JPH0685120A - Apparatus for cooling electronic part - Google Patents
Apparatus for cooling electronic partInfo
- Publication number
- JPH0685120A JPH0685120A JP4231100A JP23110092A JPH0685120A JP H0685120 A JPH0685120 A JP H0685120A JP 4231100 A JP4231100 A JP 4231100A JP 23110092 A JP23110092 A JP 23110092A JP H0685120 A JPH0685120 A JP H0685120A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- circuit board
- chip
- base portion
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、回路基板に実装されて
いる電子部品を冷却するための電子部品冷却装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component cooling device for cooling electronic components mounted on a circuit board.
【０００２】[0002]
【従来の技術】電子装置に使用されている電子部品、特
に回路印刷基板（回路基板）にチップ・オン・ボードの
形態で実装されているＬＳＩチップ等の電子部品を冷却
するための従来の手段は、ＬＳＩベアチップ等が発生す
る熱を回路基板に伝達し、その回路基板の周囲を流れて
いる冷媒によって強制的に冷却するという手段を採用し
ている。2. Description of the Related Art Conventional means for cooling electronic components used in electronic devices, particularly LSI chips and other electronic components mounted on a printed circuit board (circuit board) in the form of a chip-on-board. Employs a means of transferring heat generated by an LSI bare chip or the like to a circuit board and forcibly cooling it with a coolant flowing around the circuit board.
【０００３】図２は上述のような従来の電子部品の冷却
装置の一例を示す断面図である。FIG. 2 is a sectional view showing an example of a conventional cooling device for electronic parts as described above.
【０００４】図２において、ＬＳＩチップを含をＴＡＢ
チップ１１は、接着剤１３ａによってプリント基板１４
に固定されており、このＴＡＢチップ１１を保護するた
め、ＴＡＢチップ１１をエポキシ樹脂１７によって封止
している。In FIG. 2, the TAB including the LSI chip is included.
The chip 11 is attached to the printed circuit board 14 by the adhesive 13a.
The TAB chip 11 is sealed with an epoxy resin 17 in order to protect the TAB chip 11.
【０００５】ＴＡＢチップ１１が動作したときに発生す
る熱は、接着剤１３ａを介してプリント基板１４に伝達
され、プリント基板１４に伝達された熱は、プリント基
板１４の周囲を強制的に対流させられている冷媒１８に
伝達されて放熱する。The heat generated when the TAB chip 11 operates is transferred to the printed circuit board 14 via the adhesive 13a, and the heat transferred to the printed circuit board 14 forces the convection around the printed circuit board 14. The heat is transmitted to the coolant 18 and is radiated.
【０００６】[0006]
【発明が解決しようとする課題】近年の電子装置に使用
されている電子部品は、高集積化と高速化とが進んでお
り、特にＬＳＩチップを使用した電子装置は、チップ・
オン・ボード（ＣＯＢ）実装が必要不可決となってい
る。しかし、ＬＳＩチップをＣＯＢの形態で実装する回
路基板を強制的に空冷で冷却するとき、上述のような構
成の冷却手段においては、回路基板の上面はエポキシ樹
脂によって封止されているために冷却されず、回路基板
の下面のみがＴＡＢチップが発生する熱を伝達して冷媒
によって冷却されるため、冷却される熱量が制限される
ために全体としての冷却効率が低く、ＬＳＩチップの高
集積化および高速化に伴う発熱量の増加に応じ切れない
という欠点を有している。The electronic components used in electronic devices in recent years have been highly integrated and increased in speed. In particular, electronic devices using LSI chips are
On-board (COB) mounting is required. However, when the circuit board on which the LSI chip is mounted in the form of COB is forcibly cooled by air cooling, the upper surface of the circuit board is cooled by the epoxy resin in the cooling means having the above-described configuration. However, since only the lower surface of the circuit board transmits the heat generated by the TAB chip and is cooled by the coolant, the cooling efficiency is low because the amount of heat to be cooled is limited, and the LSI chip is highly integrated. Also, it has a drawback that it cannot be cut off in response to an increase in the amount of heat generated as the speed increases.
