JPH0682910B2 - Circuit board manufacturing method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for manufacturing a circuit board used in an electronic device.

[Prior Art] Conventionally, a terminal portion of a circuit board is tapered by polishing a corner of a tip portion thereof in order to make it easy to enter the connector. In this case, when a plurality of circuit boards are manufactured by dividing one insulating substrate into so-called multiple pieces, the terminal portion must be formed at the edge portion toward the outside of the insulating substrate. However, there is a drawback in that mass production is poor because the maximum of two rows of circuit boards is divided from one insulating board.

On the other hand, in the method of manufacturing a circuit board disclosed in Japanese Patent Laid-Open No. 55-127096, a set of circuit patterns each having a plurality of connector contact terminals to be plated is provided with a connector of each circuit pattern. 2 on one insulating substrate in a state in which the contact terminals are opposed to each other and the opposing connector contact terminals are respectively connected by the energizing pattern for plating.
Form a set. After the connector contact terminals are plated, the cutting machine first separates the circuit board having a set of circuit patterns. Next, when the circuit board having this set of circuit patterns is divided into a single circuit board having one circuit pattern, a pair of circuit patterns are provided between opposing contact point terminals of the connector, that is, an energizing pattern for plating. V-shaped groove is formed on both sides of the insulating substrate in the area where
The circuit board with the connector contact terminals is obtained by dividing the circuit board along the groove. Simultaneously with the separation of the substrate in this way, the edge of the terminal portion can be tapered.

[Problems to be Solved by the Invention] However, when a circuit board having a set of circuit patterns is cut by a cutting machine before forming the V-shaped groove, each circuit board having a set of circuit patterns is separated. Since the work of forming the V-shaped groove has to be performed, there is a problem that mass productivity deteriorates. Further, if the cutting machine separates the circuit board having a set of circuit patterns before forming the V-shaped groove, there is a problem that automation of mounting of electronic components is also hindered.

Further, in the conventional method, the energizing pattern for plating is formed so thick as to be entirely connected to the connector contact terminal. Therefore, a large stress is applied to the contact terminal when cutting the energizing pattern for plating when forming the V-shaped groove. Easy,
The connector contact terminals may be peeled off or damaged.
Further, when the area of the energization pattern is increased, powder of a conductive material such as copper foil, which forms the energization pattern when the V-shaped groove is formed, adheres to the terminals, causing a short circuit between the terminals. is there.

The present invention has been made in view of the above problems of the conventional technique, and an object of the present invention is to provide a method for manufacturing a circuit board, which has a high yield in the manufacturing process and high mass productivity.

[Means for Solving the Problem] In the method of the present invention, a set of circuit patterns each having a plurality of connector contact terminals to be plated are made to face and are opposed to the connector contact terminals of each circuit pattern. A plurality of sets are formed on a single insulating substrate in such a manner that the connector contact terminals are connected to each other by a current-carrying pattern for plating. Then, at the boundary between the circuit patterns of each set, a divided portion having a reduced strength is formed by perforations. After forming the divided parts and plating the connector contact terminals, the width of the groove is wider than the depth of the groove from the front and back surfaces of the insulating substrate between the opposing connector contact terminals of the circuit pattern of each set, and the width of the groove is opposite to each other. Slightly narrower than the distance between the contact terminals of both connectors
Form a groove. After that, the insulating substrate is divided along the V-shaped groove and the dividing portion to obtain individual circuit boards with connector contact terminals. Further, the energizing pattern for plating is formed by a line thinner than the width of the connector contact terminal.

[Operation] In the method of manufacturing a circuit board of the present invention, the circuit board is not divided by using a cutting machine, the division portion is formed by perforations on the insulating substrate, and each circuit board is divided in the final step. The V-shaped groove has a lower mechanical strength than the perforations, and when the V-shaped groove is formed to divide a set of circuit patterns at the connector contact terminal portion, the divided portion is also a V-shaped groove. When formed, the mechanical strength of the entire insulating substrate before division is reduced, and cracks occur in the V-shaped groove during transportation of the insulating substrate or during the work of mounting electronic components on the entire insulating substrate. This causes a problem that the subsequent work cannot be continued. In the present invention, since the divided portion is formed by perforations, such a problem does not occur. Also in the present invention,
Since the circuit board is divided along the V-shaped groove and the dividing portion after the V-shaped groove is formed in the insulating substrate, mass productivity is excellent.

