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JPH0682383A - Inspection device for mounted printed circuit board - Google Patents

Inspection device for mounted printed circuit board

Info

Publication number
JPH0682383A
JPH0682383A JP23478092A JP23478092A JPH0682383A JP H0682383 A JPH0682383 A JP H0682383A JP 23478092 A JP23478092 A JP 23478092A JP 23478092 A JP23478092 A JP 23478092A JP H0682383 A JPH0682383 A JP H0682383A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
mounted printed
inspection
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23478092A
Other languages
Japanese (ja)
Inventor
Hiroyoshi Saitou
広能 齊藤
Toshimichi Chikamura
敏道 近村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP23478092A priority Critical patent/JPH0682383A/en
Publication of JPH0682383A publication Critical patent/JPH0682383A/en
Pending legal-status Critical Current

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To obtain the inspection device shortening an inspection time by using two sensors to allow them to scan at the same time. CONSTITUTION:Unit inspection devices 13, 14, 15, 16 are arranged on the same circumference of a circle at equal intervals with respect to the center of a rotary member 12 so as to successively scan mounted printed circuit boards 10, 10'. The mounted printed circuit boards 10, 10' are moved in the direction shown by an arrow A by the distance predetermined by a printed circuit board feed device in synchronous relation to the pulse output of an angle-of-rotation detector detecting the angle of rotation of the rotary member 12. By this constitution, the whole of the mounted printed circuit boards can be scanned.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は実装済みプリント基板の
検査装置に関するもので、特に細かく絞ったビームスポ
ットを用いて実装された部品の位置ズレ,欠品,ハンダ
付け不良,ハンダブリッヂなどを検査しようとするもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for inspecting a printed circuit board that has been mounted, and in particular, it uses a beam spot that has been finely squeezed to inspect for misalignment, missing items, soldering defects, solder bridges and the like. Is what you are trying to do.

【0002】[0002]

【従来の技術】従来、実装済みプリント基板の位置ズ
レ、欠品,ハンダ付け不良,ハンダブリッヂなどを自動
的に検査する装置として、回転体を使い、ビームスポッ
トの反射を利用したものがある。
2. Description of the Related Art Conventionally, as a device for automatically inspecting a mounted printed circuit board for misalignment, missing parts, defective soldering, solder bridge, and the like, there is a device which uses a rotating body and utilizes reflection of a beam spot.

【0003】以下、図面を参照しながら説明する。図4
は従来の実装済みプリント基板の検査装置の一例を示す
斜視図であり、図4において、12は回転駆動される回転
体であり、この回転体の同一円周上に位置する13,14,
15,16はそれぞれビームスポットを照射し、複数の反射
光を受光する単位検査装置である。19は照射光、20は反
射光である。17は単位検査装置16が査走している現図示
状態での走査軌跡、18は次の単位走査装置13が走査する
軌跡である。10は検査される実装済みプリント基板であ
り矢印Aの方向に移動している。
A description will be given below with reference to the drawings. Figure 4
FIG. 4 is a perspective view showing an example of a conventional mounted printed circuit board inspection apparatus. In FIG. 4, reference numeral 12 denotes a rotationally driven rotating body, which is located on the same circumference of the rotating body.
Reference numerals 15 and 16 denote unit inspection devices that respectively irradiate a beam spot and receive a plurality of reflected lights. 19 is irradiation light and 20 is reflected light. Reference numeral 17 denotes a scanning locus in the present illustrated state in which the unit inspection device 16 scans, and 18 denotes a locus scanned by the next unit scanning device 13. Reference numeral 10 denotes a mounted printed circuit board to be inspected, which is moving in the direction of arrow A.