【０００７】これを救済するため、冷却効率を高める手
段として液体冷却方式を用いると、冷却装置が複雑にな
るため、コストが上昇し装置が大型になるという問題を
発生する。If a liquid cooling system is used as a means for improving the cooling efficiency in order to remedy this problem, the cooling device becomes complicated, resulting in increased cost and large size of the device.
【０００８】[0008]
【課題を解決するための手段】本発明の電子部品の冷却
装置は、ＬＳＩチップをフェースアップ状態で実装する
ベース部および前記ベース部との間に熱伝導性と可塑性
の高い冷媒を封止した放熱部を有し回路基板に設けた貫
通穴に対応する位置に固定された台座と、前記回路基板
の前記貫通穴を貫通して前記放熱部と接触する熱伝導部
および前記熱伝導部に連続して設けられ前記放熱部およ
び前記熱伝導部を介して伝達された前記ＬＳＩチップの
熱を周囲の冷媒に伝達するフィンを有するヒートシンク
とを備えている。In a cooling device for electronic parts according to the present invention, a coolant having a high thermal conductivity and a high plasticity is sealed between a base portion on which an LSI chip is mounted face up and the base portion. A pedestal fixed to a position corresponding to a through hole provided on a circuit board having a heat dissipation part, and a heat conduction part which penetrates the through hole of the circuit board and contacts the heat dissipation part and the heat conduction part are continuous. And a heat sink having fins for transmitting the heat of the LSI chip transmitted through the heat radiating portion and the heat conducting portion to the surrounding coolant.
【０００９】[0009]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１０】図１は本発明の一実施例を示す断面図であ
る。FIG. 1 is a sectional view showing an embodiment of the present invention.
【００１１】図１において、ＴＡＢチップ１は、ＬＳＩ
チップを含んでいる。ＴＡＢチップ１を搭載する台座
は、熱伝導性が良好な材料（例えばＣｕ／Ｗ・ＢｅＯ）
で形成され、ＴＡＢチップ１をフェースアップ状態で実
装するベース部２ａと、熱伝導性が良好で充分な柔軟性
を有する材料（例えばシリコンゴム）で形成され、ベー
ス部２ａとの間に熱伝導性と可塑性の高い冷媒２ｃ（例
えばシリコン樹脂）を封止した放熱部２ｂを有してお
り、ＴＡＢチップ１は、熱伝導性が良好な接着剤３ａ
（例えば銀粉入りのエポキシ系接着剤）によってベース
部２ａに接着されている。In FIG. 1, the TAB chip 1 is an LSI
Includes chips. The pedestal on which the TAB chip 1 is mounted has a good thermal conductivity (eg Cu / W · BeO).
And a base portion 2a for mounting the TAB chip 1 in a face-up state, and a material having good thermal conductivity and sufficient flexibility (for example, silicon rubber), and heat conduction between the base portion 2a. The TAB chip 1 has the heat dissipation portion 2b in which the coolant 2c (for example, silicone resin) having high heat resistance and plasticity is sealed.
(For example, an epoxy adhesive containing silver powder) is adhered to the base portion 2a.
【００１２】プリント基板４は、上記の台座を装着する
位置に貫通穴４ａを設けており、表面のこの貫通穴４ａ
の外側に、ＴＡＢチップ１のリード１ａを接続するため
のパッド４ｂを設けている。パッド４ｂの外側には、シ
ーム溶接に適した材料（例えばコバール）で形成した金
属枠４ｃが、銀蝋等の接着剤で固着されている。金属枠
４ｃの上にはキャップ４ｅが搭載され、シーム溶接によ
って金属枠４ｃに固着されている。金属枠４ｃの外側に
は、ヒートシンク５をねじ固定するためのねじ止め用穴
４ｄが設けてある。台座のベース部２ａの外周部は、プ
リント基板４の貫通穴４ａとパッド４ｂとの間におい
て、接着剤３ｂ（例えばシリコン系の接着剤）によって
プリント基板４に固着されている。The printed circuit board 4 is provided with a through hole 4a at a position where the above pedestal is mounted, and the through hole 4a on the surface is provided.