Further, if the line of the energizing pattern for plating is formed thinner than the width of the connector contact terminal, even if the energizing pattern for plating is cut when forming the V-shaped groove, a large stress may be applied to the terminal. In addition, the powder of the conductive material such as the copper foil forming the energizing pattern hardly adheres to the terminals, and the possibility of short circuit between the terminals is reduced.

Further, at the boundary of the terminal portions of the circuit patterns formed on the insulating substrate so as to face each other, the width of the groove is wider than the depth of the groove, and the width of the groove is V-shaped slightly narrower than the distance between the opposing connector contact terminals. Since a groove is formed to facilitate the division of the insulating substrate and to taper the terminal edge,
Further, it is possible to prevent the connector contact terminal from peeling off in the tapering work and improve the quality of the circuit board.

Embodiments Embodiments of the present invention will be described below with reference to the drawings.

1 (A) to (E) show a first embodiment of the present invention. FIG. 1 (A) shows an insulating substrate 1 based on phenol resin, epoxy resin, glass, ceramics or the like. A plurality of sets of circuit patterns 2 made of copper foil or conductive paint
Is formed. One set of circuit patterns 2 is formed on one large insulating substrate 1 within the range of one circuit substrate 4 which is finally divided. Further, the terminal portion 3 is composed of a plurality of connector contact terminals of the circuit pattern 2 facing each other.
3a are arranged so as to face each other, and further, the terminals 3a facing each other are connected by a conductive pattern 3b for plating made of a wire thinner than the width of the terminal 3a so as to be continuously formed. The terminal 3a is plated with gold.

Further, among the boundaries between the circuit boards 4, except the part where the terminal part 3 is located, as a divided part with reduced strength,
The perforations 5 are formed by punching and can be easily divided later for each circuit board 4.

Next, the insulating substrate 1 formed as described above
As shown in FIG. 1B, the V-cut processing machine (not shown) is mounted and positioned between the pair of cutters 6. The cutting edge angle θ of the cutter 6 is 120 °. Insulating substrate 1
Is attached such that the blade tip of the cutter 6 is located between the pair of cutters 6 on the boundary line connecting the terminal portions 3 to each other.

Then, as shown in FIG. 1 (C), when the cutter 6 is rotated, the cutting edge forms a V-shaped groove 7 having a predetermined depth on the front and back surfaces of the substrate 1, and the angle θ of the V-shaped groove 7 is formed. Is 120 °,
The width of the opening of the groove is set to be wider than the maximum depth of the groove and slightly narrower than the distance between the opposite connector contact terminals.

When dividing the circuit board 4, V
The insulating substrate 1 in which the V-shaped groove 7 is formed is folded along the perforations 5 and the V-shaped groove 7 to obtain individual circuit boards 4 as shown in FIG. 1 (D). The terminal portion 3 of the circuit board 4 is inserted into the connector 8 of the electronic device.

The circuit board 4 manufactured in this manner has a taper formed by the V-shaped groove 7 on the end face of the terminal portion 3, and the depth of the V-shaped groove 7 is shallower than the width, and this taper is also gentle. , The connector 8 can be easily inserted. Moreover, the width of the groove is made slightly narrower than the distance between the opposite connector contact terminals, and when forming the V-shaped groove 7, only a very thin pattern is cut, so that in the step of forming the V-shaped groove 7. There is little adverse effect on the terminal 3a itself, and peeling or damage of the terminal 3a can be prevented. Further, the processing for forming the taper and the processing for division can be performed at the same time by the V-cut processing, and the number of steps and cost can be reduced.

Further, the terminal portion 3 can be formed also in the central portion of one large insulating substrate 1, so that more effective multi-cavity production is possible.