【0004】以上のように構成された実装済みプリント
基板の検査位置について、以下にその動作について説明
する。回転駆動される回転体12の同一円周上に位置する
複数のビームスポット発生手段と実装済みプリント基板
よりのビームスポットの反射光を受光する複数の受光素
子からなる複数の単位検査装置13〜16の1つが回転体12
の回転に伴って、前記実装済みプリント基板10の凹凸を
検査する。前記1つの単位検査装置が前記実装済みプリ
ント基板10を走査し通過する度に実装済みプリント基板
を移動せしめる手段が一定幅の矢印Aの方向へ前進し、
次の単位検査装置での検査に備える。上記動作を繰り返
すことにより実装済みプリント基板の検査を行う。
The operation of the inspection position of the mounted printed circuit board having the above structure will be described below. A plurality of unit inspection devices 13 to 16 composed of a plurality of beam spot generating means located on the same circumference of the rotationally driven rotating body 12 and a plurality of light receiving elements for receiving the reflected light of the beam spot from the mounted printed circuit board. One is the rotating body 12
The unevenness of the mounted printed circuit board 10 is inspected with the rotation of. A means for moving the mounted printed circuit board each time the one unit inspection device scans and passes the mounted printed circuit board 10 advances in the direction of arrow A having a constant width,
Prepare for inspection at the next unit inspection device. The mounted printed circuit board is inspected by repeating the above operation.

【0005】[0005]

【発明が解決しようとする課題】上記のような構成で
は、1つの単位検査装置が実装済みプリント基板上を走
査している間、その対面(180°対称方向)等の単位検査
装置は使用されていない。そのため検査装置及び検査時
間に空間的,時間的無駄が生じている。
With the above-described structure, while one unit inspection device scans the mounted printed circuit board, the unit inspection device such as the facing surface (180 ° symmetry direction) is not used. Not not. Therefore, the inspection device and the inspection time are wasteful in space and time.

【0006】本発明はこのような点に鑑み、検査装置と
検査時間の空間的,時間的無駄を省くことを目的とす
る。
In view of the above points, an object of the present invention is to save the inspection device and inspection time in terms of space and time.

【0007】[0007]

【課題を解決するための手段】本発明は、回転駆動され
る回転体に対して相対的に検査すべき2つまたはそれ以
上の独立した実装済みプリント基板を移動せしめる手段
と、前記回転体の回転中心を中心とする同一円周上に位
置し、それぞれ前記実装済みプリント基板にほぼ垂直な
方向よりビームスポットを照射し、前記ビームスポット
が前記回転体の回転に伴って2つまたはそれ以上の箇所
でそれぞれ1枚の実装済みプリント基板を同時に検査す
る手段とを有することを特徴とする。
SUMMARY OF THE INVENTION The present invention comprises means for moving two or more independent mounted printed circuit boards to be inspected relative to a rotationally driven rotating body, and said rotating body. Positioned on the same circumference centered on the center of rotation, each of the mounted printed boards is irradiated with a beam spot from a direction substantially perpendicular thereto, and the beam spot has two or more beam spots as the rotor rotates. And a means for simultaneously inspecting one mounted printed circuit board at each location.

【0008】[0008]

【作用】本発明によれば、回転駆動される回転体の対称
位置または任意の位置において実装済みプリント基板を
同時に検査を行うことができ実装済みプリント基板の1
枚あたりの検査時間を減少させることができる。通常の
方法で検査時間を短縮しようとすると複数台の検査装置
が必要であるが、本発明では複数台の検査装置と同じ効
果をより安いコストで、より狭い空間で実現することが
可能となる。
According to the present invention, the mounted printed circuit boards can be simultaneously inspected at symmetrical positions or arbitrary positions of the rotationally driven rotating body.
The inspection time per sheet can be reduced. In order to reduce the inspection time by the usual method, a plurality of inspection apparatuses are required, but in the present invention, it is possible to realize the same effect as the plurality of inspection apparatuses at a lower cost in a narrower space. .

【0009】[0009]

【実施例】以下、本発明の一実施例の実装済みプリント
基板の検査装置について図面を参照しながら説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An inspection apparatus for a mounted printed circuit board according to an embodiment of the present invention will be described below with reference to the drawings.