A pad 4b for connecting the lead 1a of the TAB chip 1 is provided on the outer side of the pad. A metal frame 4c made of a material suitable for seam welding (for example, Kovar) is fixed to the outside of the pad 4b with an adhesive such as silver wax. A cap 4e is mounted on the metal frame 4c and is fixed to the metal frame 4c by seam welding. On the outside of the metal frame 4c, a screwing hole 4d for fixing the heat sink 5 with a screw is provided. The outer peripheral portion of the base portion 2a of the pedestal is fixed to the printed board 4 by an adhesive 3b (for example, a silicon-based adhesive) between the through hole 4a of the printed board 4 and the pad 4b.
【００１３】ヒートシンク５は、熱伝導性と加工性とが
良い材料（例えばアルミ材）によって形成されており、
プリント基板４の貫通穴４ａを貫通して台座の放熱部２
ｂと接触する熱伝導部５ａと、熱伝導部５ａに連続して
設けられて放熱部２ｂおよび熱伝導部５ａを介して伝達
されたＴＡＢチップ１の熱を周囲の冷媒に伝達する放熱
フィン５ｂとを有しており、外周部に、ねじ止め用穴４
ｄを介してボルト５ｄによってプリント基板４に固定す
るためのねじ穴５ｃを設けてある。The heat sink 5 is made of a material having good thermal conductivity and workability (for example, aluminum material),
The heat dissipation portion 2 of the pedestal penetrates through the through hole 4a of the printed circuit board 4.
b, the heat conducting portion 5a in contact with the heat conducting portion 5a, and the heat radiating fin 5b which is provided continuously to the heat conducting portion 5a and transmits the heat of the TAB chip 1 transmitted through the heat radiating portion 2b and the heat conducting portion 5a to the surrounding refrigerant. And has a screw hole 4 on the outer periphery.
A screw hole 5c is provided for fixing to the printed circuit board 4 with a bolt 5d via the d.
【００１４】次に、上述のように構成した電子部品の冷
却装置の作用について説明する。Next, the operation of the cooling device for electronic parts constructed as described above will be described.
【００１５】ヒートシンク５は、熱伝導部５ａをプリン
ト基板４の貫通穴４ａを貫通させ、ねじ止め用穴４ｄを
介してねじ穴５ｃにボルト５ｄを締付けることによって
プリント基板４に固定する。このとき、熱伝導部５ａの
上面は、台座の放熱部２ｂと所定の圧力で接触する。Ｔ
ＡＢチップ１が動作することによって発生する熱は、熱
伝導性が良好な接着剤３ａおよびベース部２ａおよび冷
媒２ｃおよび放熱部２ｂおよび熱伝導部５ａを介して、
効率よく放熱フィン５ｂに伝達される。放熱フィン５ｂ
は、ファン等によってその周囲に供給されている冷媒８
に熱を伝達する。このようにして、ＴＡＢチップ１の発
熱を効率よくかつ容易に冷却することができる。The heat sink 5 is fixed to the printed circuit board 4 by penetrating the heat conducting portion 5a through the through hole 4a of the printed circuit board 4 and fastening the bolt 5d to the screw hole 5c through the screwing hole 4d. At this time, the upper surface of the heat conducting portion 5a comes into contact with the heat radiating portion 2b of the pedestal at a predetermined pressure. T
The heat generated by the operation of the AB chip 1 is transferred through the adhesive 3a having good thermal conductivity, the base portion 2a, the coolant 2c, the heat radiating portion 2b, and the heat conducting portion 5a.
