JPH0675796B2 - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPH0675796B2 JPH0675796B2 JP61061688A JP6168886A JPH0675796B2 JP H0675796 B2 JPH0675796 B2 JP H0675796B2 JP 61061688 A JP61061688 A JP 61061688A JP 6168886 A JP6168886 A JP 6168886A JP H0675796 B2 JPH0675796 B2 JP H0675796B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flux
- cream solder
- oleic acid
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 29
- 239000006071 cream Substances 0.000 title claims description 15
- 230000004907 flux Effects 0.000 claims description 19
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 9
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 9
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 9
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000005642 Oleic acid Substances 0.000 claims description 9
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 9
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 9
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 4
- 239000012190 activator Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000007689 inspection Methods 0.000 description 4
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical class Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000006224 matting agent Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- -1 amine hydrochloride Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000013020 steam cleaning Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明はクリームはんだの改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to an improvement in cream solder.
＜先行技術と問題点＞ 近来、プリント導体回路にマウントする回路素子をチッ
プ化することが多く、このチップ化回路素子のマウント
には、クリームはんだを用いたリフロー法が使用されて
いる。このリフロー法においては、第１図に示すように
はんだ付けすべき導体面にクリームはんだａを印刷法に
より塗布し、次いで、第２図に示すようにチップ化回路
素子ｂをクリームはんだの粘着力を利用して仮固定し、
而るのち、加熱炉に通してクリームはんだを溶融させて
いる。<Prior Art and Problems> Recently, a circuit element mounted on a printed conductor circuit is often made into a chip, and a reflow method using cream solder is used for mounting the chipped circuit element. In this reflow method, as shown in FIG. 1, cream solder a is applied to the conductor surface to be soldered by a printing method, and then as shown in FIG. Temporarily fix using
After that, the cream solder is melted by passing through a heating furnace.
而して、第２図に示すチップ化回路素子ｂの仮固定の際
には、素子が導体面に当接されるときの加圧力によっ
て、クリームはんだが正規のはんだ付面より拡大し、は
んだ付け後においては、素子の接触していない露出の導
体面にもはんだの不可避的な付着がある。Thus, when the chipped circuit element b shown in FIG. 2 is temporarily fixed, the cream solder expands from the regular soldering surface due to the pressure applied when the element contacts the conductor surface, After attachment, solder is inevitably attached to the exposed conductor surface of the element which is not in contact.
ところで、上記はんだ付け後においては、素子が所定の
位置にマウントされているかどうかを検査し、次いで、
フラックス残渣を除去するための洗浄が不可欠である。By the way, after soldering, it is inspected whether the element is mounted at a predetermined position, and then,
Cleaning to remove flux residues is essential.
而して、この検査には光学的な方法を用いることが有利
である。しかし、上記露出導体面へのはんだ付着のため
に当該露出導体面が反射性になると、上記光学的検査の
際に、その反射性面での反射がノイズとなって正確な検
査を行い難い。Therefore, it is advantageous to use an optical method for this inspection. However, if the exposed conductor surface becomes reflective due to the adhesion of solder to the exposed conductor surface, the reflection on the reflective surface becomes noise during the optical inspection, which makes it difficult to perform an accurate inspection.
而るに、かかる不合理を解消する方法として、クリーム
はんだにつや消し剤を添加することが考えられる。しか
しながら、公知のつや消し剤においては、上記したフラ
ックス残渣を除去するための洗浄が困難であり、特に、
チップ化素子の場合は、第２図に示すように、チップ化
素子直下が加圧により拡大されたフラックスでほぼ充填
されてしまい、その直下への洗浄液の侵入が困難であ
り、従って、導体間の絶縁抵抗を残留フラックスのため
に充分に確保し難い。Therefore, as a method of eliminating such irrationalities, it is possible to add a matting agent to the cream solder. However, in the known matting agent, it is difficult to clean the above-mentioned flux residue, and in particular,
In the case of the chipped element, as shown in FIG. 2, the portion immediately below the chipped element is almost filled with the flux expanded by the pressurization, and it is difficult for the cleaning liquid to enter the portion directly below the element. It is difficult to secure sufficient insulation resistance due to residual flux.