【0010】図1は本発明の一実施例におけるビームス
ポット投光用光学系と受光用光学系群が一体となった単
位検査装置の斜視図である。
FIG. 1 is a perspective view of a unit inspection device in which an optical system for projecting a beam spot and an optical system group for receiving light are integrated in one embodiment of the present invention.

【0011】1はたとえば、レーザーを使ったビームス
ポット投光用光学系、2,4,6,8は前記ビームスポ
ットの反射面からの反射光を受け、その反射面の高さ及
び輝度情報を得るための半導体検出素子(PSD)のよう
な光電変換素子でなる受光用光学系である。このPSD
は、ある所定の長さを有し、ビームスポットの照射位置
に応じて複数の出力端子の出力が相対的に変化するもの
で、これにはCCD(電荷結合素子)ラインセンサー等を
用いることも可能である。3,5,7,9は三角測量を
行うために実装済みプリント基板からの反射ビームスポ
ットを前記光電変換素子2,4,6,8上にそれぞれ結
像するためのレンズ(もしくはレンズ群)である。これら
の光電変換素子及びレンズはビームスポット11の光軸周
辺に配置され、本実施例では4組のビームスポットを中
心とする同一円周上に等間隔に配置されている。10は実
装済みプリント基板であり、ビームスポット11は実装済
みプリント基板10に対してほぼ垂直に照射されている。
本実施例では2枚の実装済みプリント基板を同時に検査
するが、それ以上であってもなんら問題はない。
Reference numeral 1 denotes, for example, an optical system for projecting a beam spot using a laser, and reference numerals 2, 4, 6, 8 receive reflected light from the reflecting surface of the beam spot, and display height and brightness information of the reflecting surface. The light receiving optical system is a photoelectric conversion element such as a semiconductor detection element (PSD) for obtaining. This PSD
Has a certain predetermined length, and the outputs of a plurality of output terminals relatively change according to the irradiation position of the beam spot. For this, a CCD (charge coupled device) line sensor or the like may be used. It is possible. Reference numerals 3, 5, 7, and 9 are lenses (or lens groups) for imaging the reflected beam spots from the mounted printed circuit board on the photoelectric conversion elements 2, 4, 6, and 8 to perform triangulation. is there. These photoelectric conversion elements and lenses are arranged around the optical axis of the beam spot 11, and in the present embodiment, they are arranged at equal intervals on the same circumference centered on the four beam spots. Reference numeral 10 denotes a mounted printed circuit board, and the beam spot 11 is irradiated substantially perpendicular to the mounted printed circuit board 10.
In this embodiment, two mounted printed circuit boards are inspected at the same time, but there is no problem even if the number is greater than that.

【0012】図2は本発明の一実施例の検査装置全体の
斜視図である。図2において、13,14,15,16は図1で
示した投光・受光の光学系群が一体になった1つの単位
検査装置、12はモーター等の駆動源(図示せず)によりほ
ぼ一定速度で回転駆動される回転体(円板)、前記単位検
査装置13,14,15,16は、回転体12の中心に対し同一円
周上に等間隔に、回転体12の回転に伴って前記ビームス
ポットが順次2つの実装済みプリント基板10,及び10′
を走査するようにするよう位置されている。
FIG. 2 is a perspective view of the whole inspection apparatus according to one embodiment of the present invention. In FIG. 2, 13, 14, 15, and 16 are one unit inspection device in which the optical system groups for projecting and receiving light shown in FIG. 1 are integrated, and 12 is a drive source (not shown) such as a motor. The rotating body (disc), which is rotationally driven at a constant speed, has the unit inspection devices 13, 14, 15, and 16 that rotate with the rotating body 12 at equal intervals on the same circumference with respect to the center of the rotating body 12. The two beam spots are sequentially mounted on the two printed circuit boards 10 and 10 '.
Are positioned to scan.