The heat is efficiently transmitted to the radiation fins 5b. Radiating fin 5b
Is the refrigerant 8 supplied to the surroundings by a fan or the like.
Transfer heat to. In this way, the heat generation of the TAB chip 1 can be efficiently and easily cooled.
【００１６】台座の冷媒２ｃと放熱部２ｂは、容易に変
形することができるため、熱伝導部５ａが放熱部２ｂに
接触したとき、台座のベース部２ａに圧力がかかるのが
防止される。従って、ベース部２ａやＴＡＢチップ１の
リード１ａの破損が防止される。また、熱伝導部５ａと
放熱部２ｂは固着されていないため、ヒートシンク５を
プリント基板４から容易に外すことができる。Since the coolant 2c and the heat radiating portion 2b of the pedestal can be easily deformed, it is possible to prevent pressure from being applied to the base portion 2a of the pedestal when the heat conducting portion 5a contacts the heat radiating portion 2b. Therefore, damage to the base portion 2a and the leads 1a of the TAB chip 1 is prevented. Further, since the heat conducting portion 5a and the heat radiating portion 2b are not fixed to each other, the heat sink 5 can be easily removed from the printed board 4.
【００１７】[0017]
【発明の効果】以上説明したように、本発明の電子部品
の冷却装置は、ＬＳＩチップを搭載する台座と、台座と
接触するヒートシンクとを設け、ＬＳＩチップに発生す
る熱を効率よくヒートシンクに伝達できるようにし、ヒ
ートシンクを冷媒によって強制的に冷却するように構成
することにより、電子部品を効率よく冷却することが可
能になるという効果があり、従って、ＬＳＩチップの高
集積化および高速化に伴う発熱量の増加に対応すること
が可能になるという効果がある。As described above, the electronic component cooling apparatus of the present invention is provided with the pedestal on which the LSI chip is mounted and the heat sink that is in contact with the pedestal, and efficiently transfers the heat generated in the LSI chip to the heat sink. By allowing the heat sink to be forcibly cooled by the coolant, there is an effect that it is possible to efficiently cool the electronic component. Therefore, with high integration and high speed of the LSI chip, There is an effect that it becomes possible to cope with an increase in heat generation amount.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】従来の電子部品の冷却装置の一例を示す断面図
である。FIG. 2 is a cross-sectional view showing an example of a conventional cooling device for electronic components.
１・１１ ＴＡＢチップ １ａ リード ２ａ ベース部 ２ｂ 放熱部 ２ｃ 冷媒 ３ａ・３ｂ・３ｃ・１３ａ 接着剤 ４・１４ プリント基板 ４ａ 貫通穴 ４ｂ パッド ４ｃ 金属枠 ４ｄ ねじ止め用穴 ４ｅ キャップ ５ ヒートシンク ５ａ 熱伝導部 ５ｂ 放熱フィン ５ｃ ねじ穴 ５ｄ ボルト ８・１８ 冷媒 １７ エポキシ樹脂 1.1 TAB chip 1a Lead 2a Base part 2b Heat dissipation part 2c Refrigerant 3a, 3b, 3c, 13a Adhesive 4.14 Printed circuit board 4a Through hole 4b Pad 4c Metal frame 4d Screwing hole 4e Cap 5 Heat sink 5a Heat conduction part 5b Heat dissipation fin 5c Screw hole 5d Bolt 8.18 Refrigerant 17 Epoxy resin
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 7/20 Ｆ 8727−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 7/20 F 8727-4E
Claims (2)
装するベース部および前記ベース部との間に熱伝導性と
可塑性の高い冷媒を封止した放熱部を有し回路基板に設
けた貫通穴に対応する位置に固定された台座と、前記回
路基板の前記貫通穴を貫通して前記放熱部と接触する熱
伝導部および前記熱伝導部に連続して設けられ前記放熱
部および前記熱伝導部を介して伝達された前記ＬＳＩチ
ップの熱を周囲の冷媒に伝達するフィンを有するヒート
シンクとを備えることを特徴とする電子部品の冷却装
置。1. A base portion for mounting an LSI chip in a face-up state and a heat radiating portion for sealing a coolant having high thermal conductivity and plasticity between the base portion and the base portion, and corresponding to a through hole provided in a circuit board. Through a pedestal fixed to a position, a heat conducting portion that penetrates the through hole of the circuit board and contacts the heat radiating portion, and the heat radiating portion and the heat conducting portion that are continuously provided to the heat conducting portion. And a heat sink having a fin for transmitting the heat of the LSI chip transmitted to a surrounding coolant.