＜発明の目的＞ 本発明の目的は、つや消し剤の改良により、上記洗浄後
での絶縁抵抗を充分に確保できるクリームはんだを提供
することにある。<Object of the Invention> An object of the present invention is to provide a cream solder capable of sufficiently securing the insulation resistance after the cleaning by improving the matting agent.
＜発明の構成＞ 本発明に係るクリームはんだは、活性剤を含有するロジ
ンを主成分とするフラックスと粉末はんだとの混合物に
おいて、オレイン酸を添加したことを特徴とするもので
ある。<Structure of the Invention> A cream solder according to the present invention is characterized in that oleic acid is added to a mixture of a flux containing an activator and containing rosin as a main component and a powder solder.
＜実施例の説明＞ 本発明において使用するフラックスの主成分はロジンと
有機溶剤例えばアルコールとの混合物からなるペースト
状物質である。添加する活性剤には、アミンの塩酸塩、
臭酸塩、例えばジエチルアミンHBrを用いることができ
る。また、フラックスと粉末はんだとの分離防止のため
に適当な物質、例えば水素添加ヒマシ油を添加すること
もできる。粉末はんだには、通常200メッシュ通過のも
のを用いる。<Description of Examples> The main component of the flux used in the present invention is a paste-like substance made of a mixture of rosin and an organic solvent such as alcohol. The activator to be added includes amine hydrochloride,
Hydrobromic acid salts such as diethylamine HBr can be used. Further, an appropriate substance such as hydrogenated castor oil may be added to prevent separation of the flux and the powdered solder. As the powdered solder, one that passes through 200 mesh is usually used.
オレイン酸の添加の目的は、前記第２図におけるはんだ
の付着した露出導体面のつや消しにあり、その添加量は
フラックス中、５〜20重量％とすることが有効である。
その理由は、５重量％以下では、つや消しを効果的に行
いがたく、20重量％以上では、はんだ付け時でのフラッ
クスの流動性が大となってはんだのボール化が多く発生
するに至るからである。The purpose of adding oleic acid is to deluster the exposed conductor surface to which the solder adheres in FIG. 2, and it is effective to add 5 to 20% by weight in the flux.
The reason is that if it is 5% by weight or less, it is difficult to effectively deluster, and if it is 20% by weight or more, the flux fluidity at the time of soldering becomes large and solder ballization often occurs. Is.
本発明に係るクリームはんだのはんだ付け後（リフロー
後）での状態を観察すると、はんだから分離したフラッ
クスが粒子状ではんだ表面にのっており、このように、
フラックス残渣が粒子状であるために、つや消し効果が
発揮され、また、その残渣の洗浄除去を容易に行い得
る。When the state of the cream solder according to the present invention after soldering (after reflow) is observed, the flux separated from the solder is in the form of particles on the solder surface.
Since the flux residue is in the form of particles, a matte effect is exhibited, and the residue can be easily washed and removed.
（実施例） 次の組成のフラックスを作製した（％は重量％であり、
以下同じ）。(Example) A flux having the following composition was prepared (% is% by weight,
same as below).
重合ロジン 60％ エチルセロソルブ 27％ 水素添加ヒマシ油 ２％ ジエチルアミンHBr １％ オレイン酸 10％ このフラックス12％と粉末はんだ88％とからなるクリー
ムはんだを得た。Polymerized rosin 60% Ethyl cellosolve 27% Hydrogenated castor oil 2% Diethylamine HBr 1% Oleic acid 10% A cream solder consisting of 12% of this flux and 88% of powdered solder was obtained.
（比較例１） オレイン酸に代え、ステアリン酸を使用した以外実施例
に同じとした。(Comparative Example 1) The same as Example 1 except that stearic acid was used instead of oleic acid.
（比較例２） オレイン酸に代え、パルミチン酸を使用した以外実施例
に同じとした。(Comparative Example 2) The same as Example 1 except that palmitic acid was used instead of oleic acid.