【0013】実装済みプリント基板10及び10′は前記回
転体12の回転角度を検出する回転角度検出装置のパルス
出力と同期して、後述の構成よりなるプリント基板送り
装置により予め定められた距離だけ矢印方向Aに順次移
動される。これにより実装済みプリント基板10,10′の
全体をビームスポット11,11′により走査することが可
能となる。17,17′は現在、単位検査装置14,16で走査
している軌跡を示しており、18,18′は次に単位検査装
置15,13で走査する軌跡を示している。
The mounted printed circuit boards 10 and 10 'are synchronized with the pulse output of the rotation angle detecting device for detecting the rotation angle of the rotating body 12 and are separated by a predetermined distance by a printed circuit board feeding device having a structure described later. It is sequentially moved in the direction of arrow A. As a result, it becomes possible to scan the entire mounted printed circuit boards 10, 10 'with the beam spots 11, 11'. Reference numerals 17 and 17 'indicate the loci of scanning by the unit inspection devices 14 and 16 at present, and 18 and 18' indicate trajectories of the next unit inspection devices 15 and 13.

【0014】図2においては、単位検査装置14,16が走
査完了すると実装済みプリント基板10,10′がA方向へ
移動して次の単位検査装置13,15の走査開始前に移動が
終了するようになっており最小時間で検査を終了するこ
とができる。
In FIG. 2, when the unit inspection devices 14 and 16 have completed scanning, the mounted printed circuit boards 10 and 10 'are moved in the direction A and the movement is completed before the next unit inspection devices 13 and 15 start scanning. As a result, the inspection can be completed in the minimum time.

【0015】図3は本実施例の検査装置の電気回路のブ
ロック図を示し、光電変換素子からの照射位置により相
対的に値が変化する2つの電流出力を演算して高さ情報
及び輝度情報を得るものである。図3において、31は光
電変換素子2の2つの電流出力から割算器52を通して高
さ情報を得、また、前記2つの電流値の和よりオペアン
プ53を通して輝度情報を得ている高さ及び輝度情報検出
回路である。32,33,34も前記高さ及び輝度情報検出回
路31と同様であり光電変換素子4,6,8に接続されて
いる。この場合、光電変換素子を4個使用しているため
高さ及び輝度情報も1つの光点に対して4個出力され
る。
FIG. 3 is a block diagram of an electric circuit of the inspection apparatus of the present embodiment, in which two current outputs whose values relatively change depending on the irradiation position from the photoelectric conversion element are calculated to calculate height information and luminance information. Is what you get. In FIG. 3, 31 indicates height information obtained from two current outputs of the photoelectric conversion element 2 through a divider 52, and luminance information obtained through an operational amplifier 53 from the sum of the two current values. This is an information detection circuit. 32, 33 and 34 are also similar to the height and brightness information detection circuit 31 and are connected to the photoelectric conversion elements 4, 6 and 8. In this case, since four photoelectric conversion elements are used, four pieces of height and luminance information are also output for one light spot.

【0016】35は4個の高さ情報から1つの高さ情報を
得る高さ情報選択回路であり、選択方法として例えば4
個のうち最大レベルと最小レベルを除いた残りの2つの
平均をとる方法がある。36は35と同様に、4個の輝度情
報から1つの輝度情報を得る輝度情報選択回路であり、
選択方法として例えば4個のうち最大レベルをとる方法
がある。前記2つの高さ及び輝度の情報選択回路35,36
はRAM37の節約及び前処理をつけることによるCPU
38の負荷軽減の目的でもうけられたものである。
Reference numeral 35 is a height information selection circuit for obtaining one height information from four pieces of height information.
There is a method of taking the average of the remaining two excluding the maximum level and the minimum level. 36, like 35, is a brightness information selection circuit for obtaining one brightness information from four brightness information,
As a selection method, for example, there is a method of taking the maximum level among the four. The two height and luminance information selection circuits 35 and 36
CPU by saving RAM37 and adding pre-processing
It was made for the purpose of reducing the load of 38.