When the energization pattern 3b for plating is formed by a thin line as in the present embodiment, a large stress is not applied to the terminal 3a during the V-cut processing after the formation of the terminal 3a, and even if the energization pattern is scraped, Since only a small amount of conductive material powder such as copper foil is generated, a short circuit or the like does not occur between the terminals 3a. This is particularly effective for a circuit board in which the distance between the terminals 3a is narrow.

In the present invention, the perforation process may be any process, and may be performed after the V-cut processing. Further, the circuit pattern and the terminal may be formed on one side or both sides of the insulating substrate, the circuit pattern may be formed of copper foil and the terminal may be provided with a conductive paint, and the conductive paint may be further provided on the copper foil. The terminals may be formed by printing.

According to this embodiment, the circuit board and the circuit pattern are two-dimensionally formed on one insulating substrate, the terminal portions of the circuit board are provided to face each other, and the terminals of the circuit pattern face each other. Since the boundary line of the part having the V shape is V-cut to form the V-shaped groove, it is possible to increase the number of so-called multiple cavities. Moreover, the taper forming process of the terminal portion is not necessary, and the man-hour and cost can be significantly reduced.

Further, since the width of the V-shaped groove is wider than the depth, the opening angle of the V-shaped groove is large, the degree of stress concentration at the groove bottom is small, and the insulating substrate is not cracked during manufacturing.

Further, the width of the groove is set to be slightly narrower than the interval between the connector contact terminals facing each other, and an extremely fine pattern is formed when the connector contact terminals are plated, so that the V-shaped groove forms the connector contact terminals. It is possible to prevent peeling and breakage, and it becomes possible to manufacture a higher quality substrate with connector contact terminals.

[Effect of the Invention] According to the present invention, the circuit board is not divided by using a cutting machine, and the division portion is formed on the insulating substrate by perforations, and each circuit board is divided in the final step. Since it is not necessary to form a V-shaped groove, it is excellent in mass productivity. In addition, the division is V
Since it is formed with perforations that have higher mechanical strength than the V-shaped groove, even when the terminal is tapered by the V-shaped groove,
The mechanical strength of the entire insulating substrate before division is not significantly reduced, and the V-shaped groove is formed when the insulating substrate is transported or when electronic components are mounted on the entire insulating substrate. It is possible to prevent the occurrence of a problem that cracks occur and the subsequent work cannot be continued.

Further, if the line of the energizing pattern for plating is formed thinner than the width of the connector contact terminal, even if the energizing pattern for plating is cut when forming the V-shaped groove, a large stress may be applied to the terminal. Since it is possible to prevent the terminal from peeling off or being damaged, powder of a conductive material such as a copper foil forming the energizing pattern hardly adheres to the terminal portion.
There is an advantage that a short circuit between terminals is less likely to occur.

[Brief description of drawings]

1 (A), (B), (C), (D) and (E) are schematic views showing the steps of the first embodiment of the present invention. 1 ... Insulating substrate, 2 ... Circuit pattern, 3 ... Terminal part, 3a ... Terminal, 3b ... Plating energizing pattern, 4 ... Circuit board, 5 ...
Perforations, 6 ... Cutter, 7 ... V-shaped groove.

Claims (2)

[Claims] 1. A set of circuit patterns each having a plurality of connector contact terminals to be plated, wherein the connector contact terminals of each circuit pattern are opposed to each other and the opposed connector contact terminals are for plating. A plurality of sets are formed on a single insulating substrate in a manner that they are connected to each other by energizing patterns, and a divided portion with reduced strength is formed by perforations at the boundary of the circuit pattern of each set, and after the connector contact terminals are plated, , The width of the groove is wider than the depth of the groove from the front and back surfaces of the insulating substrate between the opposing connector contact terminals of the circuit patterns of each set, and the width of the groove is slightly smaller than the distance between the opposing connector contact terminals. A circuit in which a narrow V-shaped groove is formed, and then the insulating substrate is divided along the V-shaped groove and the dividing portion to obtain individual circuit boards with connector contact terminals. Method of manufacturing the plate. 2. The method for manufacturing a circuit board according to claim 1, wherein the energizing pattern for plating is formed by a line thinner than the width of the connector contact terminal.