装するベース部および前記ベース部との間に熱伝導性と
可塑性の高い冷媒を封止した放熱部を有し回路基板に設
けた貫通穴に対応する位置に配置されて前記回路基板に
接着によって固定された台座と、前記回路基板の前記貫
通穴を貫通して前記放熱部と接触する熱伝導部および前
記熱伝導部に連続して設けられ前記放熱部および前記熱
伝導部を介して伝達された前記ＬＳＩチップの熱を周囲
の冷媒に伝達するフィンを有し前記回路基板にねじによ
って固定されたヒートシンクとを備えることを特徴とす
る電子部品の冷却装置。2. A base portion for mounting an LSI chip in a face-up state and a heat radiating portion for sealing a coolant having high thermal conductivity and plasticity between the base portion and the base portion and corresponding to a through hole provided in a circuit board. A pedestal disposed at a position where the pedestal is fixed to the circuit board by adhesion, a heat conduction section that penetrates the through hole of the circuit board and contacts the heat dissipation section, and the heat conduction section is provided continuously to the heat conduction section. An electronic component comprising: a heat sink fixed to the circuit board with a screw, having a fin for transmitting the heat of the LSI chip transmitted through the heat radiating portion and the heat conducting portion to a surrounding coolant. Cooling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4231100A JPH0685120A (en) | 1992-08-31 | 1992-08-31 | Apparatus for cooling electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4231100A JPH0685120A (en) | 1992-08-31 | 1992-08-31 | Apparatus for cooling electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0685120A true JPH0685120A (en) | 1994-03-25 |
Family
ID=16918301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4231100A Withdrawn JPH0685120A (en) | 1992-08-31 | 1992-08-31 | Apparatus for cooling electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0685120A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1097348A (en) * | 1996-09-20 | 1998-04-14 | Toshiba Corp | Circuit module having heating circuit element and portable electronic instrument |
| JP2003337638A (en) * | 2001-10-23 | 2003-11-28 | Toshiba Corp | Portable electronic device |
| WO2005064577A1 (en) * | 2003-12-25 | 2005-07-14 | Nippon Seiki Co., Ltd. | Display device |
| US6958535B2 (en) * | 2000-09-22 | 2005-10-25 | Matsushita Electric Industrial Co., Ltd. | Thermal conductive substrate and semiconductor module using the same |
| CN114068450A (en) * | 2020-07-30 | 2022-02-18 | 舍弗勒技术股份两合公司 | Cooling member for printed circuit board member and printed circuit system |
-
1992
- 1992-08-31 JP JP4231100A patent/JPH0685120A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1097348A (en) * | 1996-09-20 | 1998-04-14 | Toshiba Corp | Circuit module having heating circuit element and portable electronic instrument |
| US6958535B2 (en) * | 2000-09-22 | 2005-10-25 | Matsushita Electric Industrial Co., Ltd. | Thermal conductive substrate and semiconductor module using the same |
| JP2003337638A (en) * | 2001-10-23 | 2003-11-28 | Toshiba Corp | Portable electronic device |
| WO2005064577A1 (en) * | 2003-12-25 | 2005-07-14 | Nippon Seiki Co., Ltd. | Display device |
| CN114068450A (en) * | 2020-07-30 | 2022-02-18 | 舍弗勒技术股份两合公司 | Cooling member for printed circuit board member and printed circuit system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991102 |