【0017】前記2つの高さ及び輝度の情報選択回路3
5,36の出力は、CPU38のバスに接続されているRA
M37へ送られる。CPU38は、前記RAM37より読み出
された高さ及び輝度の両情報と、予め基準となる実装済
みプリント基板から得られ、記憶されている高さ及び輝
度の両情報とを比較し、被検査実装済みプリント基板の
良否を決定する。
The above-mentioned two height and luminance information selection circuits 3
The outputs of 5 and 36 are RA connected to the bus of CPU38.
It is sent to M37. The CPU 38 compares the height information and the luminance information read from the RAM 37 with the height information and the luminance information stored in advance that is obtained from the mounted printed circuit board serving as a reference and compares the height information and the luminance information. Determine the quality of the printed circuit board.

【0018】以上のような本実施例は、検査すべき複数
(図面では2個)の実装済みプリント基板10,10′に垂直
にビームスポット11,11′を照射し、そのビームスポッ
トの周囲に配置された複数の光電変換素子2,4,6,
8と共に移動せしめながら実装済みプリント基板の各点
の高さ及び輝度の変化を計測するものであるため、実装
済みプリント基板の各点は同一条件で計測され良好な検
査ができる。
This embodiment as described above has a plurality of inspection targets.
Beam spots 11 and 11 'are vertically irradiated onto the mounted printed circuit boards 10 and 10' (two in the drawing), and a plurality of photoelectric conversion elements 2, 4, 6 arranged around the beam spots.
Since the change in height and brightness of each point of the mounted printed circuit board is measured while moving together with 8, each point of the mounted printed circuit board is measured under the same conditions, and a good inspection can be performed.

【0019】また、実装済みプリント基板からの反射光
は、ビームスポットの周囲に配置された複数の光電変換
素子により受光されるよう構成されているため、実装済
みプリント基板からの反射光が種種の拡散特性になって
もそれに伴う検査結果の変動を小さくできるものであ
る。
Further, since the reflected light from the mounted printed circuit board is configured to be received by the plurality of photoelectric conversion elements arranged around the beam spot, the reflected light from the mounted printed circuit board is of various kinds. Even if the diffusion characteristic is obtained, the variation of the inspection result due to the diffusion characteristic can be reduced.

【0020】さらに、ビームスポット11,11′の実装済
みプリント基板10,10′上の走査は、回転体12に接続さ
れた回転角度検出装置からの出力パルスをプリント基板
送り装置(図略)に入力することで行う。即ち、実装済み
プリント基板10,10′は回転体12の回転角度に同期して
プリント基板送り装置により正確に移動されるため、実
装済みプリント基板上に走査位置を正確に決定すること
ができる。
Further, for scanning the mounted printed circuit boards 10, 10 'of the beam spots 11, 11', the output pulse from the rotation angle detection device connected to the rotating body 12 is sent to the printed circuit board feeding device (not shown). Do by typing. That is, since the mounted printed circuit boards 10 and 10 'are accurately moved by the printed circuit board feeding device in synchronization with the rotation angle of the rotating body 12, the scanning position on the mounted printed circuit board can be accurately determined.

【0021】尚、実施例では実装済みプリント基板上の
高さと輝度の両方を検出するよう構成しているが、検査
精度が低くても良いという場合には、その一方のみを検
査するような構成にして良いものである。
In the embodiment, both the height and the brightness on the mounted printed circuit board are detected. However, when the inspection accuracy may be low, only one of them is inspected. It is a good thing to do.