（比較例３） 実施例に対しオレイン酸を添加しなかった以外、実施例
に同じとした。(Comparative Example 3) The same as Example except that oleic acid was not added.
（比較例４） 実施例に対しオレイン酸に代え、アジピン酸を添加した
以外、実施例に同じとした。(Comparative Example 4) The same as Example except that adipic acid was added instead of oleic acid.
実施例品並びに比較例品のそれぞれにつき、プリント基
板への印刷並びにリフローはんだ付けを行い、更に、冷
浴（フロン系溶剤）に20秒浸漬し、次いで蒸気洗浄20秒
の条件で洗浄を行ったところ、実施例品では、リフロー
後のはんだ表面が完全につや消しされており、洗浄によ
りフラックス残渣を完全に除去できた。For each of the example product and the comparative example product, printing and reflow soldering were performed on a printed circuit board, further immersed in a cold bath (CFC solvent) for 20 seconds, and then washed under the conditions of steam cleaning for 20 seconds. However, in the example products, the solder surface after reflow was completely matte, and the flux residue could be completely removed by cleaning.
しかし、比較例３並びに４はリフロー後のはんだ表面が
光沢性に富み、特に実施例４では、洗浄後においても、
フラックス残渣が残り、この残渣が白色化していた。However, in Comparative Examples 3 and 4, the solder surface after reflow is rich in gloss, and particularly in Example 4, even after cleaning,
Flux residue remained, and this residue was whitened.
また、比較例品１並びに２においては、リフロー後のは
んだ表面がつや消しされていたが、洗浄後においても、
フラックス残渣が残り、この残渣が白色化していた。Further, in Comparative Example Products 1 and 2, the solder surface after reflow was matted, but even after cleaning,
Flux residue remained, and this residue was whitened.
＜発明の効果＞ 上述した通り、本発明に係るクリームはんだにおいて
は、はんだ付け後でのつや消し効果を確保できるから、
はんだ付け後での光学的検査を正確に行い得、はんだ付
け後でのフラックス残渣の洗浄除去を容易に行い得るか
ら、被はんだ付け導体間の絶縁性を充分に保証できる。<Effect of the Invention> As described above, in the cream solder according to the present invention, the matting effect after soldering can be ensured,
Since the optical inspection after soldering can be accurately performed and the flux residue can be easily removed by washing after soldering, the insulation between the soldered conductors can be sufficiently ensured.
第１図、並びに第２図は、クリームはんだを用いた公知
のリフローはんだ付け方法を示す説明図であり、第１図
は印刷後を第２図はチップ状素子の仮固定後をそれぞれ
示している。FIG. 1 and FIG. 2 are explanatory views showing a known reflow soldering method using cream solder. FIG. 1 shows after printing and FIG. 2 shows after temporarily fixing chip-shaped elements. There is.
Claims (2)
ラックスと粉末はんだとの混合物において、オレイン酸
を添加したことを特徴とするクリームはんだ。1. A cream solder, wherein oleic acid is added to a mixture of a flux containing an activator and containing rosin as a main component and powdered solder.
20重量％であることを特徴とする特許請求の範囲第１項
記載のクリームはんだ。2. The content of oleic acid in the flux is 5 to 5.
20% by weight of the cream solder according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61061688A JPH0675796B2 (en) | 1986-03-18 | 1986-03-18 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61061688A JPH0675796B2 (en) | 1986-03-18 | 1986-03-18 | Cream solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62214895A JPS62214895A (en) | 1987-09-21 |
| JPH0675796B2 true JPH0675796B2 (en) | 1994-09-28 |
Family
ID=13178449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61061688A Expired - Fee Related JPH0675796B2 (en) | 1986-03-18 | 1986-03-18 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0675796B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4486287B2 (en) * | 2001-09-26 | 2010-06-23 | タムラ化研株式会社 | Solder paste composition and reflow soldering method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6044388A (en) * | 1983-08-22 | 1985-03-09 | Mitsui Toatsu Chem Inc | Recording medium |
-
1986
- 1986-03-18 JP JP61061688A patent/JPH0675796B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62214895A (en) | 1987-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |