性、寸法精度も従来の成形
材料と同等以上である。EFFECTS OF THE INVENTION As is clear from the above examples, the phenol resin molding material of the present invention makes it possible to obtain a molded product having excellent wear characteristics while maintaining good bending strength. Therefore, it has good drilling workability, and exhibits excellent performance in wear characteristics during sliding, die wear during molding, and the like. Furthermore, the electrical characteristics and dimensional accuracy are equal to or higher than those of conventional molding materials.
Claims (3)
とするフェノール樹脂成形材料であって、有機質充填材
のうち、熱硬化性樹脂硬化物の粉末を10〜40重量%
含有することを特徴とするフェノール樹脂成形材料。1. A phenol resin molding material comprising an organic filler and an inorganic filler as fillers, wherein the thermosetting resin cured product powder is 10 to 40% by weight of the organic filler.
A phenol resin molding material characterized by containing.
が、60〜80重量%対40〜20重量%であることを
特徴とする請求項1記載のフェノール樹脂成形材料。2. The phenol resin molding material according to claim 1, wherein the ratio of the organic filler and the inorganic filler is 60 to 80% by weight to 40 to 20% by weight.
又はクレーであることを特徴とする請求項1又は2記載
のフェノール樹脂成形材料。3. The phenol resin molding material according to claim 1, wherein the inorganic filler is calcium carbonate, talc or clay.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4241028A JP2849005B2 (en) | 1992-09-09 | 1992-09-09 | Phenolic resin molding materials |
MYPI93000200A MY129026A (en) | 1992-09-09 | 1993-02-09 | Phenolic resin molding material |
US08/017,482 US5432227A (en) | 1992-09-09 | 1993-02-12 | Phenolic resin molding material |
GB9303092A GB2270523B (en) | 1992-09-09 | 1993-02-16 | Phenolic resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4241028A JP2849005B2 (en) | 1992-09-09 | 1992-09-09 | Phenolic resin molding materials |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0693170A true JPH0693170A (en) | 1994-04-05 |
JP2849005B2 JP2849005B2 (en) | 1999-01-20 |
Family
ID=17068257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4241028A Expired - Fee Related JP2849005B2 (en) | 1992-09-09 | 1992-09-09 | Phenolic resin molding materials |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2849005B2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5918760A (en) * | 1982-07-22 | 1984-01-31 | Shin Kobe Electric Mach Co Ltd | Molded thermosetting resin article |
JPS6094456A (en) * | 1983-10-27 | 1985-05-27 | Matsushita Electric Works Ltd | Sealing thermosetting resin molding material and electronic part molded using the same |
-
1992
- 1992-09-09 JP JP4241028A patent/JP2849005B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5918760A (en) * | 1982-07-22 | 1984-01-31 | Shin Kobe Electric Mach Co Ltd | Molded thermosetting resin article |
JPS6094456A (en) * | 1983-10-27 | 1985-05-27 | Matsushita Electric Works Ltd | Sealing thermosetting resin molding material and electronic part molded using the same |
Also Published As
Publication number | Publication date |
---|---|
JP2849005B2 (en) | 1999-01-20 |
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