【0022】[0022]

【発明の効果】以上説明したように本発明の実装済みプ
リント基板の検査装置は、投光光学系からのビームスポ
ットを実装済みプリント基板にほぼ垂直に照射し、その
光軸のまわりに複数の受光光学系を配置し、それら投受
光光学系が一体となって複数の実装済みプリント基板上
に計測しながら走査していくことにより、従来の検査装
置では困難であった検査装置空間の節減と検査時間の短
縮をはかることができる。
As described above, the mounted printed circuit board inspecting apparatus of the present invention irradiates the mounted printed circuit board with a beam spot from the projection optical system almost vertically, and a plurality of beam spots are provided around the optical axis. By arranging the light receiving optical system and scanning them while measuring them on multiple mounted printed circuit boards as one unit, it is possible to save the inspection device space which was difficult with the conventional inspection device. The inspection time can be shortened.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例におけるビームスポット投光
用光学系と受光用光学系群が一体となった検査装置の斜
視図である。
FIG. 1 is a perspective view of an inspection apparatus in which an optical system for projecting a beam spot and an optical system group for receiving light are integrated in one embodiment of the present invention.

【図2】本発明の一実施例の検査装置全体を示す斜視図
である。
FIG. 2 is a perspective view showing an entire inspection device according to an embodiment of the present invention.

【図3】本実施例の検査装置の電気回路のブロック図で
ある。
FIG. 3 is a block diagram of an electric circuit of the inspection apparatus of this embodiment.

【図4】従来の実装済みプリント基板の検査装置の一例
を示す斜視図である。
FIG. 4 is a perspective view showing an example of a conventional mounted printed circuit board inspection apparatus.

【符号の説明】[Explanation of symbols]

1…ビームスポット投光用光学系、 2,4,6,8…
光電変換素子、 3,5,7,9…レンズもしくはレン
ズ群、 10,10′…実装済みプリント基板、 11,11′
…ビームスポット、 12…回転体、 13,14,15,16…
単位検査装置。
1 ... Optical system for projecting beam spot, 2, 4, 6, 8 ...
Photoelectric conversion element, 3, 5, 7, 9 ... Lens or lens group, 10, 10 '... Mounted printed circuit board, 11, 11'
… Beam spot, 12… Rotating body, 13, 14, 15, 16…
Unit inspection device.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 回転駆動される回転体に対して相対的に
検査すべき2つまたはそれ以上の独立した実装済みプリ
ント基板を移動せしめる手段と、前記回転体の回転中心
を中心とする同一円周上に位置し、それぞれ前記実装済
みプリント基板に垂直な方向よりビームスポットを照射
し、そのビームスポットが前記回転体の回転に伴って2
つまたはそれ以上の箇所でそれぞれ1枚の実装済みプリ
ント基板を同時に検査する手段とを有することを特徴と
する実装済みプリント基板の検査装置。
1. A means for moving two or more independent mounted printed circuit boards to be inspected relative to a rotationally driven rotating body, and a same circle having a center of rotation of the rotating body as a center. Beam spots are located on the circumference of the mounting printed circuit board and are radiated in a direction perpendicular to the mounted printed circuit board.
And a means for simultaneously inspecting one mounted printed circuit board at one or more points, respectively.
JP23478092A 1992-09-02 1992-09-02 Inspection device for mounted printed circuit board Pending JPH0682383A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23478092A JPH0682383A (en) 1992-09-02 1992-09-02 Inspection device for mounted printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23478092A JPH0682383A (en) 1992-09-02 1992-09-02 Inspection device for mounted printed circuit board

Publications (1)

Publication Number Publication Date
JPH0682383A true JPH0682383A (en) 1994-03-22

Family

ID=16976261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23478092A Pending JPH0682383A (en) 1992-09-02 1992-09-02 Inspection device for mounted printed circuit board

Country Status (1)

Country Link
JP (1) JPH0682383A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009259984A (en) * 2008-04-15 2009-11-05 Hitachi High-Tech Instruments Co Ltd Electronic component mounting apparatus and method of mounting electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009259984A (en) * 2008-04-15 2009-11-05 Hitachi High-Tech Instruments Co Ltd Electronic component mounting apparatus and method of mounting electronic component

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